CN108694360A - Fingerprint imaging module and electronic equipment - Google Patents
Fingerprint imaging module and electronic equipment Download PDFInfo
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- CN108694360A CN108694360A CN201710230582.6A CN201710230582A CN108694360A CN 108694360 A CN108694360 A CN 108694360A CN 201710230582 A CN201710230582 A CN 201710230582A CN 108694360 A CN108694360 A CN 108694360A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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Abstract
A kind of fingerprint imaging module and electronic equipment, including:Sensing face for receiving touch, and forms the imaging signal for carrying finger print information;Imaging arrangement obtains fingerprint image for acquiring the imaging signal, and according to the imaging signal;Pressure detection structure, for when the sensing face is touched, detecting the pressure in the sensing face.Technical solution of the present invention can realize that the fingerprint imaging module presses finger in sensing face the judgement of situation, be conducive to the raising of the fingerprint imaging module fingerprint recognition success rate.
Description
Technical field
The present invention relates to fingerprint imaging field, more particularly to a kind of fingerprint imaging module and electronic equipment.
Background technology
Fingerprint identification technology collects the fingerprint image of human body by fingerprint imaging sensor, then with fingerprint recognition system
In have fingerprint imaging information be compared, to realize identification.Due to the use of convenience and somatic fingerprint it is unique
Property, fingerprint identification technology have been widely used in every field, such as:The field of safety check such as public security bureau, customs, the gate inhibition system of building
System and the consumer product areas such as PC and mobile phone etc..
Imaging mode used by fingerprint identification technology has the multiple technologies such as optical profile type, condenser type, ultrasonic type.Wherein one
Kind is that the fingerprint image of human body is acquired by optical imagery module.Optical fingerprint imaging modules include mainly:Cover sheet, light
It learns sensor, integrated chip (IC), flexible PCB (FPC) and electronic device (including light source led) on flexible PCB, lead
The critical pieces such as tabula rasa, upper protection shell and lower protection shell.Wherein optical sensor is to utilize amorphous silicon film transistor
(a-Si TFT), low-temperature polysilicon film transistor (LTPS TFT) or oxide semiconductor thin-film transistor (OS TFT) etc. half
Semiconductor process technology, makes on the glass substrate;Later encapsulation is realized by processes such as cutting, dispensing, bondings.
But fingerprint imaging module in the prior art can not press situation to finger to be judged, to affect fingerprint
The success rate of identification.
Invention content
Problems solved by the invention is to provide a kind of fingerprint imaging module and electronic equipment, to judge that finger presses situation,
Improve fingerprint recognition success rate.
To solve the above problems, the present invention provides a kind of fingerprint imaging module, including:
Sensing face for receiving touch, and forms the imaging signal for carrying finger print information;Imaging arrangement, for acquiring
The imaging signal, and fingerprint image is obtained according to the imaging signal;Pressure detection structure, for the sensing face by
When touch, the pressure in the sensing face is detected.
Optionally, the pressure detection structure includes:It is close to be located at the sensing face for pressure signal layer and pressure sensitive layer
The side of the imaging arrangement, and the parallel sensing face relative spacing setting.
Optionally, the imaging arrangement includes:Backlight;The backlight is located at the pressure signal layer and the pressure
Between inductive layer.
Optionally, the imaging arrangement further includes:Optical image sensor, be located at the sensing face and the backlight it
Between, the optical image sensor has backwards to the back side of the sensing face, and the pressure signal layer covers the optical imagery
The back side of sensor;There is air layer between the backlight and the pressure signal layer.
Optionally, the imaging arrangement further includes:Optical image sensor, be located at the sensing face and the backlight it
Between, the optical image sensor has backwards to the back side of the sensing face, and the pressure signal layer covers the optical imagery
The back side of sensor;The backlight and the opposite fitting of the pressure signal layer;The pressure sensitive layer and the backlight it
Between have air layer.
Optionally, the pressure detection structure further includes:Support element is located at the pressure signal layer and the pressure sensitive
Between layer, for forming air layer between the pressure signal layer and the pressure sensitive layer.
Optionally, the thickness of the air layer is less than or equal to 50 μm.
Optionally, the pressure detection structure further includes:Filled layer is filled in the air layer.
Optionally, the pressure detection structure is between the sensing face and the imaging arrangement.
Optionally, distance is less than or equal to 1mm between the pressure signal layer and the pressure sensitive layer.
Optionally, the light transmittance of the pressure signal layer is greater than or equal to 40%.
Optionally, the pressure signal layer includes one or more signal strips, and the signal strips are in the parallel sensing face
Plane in be in square-wave-shaped or latticed setting.
Optionally, the pressure signal layer includes multiple blocks, and the multiple block is in the parallel sensing face
It is arranged in array in plane.
Optionally, the pressure detection structure includes:Lower casing;Multiple pressure-sensitive contacts are located at the lower casing and the sensing
Between face.
Optionally, the pressure detection structure is resistive pressure sensor.
Optionally, in the plane of the parallel sensing face, the multiple pressure-sensitive contact is arranged in array.
Optionally, the sensing face includes functional areas and detecting area, and the detecting area is located at the functional areas surrounding;It is described
Lower casing is located at the detecting area corresponding position;The multiple pressure-sensitive contact is located at the detecting area of the lower casing and the sensing face
Between.
Optionally, the imaging arrangement is optical profile type imaging arrangement;The imaging arrangement is located at the sensing face and described
Between pressure detection structure.
Optionally, the imaging arrangement is optical profile type imaging arrangement or condenser type imaging arrangement.
Optionally, the imaging arrangement is self-capacitance imaging arrangement or mutual capacitance imaging arrangement.
Optionally, the pressure detection structure and the imaging arrangement are by way of optical cement, UV glue or laser welding
Realize connection.
Correspondingly, the present invention also provides a kind of electronic equipment, including:The fingerprint imaging module of the present invention.
