KR101411413B1 - Converter system including air cooling type single module cooler - Google Patents

Abstract

A converter system including a single modular air cooled cooler is disclosed. The converter system includes a plurality of unit modules each having a reactor portion disposed on an upper layer and an IGBT stack portion disposed on a lower layer and connected to each other via a bus, a heat exchanger portion cooling air circulating along the internal flow path using cooling water flowing from the outside, And an air cooling type cooler including a cooling fan unit for advancing the air cooled by the heat exchanger unit along the internal flow path, wherein the air cooling type cooler can be positioned above the plurality of unit modules.

Description

[0001] The present invention relates to a converter system including a single modular air-cooled cooler,

The present invention relates to a converter system including a single modular air cooled cooler.

Generally, in a wind power generation system, a converter system is used to convert voltage characteristics such as ac and dc. Solving the heat generation problem of such a converter system is an important part for stabilization of a wind power generation system.

The most vulnerable part of the converter system is the water-cooled reactor located in the reactor panel section and the air-cooled reactor and bus located in the stack section. In the case of a water-cooled reactor, it is possible to suppress the heat generation to some extent by improving the structure of the reactor, but in the case of the air-cooled reactor and the bus bar of the stack portion, improvement of heat generation was difficult.

When the temperature of the bus bar rises above the reference value, the performance of the bus bar is lowered and the temperature of the IGBT stack may be increased. Therefore, cooling each element of the converter system below a certain temperature is also an important part of the lifetime problem of each element.

1 is a front view and a side view showing a structure of a conventional converter system. Fig. 1 (a) is a front view of the converter system, and Fig. 1 (b) is a side view of the converter system.

In the converter system, the heat exchanger 40 and the cooling fan 30 are located at the bottom of the stack portion 10, and the reactor portion 20 is located at the top of the stack portion 10. The air cooled in the heat exchanger 40 is upwardly moved by the cooling fan 30 and is transferred to the reactor unit 20 via the stack unit 10. A DC bus bar 55 is connected between the cooling fan 30 and the heat exchanger 40 and an AC bus bar 50 is connected between the cooling fan 30 and the heat exchanger 40. Also, The bar is connected.

In such a structure, there are many factors that interfere with the smooth flow of the air, such as the internal structure of the converter system in the path of the air. Therefore, there is a disadvantage in that the cooling efficiency is not high because the amount of air delivered to the reactor section 20 is not large.

1, the elements (e.g., inverter, IGBT, etc.) located in the stack portion 10 have a much higher cooling efficiency than the cooling efficiency by air, so that the cooling fan 30, The method of cooling by using is equivalent to an inefficient method.

The present invention relates to a single modular, air-cooled cooler which is advantageous for maintenance by improving the cooling structure of the converter system and designing the heat exchanger and the cooling fan as a single module, thereby improving the cooling efficiency and allowing more air to be delivered to the reactor And a converter system.

The present invention provides a converter system including a single modular air-cooled cooler in which circulation of air through a convection phenomenon of the air due to the heat exchanger and the cooling fan being located at the uppermost position is performed more smoothly than in the existing system.

Other objects of the present invention will become readily apparent from the following description.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a plurality of unit modules, each having a reactor portion on an upper layer, an IGBT stack portion on a lower layer, And an air cooling type cooler including a heat exchanger unit for cooling the air circulating along the internal flow path by using cooling water flowing from the outside and a cooling fan unit for advancing the air cooled by the heat exchanger unit along the internal flow path, The air-cooled cooler is located above the plurality of unit modules.

Further comprising a duct interposed between the air-cooled cooler and the plurality of unit modules, the duct covering all the upper surfaces of the plurality of unit modules, wherein the cooled air of the air-cooled cooler flows into the plurality of unit modules Lt; / RTI >

The unit module may include a shielding plate made of a material having no conductivity between the reactor part and the IGBT stack part.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

According to the embodiment of the present invention, by changing the cooling structure of the converter system, the heat exchanger and the cooling fan can be designed into a single module, which is advantageous for maintenance, improving the cooling efficiency and allowing more air to be delivered to the reactor It is effective.

In addition, since the heat exchanger and the cooling fan are located at the uppermost portion, circulation of the air through the convection phenomenon of the air can be performed more smoothly than in the conventional method.

