CN208538855U - A kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead - Google Patents
A kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead Download PDFInfo
- Publication number
- CN208538855U CN208538855U CN201821000928.XU CN201821000928U CN208538855U CN 208538855 U CN208538855 U CN 208538855U CN 201821000928 U CN201821000928 U CN 201821000928U CN 208538855 U CN208538855 U CN 208538855U
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- Prior art keywords
- lead frame
- control
- lamp bead
- dc5v
- patch type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The utility model discloses a kind of DC5V to drive single-point single control breakpoint transmission patch type integration packaging lamp bead, including lead frame, LED wafer, control IC and controller, the surface of lead frame is closely fitted with metal conducting layer, insertion is connected with conducting resinl between metal conducting layer and lead frame, the intermediate position of lead frame is fixedly connected with close to the upper surface of metal conducting layer controls IC, the side of lead frame is provided with LED wafer, the hollow out position insertion of lead frame is connected with protective rubber, this kind of DC5V drives single-point single control breakpoint transmission patch type integration packaging lamp bead, solves patch type integration packaging lamp bead signal serially single defect in the application, it is serial that traditional single signal is serially upgraded into dual signal, to reduce the use influence that signal transmission brings application, by way of toasting protective rubber, it can To cover in conductor wire and LED wafer, and protective layer is formed, improves the service life of DV5V driving.
Description
Technical field
The invention belongs to a kind of LED package lamp bead technical field, specially a kind of DC5V drives single-point single control breakpoint
Resume patch type integration packaging lamp bead.
Background technique
Patch type integration packaging lamp bead full name is semiconductor light-emitting-diode, using made of semiconductor material, Ke Yizhi
It connects and converts electrical energy into luminous energy, electricity number is converted into the luminescent device of optical signal;Its main feature is that low in energy consumption, high brightness, it is beautiful in colour,
The advantages that anti-vibration, service life length, cold light source, be real " green illumination ".Exist by the lamp decoration product of light source of light emitting diode
In the future of 21 century, necessarily replace incandescent lamp, becomes the revolution again of mankind's illumination.
Existing light emitting diode patch type drives lamp bead with IC integration packaging DC5V is controled, and signal is using single line string
Row cascade will lead to since abnormal point, subsequent lamp bead cannot be just when the input of any point signal or output end exception
Often work.
So how to design a kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead by lead frame,
It currently to be solved the problems, such as us.
Summary of the invention
The purpose of this utility model is to provide a kind of DC5V to drive single-point single control breakpoint transmission patch type integration packaging lamp
Pearl is by lead frame, to solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides the following technical solutions: a kind of DC5V driving single-point single control breakpoint is continuous
Patch type integration packaging lamp bead is passed, including lead frame, LED wafer, controls IC and controller, the table of the lead frame
Face is closely fitted with metal conducting layer, and insertion is connected with conducting resinl, the lead frame between the metal conducting layer and lead frame
Intermediate position be fixedly connected with close to the upper surface of metal conducting layer and control IC, the metal conducting layer and described control between IC
It is electrically connected with conductor wire, the side of the lead frame is provided with LED wafer, and the hollow out position of the lead frame is embedding
Enter and be connected with protective rubber, the inside for controling IC is electrically connected with controller, and the side of the controller is electrically connected with disconnected
Point resumes patch.
Further, the DC5V drives single-point single control breakpoint transmission patch type integration packaging lamp bead by lead frame, shines
Diode wafer, conductor wire, conducting resinl, protective rubber control IC composition, and the driving voltage value for controling IC answers drive environment that can float
Dynamic range is between 2.5-7.5V, and LED wafer can be the LED wafer of any 1-3 kind color, and
Control dual signal input port built in IC.
Further, the LED wafer is fixedly connected with controling IC and pass through conducting resinl with metal conducting layer,
And diode wafer is fixedly connected with controling IC and pass through metal conducting layer with lead frame.
Further, the intermediate position for controling IC and being fixed on lead frame by protective rubber, and control IC and led with metal
Electric layer fits closely.
Compared with prior art, the utility model has the beneficial effects that this kind of DC5V driving single-point single control breakpoint transmission patch
Chip integration packaging lamp bead solves the defect of patch type integration packaging lamp bead single signal serially in the application, by conventional lights
The controling built in IC of periphery is arranged in pearl, and light-emitting diodes tube passage realizes constant current, without any peripheral resistor in
Part, controling built-in dual signal input port above IC, to realize, dual signal is transmitted between pixel, is reduced signal transmission and is brought application
Using influence, interior envelope controls the prefabricated dual signal input port IC, and it is serial that traditional single signal is serially upgraded to dual signal, with
Reducing signal transmission and bringing the use of application influences, and LED wafer and is controled by way of high-temperature baking conducting resinl
IC is bonded on lead frame, according to circuit requirement ultrasonic wire welding machine by the electrode of light emitting diode, control IC port and
The conducting end of lead frame is welded, and the protective rubber in lead frame, can be brilliant by conductor wire and light emitting diode by way of baking
Piece covers in, and forms protective layer, improves the service life of DV5V driving.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram;
Fig. 2 is that the utility model controls IC enlarged diagram;
Fig. 3 is the application circuit schematic diagram of the utility model.
In figure: 1, lead frame, 2, metal conducting layer, 3, LED wafer, 4, conductor wire, 5, control IC, 6, protection
Glue, 7, conducting resinl, 8, controller, 9, breakpoint transmission patch.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of DC5V driving single-point single control breakpoint transmission patch
Chip integration packaging lamp bead, including lead frame 1, LED wafer 3, IC5 and controller 8 are controled, the surface of lead frame 1 is tight
Close to be fitted with metal conducting layer 2, insertion is connected with conducting resinl 7, the centre of lead frame 1 between metal conducting layer 2 and lead frame 1
Position is fixedly connected with close to the side of metal conducting layer 2 and controls IC5, and metal conducting layer 2 and controling is electrically connected between IC5
Conductor wire 4, the side of lead frame 1 are provided with LED wafer 3, and the hollow out position insertion of lead frame 1 is connected with protective rubber
6, the inside for controling IC5 is electrically connected with controller 8, and the side of controller 8 is electrically connected with breakpoint transmission patch 9.
Further, DC5V drives single-point single control breakpoint transmission patch type integration packaging lamp bead by lead frame 1, light-emitting diodes
Pipe chip 3, conductor wire 4, conducting resinl 7, protective rubber 6 and IC5 composition is controled, and the driving voltage value for controling IC5 answers drive environment
Relocatable range is between 2.5-7.5V, and LED wafer 3 can be the light emitting diode crystalline substance of any 1-3 kind color
Piece 3, and dual signal input port built in IC5 is controled, it by the conducting end of lead frame 1, LED wafer 3 and is driven with conductor wire 4
Control IC5 is mutually connected in series, and by controling the prefabricated dual signal input port IC5, it is serial that single signal serially upgrades to dual signal, with
Reduce the use influence that signal transmission brings application.
Further, LED wafer 3 is fixedly connected with controling IC5 and pass through conducting resinl 7 with metal conducting layer 2,
And diode wafer 3 is fixedly connected with controling IC5 and pass through metal conducting layer 2 with lead frame 1, the metal conducting layer 2 of lead frame 1
It is upper by LED wafer 3 and to control IC5 by conducting resinl 7 and be bonded on lead frame 1 by predetermined position, and pass through high temperature baking
Roasting conducting resinl 7 fixes it, then uses ultrasonic wire welding machine by the electrode of light emitting diode according to circuit requirement, controls IC5
Port and lead frame 1 conducting end welding, then the protective rubber 6 in lead frame 1 can be brilliant by conductor wire 4 and light emitting diode
Piece 3 is covered with IC5 is controled, and makes its solidification by way of toasting protective rubber 6, to form protective layer.
Further, it controls IC5 and the intermediate position of lead frame 1 is fixed on by protective rubber 6, and control IC5 and led with metal
Electric layer 2 fits closely, and traditional lamp bead can be arranged in controling built in IC5 for periphery, realizes DC5V driving, and light-emitting diodes
Tube passage realizes constant current, and without any peripheral resistance device in application, and is controling dual signal input port built in IC5, with reality
Dual signal is transmitted between phenomenon element, reduces the use influence that signal transmission brings application.