Optionally, the pressure detection structure is used to judge in the sensing face that the size of pressure and pressure to be distributed uniform
Property;The electronic equipment further includes:Alarm set is connected with the pressure detection structure, the mistake of pressure in the sensing face
Small or while being unevenly distributed, generates alerting signal, to increase pressure or improve uniformity.
Optionally, the alarm set includes display screen, for showing the alerting signal.
Compared with prior art, technical scheme of the present invention has the following advantages:
The pressure detection structure is used for when the sensing face is touched, and detects the pressure in the sensing face, root
According to the uniformity coefficient that the size of pressure in the sensing face and the pressure are distributed, finger in the sensing face can be pressed
Situation is judged.So the setting of the pressure detection structure can realize the fingerprint imaging module to finger in sensing face
The judgement for pressing situation, is conducive to the raising of the fingerprint imaging module fingerprint recognition success rate.
In alternative of the present invention, the imaging arrangement can be optical imagery structure, can also be capacitance imaging structure;
The pressure detection structure can be the capacitive pressure detecting structure for including pressure signal layer and pressure sensitive layer, can also be
Mechanical compression detecting structure including lower casing and multiple pressure-sensitive contacts.Therefore technical solution of the present invention can be in several ways
It realizes, advantageously reduces the fingerprint imaging module manufacture craft difficulty, be conducive to cost control.
In alternative of the present invention, the pressure detection structure and the imaging arrangement pass through optical cement, UV glue or laser
The mode of welding realizes connection.Therefore the fingerprint imaging module is not necessarily to that production can be completed to the larger change of existing producing line progress
It makes, without increase additional technique and cost.
Description of the drawings
Fig. 1 is a kind of cross-sectional view of fingerprint imaging module;
Fig. 2 is the structural schematic diagram when finger of fingerprint imaging module shown in Fig. 1 presses insufficient;
Fig. 3 is the cross-sectional view of fingerprint imaging module first embodiment of the present invention;
Fig. 4 is perspective view of the pressure signal layer in sensing face in the embodiment of fingerprint imaging module shown in Fig. 3;
Fig. 5 is the cross-sectional view of fingerprint imaging module second embodiment of the present invention;
Fig. 6 is that projection of the pressure signal layer in the sensing face described in the embodiment of fingerprint imaging module shown in Fig. 5 is shown
It is intended to;
Fig. 7 is perspective view of pressure signal layer described in third embodiment of the invention in the sensing face;
Fig. 8 is the cross-sectional view of fingerprint imaging module fourth embodiment of the present invention;
Fig. 9 is the cross-sectional view of the 5th embodiment of fingerprint imaging module of the present invention;
Figure 10 is the cross-sectional view of fingerprint imaging module sixth embodiment of the present invention;
Figure 11 is the overlooking structure diagram of pressure detection structure in the embodiment of fingerprint imaging module shown in Figure 10;
Figure 12 is pressure detection structure described in the 7th embodiment of fingerprint imaging module of the present invention in the sensing face
Perspective view;
Figure 13 is the structural schematic diagram of one embodiment of electronic equipment of the present invention.
Specific implementation mode
By background technology it is found that fingerprint imaging module in the prior art can not judge finger pressing situation, from
And affect the success rate of fingerprint recognition.
Influence of the situation to fingerprint recognition success rate is pressed in conjunction with a kind of structural analysis finger of fingerprint imaging module:
With reference to figure 1, a kind of cross-sectional view of fingerprint imaging module is shown.
As shown in Figure 1, the fingerprint imaging module is super-thin optical fingerprint imaging modules.The fingerprint imaging module
Be by photoelectricity transformation principle realize fingerprint imaging, including:Light source 11, the optics area array sensor on the light source 11
12 and the sensing face 13 on the optics area array sensor 12.
When acquiring fingerprint, finger 10 presses in sensing face 13;The incident light that light source 11 generates is projected to sensing face 13
On, reflection and refraction occur at the position that finger 10 is contacted with the sensing face 13, is formed by reflected light projects to optics
On area array sensor 12;Optics area array sensor 12 acquires the reflected light, and carries out opto-electronic conversion and signal processing, and realization refers to
The acquisition of print image.
Fingerprint imaging module shown in FIG. 1 can judge to whether there is in the sensing face 13 by touch sensor 14
Finger.The touch sensor 14 is typically to realize finger detection according to capacitance signal.Though so the fingerprint imaging module
It can so judge that finger whether there is, but can not judge the press condition of finger.
With reference to figure 2, the structural schematic diagram when finger of fingerprint imaging module shown in Fig. 1 presses insufficient is shown.
Only Toe Transplantation for Segmental Finger 20 pressing in the sensing face 13, although therefore the touch sensor 14 can judge institute
State in sensing face 13 that there are fingers, but the optics area array sensor 12 is only capable of collecting the part of fingerprint image, it is described
Information in the fingerprint image that optics area array sensor 12 is obtained is insufficient, None- identified.So the fingerprint imaging module without
Method judges finger pressing situation, affects the success rate of fingerprint recognition.
To solve the technical problem, the present invention provides a kind of fingerprint imaging module, passes through the pressure signal layer and institute
It states pressure sensitive layer and constitutes pressure detection structure, situation is pressed to finger in sensing face to make the fingerprint imaging module realize
Judgement, be conducive to the raising of fingerprint recognition success rate.
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
With reference to figure 3, the cross-sectional view of fingerprint imaging module first embodiment of the present invention is shown.
The fingerprint imaging module includes:
Sensing face 110 for receiving touch, and forms the imaging signal for carrying finger print information;Imaging arrangement 120 is used
Fingerprint image is obtained in the acquisition imaging signal, and according to the imaging signal;Pressure detection structure 130, for described
When sensing face 110 is touched, the pressure in the sensing face 110 is detected.
The pressure detection structure 130 is used for when the sensing face 110 is touched, and is detected in the sensing face 110
Pressure can be to the sensing according to the uniformity coefficient that the size of pressure in the sensing face 110 and the pressure are distributed
Finger pressing situation is judged on face 110.So the setting of the pressure detection structure 130 can realize the fingerprint imaging
Module presses finger in sensing face 110 judgement of situation, is conducive to carrying for the fingerprint imaging module fingerprint recognition success rate
It is high.
