CN208632637U - Sputtering coating equipment - Google Patents
Sputtering coating equipment Download PDFInfo
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- CN208632637U CN208632637U CN201821137476.XU CN201821137476U CN208632637U CN 208632637 U CN208632637 U CN 208632637U CN 201821137476 U CN201821137476 U CN 201821137476U CN 208632637 U CN208632637 U CN 208632637U
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Abstract
This disclosure relates to a kind of sputtering coating equipment, comprising: process cavity (10), for carrying out plated film operation；Getter device (20) is connected to the gas outlet (11) of the process cavity (10)；And air storing cavity (30), it is connected between the getter device (20) and the air inlet (12) of the process cavity (10), to form gas circulation between the process cavity (10), the getter device (20) and the air storing cavity (30).Through the above technical solutions, after carrying out plated film operation, such as the process gas of argon gas can be drawn into spare in air storing cavity by getter device, and in coating process, the process gas in air storing cavity is also used as the bailout gas of process cavity, inflates to process cavity.In this way, process gas is not directly discharged in atmospheric environment, but it is inhaled into storage in air storing cavity, and can be back in process cavity, the waste so as to avoid process gas and the pollution to atmosphere.
Description
Technical field
This disclosure relates to plated film field, and in particular, to a kind of sputtering coating equipment.
Background technique
Sputter coating technology refers to, under certain vacuum environment, the process gas of such as argon gas is passed into chamber,
Process gas generates ionization under high strong voltage, and the ion bombardment target material surface after ionization, the atom of target is knocked off and obtains
One momentum, target atom fly to substrate, form coating effects.
The above process is physical vapour deposition (PVD), and process gas is not lost substantially.But after plated film, process gas
It is typically directly discharged into atmospheric environment, not only causes the waste of process gas, so that cost improves, while also resulting in atmosphere dirt
Dye.Such as during producing CIGS thin film solar battery, the process of magnetron sputtering involved in some filming process, the mistake
Use argon gas as process gas in journey, argon gas constantly discharges in production process, causes the waste of gas and can pollute atmosphere.
Utility model content
Purpose of this disclosure is to provide a kind of sputtering coating equipment, with solve after the completion of plated film the waste of process gas and
It pollutes the problem of atmosphere.
To achieve the goals above, the disclosure provides a kind of sputtering coating equipment, comprising:
Process cavity, for carrying out plated film operation；
Getter device is connected to the gas outlet of the process cavity；And
Air storing cavity is connected between the getter device and the air inlet of the process cavity, in the process cavity, described
Gas circulation is formed between getter device and the air storing cavity.
Optionally, compressor is connected between the getter device and the air storing cavity.
Optionally, volume control device is connected between the air storing cavity and the air inlet.
Optionally, the first barometer, first barometer and the volume control device are provided in the process cavity
Electrical connection.
Optionally, the exhaust end of the getter device is provided with the first valve.
Optionally, the gas outlet is provided with the second valve and/or the air inlet is provided with third valve.
Optionally, the getter device is vacuum pump.
Optionally, the volume control device is mass flow controller.
Optionally, the process cavity include it is respective carry out the multiple of plated film operation, each process cavity respectively with it is described
Getter device, the air storing cavity form gas circulation, is provided between two process cavities of arbitrary neighborhood and separates the two
Separate cavities.
Optionally, it is provided with stop part to be opened/closed between the separate cavities and the adjacent process cavity, so that the two
It selectively communicates with or is isolated, the separate cavities and the getter device, the air storing cavity form gas circulation.
Through the above technical solutions, after carrying out plated film operation, such as the process gas of argon gas can be inhaled by getter device
Enter into air storing cavity spare, in coating process, the process gas in air storing cavity is also used as the bailout gas of process cavity, right
Process cavity inflation.In this way, process gas is not directly discharged in atmospheric environment, but it is inhaled into storage in air storing cavity, and can
To be back in process cavity, the waste so as to avoid process gas and the pollution to atmosphere.
