CN208548352U - A kind of signal recognition system and electronic equipment - Google Patents
A kind of signal recognition system and electronic equipment Download PDFInfo
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- CN208548352U CN208548352U CN201821355852.2U CN201821355852U CN208548352U CN 208548352 U CN208548352 U CN 208548352U CN 201821355852 U CN201821355852 U CN 201821355852U CN 208548352 U CN208548352 U CN 208548352U
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Abstract
The utility model embodiment discloses a kind of signal recognition system and electronic equipment, wherein signal recognition system includes display panel and image sensor array；Image sensor array includes sensitive chip array and array of optical elements；Sensitive chip array includes multiple sensitive chips, and array of optical elements includes multiple optical elements, and each optical element is correspondingly arranged with the sensitive chip；Each optical element receives the portions incident light of imaging object and portions incident light is imaged on sensitive chip；Each sensitive chip generates the portion size image of imaging object；Array of optical elements receives whole incident rays of imaging object and whole incident rays is imaged on sensitive chip array；The full size image of sensitive chip array generation imaging object.To sum up, by adjusting the distance between array of optical elements and sensitive chip array, the size of adjustable sensitive chip saves the area coverage of sensitive chip, saves cost.
Description
Technical field
The utility model embodiment is related to blipology field more particularly to a kind of signal recognition system and electronics is set
It is standby.
Background technique
Currently, as a kind of information input tool to be widely used in mobile phone, tablet computer, public place big for display panel
In the various display products such as the information enquiry machine in the Room.A kind of mode of the fingerprint recognition as user identity authentication and access control,
It is widely used in display panel.
In the prior art, fingerprint recognition mould group can be arranged in the region except display panel display area, but in this way
Meeting so that the screen of display area account for it is smaller, it is poor for experiencing.It, usually can be in display panel in order to promote the experience of user
Fingerprint recognition mould group is arranged in the back side, so that user carries out fingerprint recognition at the display product that operation is shielded comprehensively.Its realization principle
It is the entire sensor chip of non-light emission side setting in display panel, finger print information is obtained by sensor chip, realization refers to
Line identification.
But whole face sensor chip is expensive, causes the expensive problem of such as mobile phone or tablet computer.
Utility model content
In view of this, the utility model embodiment provides a kind of signal recognition system and electronic equipment, to solve existing skill
Cost too high technical problem when whole face sensor chip progress fingerprint recognition is utilized in art.
In a first aspect, the utility model embodiment provides a kind of signal recognition system, comprising: display panel and be located at
The first kind sensor array of the non-light emission side side of display panel；
The first kind sensor array includes image sensor array, and described image sensor array includes photosensitive core
Chip arrays and array of optical elements positioned at the photosensitive side side of the sensitive chip array；The sensitive chip array includes more
A sensitive chip being independently arranged, multiple sensitive chips are electrically connected to each other, and the array of optical elements includes multiple independences
The optical element of setting, and each optical element is correspondingly arranged with each sensitive chip；Each optical element
For receiving the portions incident light of imaging object and the portions incident light being imaged on the sensitive chip；Each institute
Sensitive chip is stated for generating the portion size image of the imaging object；The array of optical elements is for receiving the imaging
Whole incident rays are simultaneously imaged on the sensitive chip array by whole incident rays of object；The sensitive chip battle array
Arrange the full size image for generating the imaging object.
Optionally, the signal recognition system further includes Second Type sensor array, the Second Type sensor array
Column are electrically connected with the first kind sensor array.
Optionally, the Second Type sensor array include radar sensor array, it is array of ultrasonic sensors, ultraviolet
At least one of sensor array, infrared array sensor and photosensitive sensor array.
Optionally, the sensitive chip array includes at least the first sensitive chip subarray and the second sensitive chip submatrix
Column；The array of optical elements includes at least the first optical element subarray and the second optical element subarray；
The first sensitive chip subarray includes the first sensitive chip of multiple matrix arrangements, second sensitive chip
Subarray includes the second sensitive chip of multiple matrix arrangements；It is photosensitive along the direction of the sensitive chip array row, described first
Chip and second sensitive chip interval setting, along the direction of the sensitive chip array column, first sensitive chip and
The setting of second sensitive chip interval；
The first optical element subarray includes the first optical element of multiple matrix arrangements, second optical element
Subarray includes the second optical element of multiple matrix arrangements；Along the direction of the array of optical elements row, first optics
Element and the setting of second optical element interval；Along the array of optical elements column direction, first optical element and
The setting of second optical element interval；
Wherein, the first optical element subarray receives whole incident rays of the imaging object, first sense
The full size image of imaging object described in optical chip submatrix column-generation；
The second optical element subarray receives whole incident rays of the imaging object, second sensitive chip
The full size image of imaging object described in submatrix column-generation.
Optionally, first optical element and the received imaging object of second optical element being disposed adjacent
Incident ray there are overlapping parts.
Optionally, first optical element has the first focal length, and second optical element has the second focal length；
Wherein, first focal length is identical as second focal length.
Optionally, first optical element has third focal length, and second optical element has the 4th focal length；
Wherein, the third focal length is different from the 4th focal length.
Optionally, the signal recognition system further includes at least one control circuit, the control circuit and each described
Sensitive chip electrical connection, the portion size image of the imaging object is generated for controlling each sensitive chip, controls institute
State the full size image that sensitive chip array generates the imaging object.
Optionally, the control circuit is also electrically connected with the Second Type sensor array.
Optionally, the optical element includes at least one of lens, imaging hole and collimator.
Optionally, the display panel is organic LED display panel.