The sensing face 110 forms the imaging signal for carrying finger print information for receiving touch.
In the present embodiment, the fingerprint imaging module includes:Upper cover plate 111.The upper cover plate 111 is located at imaging knot
On structure 120 and the pressure detection structure 130, so the upper cover plate 111 is visited backwards to the imaging arrangement 120 and the pressure
The surface of geodesic structure 130 is the sensing face 110.The upper cover plate 111 is for providing the sensing face 110.
In addition, the upper cover plate 111 is additionally operable to protect the hardware of the fingerprint imaging module.Therefore the upper cover plate 111
Material need comparable hardness.Specifically, the material of the upper cover plate 111 can be glass, such as tempered glass.
The imaging arrangement 120 obtains the fingerprint image for acquiring the imaging signal, and according to the imaging signal
Picture.
In the present embodiment, the imaging arrangement 120 is optical profile type imaging arrangement, i.e., the described imaging signal is optical signal;Institute
Imaging arrangement 120 is stated for acquiring the optical signal, and the optical signal is converted into electric signal to obtain the fingerprint image
Picture.
So the imaging arrangement 120 includes:Light source, for generating incident light;The incident light is in the sensing face 110
It is upper to form the reflected light for carrying finger print information;Optical image sensor 121, the optical signal for acquiring the reflected light, and
The optical signal is converted into electric signal.
The light source is for generating incident light.
In the present embodiment, the light source is area source, including light emitting diode (not shown) and backlight 122.
The light emitting diode is for generating initial light.It is remote that the backlight 122 is located at the optical image sensor 121
Side from the sensing face 110;The initial light is projected into the backlight 122, is reflected to form through the backlight 122
The incident light of light distribution evenly;After optical image sensor 121 described in the incidence light transmission, it is projected to the sensing face
On 110.So the use of the backlight 122 can effectively improve the equalization of intensity of the incident light, be conducive to carry
The quality of high obtained fingerprint image.In other embodiments of the invention, the light source may be linear light source or point light source etc. its
The light source of his form.
The light source can be visible light source, or black light light source, therefore generated incident light can be with
For visible light, or black light.Specifically, the incident light can be black light, purple light, blue light, green
The colors such as light, sodium yellow, red light, near infrared light or white light.
The optical image sensor 121 realizes the photoelectricity of the reflected light optical signal for acquiring the reflected light
Conversion, to obtain the fingerprint image.
In the present embodiment, the fingerprint imaging module is ultrathin fingerprint imaging module, the optical image sensor 121
Between the sensing face 110 and the backlight 122;It is thrown after optical image sensor 121 described in the reflection light transmission
It is incident upon in the sensing face 110.
The optical image sensor 121 includes substrate (not indicated in figure), is located at the photosensitive layer in the substrate (in figure
Do not indicate) and the covering photosensitive layer encapsulated layer (not indicated in figure).
The substrate is for providing technological operation platform and playing mechanical support work in the optical image sensor 121
With the material of the substrate can be glass;The photosensitive layer includes sensor devices (such as light sensitive diode), described for acquiring
The optical signal of reflected light and the opto-electronic conversion for realizing the optical signal;The encapsulated layer is for realizing the photosensitive layer and extraneous ring
The isolation in border, the encapsulated layer can be the semiconductor films such as silicon oxide layer or silicon dioxide layer, and can also be optical cement etc. has
Machine film layer.
In other embodiments of the invention, the imaging arrangement may be condenser type imaging arrangement, i.e., the described imaging signal
For with the relevant electric signal of capacitance size;The imaging arrangement be used for part to be imaged constitute capacitance structure, formed with it is described
The corresponding electric signal of capacitance of capacitance structure, and the electric signal is acquired to obtain the fingerprint image.
The imaging arrangement can be self-capacitance imaging arrangement, or mutual capacitance imaging arrangement.It is tied in the imaging
When structure is self-capacitance imaging arrangement, the imaging arrangement includes perception pole plate, for constituting capacitance structure with the part to be imaged,
By the variation of capacitance between the perception pole plate and ground terminal, the electric signal for carrying finger print information is formed, to obtain
State fingerprint image;When the imaging arrangement is mutual capacitance structure imaging structure, the imaging arrangement includes:First perception pole plate
With the second perception pole plate, the first perception pole plate and the second perception pole plate with the part to be imaged for constituting electricity respectively
Hold structure, pole plate and the second perception pole plate and the part to be imaged capacitance structure between any two are perceived by described first
The variation of capacitance forms the electric signal for carrying finger print information, to obtain the fingerprint image.
The pressure detection structure 130 is used to sense the pressure in the sensing face 110, keeps the fingerprint imaging module real
The judgement for now pressing finger in sensing face 110 situation, so as to improve the fingerprint recognition success rate of the fingerprint imaging module.
As shown in figure 3, in the present embodiment, the pressure detection structure 130 is capacitive pressure detecting structure, including:Pressure
Force signal layer 131 and pressure sensitive layer 132 are located at the sensing face 110 close to the side of the imaging arrangement 120, and parallel
120 relative spacing of the sensing face is arranged.
It is isolated between the pressure signal layer 131 and the pressure sensitive layer 132, so as to form capacitance structure.
Between the pressure signal layer 131 and the pressure sensitive layer 132 capacitance of capacitance structure and the pressure signal layer 131 and
Distance is related between the pressure sensitive layer 132.Therefore when the sensing face 110 is touched, suffered by the sensing face 110
To pressure distance between the pressure signal layer 131 and the pressure sensitive layer 132 can be caused to change, so as to cause institute
Capacitance between pressure signal layer 131 and the pressure sensitive layer 132 is stated to change;According to the size of the capacitance and divide
Cloth situation can obtain the uniformity coefficient of the size of pressure suffered by the sensing face 110 and pressure distribution.