Working principle: firstly, this kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead is installed and used,
It is by lead frame 1, LED wafer 3, conductor wire 4, conducting resinl 7, protective rubber 6 and controls IC5 and forms, shown in
DC5V is only the representative value of driving voltage value, not fixed value, and driving voltage value answers the relocatable range of drive environment in 2.5-
Between 7.5V, LED wafer 3 is not limited to tri- kinds of colors of RGB, can be the light emitting diode of any 1-3 kind color
Chip controls IC5 with single-point single control, breakpoint transmission and three road light-emitting diodes pipe port constant current functions, then, on lead frame 1
Metal conducting layer 2 by LED wafer 3 and control IC5 by conducting resinl 7 and be bonded in 1 predetermined position of lead frame, go forward side by side
Row high-temperature baking is fixed, and is used ultrasonic wire welding machine by light-emitting diodes pipe electrode according to circuit requirement and controled the port of IC5
The conducting end of electrode and lead frame 1 is welded, and the protective rubber 6 in lead frame 1 can be by conductor wire 4 and LED wafer
3 cover with IC5 is controled, and make its solidification by way of toasting protective rubber 6, so that protective layer is formed, finally, periphery is driven
It controls built in IC5 device, realizes DC5V driving, and light-emitting diodes tube passage realizes constant current, and without any peripheral resistance in application
Device, and the dual signal input port built in IC5 is being controled, dual signal is transmitted between pixel may be implemented, to reduce signal transmission belt
It is influenced to the use of application, here it is the work of this kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead is former
Reason.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of DC5V drives single-point single control breakpoint transmission patch type integration packaging lamp bead, including lead frame (1), light emitting diode
Chip (3) controls IC(5) and controller (8), it is characterised in that: the surface of the lead frame (1) is closely fitted with metallic conduction
Layer (2), insertion is connected with conducting resinl (7) between the metal conducting layer (2) and lead frame (1), in the lead frame (1)
Between position be fixedly connected with close to the upper surface of metal conducting layer (2) control IC(5), the metal conducting layer (2) controls with described
IC(5 it is electrically connected between) conductor wire (4), the side of the lead frame (1) is provided with LED wafer (3), described
Lead frame (1) hollow out position insertion be connected with protective rubber (6), it is described to control IC(5) inside be electrically connected with controller
(8), the side of the controller (8) is electrically connected with breakpoint transmission patch (9).
2. a kind of DC5V according to claim 1 drives single-point single control breakpoint transmission patch type integration packaging lamp bead, special
Sign is: the DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead is brilliant by lead frame (1), light emitting diode
Piece (3), conductor wire (4), conducting resinl (7), protective rubber (6) and control IC(5) composition, and control IC(5) driving voltage value answer
The relocatable range of drive environment is between 2.5-7.5V, and LED wafer (3) can be the hair of any 1-3 kind color
Optical diode chip (3), and control IC(5) built in dual signal input port.
3. a kind of DC5V according to claim 1 drives single-point single control breakpoint transmission patch type integration packaging lamp bead, special
Sign is: the LED wafer (3) and control IC(5) by the fixed company of conducting resinl (7) and metal conducting layer (2)
Connect, and diode wafer (3) with control IC(5) be fixedly connected by metal conducting layer (2) with lead frame (1).
4. a kind of DC5V according to claim 1 drives single-point single control breakpoint transmission patch type integration packaging lamp bead, special
Sign is: described to control IC(5) it is fixed on the intermediate position of lead frame (1) by protective rubber (6), and control IC(5) and metal
Conductive layer (2) fits closely.
Priority Applications (1)
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CN201821000928.XU CN208538855U (en) | 2018-06-27 | 2018-06-27 | A kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead |
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CN201821000928.XU CN208538855U (en) | 2018-06-27 | 2018-06-27 | A kind of DC5V driving single-point single control breakpoint transmission patch type integration packaging lamp bead |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111106226A (en) * | 2020-01-20 | 2020-05-05 | 深圳市天成照明有限公司 | LED lamp bead with internal IC |
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2018
- 2018-06-27 CN CN201821000928.XU patent/CN208538855U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111106226A (en) * | 2020-01-20 | 2020-05-05 | 深圳市天成照明有限公司 | LED lamp bead with internal IC |
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