CN208485955U - A kind of chemical nickel plating device - Google Patents
A kind of chemical nickel plating device Download PDFInfo
- Publication number
- CN208485955U CN208485955U CN201821026046.0U CN201821026046U CN208485955U CN 208485955 U CN208485955 U CN 208485955U CN 201821026046 U CN201821026046 U CN 201821026046U CN 208485955 U CN208485955 U CN 208485955U
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- CN
- China
- Prior art keywords
- polytetrafluoro
- bracket
- nickel plating
- rod rest
- chemical nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of chemical nickel plating device, including coating bath, which is characterized in that the top two sides of the coating bath are symmetrically arranged with driving mechanism, and the driving mechanism is connected with bracket；The plating trench bottom is successively arranged carrier ring, electromagnet layer, and the partition layer surface is equipped with polytetrafluoro magnetic agitation sublayer；Further include rod rest, hanger is symmetrically connected on the rod rest, the rod rest is connect with bracket.The effect that the utility model bracket passes through driving mechanism, it can be realized up and down motion, rod rest is able to drive by the cooperation of bracket and rod rest simultaneously to move up and down, to realize the up and down motion of hanger, pass through the mating reaction of electromagnet layer and polytetrafluoro magnetic agitation sublayer again, it can aid in the flowing for promoting electroplate liquid upward, while stabilizer distribution after addition stabilizer can be made more uniform, guarantee the stability of electroplating process.
Description
Technical field
The utility model belongs to technical field of plating equipment, and in particular to a kind of chemical nickel plating device.
Background technique
Chemical plating is once named as electroless plating there is initial stage, and the most important difference with electrolysis plating is that it was deposited
Journey is a chemistry redox reaction, rather than physical deposition.But there is initial stage in chemical plating and do not show good work
Industry application performance.At this point, chemical plating is crossed, liquid is at high cost, and adhesive force is small, is easy to fall off, and containing more toxic in manufacturing process
Substance uses and has received very big limitation.But its excellent performance, but also quick in this period using this method
Development.People have very clear understanding to its reaction mechanism, catalytic condition, reaction condition etc..The development in this period
Make
The stability that liquid must be crossed is greatly improved.Then change with advances in technology with the development of industrial technology
Coating technology is learned also to be greatly improved.The appearance of high phosphorus amorphous chemical deposit is but also the corrosion resistance of coating obtains
Very big promotion.Amorphous structure is presented in coating, and fall into disarray is unordered wherein for atom, and crystal boundary is not present, and position is also not present
Crystal defect as mistake, this widens the practical application space of chemical plating further.The raising for crossing liquid stability simultaneously, is changed
The full-automatic of plating is learned to add
Work technology also has been greatly developed, this is but also its industrial applications have obtained bigger utilization space.
With the appearance of the low-phosphorous chemical deposit of high rigidity, high abrasion resistance, new process and new technology are also had gradually developed, chemical plating
Technology has also progressivelyed reach peak.Chemical plating nickel technology has evolved into ripe now, and coating performance is stablized, changes of function multiplicity, can
Process field plays increasingly important role on the surface of the material.
The equipment of current chemical plating is typically all to hang over plating piece on hanger, is then placed in electroplating pool and carries out chemistry
Plating.But in chemical nickel plating, since plating piece is not flexible, thus the hook of plating piece part and hanger is in contact condition always, connects
It contact portion position can not Ni plated layer.Although hanger is moved forward and backward in the horizontal direction, also can't resolve the blackspot of contact site, bubble and
Decortication phenomenon.
Utility model content
In view of this, the present invention provides a kind of chemical nickel plating device, the utility model bracket passes through driving mechanism
Effect can be realized up and down motion, while be able to drive rod rest by the cooperation of bracket and rod rest and move up and down, thus real
The up and down motion of existing hanger.So that handware workpiece can continually be detached from the hook of hanger, with hook contact portion
The problem of position can plate nickel layer, can effectively solve the problem that the blackspot, bubble and decortication of contact site.
A kind of the technical solution of the utility model are as follows: chemical nickel plating device, including coating bath, which is characterized in that the coating bath
Top two sides be symmetrically arranged with driving mechanism, the driving mechanism is connected with bracket；The plating trench bottom be successively arranged carrier ring,
Electromagnet layer, the partition layer surface are equipped with polytetrafluoro magnetic agitation sublayer；Further include rod rest, symmetrically connects on the rod rest
It is connected to hanger, the rod rest is connect with bracket.Particularly, electric connection can be achieved by the prior art simultaneously in the electromagnet layer
Realize its effect.By the effect of carrier ring, electromagnet layer can be prevented to be corroded, the carrier ring can be any existing by this field
There is technology realization.
Further, filter layer is equipped with above the polytetrafluoro magnetic agitation sublayer, prevent polytetrafluoro magnetic stir bar with
Plating piece collision, influences electroplating effect.
Further, the polytetrafluoro magnetic agitation sublayer is made of evenly arranged polytetrafluoro magnetic stir bar.
Further, the polytetrafluoro magnetic stir bar is octadentate type polytetrafluoro magnetic stir bar, can aid in promotion
The upward flowing of electroplate liquid, while stabilizer distribution after addition stabilizer can be made more uniform, guarantee the stabilization of electroplating process
Property.
Further, the upper surface opposite side of the bracket is equipped with non-slipping block, can be realized bracket and is stably connected with rod rest.
Further, the hanger opposite side is equipped with hook, for hanging plating piece.
