CN208595734U - Semiconductor ice maker - Google Patents
Semiconductor ice maker Download PDFInfo
- Publication number
- CN208595734U CN208595734U CN201821110418.8U CN201821110418U CN208595734U CN 208595734 U CN208595734 U CN 208595734U CN 201821110418 U CN201821110418 U CN 201821110418U CN 208595734 U CN208595734 U CN 208595734U
- Authority
- CN
- China
- Prior art keywords
- radiating
- silicone grease
- shell
- semiconductor
- liquid cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/80—Food processing, e.g. use of renewable energies or variable speed drives in handling, conveying or stacking
- Y02P60/85—Food storage or conservation, e.g. cooling or drying
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to technical field of semiconductors, it is related to a kind of semiconductor ice maker, including the shell with inner cavity, radiating end silicone grease pad, semiconductor and refrigeration end silicone grease pad are from top to bottom disposed in the inner cavity, the front end of the shell is provided with the binding post connecting with semi-conductive electrical, and the outer end of shell is provided with liquid cooling pipe, and the left end of liquid cooling pipe is provided with outlet tube, the right end of the liquid cooling pipe is provided with inlet tube, auxiliary heat pipe is provided between the liquid cooling pipe and radiating end silicone grease pad, the upper end of the radiating end silicone grease pad is equipped with main heat pipe.The utility model is when the heat-sinking capability of main heat pipe is unable to satisfy radiating requirements, water-cooling can also be carried out by auxiliary heat pipe, therefore the radiating efficiency of semiconductor heat-dissipating piece can be greatly promoted, and radiating mode can be formulated according to actual radiating requirements, in the appropriate range by fixing fabric structure, it is suitable for electronic instrument depths to radiate.
Description
Technical field
The utility model relates to technical field of semiconductors, in particular to a kind of semiconductor ice maker.
Background technique
Refrigeration Technique is one of modern age most important technology, and earliest refrigeration is to carry out wind cooling temperature lowering using fan etc., by
The exchange capability of heat of gas is limited under normal temperature and pressure, therefore is not suitable for high temp objects and cools down rapidly, and liquid nitrogen is a kind of effective temperature-reducing
Refrigerant, since it involves great expense, use occasion is limited therefore is widely used without liquid cooling and compressed gas refrigeration equipment, by
It is bulky in liquid cooling equipment, and compressed gas refrigeration equipment noise is very big, therefore is not all suitable in sophisticated electronics, newly
The semiconductor refrigerating technology of type due to process of refrigerastion is noiseless, without working media, easy to use, work fast small in size, make
It the advantages that long and easily controllable with the service life, is very suitable to radiate to precision instrument or small size instrument, but existing half
Conductor refrigeration equipment still remains problem, essentially consists in existing semiconductor refrigerating equipment due to small volume, the model of heat transfer
Enclose it is smaller, if hot end heat exports not in time, be eventually accumulated in heat generating components nearby influence further heat dissipation.
Summary of the invention
The main purpose of the utility model is to provide a kind of semiconductor ice makers, can reduce substrate and slide glass annular table
Contact area effectively reduces thermal diffusion between the two, to improve the thermal uniformity of substrate and reduce the production of thermal stress line
It is raw.
The utility model is achieved through the following technical solutions above-mentioned purpose: a kind of semiconductor ice maker, including has interior
The shell of chamber is from top to bottom disposed with radiating end silicone grease pad, semiconductor and refrigeration end silicone grease pad, the shell in the inner cavity
The front end of body is provided with the binding post connecting with semi-conductive electrical, and the outer end of shell is provided with liquid cooling pipe, and a left side for liquid cooling pipe
End is provided with outlet tube, and the right end of the liquid cooling pipe is provided with inlet tube, is arranged between the liquid cooling pipe and radiating end silicone grease pad
There is auxiliary heat pipe, the upper end of the radiating end silicone grease pad is equipped with main heat pipe.
Specifically, the upper end of the shell, integrally formed with installation protrusion, the upper end of the installation protrusion is bolted with end cap,
The outer end of the main heat pipe is provided with card adapter plate, and the end cap and card adapter plate clamping are installed.
Specifically, the lower end of the refrigeration end silicone grease pad is provided with the first temperature sensor being electrically connected with binding post, institute
The upper end for stating radiating end silicone grease pad is provided with second temperature sensor.
Specifically, the lower end of the shell integrally formed with side is connected, is provided with several connection spiral shells on the connection side
Hole.
Specifically, the outer end of the shell is provided with insulating layer.
By adopting the above technical scheme, the beneficial effect of technical solutions of the utility model is:
The present invention is when the heat-sinking capability of main heat pipe is unable to satisfy radiating requirements, additionally it is possible to carry out water cooling by auxiliary heat pipe
Heat dissipation, therefore the radiating efficiency of semiconductor heat-dissipating piece can be greatly promoted, and can formulate and dissipate according to actual radiating requirements
Hot mode in the appropriate range by fixing fabric structure is suitable for electronic instrument depths and radiates.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the complete section perspective view of structure of the invention.
