CN208539326U - A kind of mobile terminal and Laser emission mould group - Google Patents
A kind of mobile terminal and Laser emission mould group Download PDFInfo
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- CN208539326U CN208539326U CN201821118305.2U CN201821118305U CN208539326U CN 208539326 U CN208539326 U CN 208539326U CN 201821118305 U CN201821118305 U CN 201821118305U CN 208539326 U CN208539326 U CN 208539326U
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- laser emission
- mould group
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- laser
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Abstract
The utility model discloses a kind of Laser emission mould group, it includes mounting base (100), laser diffuser plate (200) and Laser emission chip (300), the mounting base (100) has installation space, the installation space has top opening, the laser diffuser plate (200) is mounted in the top opening, and accommodating chamber (400) are formed with the installation space, the Laser emission chip (300) is arranged in the accommodating chamber (400), and it is mounted on bottom surface opposite with the top opening in the installation space, the mounting base (100) includes the mounting surface for being fixedly linked with circuit board, the mounting surface is provided with mounting groove (110), heat-sensitive material layer (500) are provided in the mounting groove (110).Above scheme can reduce the size of Laser emission mould group and improve the temperature detecting precision to Laser emission mould group.A kind of mobile terminal is also disclosed in the utility model.
Description
Technical field
The utility model relates to mobile terminal design technology field more particularly to a kind of mobile terminals and Laser emission mould
Group.
Background technique
With advances in technology, at present smart phone entered into 3D face unlock the epoch, it is contemplated that soon there will be
More mobile terminals can feel Detection Techniques deeply using 3D to realize that 3D face unlocks.3D feels Detection Techniques deeply in the process of realization
In need to install laser reflection mould group on mobile terminals, Laser emission mould group at work can be invisible to using object to emit
Light, then the infrared camera on mobile terminal calculates the depth information for using object according to the reflected light information received, most
Recognition of face is realized according to depth information eventually.
In the actual working process, the peak power of Laser emission mould group and exomonental frequency are usually higher,
And then a large amount of heat can be generated, this part heat is unfavorable for the steady operation of Laser emission mould group, it is therefore necessary to Laser emission
The temperature of mould group is measured in real time, to facilitate the transmission power and tranmitting frequency that adjust Laser emission mould group.Referring to FIG. 1,
Thermistor 102 and Laser emission chip 103 are laid usually in the mounting base 101 of Laser emission mould group at present, passes through detection
The change in resistance of thermistor 102 carrys out the temperature change of indirect gain Laser emission mould group.The setting of thermistor 102 is being installed
The inside of seat 101, the overall dimensions that will lead to Laser emission mould group increase.With the inner space increasingly office of mobile terminal
Promote, the larger installation being unfavorable on mobile terminals of the size of Laser emission mould group.
For this purpose, referring to FIG. 2, heat is arranged in current mobile terminal usually except the mounting base 201 of Laser emission mould group
Quick resistance 202, Laser emission chip 203 is then arranged within mounting base 201, but thermistor 202 is arranged in mounting base 201
Except will affect detection accuracy to temperature.
Utility model content
The utility model discloses a kind of Laser emission mould group, is sent out with reducing the size of Laser emission mould group and improving laser
Penetrate the temperature detecting precision of mould group.
To solve the above-mentioned problems, the utility model adopts the following technical solutions:
A kind of Laser emission mould group comprising mounting base, laser diffuser plate and Laser emission chip, the mounting base have
Installation space, the installation space have top opening, the laser diffuser plate be mounted in the top opening and with it is described
Installation space forms accommodating chamber, and the Laser emission chip is arranged in the accommodating chamber and is mounted in the installation space
On the bottom surface opposite with the top opening, the mounting base includes the mounting surface for being fixedly linked with circuit board, the peace
Dress face is provided with mounting groove, is provided with heat-sensitive material layer in the mounting groove.
A kind of mobile terminal comprising described in any item Laser emission mould groups above.