Further, the bracket is "L" shaped bracket, realizes that one end is connect with driving mechanism, one end provides support
Plane.
In the utility model, bracket can be realized up and down motion, while passing through bracket and branch by the effect of driving mechanism
The cooperation of bridge is able to drive rod rest up and down motion, to realize the up and down motion of hanger.So that handware work
Part can continually be detached from the hook of hanger, can plate nickel layer with hook contact site.Pass through electromagnet layer and polytetrafluoro magnetic
Power stirs the mating reaction of sublayer, can aid in the flowing for promoting electroplate liquid upward, while can make to be added after stabilizer surely
It is more uniform to determine agent distribution, guarantees the stability of electroplating process.The utility model can make during hanger moves up and down
It obtains handware and links up with when contact position is in and contact contactless state, realize that plating piece can continually be detached from hook, with hook portion
The problem of contact site can plate nickel layer, can effectively solve the problem that the blackspot, bubble and decortication of contact site.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the partial structural diagram of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1
A kind of chemical nickel plating device, including coating bath 1, which is characterized in that the top two sides of the coating bath are symmetrically arranged with driving
Mechanism 2, the driving mechanism are connected with bracket 21；The plating trench bottom is successively arranged carrier ring 3, electromagnet layer 4, the partition
Layer surface is equipped with polytetrafluoro magnetic agitation sublayer 5；Further include rod rest 6, hanger 7 is symmetrically connected on the rod rest, it is described
Rod rest is connect with bracket.Particularly, the electromagnet layer can be achieved by the prior art electric connection and realize its effect.It is logical
The effect of carrier ring is crossed, electromagnet layer can be prevented to be corroded, the carrier ring can be realized by this field any prior art.
Further, filter layer 8 is equipped with above the polytetrafluoro magnetic agitation sublayer, prevent polytetrafluoro magnetic stir bar with
Plating piece collision, influences electroplating effect.
Further, the polytetrafluoro magnetic agitation sublayer is made of evenly arranged polytetrafluoro magnetic stir bar 51.
Further, the polytetrafluoro magnetic stir bar is octadentate type polytetrafluoro magnetic stir bar, can aid in promotion
The upward flowing of electroplate liquid, while stabilizer distribution after addition stabilizer can be made more uniform, guarantee the stabilization of electroplating process
Property.
Further, the upper surface opposite side of the bracket is equipped with non-slipping block 22, can be realized bracket and rod rest stablizes company
It connects.
Further, the hanger opposite side is equipped with hook 71, for hanging plating piece.
Further, the bracket is "L" shaped bracket, realizes that one end is connect with driving mechanism, one end provides support
Plane.
In the utility model, bracket can be realized up and down motion, while passing through bracket and branch by the effect of driving mechanism
The cooperation of bridge is able to drive rod rest up and down motion, to realize the up and down motion of hanger.So that handware work
Part can continually be detached from the hook of hanger, can plate nickel layer with hook contact site.Pass through electromagnet layer and polytetrafluoro magnetic
Power stirs the mating reaction of sublayer, can aid in the flowing for promoting electroplate liquid upward, while can make to be added after stabilizer surely
It is more uniform to determine agent distribution, guarantees the stability of electroplating process.The utility model makes five during hanger moves up and down
Golden part and hook contact position contact contactless state when being in, and realize that plating piece can continually be detached from hook, contact with hook portion
The problem of position can plate nickel layer, can effectively solve the problem that the blackspot, bubble and decortication of contact site.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the utility model, can lead to
Cross any prior art realization.
Claims (7)
1. a kind of chemical nickel plating device, including coating bath, which is characterized in that the top two sides of the coating bath are symmetrically arranged with driving machine
Structure, the driving mechanism are connected with bracket；The plating trench bottom is successively arranged carrier ring, electromagnet layer, the partition layer surface
Equipped with polytetrafluoro magnetic agitation sublayer；Further include rod rest, hanger, the rod rest and branch are symmetrically connected on the rod rest
Frame connection.
2. chemical nickel plating device according to claim 1, which is characterized in that set above the polytetrafluoro magnetic agitation sublayer
There is filter layer.
3. chemical nickel plating device according to claim 1, which is characterized in that the polytetrafluoro magnetic agitation sublayer is by equal
The polytetrafluoro magnetic stir bar of even arrangement forms.
4. chemical nickel plating device according to claim 3, which is characterized in that the polytetrafluoro magnetic stir bar is octadentate type
Polytetrafluoro magnetic stir bar.
5. chemical nickel plating device according to claim 1, which is characterized in that the upper surface opposite side of the bracket is equipped with anti-skidding
Block.
6. chemical nickel plating device according to claim 1, which is characterized in that the hanger opposite side is equipped with hook.
7. chemical nickel plating device according to claim 1, which is characterized in that the bracket is "L" shaped bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821026046.0U CN208485955U (en) | 2018-06-30 | 2018-06-30 | A kind of chemical nickel plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821026046.0U CN208485955U (en) | 2018-06-30 | 2018-06-30 | A kind of chemical nickel plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208485955U true CN208485955U (en) | 2019-02-12 |
Family
ID=65249067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821026046.0U Expired - Fee Related CN208485955U (en) | 2018-06-30 | 2018-06-30 | A kind of chemical nickel plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208485955U (en) |
-
2018
- 2018-06-30 CN CN201821026046.0U patent/CN208485955U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 Termination date: 20210630 |