Other feature and advantage of the disclosure will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
Attached drawing is and to constitute part of specification for providing further understanding of the disclosure, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 is the schematic diagram of sputtering coating equipment in accordance with one embodiment of the present disclosure；
Fig. 2 is the schematic diagram of sputtering coating equipment in accordance with another embodiment of the present disclosure；
Fig. 3 is the schematic diagram of sputtering coating equipment in accordance with another embodiment of the present disclosure；
Fig. 4 is the schematic diagram of sputtering coating equipment in accordance with another embodiment of the present disclosure；
Fig. 5 is the schematic diagram of sputtering coating equipment in accordance with another embodiment of the present disclosure.
Description of symbols
10 process cavity, 11 gas outlet
12 air inlet, 101 first process cavity
102 second process cavity, 103 separate cavities
20 getter device, 30 air storing cavity
40 compressor, 50 volume control device
60 first valve, 70 second valve
80 third valves
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the disclosure.It should be understood that this place is retouched
The specific embodiment stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
In the disclosure, the term " first " that uses, " second " etc. are in order to distinguish an element and another element, no
With succession and importance.Following description when being related to attached drawing, same appended drawing reference in different attached drawings indicate it is identical or
Similar element.
As shown in Figure 1, the sputtering coating equipment that the disclosure provides includes process cavity 10, getter device 20 and air storing cavity
30.Wherein, process cavity 10 provides plated film working space for carrying out plated film operation；Getter device 20 is connected to process cavity 10
Gas outlet 11；Air storing cavity 30 is connected between getter device 20 and the air inlet 12 of process cavity 10.Here, process cavity 10, suction
The connection of device of air 20 and air storing cavity 30 is realized by gas piping respectively.In this way, process cavity 10, getter device 20 and storage
Gas circulation is formed between air cavity 30, i.e. gas in process cavity 10 can be returned successively by getter device 20 and air storing cavity 30
It flow in process cavity 10.What needs to be explained here is that process cavity 10 is also connected to the gas source for supplying to process cavity 10, with
Receive process gas or following reaction gas.Therefore the disclosure provide air storing cavity 30 different from gas supply gas source, but
Additionally increase a gas circuit on the basis of existing equipment.Through the above technical solutions, after carrying out plated film operation, such as argon gas
Process gas can be drawn into spare in air storing cavity 30 process gas in coating process, in air storing cavity 30 by getter device 20
Body is also used as the bailout gas of process cavity 10, inflates to process cavity 10.In this way, process gas is not directly discharged to big compression ring
In border, but it is inhaled into storage in air storing cavity 30, and can be back in process cavity 30, so as to avoid the wave of process gas
Take and the pollution to atmosphere.
It can connect between getter device 20 and air storing cavity 30 according to some embodiments of the present disclosure referring to Fig. 2 and Fig. 4
Have compressor 40, allow flowed into after overcompression is pressurized by the gas that getter device 20 is sucked out it is spare in air storing cavity 30.This
Sample, the gas passed back into process cavity 10 from air storing cavity 30 may insure enough pressure, will not be substantially reduced in process cavity 10
Air pressure.
It can connect between air storing cavity 30 and air inlet 12 according to some embodiments of the present disclosure referring to Fig. 3 and Fig. 4
Volume control device 50 passes back into the gas flow in process cavity 10 with accurate control, the stable gas pressure in process cavity 10 is made to exist
In a certain range, to avoid plated film operation is influenced.
Specifically, the first barometer can be set in process cavity 10, for the air pressure in real-time detection process cavity 10, really
It protects plated film operation and stablizes progress, in this case, the first barometer is electrically connected with volume control device 50, volume control device
50 selectively adjust gas flow according to the pressure signal in process cavity 10.
Above-mentioned volume control device 50 may include the control of common flow valve and the aperture for controlling the flow valve
Device, or the mass flow controller of integrated form, i.e. MFC (mass flow controller) can also be used.Wherein, quality
Flow controller can carry out the multiple types such as accurate measurement and control, including positive displacement, differential pressure type to the flow of gas, implement
When can select controller appropriate according to specific environment, the disclosure be not especially limited its specific structure.
Getter device 20 can be using the generator that can arbitrarily manufacture vacuum effect, such as can be common vacuum
Pump.According to some embodiments of the present disclosure, referring to Fig. 4, the first valve 60 has been can be set in the exhaust end of getter device 20.It is plating
Before film operation starts, it is necessary first to the air in process cavity 10 is discharged by getter device 20, it in this course, can be by the
One valve 60 is closed, and air is prevented to enter in air storing cavity 30, needs process gas to be applied etc. to avoid pollution plated film operation.