It should be noted that distance should not be too big between the pressure signal layer 131 and the pressure sensitive layer 132.Institute
If stated between pressure signal layer 131 and the pressure sensitive layer 132, distance is too big, is unfavorable for reducing the fingerprint imaging mould
Group volume is unfavorable for improving device integration, and distance between the pressure signal layer 131 and the pressure sensitive layer 132
It is too big, the capacitance of formed capacitance structure between the pressure signal layer 131 and the pressure sensitive layer 132 can be made too small,
It is unfavorable for improving sensitivity and the accuracy of the pressure detection structure 130.Specifically, in the present embodiment, the pressure signal
Distance is less than or equal to 1mm between layer 131 and the pressure sensitive layer 132.
In the present embodiment, the imaging arrangement 120 includes the backlight 122;The backlight 122 is located at the pressure
Between signals layer 131 and the pressure sensitive layer 132.
As shown in figure 3, the imaging arrangement 120 further includes between the sensing face 110 and the backlight 122
The optical image sensor 121, the optical image sensor 121 have backwards to the back side of the sensing face 110, the pressure
Force signal layer 131 covers the back side of the optical image sensor 121;The backlight 122 and the pressure signal layer 131 it
Between have air layer 133.
Specifically, the substrate of the optical image sensor 121 has two surfaces being disposed opposite to each other, towards the sensing
The photosensitive layer is formed on the surface in face 110, another surface is the back side of the optical image sensor 121;The pressure
Force signal layer 131 covers the back side.
Therefore the optical image sensor 121 is applied not only to the optical signal of acquisition reflected light, is additionally operable to as the pressure
The formation of signals layer 131 provides technological operation platform;When the sensing face 110 is depressed, the sensing face 110 and described
Optical image sensor 121 can deform upon, to realize the deformation of the pressure signal layer 131.
In the present embodiment, the backlight 122 have towards the sensing face 110 exit facet and with the exit facet phase
The bottom surface of the back of the body.In the bottom surface reflection occurs for the initial light to form the incident light, and the incident light is from the exit facet
Outgoing is emitted towards the sensing face 110.The pressure sensitive layer 132 fits on the bottom surface of the backlight 122.
Therefore the backlight 122 is not only for forming equally distributed incident light, is additionally operable to as the pressure sensitive layer
132 offer technological operation platform;When the sensing face 110 is depressed, the pressure signal layer 131 is with the sensing face
110 and the optical image sensor 121 when deforming upon together, the backlight 122 is not exposed to influence, the feeling of stress
Layer 132 is answered to maintain shape invariance, therefore the distance between the pressure sensitive layer 132 and the pressure signal layer 131 can be with
The deformation of the pressure signal layer 131 and change, so as to realize in sensing face 110 press situation detection.
The air layer 133 for realizing between the pressure signal layer 131 and the pressure sensitive layer 132 electricity every
From so as to form capacitance structure between the pressure signal layer 131 and the pressure sensitive layer 132;The air layer 133 is also used
Space is provided in the deformation for the pressure signal layer 131, to reduce by 131 deformation of pressure signal layer to the feeling of stress
The influence of layer 132 is answered, the precision of pressing situation detection can be effectively improved.
The thickness of the air layer 133 should not be too big.If 133 thickness of the air layer is too big, it is unfavorable for reducing institute
The volume for stating fingerprint imaging module is unfavorable for improving device integration, and 133 thickness of the air layer is too big, can make described
Distance is excessive between pressure signal layer 131 and the pressure sensitive layer 132, can cause the pressure signal layer 131 and the pressure
The capacitance of formed capacitance structure is too small between power inductive layer 132, is unfavorable for improving the sensitive of the pressure detection structure 130
Degree and accuracy.Specifically, in the present embodiment, the thickness of the air layer 133 is less than or equal to 50 μm.
It should be noted that as shown in figure 3, in the present embodiment, the pressure signal layer 131 is located at the backlight 122
Between the sensing face 110, pressure signal layer 131 can be just transmitted through in the sensing face 110 described in the incidence light transmission,
So the light transmittance of the pressure signal layer 131 should not be too small.If the light transmittance of the pressure signal layer 131 is too small, can
The light intensity of incident light in the sensing face 110 is influenced, the utilization rate of the incident light can be influenced, obtained fingerprint may be influenced
The quality of image, it is also possible to influence the energy consumption of the fingerprint imaging module.Specifically, in the present embodiment, the pressure signal
The light transmittance of layer 131 is greater than or equal to 40%.
In conjunction with reference to figure 4, showing throwing of the pressure signal layer in sensing face in the embodiment of fingerprint imaging module shown in Fig. 3
Shadow schematic diagram.
The pressure signal layer 131 includes one or more signal strips, and the signal strips are in the parallel sensing face 110
It is arranged in square-wave-shaped in plane.
Set the signal strips to the way of square-wave-shaped, by sense at the signal strips different location with the pressure
The sequencing of the relative size of capacitance and capacitance variation between inductive layer 132 judges to press in the sensing face 110
Uniformity and finger press the direction of action of the sensing face 110;It is poor that uniformity is pressed in the sensing face 110
When, prompt message (such as finger moving direction etc.) can be provided, to improve the uniform of pressure in the sensing face 110
Property, to improve the success rate of fingerprint recognition.Incident light can also be made to pass through in addition, setting the signal strips to the way of square-wave-shaped
It is not provided with pressure signal layer 131 described in the fractional transmission of signal strips, it is suitable so as to make the pressure signal layer 131 have
Light transmission, reduce the influence of 131 pairs of incident light of pressure signal layer, improve the quality of obtained fingerprint image.
It should be noted that in the present embodiment, the signal strips are in square-wave-shaped in the plane of the parallel sensing face 110
Setting.In other embodiments of the invention, the signal strips can also be in latticed set in the plane of the parallel sensing face 110
It sets.
With reference to figure 5, the cross-sectional view of fingerprint imaging module second embodiment of the present invention is shown.
The present embodiment is identical with the first embodiment place, and details are not described herein by the present invention.The present embodiment and first embodiment
The difference is that in the present embodiment, the air layer 233 be located at the backlight 222 and the pressure sensitive layer 232 it
Between.
