CN208478299U - A kind of wafer position detecting system - Google Patents
A kind of wafer position detecting system Download PDFInfo
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- CN208478299U CN208478299U CN201820998899.4U CN201820998899U CN208478299U CN 208478299 U CN208478299 U CN 208478299U CN 201820998899 U CN201820998899 U CN 201820998899U CN 208478299 U CN208478299 U CN 208478299U
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- wafer
- detection device
- detecting system
- position detecting
- edge ring
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Abstract
The utility model provides a kind of wafer position detecting system, comprising: electrostatic chuck, edge ring and detection device；The edge ring is set on the electrostatic chuck to limit a bearing space, and the detection device is set on the outside of the edge ring, detects whether wafer to be processed is transferred in the bearing space just.In semiconductor processing, wafer, which needs to be placed to, carries out operation on electrostatic chuck, position is easy to happen offset when wafer is placed on the electrostatic chuck, causes wafer generating region property defect.Position in the utility model by using wafer described in the detection on the electrostatic chuck, whether the position that the wafer can be detected in time shifts, if positional shift occurs, then the detection device meeting and alarm and stop operation, it avoids subsequent wafer from continuing to deviate, continues to be damaged；To improve the yield of product, reduce due to wafer damage bring economic loss.
Description
Technical field
The utility model relates to semiconductor field, in particular to a kind of wafer position detecting system.
Background technique
In the prior art, the detecting system of semiconductor equipment transmitting path can only detect the positional shift into before cavity
And correct, position intracorporal for chamber can not be detected, and there are the detecting blind areas of key area, therefore there are biggish risks.
When wafer shifts position in detecting blind area, and it is placed on electrostatic chuck, it is brilliant if positional shift is excessive
Circle rides in edge ring, can trigger back helium system alarm；But if wafer is being put in the case where positional shift is not very big
During setting the electrostatic chuck surface, wafer generating region defect will cause, before product defects scanning, due to not having
There are relative alarm message and Parameters variation information, cavity also will continue to run goods, causes large-tonnage product yield to reduce and even scraps.
Therefore, it is badly in need of providing a kind of wafer position detecting system, to solve to be detected wafer position in the prior art
Offset, the problem of causing large-tonnage product yield relatively low or even scrap.
Utility model content
The purpose of this utility model is to provide a kind of wafer position detecting systems, to solve to be detected crystalline substance in the prior art
The problem of circle position shifts, causes large-tonnage product yield relatively low or even scrap.
In order to solve the problems in the existing technology, the utility model provides a kind of wafer position detecting system, packet
It includes: electrostatic chuck, edge ring and detection device；The edge ring is set on the electrostatic chuck to limit carrying sky
Between, the detection device is set on the outside of the edge ring, detects whether wafer to be processed is transferred to the bearing space just
In.
Optionally, in the wafer position detecting system, the detection direction of the detection device and the bearing space
Most edge it is tangent.
Optionally, in the wafer position detecting system, the wafer position detecting system includes cavity, the detection
Device is arranged on the inner wall of the cavity.
Optionally, in the wafer position detecting system, the quantity of the detection device is multiple, and is uniformly distributed.
Optionally, in the wafer position detecting system, the position of the detection device is higher than the upper of the edge ring
Surface.
Optionally, in the wafer position detecting system, the detection device includes sapphire material infrared acquisition dress
It sets.
Optionally, in the wafer position detecting system, the electrostatic chuck includes pedestal and support portion, the support
Portion is arranged on the base, and the edge ring is set in the support portion and is in contact with the pedestal, the edge ring
Height is greater than the height of the support portion.
It optionally, is in an annular table scalariform, including side on the inside of the edge ring in the wafer position detecting system
Face and a step surface, the side intersects far from the side of the support portion with the step surface and far from the pedestal, described
Step surface is lower than or is flush to the top surface of the support portion.
Optionally, in the wafer position detecting system, warning device is provided in the detection device.
Optionally, in the wafer position detecting system, the cavity includes semiconductor reaction cavity.
In wafer position detecting system provided by the utility model, the wafer position detecting system includes: electrostatic
Sucker, edge ring and detection device；The edge ring is set on the electrostatic chuck to limit a bearing space, described
Detection device is set on the outside of the edge ring, detects whether wafer to be processed is transferred in the bearing space just.