The technical solution adopted in the utility model can reach it is following the utility model has the advantages that
In Laser emission mould group disclosed by the utility model, mounting groove is set in mounting base, then in mounting groove middle berth
If heat-sensitive material layer, the temperature of Laser emission mould group is obtained by the change in resistance of heat-sensitive material layer.Due to heat-sensitive material layer
It is laid in the mounting groove in mounting base, therefore can only occupy a part of space of mounting base itself, therefore not will increase sharp
The volume of light emitting mould group.At the same time, heat-sensitive material layer setting is formed by space in mounting base itself, and Laser emission
Chip is mounted in mounting base, and therefore, the distance between heat-sensitive material layer and Laser emission chip are smaller, and then can be more accurate
The temperature of ground induction Laser emission mould group.As it can be seen that Laser emission mould group disclosed by the utility model can reduce Laser emission mould
It the size of group and improves to the temperature detecting precision of Laser emission mould group.
Detailed description of the invention
Attached drawing described herein is used to provide a further understanding of the present invention, and constitutes one of the utility model
Point, the exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the utility model
Improper restriction.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of Laser emission mould group disclosed in the prior art；
Fig. 2 is the structural schematic diagram of another kind Laser emission mould group disclosed in the prior art；
Fig. 3 is the structural schematic diagram of Laser emission mould group disclosed in the utility model embodiment.
Description of symbols:
101- mounting base, 102- thermistor, 103- Laser emission chip；
201- mounting base, 202- thermistor, 203- Laser emission chip；
100- mounting base, 110- mounting groove, 120- metal electrical connection section, 130- pad, 200- laser diffuser plate, 300- swash
Light emitting chip, 400- accommodating chamber, 500- heat-sensitive material layer, 600- resistance detection pin.
Specific embodiment
It is specific below in conjunction with the utility model to keep the purpose of this utility model, technical solution and advantage clearer
Technical solutions of the utility model are clearly and completely described in embodiment and corresponding attached drawing.Obviously, described embodiment
It is only the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field
Those of ordinary skill's every other embodiment obtained without making creative work, belongs to the utility model
The range of protection.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment of the utility model is described in detail.
Referring to FIG. 3, the utility model embodiment discloses a kind of Laser emission mould group, disclosed Laser emission mould group packet
Include mounting base 100, laser diffuser plate 200, laser reflection chip 300 and heat-sensitive material layer 500.
Mounting base 100 has installation space, and installation space has top opening, and laser diffuser plate 200 is mounted on top and opens
Accommodating chamber 400 is formed on mouth and with installation space, Laser emission chip 300 is arranged in accommodating chamber 400.A kind of specific reality
It applies in mode, top opening can have step supporting surface, and laser diffuser plate 200 can be overlapped on step supporting surface and lead to
Glue-line is crossed to be adhesively fixed with step supporting surface.
During installation, Laser emission chip 300 is mounted on the installation space of mounting base 100 by top opening
In, then laser diffuser plate 200 is mounted on top opening, and then realizes the closure to installation space, and form accommodating chamber 400.
At work, the black light (such as infrared light) that Laser emission chip 300 issues projects after penetrating laser diffuser plate 200.Swash
Light emitting chip 300 is mounted on bottom surface opposite with top opening in installation space.
During assembling, Laser emission mould group is installed on circuit boards, and circuit board can be hard circuit board, can also
Think flexible circuit board.Mounting base 100 includes the mounting surface being fixedly linked for circuit board.Mounting groove is offered on mounting surface
110, heat-sensitive material layer 500 is provided in mounting groove 110.In order to facilitate detection, resistance can be set on heat-sensitive material layer 500
Detect pin 600.Specifically, the quantity of resistance detection pin 600 can be at least two.In general, resistance detection pin 600 is
Two, two resistance detection pins 600 may be considered two electric connecting terminals, during detection, detection device and two
Resistance detection pin 600 is electrically connected, and the detection to 500 resistance of heat-sensitive material layer can be realized, thus according to heat-sensitive material layer 500
Obtain the temperature of Laser emission mould group.Certainly, it can also be not provided with resistance detection pin 600 on heat-sensitive material layer 500, detected
It during resistance variations, can realize in other manners, for example, the detection terminal of detection device is directly in electrical contact in heat
In quick material layer 500.
It should be noted that according to the resistance variations of heat-sensitive material layer 500 obtain the temperature of Laser emission mould group with it is existing
The mechanism that resistance variations in technology according to thermistor obtain the temperature of Laser emission mould group is identical, is the prior art,
This is then repeated no more.