Meanwhile it can be discharged in atmospheric environment by other increased exhaust pipe by the air that getter device 20 is sucked out.In addition, in order to
Ensure the pure of gas in air storing cavity 30, filter can also be set in the inlet of air storing cavity 30.
As shown in figure 4, the second valve 70, air inlet has can be set in gas outlet 11 according to some embodiments of the present disclosure
12 are provided with third valve 80.In this way, can be opened and closed by the second valve 70 and/or third valve 80, control gas circulation
Process, such as when not needing to make-up gas in process cavity 10, third valve 80 can be closed, needing continuous updating technique
When gas in chamber 10, the second valve 70 and third valve 80 can be opened.
In addition, the second barometer can be set in air storing cavity 30, with the air pressure in real-time monitoring air storing cavity 30, Ke Yi
Gas backstreaming is entered in process cavity 10 after adjusting the size of the air pressure.Such as in the case where being provided with above-mentioned compressor 40,
It can be by adjusting the compression effectiveness of compressor 40, to adjust the air pressure size in air storing cavity 30.
The disclosure provide sputtering coating equipment can also include control system, the control system respectively with above-mentioned air-breathing
The electric element connection such as device 20, valve, barometer, to control gas recycle process.The control system can also include
Display device, can be with parameters such as pressure, flows in real-time display gas recycle process.
One workflow of the sputtering coating equipment of one embodiment of disclosure offer is simply provided below with reference to Fig. 4
Journey.Specifically, before plated film operation starts, the second valve 70 is opened, the first valve 60 and third valve 80 are closed, in getter device
The air in process cavity 10 is discharged under the action of 20；When plated film operation carries out, the first valve 60 and third valve 80 are opened, thus
Gas circulation above-mentioned is formed, the gas pressure passed back into process cavity 10 is adjusted by compressor 40 and volume control device 50
And flow, the gas in continuous updating process cavity 10 make the air pressure in process cavity 10 maintain stable state, guarantee film-formation result
And the stability of technique；After plated film operation, third valve 80 is closed, the residual gas in process cavity 10 is drawn into storage
In air cavity 30, retain spare.It should be noted that the gas in plated film operation process includes process gas, in some cases
It can further include reaction gas, wherein reaction gas forms corresponding coating effects for reacting with target atom.
Referring to Fig. 5, according to some other embodiment, process cavity 10 includes respectively carrying out the multiple of plated film operation, each
Process cavity 10 respectively forms gas circulation with getter device 20, air storing cavity 30.In embodiment shown in Fig. 5, process cavity 10
It may include respective the first process cavity 101 and the second process cavity 102 for carrying out plated film operation, the first process cavity 101 and the second work
Skill chamber 102 respectively forms gas circulation with getter device 20, air storing cavity 30.Two circulations can be respectively provided with respective air-breathing dress
Set 20 and the equal components of air storing cavity 30；It can also be to pass through as shown in figure 5, share the components such as a set of getter device 20 and air storing cavity 30
The branch of connecting tube forms multiple circulations.Further, it is provided between two process cavities 10 of arbitrary neighborhood and to separate the two
Separate cavities 103, specifically, in embodiment shown in Fig. 5, separate cavities 103 are arranged in the first process cavity 101 and the second technique
To separate the two between chamber 102, without plated film operation in separate cavities 103.It, can also be in addition, in other embodiments
More process cavities 10 are set, and multiple process cavities 10 can work at the same time.
Further, according to some embodiments, can be set between separate cavities 103 and adjacent process cavity 10 can be opened and closed
Stop part so that the two selectively communicates with or is isolated.Specifically, it referring to Fig. 5, is needing to carry out secondary plating to target object
In the case where film, first time plated film can be carried out first in the first process cavity 101, target object is passed through into separate cavities after plated film
Enter the second process cavity 102 after 103, carries out second of plated film in the second process cavity 102.In this course, separate cavities 103
The middle gas that can be passed through in the first process cavity 101 and the second process cavity 102, in this case, referring to Fig. 5, separate cavities 103
Equally gas circulation can be formed with getter device 20, air storing cavity 30, to ensure the stable gas pressure in separate cavities 103, to avoid
Coating effects are destroyed when target object is in transfer.As shown in figure 5, the first process cavity 101, the second process cavity 102 and isolation
The air inlet and air outlet of chamber 103 are respectively arranged with corresponding control valve, to selectively turn on and close some circulation.
