CN208507675U - Display and display device - Google Patents
Display and display device Download PDFInfo
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- CN208507675U CN208507675U CN201821267928.6U CN201821267928U CN208507675U CN 208507675 U CN208507675 U CN 208507675U CN 201821267928 U CN201821267928 U CN 201821267928U CN 208507675 U CN208507675 U CN 208507675U
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Abstract
A kind of display, including drive substrate and use wafer process driver circuit of the light emitting diode of integral production and use integrated circuit technology integral production in drive substrate in drive substrate, driver circuit is electrically connected with light emitting diode, driver circuit includes the first row driver circuit, the second row drive wire road and column drive wire road and the gold thread that processing driving signal is realized by pilot spacing and line width, the first row driver circuit, the second row drive wire road and column drive wire road are electrically connected with gold thread respectively, and gold thread is electrically connected with light emitting diode.The display of the utility model can substantially reduce production cost, improve production efficiency.The utility model further relates to a kind of display device.
Description
Technical field
The utility model relates to technical field of LED display, in particular to a kind of display and display device.
Background technique
Common display is often LCD display at present, and more advantage is OLED display, but LCD display and
The OLED display service life is short, is unable to satisfy demand.Compared to LCD display and OLED display, MicroLED display has
The features such as high efficiency, high brightness, fast high-reliability and reaction time, and have the characteristic that self-luminous is not necessarily to backlight, more save
Can, the advantages such as mechanism is simple, small in size, slim.
The processing procedure of currently used Micro light-emitting diode display includes three categories:
(1) chip-scale is welded, i.e., LED is directly carried out to the Micro LEDchip (film containing epitaxy for being cut into micron grade
And substrate), using SMT technology or COB technology, display base plate is bonded in by Micro LEDchip mono- one of micron grade
On.
(2) extension grade is welded, i.e., uses inductive couple plasma ion(ic) etching (ICP) in the epitaxy film layer of LED, directly
The Micro-LED epitaxy membrane structure of micron grade is formed, the constant spacing of this structure is spacing needed for display pixel, then
LED wafer (containing epitaxial layer and substrate) is directly bonded to finally remove using physically or chemically mechanism in drive circuit substrate
Substrate only remains 4~5 microns of Micro-LED epitaxy membrane structures in forming display pixel in drive circuit substrate.
(3) film shifts, i.e., removes LED substrate using physically or chemically mechanism, thin with temporary substrate carrying LED epitaxial growth
Film layer recycles inductive couple plasma ion(ic) etching, forms the Micro-LED epitaxy membrane structure of micron grade；Alternatively, first
Using inductive couple plasma ion(ic) etching, the Micro-LED epitaxy membrane structure of micron grade is formed, physics or change are reused
Mechanism removes LED substrate, carries LED epitaxial growth membrane structure with a temporary substrate.Finally, according to required in drive circuit substrate
Display draw vegetarian refreshments spacing, using selective transfer tool, Micro LED epitaxial growth membrane structure is subjected to batch and is turned
It moves, is bonded in drive circuit substrate and forms display pixel.
But the complex process of above-mentioned production Micro light-emitting diode display, higher cost, and producing efficiency is low.
Utility model content
In view of this, the present invention provides a kind of displays, can substantially reduce production cost, improve production efficiency.
A kind of display, including drive substrate and using the light emitting diode of wafer process integral production in drive substrate
And the driver circuit using integrated circuit technology integral production in drive substrate, driver circuit are electrically connected with light emitting diode
It connects, driver circuit includes the first row driver circuit, the second row that processing driving signal is realized by pilot spacing and line width
Driver circuit and column drive wire road and gold thread, the first row driver circuit, the second row drive wire road and column drive wire road respectively with
Gold thread electrical connection, gold thread are electrically connected with light emitting diode.
In the embodiments of the present invention, above-mentioned drive substrate includes viewing area and wiring region, the light emitting diode
With gold thread setting in the viewing area, the first row driver circuit, the second row drive wire road and the setting of column drive wire road
In the wiring region.
In the embodiments of the present invention, above-mentioned wiring region includes the first row wiring region, the second row wiring region and Lie Bu
Line area, the first row wiring region are oppositely arranged with second row wiring region, and the viewing area is located at the first row wiring
Between area, the second row wiring region and column wiring area；The first row driver circuit is arranged in the first row wiring region, described
Second row drive wire road is arranged in second row wiring region, and the column drive wire road is arranged in the column wiring area.
In the embodiments of the present invention, above-mentioned the first row driver circuit, the second row drive wire road and column drive wire road
It is parallel with one another.
In the embodiments of the present invention, aforementioned display device further includes circuit board, the circuit board be equipped with it is described
Multiple golden fingers of driver circuit electrical connection.
In the embodiments of the present invention, foregoing circuit plate is flexible circuit board.
In the embodiments of the present invention, the size of above-mentioned light emitting diode is 1 micron to 100 microns.
In the embodiments of the present invention, aforementioned display device is Micro light-emitting diode display.
The utility model also provides a kind of display device, including at least one above-mentioned display.
