CN208478152U - A kind of chip multilayer ceramic capacitor - Google Patents

Abstract

The utility model discloses a kind of chip multilayer ceramic capacitor, including ceramic protective shell and the external electrode for being symmetrically set in ceramic protective shell both ends, the inside of ceramic protective shell is vertically separated into several layers dielectric ceramics layer, ceramic buffer layer is equipped between adjacent two dielectric ceramics layer, top layer and lowest level dielectric ceramics layer it is upper, lower surface is covered with ceramic cover plate, dielectric ceramics layer includes the ceramic dielectric layer for being located in the middle internal electrode layer He being wrapped on the outside of internal electrode layer, the both ends of internal electrode layer are connect with external electrode, the zigzag reinforcing rib for connecting two external electrodes is equipped in ceramic dielectric layer, external electrode includes the copper external electrode connecting with internal electrode layer, the outwardly extending electroconductive resin flexible electrode of connection copper external electrode bottom end edge and the scolding tin external electrode for being connected to electroconductive resin flexible electrode end.The capacitance of the utility model is big, and intensity is high, not easy to crack, long service life, and can avoid the generation of bad connection phenomenon between electrode to a certain extent.

Description

A kind of chip multilayer ceramic capacitor

Technical field

The utility model relates to capacitor area more particularly to a kind of chip multilayer ceramic capacitors.

Background technique

Due to electronic equipment complete machine and electric appliance, power equipment miniaturization, the quickening of lightweight process, make electronic component Volume must make the transition to extra small, ultra-thin to chip type.Therefore, chip multilayer ceramic capacitor (MLCC) manufacturing technology go out The development of modern electronic technology has now been complied with development, and has become dosage maximum, chip components and parts with fastest developing speed in the world One of.Chip multilayer ceramic capacitor is high-performance electronic complete machine, essential base components in electrical equipment, is widely used in Television set, video recorder, sound equipment, computer terminal, communication apparatus, energy-conserving light source, automotive electronics, electrical equipment and Department of Electronics The fields such as system.

The chip multilayer ceramic capacitor of the prior art, due to its Structure Designing Problem, there is also more drawbacks, specifically As follows: the intensity of 1. capacitors is low, is easy to happen fracture in use, causes to fail；2. when by impact loading When, it be easy to cause scolding tin and substrate portion to crack, or even cause local desoldering, more very weld is caused integrally to fall off, cause electricity Hold reliability rapid drawdown；3. the inside of capacitor is easy to happen layering and cracking, service life is short.Therefore, it needs to develop a kind of high The chip multilayer ceramic capacitor of quality.

Utility model content

The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of chip multilayer ceramic capacitor.

The technical solution of the utility model is as follows:

A kind of chip multilayer ceramic capacitor including ceramic protective shell and is symmetrically set in the outer of the ceramic protective shell both ends The inside of electrode, the ceramics protective shell is vertically separated into several layers dielectric ceramics layer, adjacent two dielectric ceramics It is equipped with ceramic buffer layer between layer, the upper and lower surfaces of top layer and lowest level dielectric ceramics layer are covered with ceramic cover plate, described Dielectric ceramics layer includes the ceramic dielectric layer for being located in the middle internal electrode layer He being wrapped on the outside of internal electrode layer, the interior electrode The both ends of layer are connect with the external electrode, and the zigzag for connecting two external electrode is equipped in the ceramic dielectric layer and is reinforced Muscle, the external electrode include the copper external electrode being connect with the internal electrode layer, connection copper external electrode bottom end edge prolong outward The electroconductive resin flexible electrode stretched and the scolding tin external electrode for being connected to electroconductive resin flexible electrode end.

Further, the ceramic cover plate is made of high strength ceramic material.

Further, the ceramic cover plate is composed of high-strength ceramic with BaTiO3 system dielectric ceramics cofiring.

Further, the three-point bending strength of the ceramic cover plate is more than 100MPa.

Further, the dielectric ceramics layer is BaTiO3 dielectric ceramics layer.

Further, the upper layer and lower layer ceramics cover plate exists with top layer and undermost dielectric ceramics layer cofiring respectively Together.

Compared with the existing technology, the utility model has the beneficial effects that:

1, the inside of the utility model is separated into several layers dielectric ceramics layer, to greatly improve the electricity of capacitor Capacity has the advantages that capacitance is high, insulation resistance is high；

2, the ceramic buffer layer being equipped between dielectric ceramics layer can be effectively relieved internal electrode layer and ceramic dielectric layer and burn The sintering stress generated when knot keeps capacitor not easy to crack, extends the service life of capacitor；

3, it selects high-intensitive ceramic material to cook the cover plate of dielectric ceramics layer, i.e., does not influence BaTiO3 system dielectric ceramics Electrical property can overcome again with BaTiO3 system dielectric ceramics manufacture MLCC product it is intrinsic porcelain body it is crisp, intensity is low, easy fracture Defect；

4, the zigzag reinforcing rib inside ceramic dielectric layer can effectively prevent internal electrode layer and ceramic dielectric layer in sintering The case where capacitor caused by the sintering stress of generation cracks, extends the service life of capacitor；

5, the electroconductive resin flexible electrode of its external electrode has certain deformation quantity, is avoided that in capacitor to a certain extent The overstress in portion, capacitor is cracked, cracking so as to avoiding to a certain extent, and then can avoid electrode to a certain extent Between bad connection phenomenon generation.

Detailed description of the invention

It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new Some embodiments of type for those of ordinary skill in the art without creative efforts, can be with root Other attached drawings are obtained according to these attached drawings.

Fig. 1 is the structural schematic diagram of the utility model；

Fig. 2 is the installation condition schematic diagram of the utility model.