Second aspect, the utility model embodiment additionally provide a kind of electronic equipment, the signal provided including first aspect
Identifying system.
Signal recognition system and electronic equipment provided by the embodiment of the utility model, signal recognition system include display panel
And image sensor array, image sensor array include sensitive chip array and array of optical elements, sensitive chip array
Including multiple sensitive chips being independently arranged, array of optical elements includes multiple optical elements being independently arranged, each optics member
Part receives the portions incident light of imaging object and portions incident light is imaged on the sensitive chip；Each sensitive chip
Generate the portion size image of imaging object；Array of optical elements receives whole incident rays of imaging object and will be all incident
Image formation by rays is on sensitive chip array；The full size image that sensitive chip array generates imaging object passes through.Due to optics member
The distance between part array and sensitive chip are adjustable, can be with by adjusting the distance between array of optical elements and sensitive chip
The size of each sensitive chip is adjusted, the size setting of each sensitive chip is flexible while multiple photosensitive in sensitive chip array
The sum of area of chip is less than the area of the sensitive chip of whole face setting, saves the preparation cost of imaging sensor.
Detailed description of the invention
In order to clearly illustrate the technical solution of the utility model exemplary embodiment, below in description embodiment
The required attached drawing used does a simple introduction.Obviously, the attached drawing introduced is the utility model a part to be described
The attached drawing of embodiment, rather than whole attached drawings, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of signal recognition system of the prior art；
Fig. 2 is a kind of structural schematic diagram of signal recognition system provided by the embodiment of the utility model；
Fig. 3 is a kind of the schematic diagram of the section structure of the signal recognition system along hatching A-A ' of Fig. 2 offer；
Fig. 4 is another the schematic diagram of the section structure of the signal recognition system along hatching A-A ' of Fig. 2 offer；
Fig. 5 is a kind of image-forming principle schematic diagram of image sensor array provided by the embodiment of the utility model；
Fig. 6 is the structural schematic diagram of another signal recognition system provided by the embodiment of the utility model；
Fig. 7 is a kind of the schematic diagram of the section structure of the signal recognition system along hatching B-B ' of Fig. 6 offer；
Fig. 8 is another the schematic diagram of the section structure of the signal recognition system along hatching B-B ' of Fig. 6 offer；
Fig. 9 is the structural schematic diagram of another signal recognition system provided by the embodiment of the utility model；
Figure 10 is a kind of flow diagram of the preparation method of signal recognition system provided by the embodiment of the utility model.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, implement below with reference to the utility model
Attached drawing in example is fully described by the technical solution of the utility model by specific embodiment.Obviously, described implementation
Example is a part of the embodiment of the utility model, instead of all the embodiments, is based on the embodiments of the present invention, this field
The every other embodiment that those of ordinary skill obtains without making creative work, each falls within the utility model
Protection scope within.
Fig. 1 is a kind of structural schematic diagram of signal recognition system of the prior art, as shown in Figure 1, signal in the prior art
Identifying system may include display panel 11 and the fingerprint identification device 12 positioned at the non-light emission side side of display panel 11.
Illustratively, in order to improve the screen accounting for showing equipment, can be arranged original in 11 neighboring area of display panel
Fingerprint identification device be arranged at the back side of display panel 11, while in order to entire display area be able to achieve fingerprint know
Not, it generally requires and entire fingerprint recognition chip is set at 11 back side of display panel, since fingerprint recognition chip price is high, because
This, existing full screen fingerprint identification device it is at high price.
Based on above-mentioned technical problem, the utility model embodiment provide a kind of signal recognition system, including display panel with
And the first kind sensor array positioned at the non-light emission side side of display panel；First kind sensor array includes image sensing
Device array, image sensor array include sensitive chip array and the optics positioned at the photosensitive side side of the sensitive chip array
Element arrays；Sensitive chip array includes multiple sensitive chips being independently arranged, and multiple sensitive chips are electrically connected to each other, optics member
Part array includes multiple optical elements being independently arranged, and each optical element is correspondingly arranged with each sensitive chip；Each light
Element is learned to be used to receive the portions incident light of imaging object and portions incident light is imaged on sensitive chip；It is each photosensitive
Chip is used to generate the portion size image of imaging object；Array of optical elements is used to receive whole incident rays of imaging object
And whole incident rays are imaged on sensitive chip array；Sensitive chip array is used to generate the full-size draft of imaging object
Picture.Image sensor array is arranged by the non-light emission side in display panel in technical solution provided by the embodiment of the utility model,
And image sensor array sensitive chip array and the array of optical elements positioned at the photosensitive side side of sensitive chip array, each
Optical element receives the portions incident light of imaging object and portions incident light is imaged on sensitive chip；Each photosensitive core
The portion size image of piece generation imaging object；Array of optical elements receives whole incident rays of imaging object and will all enter
Image formation by rays is penetrated on sensitive chip array；The full size image of sensitive chip array generation imaging object.To sum up, by adjusting
The distance between array of optical elements and sensitive chip array, the size of adjustable sensitive chip, the ruler of each sensitive chip
Very little setting is flexible；The area coverage of each sensitive chip in sensitive chip array can also be reduced simultaneously, guarantee sensitive chip battle array
The sum of area coverage of all sensitive chips is less than the area of the sensitive chip of whole face setting in column, saves the covering of sensitive chip
Area saves the cost of sensitive chip, and then saves the cost of signal recognition system.