The preferred embodiment of the disclosure is described in detail in conjunction with attached drawing above, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection scope of the disclosure.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the disclosure to it is various can
No further explanation will be given for the combination of energy.
In addition, any combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (10)
1. a kind of sputtering coating equipment characterized by comprising
Process cavity (10), for carrying out plated film operation；
Getter device (20) is connected to the gas outlet (11) of the process cavity (10)；And
Air storing cavity (30) is connected between the getter device (20) and the air inlet (12) of the process cavity (10), in institute
It states and forms gas circulation between process cavity (10), the getter device (20) and the air storing cavity (30).
2. sputtering coating equipment according to claim 1, which is characterized in that the getter device (20) and the air storing cavity
(30) compressor (40) are connected between.
3. sputtering coating equipment according to claim 1, which is characterized in that the air storing cavity (30) and the air inlet
(12) volume control device (50) are connected between.
4. sputtering coating equipment according to claim 3, which is characterized in that be provided with the first gas in the process cavity (10)
Pressure meter, first barometer are electrically connected with the volume control device (50).
5. sputtering coating equipment according to claim 3, which is characterized in that the volume control device (50) is quality stream
Amount controller.
6. sputtering coating equipment according to claim 1, which is characterized in that the exhaust end of the getter device (20) is arranged
There are the first valve (60).
7. sputtering coating equipment according to claim 1, which is characterized in that the gas outlet (11) is provided with the second valve
(70) and/or the air inlet (12) is provided with third valve (80).
8. sputtering coating equipment according to claim 1, which is characterized in that the getter device (20) is vacuum pump.
9. sputtering coating equipment according to claim 1 to 8, which is characterized in that the process cavity (10) includes
Respectively carry out plated film operation it is multiple, each process cavity (10) respectively with the getter device (20), the air storing cavity
(30) gas circulation is formed, is provided with the separate cavities (103) for separating the two between arbitrary neighborhood two process cavities (10).
10. sputtering coating equipment according to claim 9, which is characterized in that the separate cavities (103) with it is adjacent described
Process cavity is provided with stop part to be opened/closed between (10), so that the two selectively communicates with or is isolated, the separate cavities (103)
Gas circulation is formed with the getter device (20), the air storing cavity (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821137476.XU CN208632637U (en) | 2018-07-17 | 2018-07-17 | Sputtering coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821137476.XU CN208632637U (en) | 2018-07-17 | 2018-07-17 | Sputtering coating equipment |
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| Publication Number | Publication Date |
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| CN208632637U true CN208632637U (en) | 2019-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821137476.XU Active CN208632637U (en) | 2018-07-17 | 2018-07-17 | Sputtering coating equipment |
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| CN (1) | CN208632637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112759274A (en) * | 2020-12-31 | 2021-05-07 | 中建材（内江）玻璃高新技术有限公司 | Automatic glass coating system and method |
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2018
- 2018-07-17 CN CN201821137476.XU patent/CN208632637U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112759274A (en) * | 2020-12-31 | 2021-05-07 | 中建材（内江）玻璃高新技术有限公司 | Automatic glass coating system and method |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee after: Beijing Dingrong Photovoltaic Technology Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210407 Address after: Room 201, Building A, 1 Qianwan Road, Qianhai Shenzhen-Hong Kong Cooperation Zone, Shenzhen, Guangdong Province Patentee after: Shenzhen Zhengyue development and Construction Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: Beijing Dingrong Photovoltaic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210908 Address after: No.66210, 3rd floor, Pudong Free Trade Zone, Shanghai, China Patentee after: Shanghai zuqiang Energy Co.,Ltd. Address before: Room 201, Building A, 1 Qianwan Road, Qianhai Shenzhen-Hong Kong Cooperation Zone, Shenzhen, Guangdong Province Patentee before: Shenzhen Zhengyue development and Construction Co.,Ltd. |
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| TR01 | Transfer of patent right |