1 is a front view and a side view showing a structure of a conventional converter system,
2 is a front perspective view of a converter system including a single modular air-cooled cooler in accordance with an embodiment of the present invention;
Figure 3 is a side view of the converter system including the single modular air cooled cooler shown in Figure 2;
4 is a comparative diagram of a heat exchanger of a conventional converter system and of a heat exchanger according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Also, the terms " part, "" module," and the like, which are described in the specification, refer to a unit for processing at least one function or operation, and may be implemented by hardware or software or a combination of hardware and software.

It is to be understood that the components of the embodiments described with reference to the drawings are not limited to the embodiments and may be embodied in other embodiments without departing from the spirit of the invention. It is to be understood that although the description is omitted, multiple embodiments may be implemented again in one integrated embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

FIG. 2 is a front perspective view of a converter system including a single modular air-cooled cooler in accordance with an embodiment of the present invention, FIG. 3 is a side view of a converter system including a single modular air- Is a comparative diagram of a heat exchanger of a conventional converter system and a heat exchanger of an embodiment of the present invention.

2 and 3, the converter system 100, the case 105, the IGBT stack unit 110, the reactor unit 120, the cooling fan unit 130, the heat exchanger unit 140, the duct 150, A shielding plate 160, a braking resistor 170, and a bus bar 180 are illustrated.

The converter system according to an embodiment of the present invention is configured such that the air cooling type cooler including the cooling fan unit and the heat exchanger unit is composed of a single module and thus the cooling efficiency is improved and the circulation of the air .

The converter system 100 according to an embodiment of the present invention includes a single modular air-cooled cooler 200 and a plurality of unit modules 300 cooled by the cooled air delivered from the air-cooled cooler 200.

The unit module 300 includes a reactor unit 120 and an IGBT stack unit 110. The reactor unit 120 is located above the IGBT stack unit 110. [ In the drawing, six unit modules 300 are arranged in a 3x2 structure.

In the IGBT stack unit 110, for example, IGBTs and the like, the efficiency of the water cooling method using cooling water is very high, and the smooth flow of air is hindered due to the complexity of the internal structure. Accordingly, in the present embodiment, air is not allowed to flow into the IGBT stack portion 110, and cooling by the water cooling method is performed. For this purpose, air passing through the reactor part 120 is transferred to the IGBT stack part 110 through the shielding plate 160 made of a non-conductive material between the reactor part 120 and the IGBT stack part 110 .

The air-cooled cooler 200 includes a cooling fan unit 130 and a heat exchanger unit 140.

The heat exchanger unit 140 uses the cooling water flowing from the outside to cool the air circulating along the internal flow path, and the cooling fan unit 130 advances the air cooled by the heat exchanger unit along the internal flow path.

The cooling fan unit 130 is positioned above the heat exchanger unit 140 and the air cooled cooler 200 is located above the plurality of unit modules 300 so that the air cooled by the heat exchanger unit 140 flows into the cooling fan unit 130, And can be transmitted to each of the plurality of unit modules 300.

In the case of the conventional converter system shown in FIG. 1, each of the plurality of unit modules has a separate air-cooled cooler at the lower part thereof. In contrast, in the present embodiment, the air-cooling type cooler 200 may be formed into a single module so as to have the same or excellent cooling efficiency while having a sectional area smaller than the entire cross-sectional area of the plurality of unit modules 300.

If the heat exchanger unit 140 included in the air-cooled cooler 200 is designed as a single module, the fluid resistance becomes small when the cooling water flows through the heat exchanger unit 140, so that more cooling water can be flowed even with the same pump capacity Cooling efficiency is improved.

Referring to Fig. 4, a heat exchanger 40 (see Fig. 4 (a)) included in the conventional converter system and a heat exchanger unit 140 (see Fig. 4 (b) have.

In the case of the conventional heat exchanger 40, since the volume of the heat exchanger 40 can not be increased because the heat exchanger 40 is provided separately for each of the plurality of unit modules, 43 have to be limited. That is, there is a disadvantage in that the diameter of the oil pipe 43 usable in the heat exchanger 40 is limited.

In contrast, the heat exchanger unit 140 according to the present embodiment has the same structure, but the heat exchanger unit 140 has a much larger volume, thereby increasing the diameter of the oil pipe 143 in the heat exchanger unit 140. [ As the length of the oil pipe 143 becomes shorter or the diameter of the oil pipe 143 becomes larger, the resistance of the cooling water flowing through the oil pipe 143 becomes smaller. In the case of the oil pipe 143 having a larger diameter for the cooling water pump of the same output The cooling water flows more smoothly, and the heat exchange efficiency with the air for cooling inside the converter system 100, that is, the cooling efficiency can be improved.