Specific embodiment

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation The present invention will be further described in detail for example.It should be appreciated that specific embodiment described herein is only used to explain The utility model is not used to limit the utility model.

In order to illustrate technical solution described in the utility model, the following is a description of specific embodiments.

Embodiment

Fig. 1, Fig. 2 are please referred to, the present embodiment provides a kind of chip multilayer ceramic capacitor, including ceramic protective shell 1 and right Claim the external electrode 2 for being set to 1 both ends of ceramic protective shell, the inside of ceramic protective shell 1 is vertically separated into several layers dielectric Ceramic layer 11 increases the capacitance of capacitor.

Further, ceramic buffer layer 3 is equipped between adjacent two dielectric ceramics layer 11, ceramic buffer layer 3 can effectively delay The sintering stress that solution internal electrode layer 111 and ceramic dielectric layer 112 are generated in sintering, keeps capacitor not easy to crack, extends capacitor The service life of device.

The upper and lower surfaces of top layer and lowest level dielectric ceramics layer 11 are covered with ceramic cover plate 4.When implementation, the pottery Porcelain cover plate 4 can be made of single high strength ceramic material；Preferably, the ceramics cover plate 4 is by high-strength ceramic and BaTiO3 It is that dielectric ceramics cofiring is composed.The condition to be met is: the three-point bending strength of the ceramics cover plate 4 will be more than 100MPa.It is not easy to break to improve the intensity of capacitor.

Further, the dielectric ceramics layer 11 is BaTiO3 dielectric ceramics layer, the upper layer and lower layer ceramics cover plate 4 It is co-fired together respectively with top layer and undermost dielectric ceramics layer 11.It ensure that integrally-built stability.

Further, the dielectric ceramics layer 11 includes being located in the middle internal electrode layer 111 and being wrapped in internal electrode layer The ceramic dielectric layer 112 in 111 outsides, insulation resistance is high, and the both ends of internal electrode layer 111 are connect with external electrode 2, ceramic dielectric layer It is equipped with the zigzag reinforcing rib 5 for connecting two external electrodes 2 in 112, internal electrode layer 111 and ceramic dielectric layer 112 can be effectively prevent Caused by the sintering stress generated in sintering the case where capacitor cracking, extends the service life of capacitor, be sintered When, the zigzag reinforcing rib 5 can always hold the external electrode 2 of two sides, prevent from being broken.

Further, the external electrode 2 includes the copper external electrode 21 connecting with internal electrode layer 111, connection copper external electrode 21 The outwardly extending electroconductive resin flexible electrode 22 of bottom end edge and the scolding tin dispatch from foreign news agency for being connected to 22 end of electroconductive resin flexible electrode Pole 23.

When chip multilayer ceramic capacitor described in embodiment is mounted, two scolding tin external electrode 23 is passed through into weldering Tin 6 is welded on corresponding substrate 7.After completing attachment, surrounded between the chip multilayer ceramic capacitor and the substrate 7 One cavity 8.

After attachment, when deformation occurs for substrate 7, both ends electroconductive resin flexible electrode 22 has certain during support Amount of deflection, the cracking of scolding tin 6 Yu 7 coupling part of substrate is avoided to a certain extent, to avoid this to a certain extent The generation of the even whole obscission of the local desoldering of chip multilayer ceramic capacitor；On the other hand, make the sheet type multi-layer ceramic The termination electrode of capacitor has certain deformation quantity, this make it is subsequent mounted to corresponding substrate 7, receive impact at it When load acts on, the separation of scolding tin 6 Yu 7 coupling part of substrate is avoided to a certain extent, and then avoid to a certain extent The generation of the even whole obscission of chip multilayer ceramic capacitor desoldering.

The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model Protection scope within.

Claims (6)

1. a kind of chip multilayer ceramic capacitor, it is characterised in that: including ceramic protective shell and be symmetrically set in the ceramics protection The inside of the external electrode at shell both ends, the ceramics protective shell is vertically separated into several layers dielectric ceramics layer, and adjacent two It is equipped with ceramic buffer layer between dielectric ceramics layer, the upper and lower surfaces of top layer and lowest level dielectric ceramics layer are covered with pottery Porcelain cover plate, the dielectric ceramics layer include the ceramic dielectric for being located in the middle internal electrode layer He being wrapped on the outside of internal electrode layer Layer, the both ends of the internal electrode layer are connect with the external electrode, are equipped in the ceramic dielectric layer and are connected two external electrode Zigzag reinforcing rib, the external electrode include the copper external electrode being connect with the internal electrode layer, connection copper external electrode bottom The outwardly extending electroconductive resin flexible electrode in end edge portion and the scolding tin external electrode for being connected to electroconductive resin flexible electrode end.

2. a kind of chip multilayer ceramic capacitor according to claim 1, it is characterised in that: the ceramics cover plate is by high-strength Degree ceramic material is made.

3. a kind of chip multilayer ceramic capacitor according to claim 1, it is characterised in that: the ceramics cover plate is by high-strength Degree ceramics are composed with BaTiO3 system dielectric ceramics cofiring.

4. a kind of chip multilayer ceramic capacitor according to claim 2 or 3, it is characterised in that: the ceramics cover plate Three-point bending strength is more than 100MPa.

5. a kind of chip multilayer ceramic capacitor according to claim 1, it is characterised in that: the dielectric ceramics layer is BaTiO3 dielectric ceramics layer.

6. a kind of chip multilayer ceramic capacitor according to claim 5, it is characterised in that: the upper layer and lower layer ceramic cap Piece is co-fired together with top layer and undermost dielectric ceramics layer respectively.