It is the core concept of the utility model above, the following will be combined with the drawings in the embodiments of the present invention, to this reality
It is clearly and completely described with the technical solution in new embodiment.Based on the embodiments of the present invention, this field is general
Without making creative work, every other embodiment obtained belongs to the utility model to logical technical staff
The range of protection.
Fig. 2 is a kind of structural schematic diagram of signal recognition system provided by the embodiment of the utility model, as shown in Fig. 2, this
Utility model embodiment provide signal recognition system may include display panel 21 and be located at the non-light emission side one of display panel 21
The first kind sensor array of side；
First kind sensor array includes image sensor array 22, and image sensor array 22 includes sensitive chip battle array
Column 221 and array of optical elements 222 positioned at the photosensitive side side of sensitive chip array；Sensitive chip array 221 includes multiple only
The sensitive chip 2211 set is erected, multiple sensitive chips 2211 are electrically connected to each other, and array of optical elements 222 is independently set including multiple
The optical element 2221 set, and each optical element 2221 is correspondingly arranged with each sensitive chip 2211；Each optical element
2221 for receiving the portions incident light of imaging object and portions incident light being imaged on sensitive chip 2211；Each sense
Optical chip 2211 is used to generate the portion size image of imaging object；Array of optical elements 222 is for receiving the complete of imaging object
Whole incident rays are simultaneously imaged on sensitive chip array 221 by portion's incident ray；Sensitive chip array 221 is for generating imaging
The full size image of object.
Image sensor array 22 may include sensitive chip array 221 and array of optical elements 222, sensitive chip array
221 may include multiple sensitive chips 2211 being independently arranged, and multiple sensitive chips 2211 are electrically connected to each other, array of optical elements
222 may include multiple optical elements 2221 being independently arranged, and each optical element 2221 and each sensitive chip 2211 are right
It should be arranged.In imaging sensor work, each optical element 2221 receives the portions incident light of imaging object and by the portion
It is divided into and penetrates image formation by rays on corresponding sensitive chip 2211, sensitive chip 2211 generates the part ruler of imaging object later
Very little image；Entire array of optical elements 222 receives whole incident rays of imaging object, and entire sensitive chip array 221 generates
The full size image of imaging object, guarantee imaging object can on image sensor array 22 complete imaging.
Fig. 3 is a kind of the schematic diagram of the section structure of the signal recognition system along hatching A-A ' of Fig. 2 offer, and Fig. 4 Fig. 2 is provided
Signal recognition system along hatching A-A ' another the schematic diagram of the section structure, as shown in Figure 3 and Figure 4, multiple sensitive chips
2211 are electrically connected to each other, and form sensitive chip array 221.Optionally, multiple sensitive chips 2211 are arranged to be electrically connected to each other, it can be with
It is the signal wire in PCB substrate, by the manufacture of semiconductor wires technique for interconnection, each sensitive chip 2211 is divided and is picked up simultaneously
PCB substrate is placed in advance on designed position, so that can be interconnected by prefabricated signal wire between sensitive chip 2211,
Sensitive chip array 221 is formed, as shown in Figure 3；Also fan-out package structure (fanout) Lai Jinhang chip array can be used
Encapsulation, with replace PCB substrate mutual contact mode, as shown in Figure 4.It should be noted that the utility model embodiment is to multiple
How sensitive chip 2211 is electrically connected to each other to form sensitive chip array 221 without limiting.
It is illustrated so that signal recognition system provided by the embodiment of the utility model identifies fingerprint signal as an example, image sensing
Device array 22 is set to the display area of display panel 21, and finger can be in the arbitrary region in the display area of display panel 21
Pressing operation is carried out, multiple optical elements 2221 corresponding with pressing area receive the portions incident light of finger print simultaneously respectively
The portions incident light is imaged on corresponding sensitive chip 2211, each sensitive chip 2211 generates finger print
Portion size image, multiple sensitive chips 2211 generate the full size image of finger print, identify to finger fingerprint signal.
It should be noted that being only illustrated so that signal recognition system identifies fingerprint signal as an example here, it is to be understood that this is practical
The signal recognition system that new embodiment provides can also identify other signals, such as identification palmmprint signal, face signal etc.,
The utility model embodiment is to this without limiting.
By taking lens as an example, according to the image-forming principle of optical lens, 1/f=1/u+1/v, wherein f indicates the focal length of lens, u table
Show image distance, v expression thing away from.By adjusting the distance v to the object to be imaged of focal length f and lens of lens, adjustable optics
The distance between element arrays 222 and sensitive chip array 221 u, so that the area of picture is less than the area of object with certain multiple,
Achieve the purpose that control each 2211 size of sensitive chip in sensitive chip array 221, this is just the design of sensitive chip 2211
Freedom degree is provided, guarantees that the size setting of each sensitive chip 2211 is flexible；At the same time it can also by reducing sensitive chip battle array
The area coverage of each sensitive chip 2211 of column 221 guarantees that the area coverage of sensitive chip array 221 is less than the sense of whole face setting
The area of optical chip saves the covering rice and flour product of sensitive chip, saves the cost of sensitive chip, and then save signal recognition system
Cost.
Specifically, Fig. 5 is a kind of image-forming principle schematic diagram of image sensor array provided by the embodiment of the utility model,
As shown in figure 5, each sensitive chip 2211 generates the portion size image of imaging object, obtained after control circuit cuts splicing
The full size image of imaging object.Therefore, technical solution provided by the embodiment of the utility model, not influencing, imaging object is final
Image under the premise of, sensitive chip array 221 and array of optical elements 222, the sense in sensitive chip array 221 are set
Optical chip 2211 is correspondingly arranged with the optical element 2221 in array of optical elements 222, by adjusting the coke of optical element 2221
Away from and the distance between array of optical elements 222 and sensitive chip array 221, the ruler of adjustable each sensitive chip 2211
It is very little, the setting of the size of each sensitive chip 2211 flexibly, while in sensitive chip array 221 multiple sensitive chips 2211 area
The sum of be less than whole face setting sensitive chip area, save the preparation cost of imaging sensor.