In the present embodiment, the imaging arrangement 220 is also optical profile type imaging arrangement, including backlight 222 and positioned at described
Optical image sensor 221 between sensing face 210 and the backlight 222;The pressure signal layer 231 and the feeling of stress
Layer 232 is answered also to be located at 222 both sides of the backlight.
The optical image sensor 221 has backwards to the back side of the sensing face 210, and the pressure signal layer 231 covers
Cover the back side of the optical image sensor 221;The backlight 222 and the opposite fitting of the pressure signal layer 231;The pressure
There is air layer 233 between power inductive layer 232 and the backlight 222.
Specifically, the backlight 222 have towards the optical image sensor 221 exit facet and with it is described go out
The bottom surface that the face of penetrating is disposed opposite to each other, the exit facet of the backlight 222 and the pressure signal layer 231 are opposite to be bonded, the backlight
There is air layer 233 between the bottom surface of plate 222 and the pressure sensitive layer 232.
In the present embodiment, opposite fitting is realized by UV glue between the backlight 222 and the pressure signal layer 231.
Since UV glue has relatively good toughness and intensity, the backlight 222 and the pressure signal are realized using UV glue
The connection of layer 231, can effectively improve the stabilization and intensity connected between the two, especially in the pressure signal layer 231
In the case of deforming upon, UV glue has preferable toughness, can effectively improve the durability of the fingerprint imaging module.
And the connection of the backlight 222 and the pressure signal layer 231 is realized using UV glue, it can be described in guarantee
Between backlight 222 and the pressure signal layer 231 under the premise of bonding strength, reduce the thickness of UV glue, to be conducive to subtract
The thickness of few formed fingerprint imaging module is also beneficial to improve the pressure detection structure 230 and be visited to pressure in sensing face 210
The sensitivity of survey.Specifically, the thickness of the UV glue is less than or equal to 20 μm.
In conjunction with reference to figure 6, showing that pressure signal layer is in the sensing described in the embodiment of fingerprint imaging module shown in Fig. 5
Perspective view on face.
In the present embodiment, the pressure signal layer 231 includes multiple blocks, and the multiple block is in the parallel sense
It is arranged in array in the plane in survey face 210.Specifically, in the present embodiment, the pressure signal layer 231 includes 9 blocks, institute
State the array that 9 blocks constitute 3 × 3 in the plane of the parallel sensing face 210.
In the present embodiment, in the pressure signal layer 231, the shape of the block is rectangular.But the present invention other
In embodiment, the shape of the block may be diamond shape.As shown in fig. 7, showing described in third embodiment of the invention
Perspective view of the pressure signal layer in the sensing face.In the pressure signal layer 341, the shape of the block is water chestnut
Shape.The multiple diamond shape block is arranged in array.
It should be noted that the pressure signal layer whether includes the signal strips of square waveform or grid-shaped, still include
Multiple blocks of array arrangement, the pressure signal layer is engraved structure, and the incident light can be between signal strips
Or the gap between block transmits the pressure signal layer.But in other embodiments of the invention, the pressure signal layer
May be arranged as transparent oxide conductor, aluminium, silver etc. has the conductive material of translucency, to realize the saturating of the incident light
It penetrates.When the pressure signal layer is set as the conductive material with translucency, the pressure signal layer may be set to be
The shape in the region corresponding to sensing face described in all standing.
With reference to figure 8, the cross-sectional view of fingerprint imaging module fourth embodiment of the present invention is shown.
The present embodiment and previous embodiment something in common, details are not described herein by the present invention.The present embodiment and previous embodiment
The difference is that in the present embodiment, the pressure detection structure 430 further includes:Support element 434 is located at the pressure signal
Between layer 431 and the pressure sensitive layer 432, for the shape between the pressure signal layer 431 and the pressure sensitive layer 432
At air layer 433.
The support element 434 is between the pressure signal layer 431 and the pressure sensitive layer 432, to realize
The interval between pressure signal layer 431 and the pressure sensitive layer 432 is stated, in the pressure signal layer 431 and the feeling of stress
It answers and forms air layer 433 between layer 432, the deformation for the pressure signal layer 431 provides space, and realizes that the pressure is believed
Electric isolution number between floor 431 and the pressure sensitive floor 432.
In the present embodiment, the pressure detection structure 430 is located at the backlight 422 far from the optical image sensor
421 side, i.e., the described backlight 422 is between the pressure detection structure 430 and the optical image sensor 421.
Specifically, the pressure signal layer 431 covers the bottom surface of the backlight 422;The pressure sensitive layer 432 is believed with the pressure
The setting of number floor 431 interval;The support element 434 is between the pressure signal layer 431 and the pressure sensitive layer 432.
The material of the support element 434 needs the mechanical strength for having certain, metastable so as to form thickness
Air layer 433, the detection performance of the pressure detection structure 430 can be effectively improved by forming the air layer 433 of dimensionally stable.This
In embodiment, the material of the support element 434 is the epoxy resin for being mixed with rigid particles.Wherein, the rigid particles are silicon
One or both of ball and glass powder.
With reference to figure 9, the cross-sectional view of the 5th embodiment of fingerprint imaging module of the present invention is shown.
In the present embodiment, the pressure detection structure 530 further includes:Filled layer 534 is filled in the air layer (in figure
It is not shown) in.As shown in figure 9, in the pressure detection structure 530, the support element 533 is in 531 He of pressure signal layer
Air layer (not shown) is formed between the pressure sensitive layer 532;The full air layer of the filling of the filled layer 534.
Since the air layer needs the deformation for the pressure signal layer 531 to provide space, so described in order to reduce
Filled layer 534 impacts 531 deformation of pressure signal layer, and the material of the filled layer 534 needs the bullet for having certain
Property, it can realize deformation.In the present embodiment, the material of the filled layer 534 is epoxy resin.