In Laser emission mould group disclosed in the utility model embodiment, mounting groove is set on the mounting surface of mounting base 100
110, then heat-sensitive material layer 500 is set in mounting groove 110, laser is obtained by the change in resistance of heat-sensitive material layer 500
The temperature of emitting mould train.Since heat-sensitive material layer 500 is arranged in the mounting groove 110 in mounting base 100, can only occupy
A part of space of mounting base 100 itself, therefore not will increase the volume of Laser emission mould group.At the same time, heat-sensitive material layer
500 settings itself are formed by space in mounting base 100, and Laser emission chip 300 is mounted in mounting base 100, therefore,
The distance between heat-sensitive material layer 500 and Laser emission chip 300 are smaller, and then can relatively accurately incude Laser emission mould group
Temperature.As it can be seen that Laser emission mould group disclosed in the utility model embodiment can reduce the size of Laser emission mould group and mention
Temperature detecting precision of the height to Laser emission mould group.
In addition, Laser emission mould group disclosed in the present embodiment includes heat-sensitive material layer 500, heat-sensitive material layer 500 is directly used
The slot bottom of mounting groove 110 is arranged in thermo-sensitive material, without other processing, and the prior art then use thermistor this at
The detection of type product progress temperature.It will be apparent that the setting of heat-sensitive material layer 500 can undoubtedly reduce the manufacture of Laser emission mould group at
This.
In preferred scheme, mounting groove 110 and Laser emission chip 300 are positioned opposite, in such cases, mounting groove 110
Interior heat-sensitive material layer 500 can preferably incude the heat generated when Laser emission chip 300 works.
In a kind of specific embodiment, Laser emission chip 300 may be mounted in installation space with top opening phase
Pair bottom surface on.In such cases, mounting groove 110 and Laser emission chip 300 are respectively positioned on mounting base 100 close to the one of mounting surface
On end, be conducive to the induction of heat-sensitive material layer 500.In preferred scheme, Laser emission chip 300 and mounting groove 110 are with respect to cloth
It sets, to realize the positioned opposite of Laser emission chip 300 and heat-sensitive material layer 500.Above-mentioned assembling mode can not only be improved and be led
The thermal efficiency, but also facilitate laying of the subsequent entire Laser emission mould group on the circuit board of mobile terminal.
Laser emission chip 300 can form gap between the bottom surface of installation space, still, in order to enable thermo-sensitive material
The heat that the preferably induction Laser emission chip 300 of layer 500 generates, the bottom surface phase patch of Laser emission chip 300 and installation space
It sets, and then the heat that Laser emission chip 300 can be made to occur is conducted through mounting base 100 to heat-sensitive material layer 500 quickly
In.
Laser emission chip 300 realizes work after needing energization, and there are many modes powered to Laser emission chip 300.
In a kind of specific embodiment, metal electrical connection section 120, metal electrical connection section can be set on the bottom wall of installation space
120 are electrically connected with Laser emission chip 300, and pad 130, pad 130 and metal can be equipped on the mounting surface of mounting base 100
Electrical connection section 120 is electrically connected.During installation, the mounting surface of mounting base 100 is fixed in mobile terminal by pad 130
Circuit board (usually mainboard) on, circuit board passes sequentially through pad 130 and metal electrical connection section 120 to Laser emission chip
300 power supplies.Pad 130 can play the role of fixed laser emitting mould train, and can also play electrical connection.
Metal electrical connection section 120 can be set between Laser emission chip 300 and heat-sensitive material layer 500.Metal is electrically connected
Socket part 120 is made of metal material, metal material be conducive to it is thermally conductive, therefore, in above-mentioned laying mode, metal electrical connection section 120
Not only play the role of electrical connection, and auxiliary heat conduction can also be played, Laser emission chip 300 is enabled to generate
Heat is conducted to quickly on heat-sensitive material layer 500.
In the utility model embodiment, metal electrical connection section 120 can be made of the good metal material of heating conduction.
In a kind of specific embodiment, metal electrical connection section 120 can be copper electrical connection section.
Metal electrical connection section 120 can be mounted in mounting base 100 using various ways, a kind of specific embodiment
In, open up fluted on the bottom wall of installation space, metal electrical connection section 120 is fixed in a groove.
Metal electrical connection section 120 is usually two (respectively cathode metal electrical connection section and negative metal electrical connection section),
Two metal electrical connection sections 120 are distributed across in mounting base 100.Two metal electrical connection sections 120 respectively with corresponding weldering
Disk 130 is electrically connected.In a kind of specific embodiment, the quantity of pad 130 can be two, and two pads 130 are laid respectively
In the notch two sides of mounting groove 110.