To sum up, signal recognition system provided by the embodiment of the utility model, including image sensor array, imaging sensor
Array includes sensitive chip array and array of optical elements, in the optical element and sensitive chip array in array of optical elements
Sensitive chip is correspondingly arranged, and each optical element receives the portions incident light of imaging object and is imaged on portions incident light
On each sensitive chip, each sensitive chip generates the parts of images of imaging object, and array of optical elements receives imaging object
Whole incident rays are simultaneously imaged on sensitive chip array by whole incident rays；Sensitive chip array generates the imaging object
Full size image.By adjusting the distance between the focal length and array of optical elements of optical element and sensitive chip array,
The size setting of the size of adjustable each sensitive chip, each sensitive chip is flexible；Sensitive chip can also be reduced simultaneously
The area coverage of each sensitive chip in array guarantees that the sum of the area coverage of all sensitive chips in sensitive chip array is less than
The area of the sensitive chip of whole face setting, saves the area coverage of sensitive chip, saves the cost of sensitive chip, and then save letter
The cost of number identifying system.
Optionally, array of optical elements 222 is located at the side of the photosensitive side of sensitive chip array 221, wherein optical element battle array
Column 222 sensitive chip array 221 upright projection in the plane can cover sensitive chip array 221 (as shown in Figure 1),
Sensitive chip array 221 can not also be covered, the utility model embodiment is to this without limiting.It should be noted that optics
Element arrays 222 are located at the side of the photosensitive side of sensitive chip array 221, when the sensitive chip 2211 in sensitive chip array 221
When for sensitive chip front-illuminated, array of optical elements 222 is between sensitive chip array 221 and display panel 21, when photosensitive
When sensitive chip 2211 in chip array 221 is back-illuminated type sensitive chip, array of optical elements 222 is located at sensitive chip array
221 sides far from display panel 21, class of the utility model embodiment to the sensitive chip 2211 in sensitive chip array 221
Without limiting, Fig. 1 is only illustrated by taking sensitive chip front-illuminated as an example type.
The utility model embodiment creatively applies the concept of " breaking the whole up into parts " in signal recognition system, will be existing
The image sensor chip that whole face designs in technology is designed to that sensitive chip array 221, sensitive chip array 221 include multiple independences
The sensitive chip 2211 of setting, each sensitive chip 2211 generate the portion size image of imaging object, sensitive chip array 221
Generate the full size image of imaging object.It arrives by adjusting the focal length and optical element 2221 of optical element 2221 by imaging object
The distance of body, the distance between adjustable array of optical elements 222 and sensitive chip array 221, so that the area of picture is with one
Fixed multiple is less than the area of object, guarantees that the size setting of each sensitive chip 2211 is flexible；Know simultaneously compared to existing signal
The image sensor chip that whole face is arranged in other system, in the technical solution of the utility model embodiment, in sensitive chip array 221
The sum of area coverage of all sensitive chips 2211 is less than the area of the sensitive chip of whole face setting, saves signal recognition system
Preparation cost.
Optionally, signal recognition system provided by the embodiment of the utility model can also include at least one control circuit
(not shown), control circuit are electrically connected with each sensitive chip 2211, for control each sensitive chip 2211 generate at
As the portion size image of object, the full size image that sensitive chip array 221 generates imaging object is controlled.Optionally, it controls
Input/output pin (not shown) is provided with around each sensitive chip 2211, control circuit can pass through solder, metal
Conducting wire, conducting resinl or other connecting materials are electrically connected with the input/output pin of each sensitive chip 2211 (not to be shown in figure
Out), realize that control sensitive chip 2211 generates the purpose of imaging object portion size image.The utility model embodiment is to control
How circuit is realized with sensitive chip 2211 is electrically connected without limiting.
Fig. 6 is the structure of another signal recognition system provided by the embodiment of the utility model, and Fig. 7 is the letter that Fig. 6 is provided
Along a kind of the schematic diagram of the section structure of hatching B-B ', Fig. 8 is the signal recognition system that provides of Fig. 6 along hatching for number identifying system
Another the schematic diagram of the section structure of B-B ', as shown in Fig. 6, Fig. 7 and Fig. 8, signal identification provided by the embodiment of the utility model
System can also include Second Type sensor array 23, Second Type sensor array 23 and first kind sensor array,
It is electrically connected with image sensor array 22.As shown in Figure 7 and Figure 8, Second Type sensor array 23 may include one or
The multiple Second Type sensors 231 of person, each Second Type sensor 231 and the imaging sensor in image sensor array 22
Electrical connection, specifically can be and is electrically connected with the sensitive chip 2211 in image sensor array 22.Second Type sensor 231 with
Sensitive chip 2211 is electrically connected, and can be in PCB substrate, the signal wire by the manufacture of semiconductor wires technique for interconnection,
Sensitive chip 2211 and Second Type sensor 231 are divided and pick up and be placed on PCB substrate in advance on designed position, so that sense
It can be interconnected by prefabricated signal wire between optical chip 2211 and Second Type sensor 231, as shown in Figure 7；It can also make
With the encapsulation of fan-out package structure (fanout) Lai Jinhang sensitive chip 2211 and Second Type sensor 231, to replace PCB
The mutual contact mode of substrate, as shown in Figure 8.It should be noted that the utility model embodiment is to Second Type sensor array 23
How to be electrically connected to each other with first kind sensor array without limiting.