That is, in the case of the heat exchanger unit 140 having a single module with a size larger than that of the conventional heat exchangers 40, the flow path can be efficiently configured. When a plurality of heat exchangers 40 are used as in the prior art, a frame for supporting the heat exchanger 40 having the cooling water inlet 41 and the cooling water outlet 42 is commonly used, which makes it difficult to form an efficient flow path. However, as in the present embodiment, when the heat exchanger unit 140 is single-modularized, the portion occupied by the frame having the cooling water inlet 141 and the cooling water outlet 142 can be reduced, thereby increasing the degree of freedom in designing the oil pipe, . Therefore, the area where the cooling water flows in the heat exchanger unit 140 can be increased as compared with the conventional one, so that the cooling efficiency can be further improved.

Referring again to Figures 2 and 3, the single modular air-cooled cooler 200 is located at the top of the converter system 100 and delivers the cooled air to each of the plurality of unit modules 300 through the duct 150 . The duct 150 is made of a non-conductive metal material and covers all the upper surfaces of the plurality of unit modules 300.

The air cooled in the heat exchanger unit 140 is preferentially delivered to the reactor unit 120 located in the upper layer of each unit module 300 by the duct 150. The air passing through the reactor unit 120 can not proceed to the IGBT stack unit 110 of the lower layer by the closure plate 160 and proceeds to the space between the plurality of unit modules 300 to be delivered to the bus bar 180 do.

The portion of the converter system 100 where the cooling is most required is the reactor unit 120, and the next is the bus bar 180. In this case, in the present embodiment, by applying the duct 150, the air cooled in the heat exchanger unit 140 is first transferred to the reactor unit 120 and then transferred to the bus bar 180 to control the flow of the cooling air . Since there is no structure for blocking the air flow between the air-cooled cooler 200 and the reactor 120, more cooled air is delivered to the reactor 120, and air cooled to the lowest temperature is directly transferred, The cooling performance for the heat exchanger 120 is excellent.

The air heated while passing through the bus bar 180 is moved to the upper portion of the converter system 100 along the designed flow path between the case 105 and the unit module 300. At this time, the hot air moves to the upper layer and the cooled air uses the convection phenomenon of the air moving to the lower layer, so that the circulation of the air is performed more smoothly than the conventional method.

In addition, when the cooling fan unit 130 is single-moduleed, it is advantageous in maintenance and maintenance compared to a case where a plurality of cooling fans are used, and cooling efficiency is improved and power consumption can also be reduced.

In addition, since the position of the IGBT stack unit 110 is positioned below the converter system 100, it is also possible to easily replace the IGBT stack unit 110 even when a problem occurs in the IGBT stack unit 110.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims And changes may be made without departing from the spirit and scope of the invention.

100: converter system 110: IGBT stack unit
120: reactor section 130: cooling fan section
140: Heat exchanger base 150: Duct
160: blocking plate 170: braking resistor
180: bus bar 200: air-cooled cooler
300: Unit module

Claims (3)

delete A plurality of unit modules each having a reactor portion on an upper layer and an IGBT stack portion on a lower layer, the bus modules being directly connected to each other; And
And an air cooling type cooler including a heat exchanger unit for cooling the air circulating along the internal flow path by using cooling water flowing from the outside and a cooling fan unit for advancing the air cooled by the heat exchanger unit along the internal flow path,
Wherein the air-cooled cooler is located above the plurality of unit modules,
Further comprising a duct interposed between the air-cooled cooler and the plurality of unit modules, the duct covering all the upper surfaces of the plurality of unit modules,
And the cooled air of the air-cooled cooler is transferred to the plurality of unit modules along the duct. A plurality of unit modules each having a reactor portion on an upper layer and an IGBT stack portion on a lower layer, the bus modules being directly connected to each other; And
And an air cooling type cooler including a heat exchanger unit for cooling the air circulating along the internal flow path by using cooling water flowing from the outside and a cooling fan unit for advancing the air cooled by the heat exchanger unit along the internal flow path,
Wherein the air-cooled cooler is located above the plurality of unit modules,
Wherein the unit module includes a shielding plate made of a non-conductive material between the reactor part and the IGBT stack part.

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