The display of the utility model includes drive substrate and the hair using wafer process integral production in drive substrate
Optical diode and the driver circuit for using integrated circuit technology integral production in drive substrate, driver circuit and light-emitting diodes
Pipe electrical connection, driver circuit include the first row driver circuit that processing driving signal is realized by pilot spacing and line width,
Second row drive wire road and column drive wire road and gold thread, the first row driver circuit, the second row drive wire road and column drive wire road
It is electrically connected respectively with gold thread, gold thread is electrically connected with light emitting diode.The display of the utility model avoid be fabricated separately it is luminous
Diode and the process for welding light emitting diode one by one, can substantially reduce production cost, improve production efficiency.
Detailed description of the invention
Fig. 1 is the partial structural diagram of the display of the utility model.
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
The embodiment of type is further described.
First embodiment
Fig. 1 is the partial structural diagram of the display of the utility model.As shown in Figure 1, display 100 includes driving base
Plate 10 and circuit board 20.It is Micro light-emitting diode display in the display 100 of the present embodiment.
There is the multiple layer of production light emitting diode 12 and driver circuit 13, such as structure sheaf is extremely in drive substrate 10
It less include one layer of metal layer, glue-line, silicon dioxide layer, indium tin oxide layer (ITO), luminescent layer, N-type layer, P-type layer etc., wherein gold
Belonging to coating is titanium tungsten copper, silver, copper, nobelium, platinum, nickel, gold etc., but is not limited thereto.In the present embodiment, by using wafer work
Skill integral production light emitting diode 12 and use integrated circuit technology system in drive substrate 10 in drive substrate 10
Make driver circuit 13, such as wafer is cleaned, is aoxidized, chemical deposition, film, exposure, development, etching, ion implantation, gold
Belong to the techniques such as sputter, completes the production of multiple light emitting diodes 12 and its driver circuit 13, that is to say, that 12 He of light emitting diode
Driver circuit 13 is to make to be formed directly in drive substrate 10.Therefore, the display 100 of the utility model is compared to existing
Display 100 avoids and light emitting diode 12 is fabricated separately, makes the soldered ball of driving circuit and one by one by light emitting diode 12
Metal pad and driving circuit ball bond process, can substantially reduce production cost, improve production efficiency.
Further, drive substrate 10 includes viewing area 101 and wiring region 102.Viewing area 101 is located at drive substrate 10
Intermediate region, light emitting diode 12 are arranged in viewing area 101, to realize luminescence display.Wiring region 102 is located at drive substrate 10
Neighboring area, the setting of driver circuit 13 is in viewing area 101 and wiring region 102, and driver circuit 13 and light emitting diode 12 are electrically
Connection, row scanning electric signal and column scan electric signal can light light emitting diode 12 after 13 working process of driver circuit.
Wiring region 102 includes the first row wiring region 102a, the second row wiring region 102b and column wiring area 102c.The first row wiring region 102a
It is oppositely arranged with the second row wiring region 102b, the first row wiring region 102a and the second row wiring region 102b are located at drive substrate
10 left and right sides, and be arranged along the width direction of drive substrate 10.Column wiring area 102c be located at the first row wiring region 102a,
One end of second row wiring region 102b, column wiring area 102c is arranged along the length direction of drive substrate 10, and viewing area 101
Between the first row wiring region 102a, the second row wiring region 102b and column wiring area 102c.
Further, driver circuit 13 includes the first row driver circuit 13a, the second row drive wire road 13b, column drive wire road
13c and gold thread (not shown).The first row driver circuit 13a, the second row drive wire road 13b and column drive wire road 13c are parallel with one another
Setting, wherein the first row driver circuit 13a and the second row drive wire road 13b drives electric signal, column driving for working process row
Route 13c is for working process column driving electric signal, and gold thread is to be transferred to light emitting diode for the electric signal after working process
12, light emitting diode 12 is lighted in realization.Preferably, the size of the light emitting diode 12 is 1 micron to 100 microns.The
A line driver circuit 13a, the second row drive wire road 13b and column drive wire road 13c are electrically connected with gold thread respectively, gold thread and luminous two
Pole pipe 12 is electrically connected；The first row driver circuit 13a be arranged in the 102a of the first row wiring region, the first row driver circuit 13a along
The width direction of drive substrate 10 is arranged.Second row drive wire road 13b is arranged in the second row wiring region 102b, the driving of the second row
Route 13b is arranged along the width direction of drive substrate 10.Column drive wire road 13c is arranged in column wiring area 102c, column driving
Route 13c is arranged along the length direction of drive substrate 10.Gold thread is arranged in viewing area 101.In the present embodiment, pass through control
The first row driver circuit 13a, the wire spacing of the second row drive wire road 13b and column drive wire road 13c and line width realize that processing is driven
Dynamic signal can save driving IC, reduce production cost.