In semiconductor processing, wafer, which needs to be placed to, carries out operation on electrostatic chuck, wafer is placed into the electrostatic
Position is easy to happen offset when on sucker, causes wafer generating region defect.It is filled in the utility model by using the detection
The position for detecting the wafer on the electrostatic chuck is set, whether the position that can detect wafer in time deviates, if appearance position
Offset, the detection device meeting and alarm simultaneously stop operation, and avoid subsequent wafer from continuing to deviate, continue to be damaged；If the crystalline substance
Round position does not go out to deviate, then continues normal operation, neither influence being normally carried out for technique, and can find the problem in time, hinder
Only more wafer damages.Further, the utility model improves the yield of product, reduces since wafer damage bring passes through
Ji loss.
Detailed description of the invention
Fig. 1 is wafer position detecting system top view provided by the embodiment of the utility model；
Fig. 2 is wafer position detecting system side view provided by the embodiment of the utility model；
Wherein, 1- wafer；2- electrostatic chuck；21- pedestal；22- support portion；3- detection device；4- edge ring；5- cavity.
Specific embodiment
Specific embodiment of the present utility model is described in more detail below in conjunction with schematic diagram.It is retouched according to following
It states, will be become apparent from feature the advantages of the utility model.It should be noted that attached drawing is all made of very simplified form and uses
Non-accurate ratio, only to convenient, lucidly aid illustration the utility model embodiment purpose.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is wafer position detecting system top view provided by the embodiment of the utility model；Fig. 2
For wafer position detecting system side view provided by the embodiment of the utility model.
As shown in Figure 1, 2, the utility model provides a kind of wafer position detecting system, comprising: electrostatic chuck 2, edge
Ring 4 and detection device 3；The edge ring 4 is set on the electrostatic chuck 2 to limit a bearing space, the detection
Device 3 is set to 4 outside of edge ring, detects whether wafer 1 to be processed is transferred in the bearing space just.
Further, the detection direction of the detection device 3 and the most edge of the bearing space are tangent.Therefore the spy
The inward flange of the electrostatic chuck 2 and the outer edge of wafer 1 can be passed through by surveying the detection light beam that device 3 is launched, so as to improve spy
Survey precision degree.
Common, the wafer 1 is placed on the electrostatic chuck 2, and in the edge ring 4, the edge ring 4 is for steady
Admittedly having been placed in the position of the wafer 1 on the electrostatic chuck 2.Common, the diameter of the wafer 1 is about 300 millimeters,
The diameter of the electrostatic chuck 2 is slightly smaller than 300 millimeters, about 298~299 millimeters, and the edge ring 4 is used to provide the described
Several millimeters be short of on electrostatic chuck 2.
Currently, when wafer 1 shifts position in detecting blind area, and be placed on electrostatic chuck 2, if positional shift
It is excessive, it rides over wafer 1 in edge ring 4, back helium system alarm can be triggered；But it if is placed on electrostatic chuck 2 and position
In the case that offset is not very big, wafer 1 can rub during being placed into 2 surface of electrostatic chuck to edge ring 4
Side generates particle, but since back helium system is shown normally, will be unable to detect 1 positional shift of wafer, board also can
Continue normal operation, it will cause the region of the wafer 1 to generate defect, before product defects scanning, due to there is no phase
Warning message and Parameters variation information are closed, board also will continue to run goods, cause large-tonnage product yield relatively low or even scrap.
Position of the wafer 1 on the electrostatic chuck 2 is detected by using the detection device 3 in the utility model
It sets, whether the position that can detect wafer 1 in time deviates, if appearance position deviates, 3 meeting of detection device and alarm simultaneously stop
Operation avoids subsequent wafer 1 from continuing to deviate, and continues to be damaged；If the position of the wafer 1 does not deviate, continue normal
Operation neither influences being normally carried out for technique, and can find the problem in time, prevents more wafers 1 impaired.Further, this reality
With the novel yield for improving product, reduce since wafer 1 is damaged bring economic loss.