Optionally, Second Type sensor array can be with radar sensor array, array of ultrasonic sensors, ultraviolet transducing
At least one of device array, infrared array sensor and photosensitive sensor array.
When Second Type sensor array includes radar sensor array, radar sensor can be worn by radar signal
Semitransparent display panel 21 is irradiated to the echo after object to judge the distance and shape of object before display panel 21, to realize perception
The function of distance and three-dimensional imaging.
Meanwhile the interconnection circuit layer between radar sensor array and first kind sensor array can also be used as radar biography
The antenna of sensor, to realize the purpose of enhancing radar performance.
When Second Type sensor array includes array of ultrasonic sensors, display panel 21 is penetrated by ultrasonic signal
Echo after being irradiated to object judges the distance and shape of object before display panel 21, thus realize perceived distance and it is three-dimensional at
The function of picture.
When Second Type sensor array includes photosensitive sensor array, photosensitive sensor array can incude extraneous ring
Border light can also adjust the light emission luminance of display panel 21 by incuding external environmental light.For example, when sensing external environmental light
When brightness is darker, the light emission luminance of adjustable display panel 21 is smaller, avoid display panel light emission luminance it is larger cause using
Person's visual fatigue.
Optionally, control circuit is also electrically connected with Second Type sensor array.
To sum up, by the way that first kind sensor array and Second Type sensor array is arranged simultaneously in signal recognition system
Column, the sensor array for having a variety of different sensing functions are integrated in the same hardware system, can greatly simplify existing letter
The setting complexity of number identifying system, the integrated level of promotion signal identifying system reduce cost；Meanwhile in signal recognition system
Different types of sensor array, which can cooperate, acquires the different transduction features of the same target, the function of multiple sensors
Complementation can may be implemented, to realize the function that existing discreet sensor part cannot achieve, guarantee that signal recognition system can be with
Realize the fusion of multidimensional heat transfer agent, promotion signal identifying system performance.
Fig. 9 is the structural schematic diagram of another signal recognition system provided by the embodiment of the utility model, as shown in figure 9,
Sensitive chip array 221 at least may include the first sensitive chip subarray 221A and the second sensitive chip subarray 221B, light
Learn element arrays 222 at least may include the first optical element subarray 222A and the second optical element subarray 222B, Fig. 9 only
It include the first sensitive chip subarray 221A and the second sensitive chip subarray 221B, optical element with sensitive chip array 221
Array 222 for the first optical element subarray 222A and the second optical element subarray 222B including illustrating.
In order to more clearly indicate the first sensitive chip subarray 221A and the second sensitive chip subarray 221B in the accompanying drawings, first
Optical element subarray 222A and the second optical element subarray 222B, in attached drawing 9, the first sensitive chip subarray 221A is used
Solid line indicates that the second sensitive chip subarray 221B is represented by dashed line, and the first optical element subarray 222A is indicated by the solid line, the
Two optical element subarray 222B are represented by dashed line.
As shown in figure 9, the first sensitive chip subarray 221A may include the first sensitive chip of multiple matrix arrangements
2211A, the second sensitive chip subarray 221B may include the second sensitive chip 2211B of multiple matrix arrangements；Along photosensitive core
The direction (X-direction as shown in Figure 9) of 221 row of chip arrays, between the first sensitive chip 2211A and the second sensitive chip 2211B
Every setting；Along the direction (Y-direction as shown in Figure 9) that sensitive chip array 221 arranges, the first sensitive chip 2211A and second
The setting of the interval sensitive chip 2211B.First optical element subarray 222A includes the first optical element of multiple matrix arrangements
2221A, the second optical element subarray 222B include the second optical element 2221B of multiple matrix arrangements；Along optical element battle array
The direction (X-direction as shown in Figure 9) of 222 row of column, the first optical element 2221A and the second interval optical element 2221B are set
It sets；Along the direction (Y-direction as shown in Figure 9) that array of optical elements 222 arranges, the first optical element 2221A and the second optics
The setting of the interval element 2221B.
Wherein, the great circle in Fig. 9 indicates the visual angle coverage area of array of optical elements 222, and 24A indicates the first optical element
The visual angle coverage area of array 222A, 24B indicate the visual angle coverage area of the second array of optical elements 222B, can be with from Fig. 9
See, the first optical element subarray 222A receives whole incident rays of imaging object, the first sensitive chip subarray 221A
Generate the full size image of imaging object；Second optical element subarray 222B receives whole incident rays of imaging object, the
The full size image of two sensitive chip subarray 221B generation imaging object.