Based on Laser emission mould group disclosed in the utility model embodiment, the utility model embodiment discloses a kind of mobile whole
End, disclosed mobile terminal may include Laser emission mould group described above.
Mobile terminal disclosed in the utility model embodiment can be the shifting such as smart phone, tablet computer, wearable device
Dynamic terminal device, the specific type of the utility model embodiment not limiting mobile terminal.
Emphasis describes the difference between each embodiment in the utility model foregoing embodiments, between each embodiment
As long as different optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, this then no longer
It repeats.
The above description is only the embodiments of the present invention, is not intended to limit the utility model.For this field
For technical staff, various modifications and changes may be made to the present invention.All institutes within the spirit and principle of the utility model
Any modification, equivalent substitution, improvement and etc. of work, should be included within the scope of the claims of the utility model.
Claims (10)
1. a kind of Laser emission mould group, which is characterized in that including mounting base (100), laser diffuser plate (200) and Laser emission core
Piece (300), the mounting base (100) have installation space, and the installation space has top opening, the laser diffuser plate
(200) it is mounted in the top opening and forms accommodating chamber (400) with the installation space, the Laser emission chip
(300) it is arranged in the accommodating chamber (400) and is mounted on bottom surface opposite with the top opening in the installation space
On, the mounting base (100) includes the mounting surface for being fixedly linked with circuit board, and the mounting surface is provided with mounting groove
(110), heat-sensitive material layer (500) are provided in the mounting groove (110).
2. Laser emission mould group according to claim 1, which is characterized in that the mounting groove (110) and the laser are sent out
Core shooting piece (300) is positioned opposite.
3. Laser emission mould group according to claim 2, which is characterized in that be provided on the heat-sensitive material layer (500)
Resistance detection pin (600).
4. Laser emission mould group according to claim 1, which is characterized in that be provided with gold on the bottom surface of the installation space
Belong to electrical connection section (120), the metal electrical connection section (120) is electrically connected with the Laser emission chip (300), the mounting surface
On be equipped with pad (130), the pad (130) is electrically connected with the metal electrical connection section (120), and the pad is for fixing
Connect the mounting surface and the circuit board.
5. Laser emission mould group according to claim 4, which is characterized in that the Laser emission chip (300) with it is described
The bottom surface opposite with the top opening is affixed arrangement in installation space.
6. Laser emission mould group according to claim 4, which is characterized in that metal electrical connection section (120) setting exists
Between the Laser emission chip (300) and the heat-sensitive material layer (500).
7. Laser emission mould group according to claim 4, which is characterized in that the metal electrical connection section (120) is copper electricity
Interconnecting piece.
8. Laser emission mould group according to claim 4, which is characterized in that offered on the bottom surface of the installation space recessed
Slot, the metal electrical connection section (120) are fixed in the groove.
9. a kind of mobile terminal, which is characterized in that including Laser emission mould group of any of claims 1-8.
10. mobile terminal according to claim 9, which is characterized in that the mobile terminal is smart phone, tablet computer
Or wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821118305.2U CN208539326U (en) | 2018-07-13 | 2018-07-13 | A kind of mobile terminal and Laser emission mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821118305.2U CN208539326U (en) | 2018-07-13 | 2018-07-13 | A kind of mobile terminal and Laser emission mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208539326U true CN208539326U (en) | 2019-02-22 |
Family
ID=65387517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821118305.2U Active CN208539326U (en) | 2018-07-13 | 2018-07-13 | A kind of mobile terminal and Laser emission mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208539326U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110873636A (en) * | 2020-01-19 | 2020-03-10 | 常州纵慧芯光半导体科技有限公司 | Temperature control test fixture of laser emission module |
| CN112666776A (en) * | 2019-09-29 | 2021-04-16 | 宁波舜宇光电信息有限公司 | Transmission module, manufacturing method thereof, depth information acquisition module and electronic equipment |
-
2018
- 2018-07-13 CN CN201821118305.2U patent/CN208539326U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112666776A (en) * | 2019-09-29 | 2021-04-16 | 宁波舜宇光电信息有限公司 | Transmission module, manufacturing method thereof, depth information acquisition module and electronic equipment |
| CN110873636A (en) * | 2020-01-19 | 2020-03-10 | 常州纵慧芯光半导体科技有限公司 | Temperature control test fixture of laser emission module |
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