In wafer position detecting system provided by the utility model, the wafer position detecting system includes cavity 5,
The detection device 3 is arranged on the inner wall of the cavity 5.The wafer 1 is passed in cavity 5, and the cavity 5, which becomes, to be detectd
Blind area is surveyed, therefore needs that detection device 3 is arranged in the cavity 5 in the present embodiment, to detect the wafer in the cavity 5
1 position.Common, the electrostatic chuck 2 and edge ring 4 are set in the cavity 5.
Preferably, the quantity of the detection device 3 is multiple, and it is uniformly distributed on the inner wall of the cavity 5.So as to multi-party
Position detects the position of the wafer 1.Further, the position of the detection device 3 is higher than the upper surface of the edge ring 4.It keeps away
Exempt from detection light beam to be blocked by the edge ring 4, detect less than the wafer 1, so that detection device 3 loses meaning.Preferably, institute
The detection light beam for stating detection device 3 and 4 upper surface of edge ring allow the detection device 3 to detect institute in sustained height
The last motion profile that wafer 1 is fallen on the electrostatic chuck 2 is stated, so that detection result is more accurate.
Preferably, the detection device 3 includes sapphire material infrared detection device 3.In semiconductor processing, cavity 5
It is interior to make the detection device 3 according to general material, it may result in the detection device 3 and be easily damaged, reduce the spy
Survey 3 service life of device.Infrared detection device 3 is preferably used in the utility model, the infrared detection device 3 emits including infrared ray
Device, receiver and signal processor, the signal output end of signal processor is through infrared transmitter and RF transmitter
Connection；Signal input part is connect through infrared radiation receiving circuit with infrared receiver, feedback signal output and peripheral control
Circuit connection.The infrared detection device 3 can generate encoded signal as signal processor using one chip microcomputer, drive red
Outside line transmitter issue have encoded signal infrared signal, and real-time detection by amplifying circuit treated reflection letter
Number, encoded signal can guarantee that the sensor of multiple same models is worked in the same time and place without interfering with each other.And work frequency
Rate is consistent, high reliablity, small power consumption.
In wafer position detecting system provided by the utility model, the electrostatic chuck 2 includes pedestal 21 and support
Portion 22, the support portion 22 are arranged on the pedestal 21, the edge ring 4 be set in the support portion 22 and with the pedestal
21 are in contact, and the height of the edge ring 4 is greater than the height of the support portion 22.It further, is in one on the inside of the edge ring 4
Annular table scalariform, including one side and a step surface, side phase of the side with the step surface far from the support portion 22
It hands over and the separate pedestal 21, the step surface is lower than or is flush to the top surface of the support portion 22.
Further, warning device is provided in the detection device 3.It is common, the wafer 1 by thimble rise or
Decline, the wafer 1 is placed on the electrostatic chuck 2；During the wafer 1 is mobile, the detection device 3 is visited
Survey the movement routine of the wafer 1；The detection device 3 according to detectable signal, and judge in time the wafer 1 position whether
Offset, if appearance position deviates, 3 meeting of detection device and alarm simultaneously stop operation, and subsequent wafer 1 is avoided to continue to deviate,
Continue to be damaged；If the position of the wafer 1 does not go out to deviate, continues normal operation, neither influence being normally carried out for technique, again
It can find the problem in time, prevent more wafers 1 impaired.Further, the utility model improves the yield of product, reduce by
Bring economic loss is damaged in wafer 1.
In wafer position detecting system provided by the utility model, the cavity 5 includes semiconductor reaction cavity 5.
In semiconductor processing, product is processed and is improved in the reaction cavity 5.
To sum up, in wafer position detecting system provided by the utility model, the wafer position detecting system includes:
Electrostatic chuck, edge ring and detection device；The edge ring is set to limit a bearing space on the electrostatic chuck,
The detection device is set on the outside of the edge ring, detects whether wafer to be processed is transferred in the bearing space just.
In semiconductor processing, wafer, which needs to be placed to, carries out operation on electrostatic chuck, wafer is placed into the electrostatic
Position is easy to happen offset when on sucker, causes wafer generating region defect.It is filled in the utility model by using the detection
The position for detecting the wafer on the electrostatic chuck is set, whether the position that can detect wafer in time deviates, if appearance position
Offset, the detection device meeting and alarm simultaneously stop operation, and avoid subsequent wafer from continuing to deviate, continue to be damaged；If the crystalline substance
Round position does not go out to deviate, then continues normal operation, neither influence being normally carried out for technique, and can find the problem in time, hinder
Only more wafer damages.Further, the utility model improves the yield of product, reduces since wafer damage bring passes through
Ji loss.
The preferred embodiment that above are only the utility model, does not play the role of any restrictions to the utility model.
Any person of ordinary skill in the field, in the range of not departing from the technical solution of the utility model, to the utility model
The technical solution and technology contents of exposure make the variation such as any type of equivalent replacement or modification, belong to without departing from the utility model
Technical solution content, still fall within the protection scope of the utility model.
Claims (10)
1. a kind of wafer position detecting system characterized by comprising electrostatic chuck, edge ring and detection device；The side
Edge ring is set on the electrostatic chuck to limit a bearing space, and the detection device is set on the outside of the edge ring,
Detect whether wafer to be processed is transferred in the bearing space just.
2. wafer position detecting system as described in claim 1, which is characterized in that the detection direction of the detection device and institute
The most edge for stating bearing space is tangent.
3. wafer position detecting system as described in claim 1, which is characterized in that the wafer position detecting system includes chamber
Body, the detection device are arranged on the inner wall of the cavity.
4. wafer position detecting system as described in claim 1, which is characterized in that the quantity of the detection device be it is multiple,
And it is uniformly distributed.
5. wafer position detecting system as described in claim 1, which is characterized in that the position of the detection device is higher than described
The upper surface of edge ring.
6. wafer position detecting system as described in claim 1, which is characterized in that the detection device includes sapphire material
Infrared detection device.
7. wafer position detecting system as described in claim 1, which is characterized in that the electrostatic chuck includes pedestal and support
Portion, on the base, the edge ring is set in the support portion and is in contact with the pedestal, institute for the support portion setting
The height for stating edge ring is greater than the height of the support portion.
8. wafer position detecting system as claimed in claim 7, which is characterized in that be in a ring-shaped step on the inside of the edge ring
Shape, including one side and a step surface, the side intersect far from the side of the support portion with the step surface and far from institutes
Pedestal is stated, the step surface is lower than or is flush to the top surface of the support portion.
9. wafer position detecting system as described in claim 1, which is characterized in that be provided with alarm dress in the detection device
It sets.
10. wafer position detecting system as claimed in claim 3, which is characterized in that the cavity includes semiconductor reaction chamber
Body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820998899.4U CN208478299U (en) | 2018-06-26 | 2018-06-26 | A kind of wafer position detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820998899.4U CN208478299U (en) | 2018-06-26 | 2018-06-26 | A kind of wafer position detecting system |
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| Publication Number | Publication Date |
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| CN208478299U true CN208478299U (en) | 2019-02-05 |
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ID=65215479
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| CN201820998899.4U Active CN208478299U (en) | 2018-06-26 | 2018-06-26 | A kind of wafer position detecting system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885765A (en) * | 2021-01-19 | 2021-06-01 | 拾斛科技(南京)有限公司 | Wafer substrate sucking disc |
| CN114000192A (en) * | 2021-10-29 | 2022-02-01 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and monitoring method of wafer position state |
| CN114855149A (en) * | 2021-03-25 | 2022-08-05 | 拓荆科技股份有限公司 | Shadow ring and reaction cavity structure comprising same |
-
2018
- 2018-06-26 CN CN201820998899.4U patent/CN208478299U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885765A (en) * | 2021-01-19 | 2021-06-01 | 拾斛科技(南京)有限公司 | Wafer substrate sucking disc |
| CN114855149A (en) * | 2021-03-25 | 2022-08-05 | 拓荆科技股份有限公司 | Shadow ring and reaction cavity structure comprising same |
| CN114855149B (en) * | 2021-03-25 | 2023-07-28 | 拓荆科技股份有限公司 | Shadow ring and reaction cavity structure comprising same |
| CN114000192A (en) * | 2021-10-29 | 2022-02-01 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and monitoring method of wafer position state |
| WO2023072180A1 (en) * | 2021-10-29 | 2023-05-04 | 北京北方华创微电子装备有限公司 | Semiconductor processing device and method for monitoring wafer position status |
| CN114000192B (en) * | 2021-10-29 | 2023-10-13 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and method for monitoring wafer position state |
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