Illustratively, array of optical elements 222 provided by the embodiment of the utility model can include at least two optics members
Part subarray, i.e. the first optical element subarray 222A and the second optical element subarray 222B, and each optical element submatrix
Column can receive whole incident rays of imaging object；Meanwhile sensitive chip array corresponding with array of optical elements 222
221 can equally include at least two sensitive chip subarrays, i.e. the first sensitive chip subarray 221A and the second sensitive chip
Subarray 221B, and the full size image of imaging object can be generated in each sensitive chip subarray.Specifically, when the first sense
It, can be simultaneously when optical chip subarray 221A and the second sensitive chip subarray 221B is imaged for the same imaging object
Show two identical full size images of the same imaging object.Therefore, when needing that the same imaging object is imaged
When, control circuit can control only the first sensitive chip subarray 221A and is imaged or controlled only the second sensitive chip submatrix
Column 221B is imaged, under the premise of guaranteeing to obtain the full size image of imaging object, it is possible to reduce sensitive chip 2211
Usage quantity reduces the use power consumption of imaging sensor；Or when some sensitive chip subarray breaks down and can not be imaged
When, another sensitive chip subarray can be used and be imaged, do not influence image normal operation of sensor.When the first photosensitive core
When sub-array 221A and the second sensitive chip subarray 221B is imaged for different imaging objects, it can show simultaneously
The full size image of two imaging objects.Therefore when needing that two different imaging objects are imaged, control circuit can
To control the first sensitive chip subarray 221A and the second sensitive chip subarray 221B respectively to two different imaging objects
It is imaged, while obtaining the full size image of two different imaging objects, control circuit only needs control sensitive chip 2,211 1
The different full size images for obtaining two imaging objects can be obtained in secondary exposure, guarantee that imaging sensor imaging efficiency is high.
With continued reference to Fig. 9, due to the first optical element 2221A and the second optics in the first optical element subarray 222A
The second interval optical element 2221B setting in element subarray 222B, therefore, the first optical element 2221A being disposed adjacent
There is overlapping part with the incident ray of the second received imaging object of optical element 2221B, can so guarantee the first optics
Element subarray 222A can receive whole incident rays of imaging object, and the second optical element subarray 222B can be received
To whole incident rays of imaging object, the first sensitive chip subarray 221A can generate the full size image of imaging object,
Second sensitive chip subarray 221B can generate the full size image of imaging object.
It should be noted that the utility model embodiment is to the first optical element 2221A being disposed adjacent and the second optics
The size of the incident ray overlapping part of the received imaging object of element 2221B need to only guarantee the first optics member without limiting
Part subarray 222A and the second optical element subarray 222B can receive whole incident rays of imaging object.
Optionally, the first optical element 2221A and the second optical element 2221B can have identical focal length or have
Standby different focal length, will be made below being discussed in detail.
The first optical element 2221A and the identical situation of the second optical element 2221B focal length are introduced first.Specifically, the
One optical element 2221A can have the first focal length, and the second optical element 2221B can have the second focal length；Wherein, first is burnt
Away from identical as the second focal length.When the first optical element 2221A and the second optical element 2221B have identical focal length, first
Sensitive chip subarray 221A and the second sensitive chip subarray 221B can be imaged the same imaging object, raw simultaneously
At two identical full size images of the same imaging object；Either only use the first sensitive chip subarray 221A or second
Imaging object is imaged in sensitive chip subarray 221B.For example, using signal identification provided by the embodiment of the utility model
When system identification fingerprint signal, generated simultaneously by the first sensitive chip subarray 221A and the second sensitive chip subarray 221B
Two full-scale fingerprint images of same fingerprint, respectively identify two full-scale fingerprint images, guarantee that identification is accurate
Property it is high；Or when wherein there are another full-scale fingerprint image when excalation, can be used for some full-scale fingerprint image
As being identified, guarantee that fingerprint recognition can be normally carried out.
Next the first optical element 2221A and the different situation of the second optical element 2221B focal length are introduced.Specifically,
First optical element 2221A can have third focal length, and the second optical element 2221B can have the 4th focal length；Wherein, third
Focal length is different from the 4th focal length.By taking lens as an example, according to the image-forming principle of optical lens, 1/f=1/u+1/v, wherein f is indicated
The focal length of lens, u indicate image distance, v expression thing away from.Since the distance between array of optical elements 222 and sensitive chip array 221 are
Certain, i.e., image distance u is certain, when third focal length and the 4th focal length difference, signal provided by the embodiment of the utility model
Identifying system can identify two imaging objects at different object distances, i.e., can identify simultaneously in same set of signal recognition system
Two objects at different object distances substantially improve the drawbacks of can only once identifying an object in existing blipology, mention
Rise signal recognition system performance.
It should be noted that the utility model embodiment only includes the first sensitive chip submatrix with sensitive chip array 221
221A and 221B is arranged, array of optical elements 222 includes the first optical element subarray 222A and the second optical element subarray
It is illustrated for 222B.It is understood that sensitive chip array 221 provided by the embodiment of the utility model can be with
Corresponding including multiple sensitive chip subarrays, array of optical elements 222 may include multiple optical element subarrays.When more
When a optical element subarray all has identical focal length, signal recognition system provided by the embodiment of the utility model can be simultaneously
The same signal is repeatedly identified, recognition accuracy is good；Or it is photosensitive using only an optical element subarray and one
Chip subarray identifies that signal recognition system is low in energy consumption to signal.When multiple optical element subarrays all have it is different
When focal length, signal recognition system provided by the embodiment of the utility model can simultaneously be identified multiple signals, improve signal
Identifying system function.
Explanation is needed further exist for, Fig. 9 is only with each first sensitive chip 2211A and each second sensitive chip
The setting of the interval 2211B, each first optical element 2221A and each second optical element 2221B be set to example into
Row exemplary illustration, it is to be understood that can also be multiple first sensitive chip 2211A and multiple second sensitive chips
The setting of the interval 2211B, multiple first optical element 2221A and the setting of multiple intervals second optical element 2221B, such as every two
First sensitive chip 2211A and the every two interval the second sensitive chip 2211B setting, every two the first optical element 2221A and
The setting of the every two interval the second optical element 2221B, the utility model embodiment is to this without limiting.