It should be noted that in the present embodiment, the pressure detection structure 530 is located at the imaging arrangement 520 far from institute
State the side of sensing face 510, i.e., the described imaging arrangement 520 be located at the pressure detection structure 530 and the sensing face 510 it
Between.But in other embodiments of the invention, when the filled layer fills the air layer, therefore the pressure detection structure
With certain mechanical strength, comparable pressure can be born, the pressure detection structure may be located on the sensing face and
Between the optical image sensor.
When the pressure detection structure is between the sensing face and the imaging arrangement, the incident light needs to throw
The pressure detection structure is penetrated, therefore not only the pressure signal layer needs the translucency for having certain, the pressure sensitive layer
It is also required to that there is comparable translucency with the filled layer, so as to effectively improve the utilization rate of the incident light, is conducive to
The raising of fingerprint image quality is conducive to the reduction of the fingerprint imaging module energy consumption.
In the present embodiment, in order to reduce the thickness of the fingerprint imaging module, in the imaging arrangement 520, the light source
522 be point light source, such as light emitting diode.Specifically, the light source 522 is located at 521 side of the optical image sensor.This
Kind way can save the use of backlight, can effectively reduce the thickness of the fingerprint imaging module, be conducive to described in raising
The integrated level of electronic equipment.
In addition, the imaging arrangement 520 further includes:Stiffening plate 523 is located at the optical image sensor 521 backwards to institute
The side of sensing face 510 is stated, the pressure detection structure 530 is located at the stiffening plate 523 backwards to the optical image sensor
521 side.
The stiffening plate 523 plays the role of mechanical support in the imaging arrangement 520.Therefore the stiffening plate 523
Material needs have comparable mechanical strength, and under normal circumstances, the material of the stiffening plate 523 can be metal or plastics.
So the pressure detection structure 530 can by UV stickers together in the stiffening plate 523 backwards to the optical image sensor
521 surface.
In the present embodiment, the stiffening plate 523 is the bottom case of 520 protective shell of the imaging arrangement, that is to say, that the pressure
Power detecting structure 530 is connected with the bottom case of the imaging arrangement 520 by UV glue.When carrying out fingerprint sensing, with the sense
Survey face 510 is depressed, and the entire imaging arrangement 520 deforms upon, and then causes the deformation of the pressure signal layer 531,
To carry out pressure detection.
It should be noted that during due to fingerprint sensing, the entire imaging arrangement 520 can deform upon, in turn
Cause the deformation of the pressure signal layer 531, therefore the thickness of the imaging arrangement 520 should not be too big.The imaging arrangement 520
If thickness is too big, it is unfavorable for the deformation of the pressure signal layer 531, is unfavorable for the pressure detection structure 530 to described
The detection of pressure in sensing face 510.So in the present embodiment, the thickness of the pressure detection structure 530 is less than or equal to 1mm.
Specifically, the stiffening plate 523 is the bottom case of 520 protective shell of the imaging arrangement, so the stiffening plate 523 is carried on the back
It is the first face to the surface of the optical image sensor 521, the thickness of the imaging arrangement 520 is the stiffening plate 523
The distance between first face and the sensing face 510, i.e., between described 523 first face of stiffening plate and the sensing face 510 away from
From less than or equal to 1mm.
In above-described embodiment, the pressure detection structure is the condenser type pressure for including pressure signal layer and pressure sensitive layer
Power detecting structure obtains finger and presses situation by the detection to capacitance structure capacitance.But other embodiments of the invention
In, the pressure detection structure can also be mechanical compression detecting structure.
With reference to figure 10, the cross-sectional view of fingerprint imaging module sixth embodiment of the present invention is shown.
In the present embodiment, the pressure detection structure 630 is mechanical compression detecting structure, including:Lower casing 631;It is multiple
Pressure-sensitive contact 632, between the lower casing 631 and the sensing face 610.
The lower casing 631 in the pressure detection structure 630 for playing the role of mechanical support.In addition, the lower casing
631 part in the pressure detection structure 630 as protective shell is additionally operable to play the work of protection internal hardware devices
With.Since the lower casing 631 needs to play the role of mechanical processing procedure and protection, so the material of the lower casing 631 can be arranged
There is the material of suitable mechanical strength for plastics or metal etc..
The pressure-sensitive contact 632 is used to experience pressure, and related to pressure size according to the generation of the size of suffered pressure
Electric signal.In the present embodiment, the pressure detection structure 630 is resistive pressure sensor, i.e. the pressure-sensitive contact 632 exists
When being under pressure, the resistivity of the varistor 632 can change, therefore the pressure-sensitive contact 632 can be according to suffered
To the size of pressure, corresponding electric signal is generated, to reflection and 632 corresponding position sensing face 610 of the pressure-sensitive contact
The size of suffered pressure.
And the quantity of the pressure-sensitive contact 632 is multiple, is distributed in the plane of the parallel sensing face 610, each
Pressure-sensitive contact 632 can reflect the size of pressure suffered by corresponding position sensing face 610, so the multiple varistor
632 can reflect the distribution situation of pressure in the sensing face 610.
In conjunction with the plan structure for reference to figure 11, showing pressure detection structure in the embodiment of fingerprint imaging module shown in Figure 10
Schematic diagram.
In the present embodiment, in the plane of the parallel sensing face 610, the multiple pressure-sensitive contact 632 is arranged in array.Tool
Body, in the present embodiment, the pressure detection structure 630 includes 9 pressure-sensitive contacts 632, and 9 pressure-sensitive contacts 632 constitute 3
× 3 array.
During fingerprint sensing, the fingerprint imaging module can be according to position corresponding to 9 pressure-sensitive contacts 632 at
The size of pressure suffered by the sensing face 610 can obtain the size of pressure and pressure distribution feelings in the sensing face 610
Condition, to judge that finger presses situation in the sensing face 610;It can also be under pressure according to 9 pressure-sensitive contacts 632
Sequencing, judge the direction of motion of finger.
It should be noted that as shown in Figure 10 and Figure 11, in the present embodiment, the pressure detection structure 630 further includes outer
Frame 633 acts on for realizing protection packaging.