In the figure, it is marked as
1- shell, 2- installation protrusion, 3- binding post, 4- inlet tube, the main heat pipe of 5-, 6- end cap, 7- liquid cooling pipe, 8- go out liquid
Pipe, 9- connection side, 10- second temperature sensor, 11- card adapter plate, 12- auxiliary heat pipe, 13- refrigeration end silicone grease pad, 14- radiating end
Silicone grease pad, the first temperature sensor of 15-, 16- semiconductor.
Specific embodiment
The utility model is described in further detail combined with specific embodiments below.
Embodiment:
As depicted in figs. 1 and 2, a kind of semiconductor ice maker, including the shell 1 with inner cavity, in inner cavity from top to bottom
It is disposed with radiating end silicone grease pad 14, semiconductor 16 and refrigeration end silicone grease pad 13, the front end of shell 1 is provided with and semiconductor 16
The binding post 3 of electric connection；The outer end of shell 1 is provided with liquid cooling pipe 7, and the left end of liquid cooling pipe 7 is provided with outlet tube 8, liquid cooling
The right end of pipe 7 is provided with inlet tube 4, and auxiliary heat pipe 12, radiating end silicone grease are provided between liquid cooling pipe 7 and radiating end silicone grease pad 14
The upper end of pad 14 is equipped with main heat pipe 5.The present invention can timely be dissipated the heat of 16 radiating end of semiconductor by main heat pipe 5
Fall, when the heat-sinking capability of main heat pipe 5 is unable to satisfy radiating requirements, additionally it is possible to water-cooling is carried out by auxiliary heat pipe 12, because
This can greatly promote the radiating efficiency of semiconductor heat-dissipating piece, and can formulate radiating mode according to actual radiating requirements,
In the appropriate range by fixing fabric structure, the present apparatus possesses good insulation performance and lesser volume, and it is deep to be suitable for electronic instrument
Place's heat dissipation.
As depicted in figs. 1 and 2, the upper end of shell 1 is bolted with end integrally formed with installation protrusion 2, the upper end of installation protrusion 2
Lid 6, the outer end of main heat pipe 5 is provided with card adapter plate 11, and end cap 6 and the clamping of card adapter plate 11 are installed.This structure plays main heat pipe 5
A kind of effect connected and fixed makes main heat pipe 5 keep coming into full contact between radiating end silicone grease pad 14, guarantees main heat pipe 5
Heat dissipation performance.
As shown in Fig. 2, the lower end of refrigeration end silicone grease pad 13 is provided with the first temperature sensor being electrically connected with binding post 3
15, the upper end of radiating end silicone grease pad 14 is provided with second temperature sensor 10.First temperature sensor 15 and second temperature sensing
Device 10 can characterize the heat dissipating state of 16 two sides of semiconductor respectively, remind whether worker needs to open auxiliary heat pipe 12.
As depicted in figs. 1 and 2, the lower end of shell 1 connects integrally formed with connection side 9 and is provided with several connections on side 9
Screw hole.Connection sheet 9, which is used to install the present apparatus, fixes.
The outer end of shell 1 is provided with insulating layer.Insulating layer can allow the present apparatus to possess good insulation performance, be more suitable for electricity
Sub- instrument depths heat dissipation.
Above-described is only some embodiments of the utility model.For those of ordinary skill in the art,
Without departing from the concept of the present invention, various modifications and improvements can be made, these belong to practical
Novel protection scope.
Claims (5)
1. a kind of semiconductor ice maker, it is characterised in that: including the shell with inner cavity, in the inner cavity from top to bottom successively
It is provided with radiating end silicone grease pad, semiconductor and refrigeration end silicone grease pad, the front end of the shell is provided with to be connect with semi-conductive electrical
Binding post, and the outer end of shell is provided with liquid cooling pipe, and the left end of liquid cooling pipe is provided with outlet tube, the right end of the liquid cooling pipe
Be provided with inlet tube, be provided with auxiliary heat pipe between the liquid cooling pipe and radiating end silicone grease pad, the radiating end silicone grease pad it is upper
End is equipped with main heat pipe.
2. semiconductor ice maker according to claim 1, it is characterised in that: specifically, the upper end one of the shell
Installation protrusion is formed, the upper end of the installation protrusion is bolted with end cap, and the outer end of the main heat pipe is provided with card adapter plate, described
End cap and card adapter plate clamping are installed.
3. semiconductor ice maker according to claim 1, it is characterised in that: the lower end of the refrigeration end silicone grease pad is arranged
There is the first temperature sensor being electrically connected with binding post, the upper end of the radiating end silicone grease pad is provided with second temperature sensor.
4. semiconductor ice maker according to claim 1, it is characterised in that: the lower end of the shell is integrally formed with even
Edge fit is provided with several connecting screw holes on the connection side.
5. semiconductor ice maker according to claim 1, it is characterised in that: the outer end of the shell is provided with insulation
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821110418.8U CN208595734U (en) | 2018-07-13 | 2018-07-13 | Semiconductor ice maker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821110418.8U CN208595734U (en) | 2018-07-13 | 2018-07-13 | Semiconductor ice maker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208595734U true CN208595734U (en) | 2019-03-12 |
Family
ID=65602827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821110418.8U Active CN208595734U (en) | 2018-07-13 | 2018-07-13 | Semiconductor ice maker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208595734U (en) |
-
2018
- 2018-07-13 CN CN201821110418.8U patent/CN208595734U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |