CN208480208U - Electronic apparatus heat radiation construction - Google Patents
Electronic apparatus heat radiation construction Download PDFInfo
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- CN208480208U CN208480208U CN201821275102.4U CN201821275102U CN208480208U CN 208480208 U CN208480208 U CN 208480208U CN 201821275102 U CN201821275102 U CN 201821275102U CN 208480208 U CN208480208 U CN 208480208U
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- ontology
- heat
- heat pipe
- radiating module
- flow
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Abstract
The utility model provides a kind of electronic apparatus heat radiation construction, there is one first heat pipe heat and one second heat pipe heat including at least an ontology, first heat pipe heat includes the vertical ontology of at least one first heat pipe and is equipped with one first radiating module and one first fan, second heat pipe heat includes that at least one second heat pipe has the vertical ontology of a first part and the parallel ontology of the first part one second part of extension, and the second part is equipped with one second radiating module and one second fan；First fan generates one first air-flow of a first direction by first radiating module and second radiating module, and one second air-flow which generates a second direction passes through second radiating module.
Description
Technical field
The utility model relates to field of radiating, especially with respect to a kind of electronic apparatus heat radiation construction.
Background technique
For computer in running, many internal elements can generate a large amount of thermal energy, therefore good cooling system is to determine computer
One big key factor of operational effectiveness and reliability.In all elements that can be generated heat, generally with workload highest it
The heat dissipation problem of the two such as central processing unit (CPU) and drawing wafer processor (GPU) is the most intractable.Especially current all kinds of electricity
The picture of brain game is more and more fine and smooth, and the function of computer-aided drawing software is also increasingly powerful, this kind of software running when often
Central processing unit and drawing wafer processor can be allowed to be in higher load condition, while also resulting in a large amount of thermal energy and generating, this
If a little thermal energy cannot effectively disperse, the efficiency of central processing unit or drawing wafer processor is gently caused to decline, when serious more
The damage or service life that may cause central processing unit or drawing wafer processor are greatly reduced.
Utility model content
Therefore how the inventor and phase engaged in this industry that a kind of radiator structure that radiating efficiency is high is this case are provided
Shutout quotient wants to study improved direction place.
To reach above-mentioned purpose, the utility model provides a kind of electronic apparatus heat radiation construction, includes: an ontology has
One first heat pipe heat and one second heat pipe heat, first heat pipe heat include the vertical ontology of at least one first heat pipe and are equipped with one the
One radiating module, second heat pipe heat include that at least one second heat pipe has the vertical ontology of a first part and the first part
Bending extends the parallel ontology of a second part, and the second part is equipped with one second radiating module；One first fan, is correspondence
First radiating module and drive one first air-flow flow along a first direction；One second fan is corresponding second radiating mould
Block and drive one second air-flow flowed along a second direction.
Aforementioned first air-flow flows through first radiating module and second radiating module；Second air-flow flow through this second
Radiating module simultaneously hits the first air-flow for flowing through second radiating module.
Aforementioned ontology is a temperature-uniforming plate or a flat-plate heat pipe, has an ontology chamber, is equipped with an ontology in the body cavity room
Capillary structure and a working fluid, the ontology are equipped with plural open-work and are connected to the ontology chamber.
Aforementioned first heat pipe have one first closed end and one first open end and one first heat pipe chamber be located at this first
Between closed end and first open end, which connects the ontology, and first heat by the open-work of the ontology
Lumen room is connected to the ontology chamber by first open end: aforementioned at least one second heat pipe has one second closed end and one the
Two open ends and one second heat pipe chamber are located between second closed end and second open end, which passes through
The open-work of the ontology connects the ontology, and the second heat pipe chamber is connected to the ontology chamber by second open end.
It is equipped with one first heat tube capillary structure in aforementioned first heat pipe chamber room and contacts the ontology capillary structure；Aforementioned second heat
It is equipped with one second heat tube capillary structure in lumen room and contacts the ontology capillary structure.
Aforementioned first radiating module includes the first heat sink that plural number stacks, and the first heat sink interval which stacks is set
It sets, and there is one first flow channel between two the first adjacent heat sinks；Second radiating module includes second that plural number stacks
Heat sink, the second heat sink interval setting which stacks, and there is one second air-flow between two the second adjacent heat sinks
Road.
Aforementioned first heat sink and second heat sink are fin or temperature-uniforming plate or radiator.
The second part of aforementioned at least one second heat pipe is located at the top septal surface of the ontology to the ontology.
Aforementioned first heat pipe heat includes that an at least third heat pipe has the vertical ontology of a Part III and the Part III
Bending extends the parallel ontology of a Part IV and contacts first radiating module.
Aforementioned second heat pipe heat includes the vertical ontology of at least one the 4th heat pipe and contacts second radiating module.
Aforementioned second heat pipe heat includes at least one the 5th heat pipe and the vertical ontology of at least one the 6th heat pipe, and the 5th is hot
Pipe is equipped with a third radiating module, and the 6th heat pipe is equipped with one the 4th radiating module；One third fan connects the third radiating mould
Block and drive a third air-flow flowed from the third radiating module towards the second radiating module；One the 4th fan connects the 4th heat dissipation
Module and drive one the 4th air-flow flowed from the 4th radiating module towards the second radiating module.
The parallel ontology of the first direction of aforementioned first air-flow is tilted towards the ontology；The second direction of second air-flow is hung down
The straight ontology.
One advantage of the utility model provides a kind of electricity for flowing in different directions at least two strands of air-flows and helping to radiate
Sub-device radiator structure.
Another advantage of the utility model provides one kind at least two strands of different directions air-flows and mutually hits to help the electricity to radiate
Sub-device radiator structure.
It is staggeredly and/or flat with row or column with vertical and L-type heat pipe to provide a kind of ontology for another advantage of the utility model
The capable electronic apparatus heat radiation construction being arranged.
The purpose of following schema is that the utility model is enable to be more easily understood, and can encyclopaedize those figures in this article
Formula, and it is made to constitute some of specific embodiment.Pass through specific embodiment herein and refer to corresponding schema, with detailed
It is thin to explain specific embodiment of the utility model, and the action principle to illustrate invention.
Detailed description of the invention
Fig. 1 is the utility model ontology perspective exploded view；
Fig. 2 is the utility model ontology Three-dimensional combination diagram；
Fig. 3 is the Three-dimensional combination diagram of the utility model ontology and the first fan and the second fan；
Fig. 4 A is that the utility model makees schematic diagram；
Fig. 4 B is that schematic diagram is made in another substitution implementation of the utility model；
Fig. 5 A is the schematic diagram of the 5A-5A hatching line of the utility model ontology；
Fig. 5 B is the enlarged diagram of Fig. 5 A；
Fig. 6 A is the schematic diagram of the 6A-6A hatching line of the utility model ontology；
Fig. 6 B is the enlarged diagram of Fig. 6 A；
Fig. 7 is the schematic diagram that the utility model second is implemented；
Fig. 8 is the schematic diagram that the utility model third is implemented；
Fig. 9 is the schematic diagram that the utility model the 4th is implemented.
Description of symbols: ontology 10；Upper housing 101；Upper surface 1011；Lower case 102；Lower surface 1021；Body cavity
Room 103；Ontology capillary structure 1031；First fan 21；Second fan 22；First heat pipe heat 11；First heat pipe 111；First envelope
Closed end 1111；First open end 1112；Intercommunicating pore 11121；First heat pipe chamber 1113；First heat tube capillary structure 1131；The
Two heat pipe heats 12；Second heat pipe 121；First part 1211；Second part 1212；Second closed end 1214；Second open end
1215；Intercommunicating pore 12151；Second heat pipe chamber 1216；Second heat tube capillary structure 1231；First radiating module 13,13A；The
One heat sink 131,131A；First flow channel 132,132A；Through-hole 133；Slot 134A；Open-work 135A；Second radiating module
14,14A；Second heat sink 141,141A；Second flow channel 142,142A；Through-hole 143；Open-work 143A；Slot 144A；First wind
Fan 21；Second fan 22；Switchover frame 211,221,231,241；First air-flow F1；Second air-flow F2；Third heat pipe 211；Third
Part 2111；Part IV 2112；4th heat pipe 212；5th heat pipe 35；6th heat pipe 36；Third radiating module 15；4th dissipates
Thermal modules 16；Third fan 23；4th fan 24；Multi-direction fluid impact field domain FA.
Specific embodiment
The above-mentioned purpose and its structure of the utility model and characteristic functionally, by the preferred embodiment according to institute's accompanying drawings
It is explained.
Fig. 1 is the utility model ontology perspective exploded view；Fig. 2 is the utility model ontology Three-dimensional combination diagram；
Fig. 3 is the Three-dimensional combination diagram of the utility model ontology and the first fan and the second fan；Fig. 4 A is that the utility model is done
Schematic diagram；Fig. 4 B is that schematic diagram is made in another substitution implementation of the utility model；Fig. 5 A is the 5A-5A hatching line of the utility model ontology
Schematic diagram；Fig. 5 B is the enlarged diagram of Fig. 5 A；Fig. 6 A is the schematic diagram of the 6A-6A hatching line of the utility model ontology；Fig. 6 B
It is the enlarged diagram of Fig. 6 A.As shown, the electronic apparatus heat radiation construction of the utility model includes an ontology 10 and one first
Fan 21 and one second fan 22, the ontology 10 have one first heat pipe heat 11 and one second heat pipe heat 12, and the ontology 10 is for example
For a temperature-uniforming plate or a flat-plate heat pipe, there is upper housing 101 and a lower case 102, an ontology chamber 103 is defined in the upper casing
Between body 101 and lower case 102, a lower surface 1021 of the lower case 102 is a thermal interface contact at least pyrotoxin, should
One upper surface 1011 of upper housing 101 is a radiating surface.It include an ontology capillary structure 1031 and a work in the ontology chamber 103
Make liquid or selection is arranged plural support column and supports the upper housing 101 and the lower case 102 (such as Fig. 5 A, Fig. 5 B and Fig. 6 A).
Furthermore the top (such as 101 top of upper housing) of ontology 10 defines a multi-direction fluid impact field domain FA and provides first fan
21 and second fan 22 driven fluid flowing.
First heat pipe heat 11 and second heat pipe heat 12 are arranged on the upper housing 101 of the ontology 10, that is, this
One end (open end as be described hereinafter) of one heat pipe 11 and second heat pipe 12 is connect with the upper housing 101 of the ontology 10, but not
It is limited to this, one end (open end) of first heat pipe heat 11 and second heat pipe heat 12 also can connect 10 side of ontology.It should
First heat pipe heat 11 includes the vertical ontology 10 of at least one first heat pipe 111 (3 heat pipes are shown in figure).Second heat pipe heat
12 include at least one second heat pipe 121 (3 heat pipes are shown in figure), and every one second heat pipe 121 has a first part
1211 vertical ontologies 10, the first part 1211 bending extend the parallel ontology 10 of a second part 1212, the second part
1222 are located at the top of the ontology 10 and septal surface to the ontology 10.First heat pipe heat 11 and second heat pipe heat 12 are, for example,
Round tube or flat hot pipe or D type heat pipe or flat plate heat tube.
Furthermore as shown in Fig. 5 A, Fig. 5 B and Fig. 6 A, Fig. 6 B, the first heat pipe 111 of first heat pipe heat 11 has one the
One closed end 1111 and one first open end 1112 and one first heat pipe chamber 1113 be located at first closed end 1111 and this
Between one open end 1112, which runs through the upper housing 101 of the ontology 10 and is equipped with an intercommunicating pore 11121
It is connected to the ontology chamber 103, so that the first heat pipe chamber 1113 is connected to the ontology chamber by first open end 1112
103.It is equipped with one first heat tube capillary structure 1131 in the first heat pipe chamber 1113 and contacts the ontology capillary structure 1031.It should
Second heat pipe 121 of the second heat pipe heat 12 has one second closed end 1214 and one second open end 1215 and one second heat pipe
Chamber 1216 is located between second closed end 1214 and second open end 1215, which runs through should
It the upper housing 101 of ontology 10 and is equipped with an intercommunicating pore 12151 and is connected to the ontology chamber 103, and the second heat pipe chamber 1216 is logical
It crosses second open end 1215 and is connected to the ontology chamber 103.One second heat pipe capillary knot is equipped in the second heat pipe chamber 1216
Structure 1231 contacts the ontology capillary structure 1031.In this way, working fluid can be in ontology chamber 103 and the first heat pipe chamber
1113 and second steam-condensate circulating in heat pipe chamber 1216, transfer heat to first heat pipe heat 11 and second heat pipe heat 12 and
It radiates the upper surface 1011 of the upper housing 101 of the ontology 10.
Join shown in Fig. 1 to Fig. 4 A and Fig. 4 B again, one first radiating module, 13 system is socketed the first heat of first heat pipe heat 11
Pipe 111, one second radiating module, 14 system are socketed the second heat pipe 121 of second heat pipe heat 12 and are located at 10 top of ontology
Multi-direction fluid impact field domain, first radiating module 13 include the first heat sink 131 that plural number stacks, and the of plural number stacking
The setting of one heat sink 131 interval, and there is the parallel ontology of one first flow channel 132 between two the first adjacent heat sinks 131
It 10 or is tilted towards ontology 10 and corresponding second radiating module 14, and every one first heat sink 131 opens up at least 133 sets of a through-hole
Connect first heat pipe 111；The second heat sink 141 that second radiating module 14 is stacked including plural number, the second of plural number stacking
The setting of the interval of heat sink 141, and there is the vertical ontology 10 of one second flow channel 142 between two the second adjacent heat sinks 141
And corresponding first radiating module 13, and every one second heat sink 141 opens up an at least through-hole 143 and is socketed second heat pipe 121
Second part 1212.Furthermore the first heat sink 131 of first radiating module 13 and the second of second radiating module 14 dissipate
Hot plate 141 is, for example, radiator or radiating fin or temperature-uniforming plate.There is a work if a chamber housing has been defined in temperature-uniforming plate then its
Make liquid steam-condensate circulating in chamber to operate.
Furthermore one first fan 21 is direct or indirect connection first radiating module 13, and one second fan, 22 system is direct
Or it is indirectly connected with second radiating module 14, first fan 21 and (for example, axis stream of the second fan 22 are indicated in detail in this figure
Fan or centrifugal fan or cross flow fan) can directly or by a switchover frame 211,221 be separately connected first radiating module 13 and should
Second radiating module 14.And as shown in Figure 4 A, due to the parallel ontology 10 of first flow channel 132, so working as first fan
When 21 runnings generate one first air-flow F1 by first flow channel 132, the first air-flow F1 is (i.e. flat along a first direction
The direction of the row ontology 10 indicates the parallel ontology 10 of first air-flow F1 in Fig. 4 A) it is flowed from first radiating module 13
To second radiating module 14.But implement as shown in Figure 4 B in another substitution, since 132 system of the first flow channel is towards the ontology
10 inclinations, so the first air-flow F1 (inclines along a first direction when the first air-flow F1 passes through first flow channel 132
The direction of the oblique ontology 10, indicates that first air-flow F1 tilts the ontology 10 in Fig. 4 B) it is flowed to from first radiating module 13
Second radiating module 14.
Furthermore one second air-flow F2 is generated along a second direction (i.e. vertical ontology 10 when second fan 22 operates
Direction) flowing；Second air-flow F2 of second fan 22, which flows through second radiating module 14 and hits, flow to second heat dissipation
First air-flow F1 of module 14, to radiate by the first air-flow F1 and the second air-flow F2 to first thermal modules 13 and second
14 thermal convection of module heat dissipation.
By above implementation, the utility model, which provides one kind, has the first air-flow F1 and the second air-flow F2 in different directions
Flowing generates thermal convection, and the first air-flow F1 and second air-flow F2 by the first radiating module 13 and the second radiating module 14
Multi-direction fluid impact field domain FA above ontology 10 generates fluid impact, and then ontology 10 is helped to radiate.
As shown in fig. 7, implementing in another substitution, which includes that an at least third heat pipe 211 has one the
The vertical ontology 10 of three parts 2111 and the Part III 2111, which are bent, to be extended the parallel ontology 10 of a Part IV 2112 and connects
Touch first radiating module 13A.These described 211 systems of third heat pipe are adjacent to first heat pipe 111, and first heat pipe 111
Interlocked in a manner of row or column with 211 system of third heat pipe according to design requirement and/or parallel and/or difference of height arrangement is set
It sets.The specific implementation of third heat pipe 211 is identical with the structure of the second heat pipe 121 above-mentioned.And in order to cooperate first heat pipe 111
And the third heat pipe 211, first thermal modules 13A offer open-work 135A and pass through for the Part IV 2112 of the third heat pipe 211
It wears and connects, and open up grooved hole 134A and correspond to first heat pipe 111.First radiating module 13A includes first that plural number stacks
Heat sink 131A, the first interval heat sink 131A setting which stacks, and have between two the first adjacent heat sink 131A
There is one first flow channel 132A.
As shown in figure 8, implement in another substitution, second heat pipe heat 12 include at least one the 4th heat pipe 212 it is vertical this
Body 10 and contact second radiating module 14A, these described 212 systems of the 4th heat pipe adjacent to second heat pipe 121, and this second
Heat pipe 121 is interlocked with 212 system of the 4th heat pipe according to design requirement with row or column and/or parallel and/or difference of height arrangement is set
It sets (as can be seen from figures 8 and 9).The specific implementation of 4th heat pipe 212 is identical with 111 structure of the first heat pipe above-mentioned.And in order to match
Second heat pipe 121 and the 4th heat pipe 212 are closed, second radiating module 14A offers open-work 143A for second heat pipe 121
Second part 1212 through socket, and open up grooved hole 144A and correspond to the 4th heat pipe 212.Second radiating module 14A
Including the second heat sink 141A that plural number stacks, the second interval heat sink 141A which stacks is arranged, and two adjacent the
There is one second flow channel 142A between two heat sink 141A.
As shown in figure 9, implementing in another substitution, which includes at least one the 5th heat pipe 35 and at least one
The vertical ontology 10 of 6th heat pipe 36, indicates the 5th heat pipe 35 in this schema and the 6th heat pipe 36 is respectively 3, and it has
Body is implemented identical with 111 structure of the first heat pipe above-mentioned.One third radiating module 15 and one the 4th radiating module 16 are socketed respectively
5th heat pipe 35 and the 6th heat pipe 36.The third radiating module 15 and the 4th radiating module 16 are with the first radiating mould above-mentioned
The structure of block 13 is identical.One third fan 23 is the direct or indirect connection third radiating module 15, and 24 system of the 4th fan is straight
The 4th radiating module 16 is connect or be indirectly connected with, the third fan 23 is indicated in detail in this figure and the 4th fan 24 is, for example, axis stream
Fan and the third radiating module 15 and the 4th radiating module 16 are separately connected by a switchover frame 231,241.The third wind
23 one third air-flow of generation of fan flows to second radiating module 14 flowing from the third radiating module 15；4th fan 24 produces
Raw one the 4th air-flow flows to second radiating module 16 from the 4th radiating module 15, this first, second and third and four air-flow at this
The multi-direction fluid impact field domain FA of 10 top of body generates fluid impact, and then ontology 10 is helped to radiate.
It is described above to be merely exemplary for the utility model, and not restrictive, those of ordinary skill in the art
Understand, without departing from the spirit and scope defined by the claims, can many modifications may be made, variation or it is equivalent, but
It falls within the protection scope of the utility model.
Claims (13)
1. a kind of electronic apparatus heat radiation construction, it is characterized in that comprising:
One ontology, has one first heat pipe heat and one second heat pipe heat, which includes at least the one of the vertical ontology
First heat pipe, and first heat pipe is equipped with one first radiating module, which includes at least one second heat pipe, this second
Heat pipe has a first part of the vertical ontology, and first part bending extends a second part of the parallel ontology, and
The second part is equipped with one second radiating module；
One first fan connects first radiating module and is able to drive one first air-flow and flows along a first direction；
One second fan connects second radiating module and is able to drive one second air-flow and flows along a second direction.
2. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: first air-flow is from first radiating module
Flow to second radiating module；Second air-flow, which flows through second radiating module and hits, flows to second radiating module
First air-flow.
3. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: the ontology is a temperature-uniforming plate or plate heat
Pipe has an ontology chamber, is equipped with an ontology capillary structure and a working fluid in the body cavity room.
4. electronic apparatus heat radiation construction as claimed in claim 3, it is characterised in that: at least one first heat pipe has one first
Closed end, one first open end and one first heat pipe chamber, which is located at first closed end and this first is opened
It puts between end, first open end is through the ontology and is connected to the ontology chamber, which passes through first opening
End is connected to the ontology chamber；At least one second heat pipe has one second closed end, one second open end and one second heat pipe chamber
Room, the second heat pipe chamber are located between second closed end and second open end, second open end through the ontology and
It is connected to the ontology chamber, which is connected to the ontology chamber by second open end.
5. electronic apparatus heat radiation construction as claimed in claim 4, it is characterised in that: be equipped with one first in the first heat pipe chamber room
Heat tube capillary structure contacts the ontology capillary structure, which is equipped with an intercommunicating pore and is connected to the ontology chamber；This second
It is equipped with one second heat tube capillary structure in heat pipe chamber room and contacts the ontology capillary structure, which connects equipped with an intercommunicating pore
Lead to the ontology chamber.
6. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: first radiating module includes that plural number stacks
The first heat sink, the first heat sink interval setting which stacks, and have one the between two the first adjacent heat sinks
One flow channel；Second radiating module includes the second heat sink that plural number stacks, and the second heat sink interval which stacks is set
It sets, and there is one second flow channel between two the second adjacent heat sinks.
7. electronic apparatus heat radiation construction as claimed in claim 6, it is characterised in that: first heat sink and second heat sink
It is fin or temperature-uniforming plate or radiator.
8. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: the second part of at least one second heat pipe
Positioned at the ontology top and septal surface to the ontology.
9. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: first heat pipe heat includes an at least third
Heat pipe, which has a Part III of the vertical ontology, and Part III bending extends a Part IV, this
The parallel ontology in four parts and contact first radiating module.
10. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: second heat pipe heat includes at least 1 the
Four heat pipes, the vertical ontology of the 4th heat pipe and contact second radiating module.
11. electronic apparatus heat radiation construction as described in claim 1, it is characterised in that: second heat pipe heat include it is vertical this
At least one the 6th heat pipe of at least one the 5th heat pipe of body and the vertical ontology, and the 5th heat pipe is equipped with a third radiating mould
Block, the 6th heat pipe are equipped with one the 4th radiating module；One third fan connects the third radiating module and is able to drive a third
Air-flow is flowed from the third radiating module towards the second radiating module；One the 4th fan connects the 4th radiating module and is able to drive
One the 4th air-flow is flowed from the 4th radiating module towards the second radiating module.
12. electronic apparatus heat radiation construction as claimed in claim 1 or 2, it is characterised in that: the first direction of first air-flow is flat
The row ontology is tilted towards the ontology；The vertical ontology of the second direction of second air-flow.
13. electronic apparatus heat radiation construction as claimed in claim 1 or 2, it is characterised in that: it is multi-direction to define one above the ontology
Fluid impact field domain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821275102.4U CN208480208U (en) | 2018-08-08 | 2018-08-08 | Electronic apparatus heat radiation construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821275102.4U CN208480208U (en) | 2018-08-08 | 2018-08-08 | Electronic apparatus heat radiation construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208480208U true CN208480208U (en) | 2019-02-05 |
Family
ID=65209470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821275102.4U Withdrawn - After Issue CN208480208U (en) | 2018-08-08 | 2018-08-08 | Electronic apparatus heat radiation construction |
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| Country | Link |
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| CN (1) | CN208480208U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925118A (en) * | 2018-08-08 | 2018-11-30 | 奇鋐科技股份有限公司 | Electronic apparatus heat radiation construction |
-
2018
- 2018-08-08 CN CN201821275102.4U patent/CN208480208U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925118A (en) * | 2018-08-08 | 2018-11-30 | 奇鋐科技股份有限公司 | Electronic apparatus heat radiation construction |
| CN108925118B (en) * | 2018-08-08 | 2021-02-02 | 奇鋐科技股份有限公司 | Heat dissipation structure of electronic device |
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