Specifically, the sensing face 610 includes central area and surrounds the fringe region of the central area, it is described pressure-sensitive
Contact 632 is located between the fringe region and the lower casing 631 of the sensing face 610, and the outer rim 633 is located at the sensing
Between the fringe region in face 610 and the lower casing 631.
It is connected in addition, the outer rim 633 is additionally operable to realize with the imaging arrangement 620.In the present embodiment, the imaging
Structure 620 is between the sensing face 610 and the pressure detection structure 630, so the outer rim 630 and the imaging
Structure 620 is connected backwards to the one side contact of the sensing face 610.
The pressure detection structure 630 and the imaging arrangement 620 can pass through OCA glue (Optically Clear
Adhesive), the mode of UV glue or laser welding realizes connection.In the present embodiment, the outer rim of the pressure detection structure 630
633 contact with the realization of the stiffening plate of the imaging arrangement 620 622 by way of laser welding it is connected.
It should be noted that in the present embodiment, the imaging arrangement 620 is condenser type imaging arrangement, the imaging arrangement
620 between the pressure detection structure 630 and the sensing face 610, to reduce the manufacture of the fingerprint imaging module
Technology difficulty is conducive to cost control.But the present invention does not limit the position of the pressure detection structure.The present invention other
Imaging arrangement is in the embodiment of condenser type imaging arrangement, and it is separate that the imaging arrangement can also be located at the pressure detection structure
The side of the sensing face, i.e., the described pressure detection structure is between the sensing face and the imaging arrangement.But due to
The pressure detection structure is usual and opaque, so in other embodiments of the invention, the imaging arrangement is optical profile type
When imaging arrangement, the pressure detection structure is located at side of the imaging arrangement far from the sensing face, i.e., the described imaging knot
Structure is between the pressure detection structure and the sensing face, to avoid the pressure detection structure from influencing the imaging knot
Acquisition of the structure to optical signal.
In addition, in the present embodiment, the lower casing 631 of the pressure detection structure 630 and the shape phase of the sensing face 610
Together, therefore the pressure-sensitive contact 632 can be distributed in the range of region corresponding to the sensing face 610.But the present invention its
In his embodiment, the pressure-sensitive contact can also only be distributed in the position at the sensing face edge.
As shown in figure 12, show that pressure detection structure is described described in the 7th embodiment of fingerprint imaging module of the present invention
Perspective view in sensing face.
In the present embodiment, the sensing face 710 includes functional areas 711 and detecting area 712, and the detecting area 712 is located at institute
State 711 surrounding of functional areas;The lower casing 731 is located at 712 corresponding position of the detecting area;The multiple pressure-sensitive contact 732
Between the lower casing 731 and the detecting area of the sensing face 710 712.
Specifically, the sensing face 710 is rectangular, the functional areas 711 are rectangular, and the detecting area 712 is located at described
711 surrounding of functional areas is in " Qian " shape;In the plane of the parallel sensing face 710, the lower casing 731 is also in " Qian " shape, described
Projection in sensing face 710 is Chong Die with the detecting area 712.
The multiple pressure-sensitive contact 732 is located on the lower casing 731, be located at the lower casing 731 and the sensing face 710 it
Between, so projection of the pressure-sensitive contact 732 in the sensing face 710 is located in the detecting area 712.
It is usually integrated in due to fingerprint imaging module at the position of electronic equipment button, so by the pressure detection structure
730 are set as the way of " Qian ", can provide space for the setting of electronic equipment button, to be conducive to the fingerprint imaging mould
Group is integrated with electronic equipment button.
Correspondingly, the present invention also provides a kind of electronic equipment.With reference to figure 13, one embodiment of electronic equipment of the present invention is shown
Structural schematic diagram.The electronic equipment includes:Fingerprint imaging module 810 of the present invention.
The fingerprint imaging module 810 is for acquiring fingerprint image.The fingerprint imaging module 810 be fingerprint of the present invention at
As module, specific technical solution refers to the specific embodiment of aforementioned fingerprint imaging modules, and details are not described herein by the present invention.The electricity
Sub- equipment carries out fingerprint recognition according to 810 obtained fingerprint image of the fingerprint imaging module.
When finger pressing is in the sensing face, the imaging arrangement acquires imaging signal and obtains fingerprint image;Together
When, the pressure detection structure detects pressure in the sensing face, size and pressure for judging pressure in the sensing face
The uniformity of distribution, and pressing situation of the finger in the sensing face is judged according to the size of the pressure or uniformity coefficient.
In the present embodiment, the electronic equipment further includes:Alarm set 820 is connected with the pressure detection structure, in institute
It states the too small of pressure in sensing face or generates alerting signal when being unevenly distributed, to increase pressure or improve uniformity.
Specifically, as shown in figure 13, the electronic equipment is the portable electronic devices such as mobile phone or tablet computer.So institute
It includes display screen to state alarm set 820, for showing the alerting signal.The display screen can show text information, image
Various types of information such as information, animation information, to make pressing situation of user's adjustment to fingerprint imaging module sensing face,
The size of pressure and uniformity coefficient in the sensing face is set to reach requirement, to improve the success rate of the fingerprint recognition.
To sum up, the pressure detection structure is used for when the sensing face is touched, and detects the pressure in the sensing face
Power can be to the sensing face left-hand seat according to the uniformity coefficient that the size of pressure in the sensing face and the pressure are distributed
Refer to pressing situation to be judged.So the setting of the pressure detection structure can realize the fingerprint imaging module to sensing face
The judgement of upper finger pressing situation, is conducive to the raising of the fingerprint imaging module fingerprint recognition success rate.Moreover, the present invention can
It selects in scheme, the imaging arrangement can be optical imagery structure, can also be capacitance imaging structure;The pressure detection structure
It can be the capacitive pressure detecting structure for including pressure signal layer and pressure sensitive layer, can also be including lower casing and multiple pressures
The mechanical compression detecting structure of quick contact.Therefore technical solution of the present invention can be accomplished in several ways, and be advantageously reduced
The fingerprint imaging module manufacture craft difficulty, is conducive to cost control.In addition, in alternative of the present invention, the pressure is visited
Geodesic structure and the imaging arrangement realize connection by way of optical cement, UV glue or laser welding.Therefore the fingerprint imaging
Module is not necessarily to that the larger change of existing producing line progress can be completed and manufactures, without increase additional technique and cost.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (24)
1. a kind of fingerprint imaging module, which is characterized in that including:
Sensing face for receiving touch, and forms the imaging signal for carrying finger print information;
Imaging arrangement obtains fingerprint image for acquiring the imaging signal, and according to the imaging signal;
Pressure detection structure, for when the sensing face is touched, detecting the pressure in the sensing face.
2. fingerprint imaging module as described in claim 1, which is characterized in that the pressure detection structure includes:
Pressure signal layer and pressure sensitive layer are located at the sensing face close to the side of the imaging arrangement, and the parallel sense
The relative spacing setting of survey face.
3. fingerprint imaging module as claimed in claim 2, which is characterized in that the imaging arrangement includes:Backlight;
The backlight is between the pressure signal layer and the pressure sensitive layer.
4. fingerprint imaging module as claimed in claim 3, which is characterized in that the imaging arrangement further includes:Optical imagery passes
Sensor, between the sensing face and the backlight, the optical image sensor has the back of the body backwards to the sensing face
Face, the pressure signal layer cover the back side of the optical image sensor;
There is air layer between the backlight and the pressure signal layer.
5. fingerprint imaging module as claimed in claim 3, which is characterized in that the imaging arrangement further includes:Optical imagery passes
Sensor, between the sensing face and the backlight, the optical image sensor has the back of the body backwards to the sensing face
Face, the pressure signal layer cover the back side of the optical image sensor;
The backlight and the opposite fitting of the pressure signal layer;
There is air layer between the pressure sensitive layer and the backlight.
6. fingerprint imaging module as claimed in claim 2, which is characterized in that the pressure detection structure further includes:Support element,
Between the pressure signal layer and the pressure sensitive layer, for the pressure signal layer and the pressure sensitive layer it
Between form air layer.
7. the fingerprint imaging module as described in claim 4,5 or 6, which is characterized in that the thickness of the air layer is less than or waits
In 50 μm.
8. the fingerprint imaging module as described in claim 4,5 or 6, which is characterized in that the pressure detection structure further includes:It fills out
Layer is filled, is filled in the air layer.
9. fingerprint imaging module as claimed in claim 8, which is characterized in that the pressure detection structure is located at the sensing face
Between the imaging arrangement.
10. fingerprint imaging module as claimed in claim 2, which is characterized in that the pressure signal layer and the pressure sensitive
Distance is less than or equal to 1mm between layer.
11. fingerprint imaging module as claimed in claim 4, which is characterized in that the light transmittance of the pressure signal layer be more than or
Equal to 40%.
12. fingerprint imaging module as claimed in claim 11, which is characterized in that the pressure signal layer includes one or more
Signal strips, the signal strips are in square-wave-shaped or latticed setting in the plane of the parallel sensing face.
13. fingerprint imaging module as claimed in claim 11, which is characterized in that the pressure signal layer includes multiple signals
Block, the multiple block are arranged in array in the plane of the parallel sensing face.
14. fingerprint imaging module as described in claim 1, which is characterized in that the pressure detection structure includes:Lower casing;It is more
A pressure-sensitive contact, between the lower casing and the sensing face.
15. fingerprint imaging module as claimed in claim 14, which is characterized in that the pressure detection structure is resistive pressure
Sensor.
16. fingerprint imaging module as claimed in claim 14, which is characterized in that described in the plane of the parallel sensing face
Multiple pressure-sensitive contacts are arranged in array.
17. fingerprint imaging module as claimed in claim 14, which is characterized in that the sensing face includes functional areas and detection
Area, the detecting area are located at the functional areas surrounding;
The lower casing is located at the detecting area corresponding position;
The multiple pressure-sensitive contact is between the lower casing and the detecting area of the sensing face.
18. fingerprint imaging module as claimed in claim 14, which is characterized in that the imaging arrangement is optical profile type imaging knot
Structure;The imaging arrangement is between the sensing face and the pressure detection structure.
19. fingerprint imaging module as described in claim 1, which is characterized in that the imaging arrangement is optical profile type imaging arrangement
Or condenser type imaging arrangement.
20. fingerprint imaging module as claimed in claim 19, which is characterized in that the imaging arrangement is self-capacitance imaging arrangement
Or mutual capacitance imaging arrangement.
21. fingerprint imaging module as described in claim 1, which is characterized in that the pressure detection structure and imaging knot
Structure realizes connection by way of optical cement, UV glue or laser welding.
22. a kind of electronic equipment, which is characterized in that including:Such as claim 1 to claim 21 any one claim institute
The fingerprint imaging module stated.
23. electronic equipment as claimed in claim 22, which is characterized in that the pressure detection structure is for judging the sensing
The uniformity of the size of pressure and pressure distribution on face;
The electronic equipment further includes:Alarm set is connected with the pressure detection structure, the mistake of pressure in the sensing face
Small or while being unevenly distributed, generates alerting signal, to increase pressure or improve uniformity.
24. electronic equipment as claimed in claim 23, which is characterized in that the alarm set includes display screen, for showing
The alerting signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710230582.6A CN108694360A (en) | 2017-04-10 | 2017-04-10 | Fingerprint imaging module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710230582.6A CN108694360A (en) | 2017-04-10 | 2017-04-10 | Fingerprint imaging module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108694360A true CN108694360A (en) | 2018-10-23 |
Family
ID=63842371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710230582.6A Pending CN108694360A (en) | 2017-04-10 | 2017-04-10 | Fingerprint imaging module and electronic equipment |
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| CN (1) | CN108694360A (en) |
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| CN109558799A (en) * | 2018-10-26 | 2019-04-02 | 国微集团(深圳)有限公司 | A kind of fingerprint collecting method and device, the product using the fingerprint acquisition device |
| CN110210390A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint collecting mould group, fingerprint collecting method and terminal |
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Application publication date: 20181023 |