It should also be noted that, Fig. 9 is only with the first optical element subarray 222A and the second optical element subarray 222B
It is located on the same floor and is illustrated, it is possible to understand that, array of optical elements 222 provided by the embodiment of the utility model can also include
Multilayer optical device layer may include multilayer lens arrangement by taking lens as an example.Since multilayer lens arrangement includes being located at different layers
Lens, the object distance between the lens and imaging object of different layers is different, at the same the lens of different layers and sensitive chip 2211 it
Between image distance it is also different, no matter the lens of different layers focal length keep it is identical or different, it is provided by the embodiment of the utility model
Signal recognition system can guarantee to accurately identify.
Optionally, optical element 2221 provided by the embodiment of the utility model may include lens, imaging hole and collimation
At least one of device, i.e., optical element 2221 provided by the embodiment of the utility model can only include a type of optics member
Part, such as only include lens, perhaps only include aperture or only include collimator；It also may include at least two different types
Optical element combination, the combination of combination or lens, aperture and collimator for example including lens and aperture, this is practical
New embodiment is to this without limiting.
Optionally, display panel 21 provided by the embodiment of the utility model can be Organic Light Emitting Diode (Organic
Light-Emitting Diode, OLED) display panel can be with since organic LED display panel is not necessarily to backlight
Realize transparence display.First kind sensor array is arranged in the non-light emission side of OLED display panel, imaging object transmitting or
The light of person's reflection is incident to array of optical elements 222 after OLED display panel penetrates, and guarantees that array of optical elements 222 can connect
The light for receiving imaging object transmitting or reflection guarantees that image sensor array 22 can work normally.
The utility model embodiment additionally provides a kind of preparation method of signal recognition system, and as shown in Figure 10, this is practical
New embodiment provide preparation method may include:
S110, a display panel is provided.
Illustratively, display panel can be OLED display panel or the display surface of transparence display may be implemented in other
Plate.
S120, first kind sensor array, the first kind sensor are prepared in the non-light emission side of the display panel
Array includes image sensor array, and described image sensor array includes sensitive chip array and is located at the sensitive chip
The array of optical elements of the photosensitive side side of array.
Illustratively, sensitive chip array may include multiple sensitive chips being independently arranged, multiple senses being independently arranged
Optical chip is electrically connected to each other, and array of optical elements may include multiple optical elements being independently arranged, and each optical element with
Each sensitive chip is correspondingly arranged；Each optical element is used to receive the portions incident light of imaging object and by portion of incident light
Line imaging is on sensitive chip；Each sensitive chip is used to generate the portion size image of imaging object；Array of optical elements is used
In the whole incident rays for receiving imaging object and whole incident rays are imaged on sensitive chip array；Sensitive chip array
For generating the full size image of imaging object.
The preparation method of signal recognition system provided by the embodiment of the utility model is prepared in the non-light emission side of display panel
Image sensor array, image sensor array include sensitive chip array and array of optical elements, in array of optical elements
Optical element is correspondingly arranged with the sensitive chip in sensitive chip array, and each optical element receives the portions incident of imaging object
Portions incident light is simultaneously imaged on each sensitive chip by light, and each sensitive chip generates the parts of images of imaging object,
Array of optical elements receives whole incident rays of imaging object and whole incident rays is imaged on sensitive chip array；Sense
Optical chip array generates the full size image of the imaging object.By adjusting the focal length and array of optical elements of optical element
Spirit is arranged in the size of the distance between sensitive chip array, the size of adjustable each sensitive chip, each sensitive chip
It is living；The area coverage of each sensitive chip in sensitive chip array can also be reduced simultaneously, guarantee own in sensitive chip array
The sum of area coverage of sensitive chip is less than the area of the sensitive chip of whole face setting, saves the area coverage of sensitive chip, saves
The cost of sensitive chip is saved, and then saves the cost of signal recognition system.
Specifically, preparing first kind sensor array in the non-light emission side of display panel, first kind sensor is in array
Including image sensor array, image sensor array include sensitive chip array and be located at the photosensitive side one of sensitive chip array
The array of optical elements of side, comprising:
Semiconductor wafer is provided；
Using semiconductor wafer manufacturing technique, sensitive chip array, sensitive chip array packet are manufactured on a semiconductor wafer
Include multiple sensitive chips being independently arranged；
Array of optical elements is provided；
Array of optical elements and sensitive chip array are fitted and connected in the photosensitive side of sensitive chip array.
Illustratively, a silicon wafer is provided, using etching, polishing or other semiconductor devices systems in silicon wafer
Standby technique prepares to form multiple sensitive chips being independently arranged.Array of optical elements can be optical lens array, optics aperture
Array or collimator array, by taking optical lens array as an example, preparation method be can be on glass wafer, be infused using polyester
Modeling or photoetching process, manufacture obtain optical lens array.Obtained array of optical elements is placed on sensitive chip array sense
Light side, is fitted and connected using glueing material.Then again by the device junction including sensitive chip array and array of optical elements
Structure is cut, and obtains multiple independent devices including single sensitive chip and single optical element, each independent device is put
It sets in PCB or fanout encapsulation, becomes a complete image sensor array after electricity interconnection.
Perhaps it is to provide a silicon wafer in silicon wafer using etching, polishing or the preparation of other semiconductor devices
Technique prepares to form multiple sensitive chips being independently arranged, and then cuts to silicon wafer, obtains multiple sensitive chips, so
Single sensitive chip is aligned respectively afterwards be placed on pcb board or fanout encapsulation in, electricity interconnection after, then completion PCB or
The array of optical elements that one monolith of fitting includes multiple optical elements is aligned on fanout substrate again, forms imaging sensor battle array
Column.Optionally, the preparation method of signal recognition system provided by the embodiment of the utility model can also include preparing Second Type
Sensor array, second sensor array are electrically connected with first sensor array, guarantee that multidimensional may be implemented in signal recognition system
The fusion of heat transfer agent, promotion signal identifying system performance.
The utility model embodiment additionally provides a kind of electronic equipment, and the electronic equipment may include the utility model reality
The signal recognition system for applying example offer, has corresponding beneficial effect, which is not described herein again.Optionally, the utility model is implemented
Example provide electronic equipment equipment can for mobile phone, tablet computer, information enquiry machine or other need using signal identification system
The list equipment of system, the utility model embodiment will not enumerate.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation is readjusted, be combined with each other and is substituted without departing from the protection scope of the utility model.Therefore, although passing through
Above embodiments are described in further detail the utility model, but the utility model is not limited only to the above implementation
Example can also include more other equivalent embodiments in the case where not departing from the utility model design, and the utility model
Range is determined by the scope of the appended claims.
Claims (12)
1. a kind of signal recognition system characterized by comprising display panel and be located at the non-light emission side one of the display panel
The first kind sensor array of side；
The first kind sensor array includes image sensor array, and described image sensor array includes sensitive chip battle array
Column and the array of optical elements positioned at the photosensitive side side of the sensitive chip array；The sensitive chip array includes multiple only
The sensitive chip set is erected, multiple sensitive chips are electrically connected to each other, and the array of optical elements includes multiple is independently arranged
Optical element, and each optical element is correspondingly arranged with each sensitive chip；Each optical element is used for
It receives the portions incident light of imaging object and the portions incident light is imaged on the sensitive chip；Each sense
Optical chip is used to generate the portion size image of the imaging object；The array of optical elements is for receiving the imaging object
Whole incident rays and whole incident rays are imaged on the sensitive chip array；The sensitive chip array is used
In the full size image for generating the imaging object.
2. signal recognition system according to claim 1, which is characterized in that the signal recognition system further includes the second class
Type sensor array, the Second Type sensor array are electrically connected with the first kind sensor array.
3. signal recognition system according to claim 2, which is characterized in that the Second Type sensor array includes thunder
Up in sensor array, array of ultrasonic sensors, Ultraviolet sensor array, infrared array sensor and photosensitive sensor extremely
Few one kind.
4. signal recognition system according to claim 1, which is characterized in that the sensitive chip array includes at least first
Sensitive chip subarray and the second sensitive chip subarray；The array of optical elements includes at least the first optical element subarray
With the second optical element subarray；
The first sensitive chip subarray includes the first sensitive chip of multiple matrix arrangements, the second sensitive chip submatrix
Column include the second sensitive chip of multiple matrix arrangements；Along the direction of the sensitive chip array row, first sensitive chip
It is arranged with second sensitive chip interval, along the direction of the sensitive chip array column, first sensitive chip and described
The setting of second sensitive chip interval；
The first optical element subarray includes the first optical element of multiple matrix arrangements, the second optical element submatrix
Column include the second optical element of multiple matrix arrangements；Along the direction of the array of optical elements row, first optical element
It is arranged with second optical element interval；Along the direction of array of optical elements column, first optical element and described
The setting of second optical element interval；
Wherein, the first optical element subarray receives whole incident rays of the imaging object, the first photosensitive core
Sub-array generates the full size image of the imaging object；
The second optical element subarray receives whole incident rays of the imaging object, the second sensitive chip submatrix
The full size image of imaging object described in column-generation.
5. signal recognition system according to claim 4, which is characterized in that first optical element that is disposed adjacent and
There are overlapping parts for the incident ray of the received imaging object of second optical element.
6. signal recognition system according to claim 4, which is characterized in that first optical element has the first coke
Away from second optical element has the second focal length；
Wherein, first focal length is identical as second focal length.
7. signal recognition system according to claim 4, which is characterized in that first optical element has third coke
Away from second optical element has the 4th focal length；
Wherein, the third focal length is different from the 4th focal length.
8. signal recognition system according to claim 2, which is characterized in that the signal recognition system further includes at least one
A control circuit, the control circuit are electrically connected with each sensitive chip, are generated for controlling each sensitive chip
The portion size image of the imaging object controls the full size image that the sensitive chip array generates the imaging object.
9. signal recognition system according to claim 8, which is characterized in that the control circuit also with the Second Type
Sensor array electrical connection.
10. signal recognition system according to claim 1, which is characterized in that the optical element includes lens, imaging hole
And at least one of collimator.
11. signal recognition system according to claim 1, which is characterized in that the display panel is organic light-emitting diodes
Pipe display panel.
12. a kind of electronic equipment, which is characterized in that including such as signal recognition system of any of claims 1-11.
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| CN201821355852.2U CN208548352U (en) | 2018-08-22 | 2018-08-22 | A kind of signal recognition system and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899336A (en) * | 2018-08-22 | 2018-11-27 | 苏州多感科技有限公司 | A kind of signal recognition system and preparation method thereof, electronic equipment |
| CN108899336B (en) * | 2018-08-22 | 2024-04-30 | 苏州多感科技有限公司 | Signal identification system, preparation method thereof and electronic equipment |
-
2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899336A (en) * | 2018-08-22 | 2018-11-27 | 苏州多感科技有限公司 | A kind of signal recognition system and preparation method thereof, electronic equipment |
| CN108899336B (en) * | 2018-08-22 | 2024-04-30 | 苏州多感科技有限公司 | Signal identification system, preparation method thereof and electronic equipment |
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