Circuit board 20 is equipped with the multiple golden fingers being electrically connected with driver circuit 13 for transmitting control signal, circuit board 20
22, each golden finger 22 is spaced apart from each other setting, and one end of each golden finger 22 is electrically connected with circuit board 20, the other end of each golden finger 22
It is electrically connected with driver circuit 13.Only have route and golden finger on circuit board 20, without electronic component.In the present embodiment, circuit
Plate 20 is flexible circuit board (FlexiblePrinted Circuit；FPC), but it is not limited thereto.
The display 100 of the utility model is including drive substrate 10 and uses wafer process system in drive substrate 10
The light emitting diode 12 of work and the driver circuit 13 for using integrated circuit technology integral production in drive substrate 10 drive line
Road 13 is electrically connected with light emitting diode 12, and driver circuit 13 includes realizing processing driving signal by pilot spacing and line width
The first row driver circuit 13a, the second row drive wire road 13b and column drive wire road 13c and gold thread, the first row driver circuit
13a, the second row drive wire road 13b and column drive wire road 13c are electrically connected with gold thread respectively, and gold thread is electrically connected with light emitting diode 12
It connects.The display 100 of the utility model, which avoids, to be fabricated separately light emitting diode 12 and welds light emitting diode 12 one by one
Process can substantially reduce production cost, improve production efficiency.
Moreover, the display 100 of the utility model is not necessarily to back light system, what can be done is thinner, autonomous part without driving IC
It shines, light source everywhere, extremely power saving can be adjusted in real time with picture, beautiful in colour, dynamic contrast is high.
The utility model further relates to a kind of display device, and the display device includes above-mentioned one or more displays
100, the fixed mechanism of control device and fixed display, the structure about display device please refer to the prior art, herein not
It repeats again.It should be noted that the display device of the utility model designs for no device, production cost can be substantially reduced.
The utility model be not limited to the above embodiment in detail, in the range of the technology design of the utility model
It is interior, a variety of simple variants can be carried out to the technical solution of the utility model, these simple variants belong to the utility model
Protection scope.Specific technical features described in the above specific embodiments, in the case of no contradiction, Ke Yitong
Any suitable way is crossed to be combined.In order to avoid unnecessary repetition, the utility model is to various combinations of possible ways
No further explanation will be given.
Claims (9)
1. a kind of display, which is characterized in that including drive substrate (10) and using wafer process in the drive substrate (10)
The light emitting diode (12) and use integrated circuit technology integral production on the drive substrate (10) of upper integral production
Driver circuit (13), the driver circuit (13) are electrically connected with the light emitting diode (12), and the driver circuit (13) includes
The first row driver circuit (13a) of processing driving signal, the second row drive wire road are realized by pilot spacing and line width
(13b) and column drive wire road (13c) and gold thread, the first row driver circuit (13a), the second row drive wire road (13b) and
(13c) is electrically connected with the gold thread respectively on column drive wire road, and the gold thread is electrically connected with the light emitting diode (12).
2. display as described in claim 1, which is characterized in that the drive substrate (10) includes viewing area (101) and cloth
Line area (102), the light emitting diode (12) and the gold thread are arranged in the viewing area (101), first row drive wire
Road (13a), the second row drive wire road (13b) and column drive wire road (13c) are arranged in the wiring region (102).
3. display as claimed in claim 2, which is characterized in that the wiring region (102) includes the first row wiring region
(102a), the second row wiring region (102b) and column wiring area (102c), the first row wiring region (102a) and second row
(102b) is oppositely arranged for wiring region, and the viewing area (101) is located at the first row wiring region (102a), the second row wiring region
Between (102b) and column wiring area (102c)；The first row driver circuit (13a) is arranged in the first row wiring region
In (102a), second row drive wire road (13b) setting is in second row wiring region (102b), the column drive wire road
(13c) setting is in the column wiring area (102c).
4. display as described in claim 1, which is characterized in that the first row driver circuit (13a), the second row drive wire
Road (13b) and column drive wire road (13c) are parallel with one another.
5. the display as described in Claims 1-4 any one, which is characterized in that the display further includes circuit board
(20), the circuit board (20) is equipped with the multiple golden fingers (22) being electrically connected with the driver circuit (13).
6. display as claimed in claim 5, which is characterized in that the circuit board (20) is flexible circuit board.
7. display according to claim 1, which is characterized in that the light emitting diode size is 1 micron to 100
Micron.
8. display according to claim 1, which is characterized in that the display is Micro light-emitting diode display.
9. a kind of display device, which is characterized in that including display described at least one claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821267928.6U CN208507675U (en) | 2018-08-07 | 2018-08-07 | Display and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821267928.6U CN208507675U (en) | 2018-08-07 | 2018-08-07 | Display and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507675U true CN208507675U (en) | 2019-02-15 |
Family
ID=65300210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821267928.6U Active CN208507675U (en) | 2018-08-07 | 2018-08-07 | Display and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208507675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063270A (en) * | 2019-12-30 | 2020-04-24 | 錼创显示科技股份有限公司 | Micro light emitting device display device |
-
2018
- 2018-08-07 CN CN201821267928.6U patent/CN208507675U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063270A (en) * | 2019-12-30 | 2020-04-24 | 錼创显示科技股份有限公司 | Micro light emitting device display device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |