CN208477468U - A kind of water-cooled radiator device for computer CPU heat dissipation - Google Patents
A kind of water-cooled radiator device for computer CPU heat dissipation Download PDFInfo
- Publication number
- CN208477468U CN208477468U CN201821197273.XU CN201821197273U CN208477468U CN 208477468 U CN208477468 U CN 208477468U CN 201821197273 U CN201821197273 U CN 201821197273U CN 208477468 U CN208477468 U CN 208477468U
- Authority
- CN
- China
- Prior art keywords
- water
- tee tube
- pipe
- frame
- far
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of water-cooled radiator devices for computer CPU heat dissipation, including bottom plate, the water inlet end and backwater end of miniature cooling pump have been respectively communicated with water inlet pipe, return pipe, water inlet pipe is communicated with the first tee tube far from one end of miniature cooling pump, return pipe is communicated with the second tee tube far from one end of miniature cooling pump, the bottom end of first tee tube, the bottom end of second tee tube is connected to cooling tube into backwater end respectively, first tee tube is communicated with the first water pipe far from one end of water inlet pipe, second tee tube is communicated with the second water pipe far from one end of return pipe, the inside of heat sink offers S-shaped water channel, the utility model relates to CPU technical field of heat dissipation.A kind of water-cooled radiator device for computer CPU heat dissipation, has achieved the effect that radiating efficiency is high, and structure is simple, easy to use, realizes wind water cooling and combines, improve radiating efficiency, extends the service life of CPU.
Description
Technical field
Utility model is related to CPU technical field of heat dissipation, specially a kind of water-cooled radiator dress for computer CPU heat dissipation
It sets.
Background technique
With electronics technology fast development and people life & amusement and work on needs, computer at
Essential a kind of daily necessity in people's daily life.Central processing unit is one piece of ultra-large integrated circuit, is one
The arithmetic core and control core of platform computer, its function are mainly in interpretive machine instruction and processing computer software
Data, CPU workload is very big, therefore big calorimetric can be generated in the course of work, if heat distributes not in time can drag slow meter
The speed of service of calculation machine results even in burning for computer, therefore, it is necessary to carry out cooling heat to computer CPU.At present
Existing CPU radiator is most or air-cooled, and it is too low that there is cooling efficiencies, and heat cannot be distributed in time, a small number of
Also water cooling can be used, structure is complicated, inconvenient to use, and by inside dust inspiration device during blowing, further
Influence the service life of computer.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of water-cooled radiator dress for computer CPU heat dissipation
It sets, solves the problems, such as that radiating efficiency is low, it is structurally reasonable simple, it is easy to use, it realizes wind water cooling and combines, improve heat dissipation
Efficiency extends the service life of CPU.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: one kind radiates for computer CPU
Water-cooled radiator device, including bottom plate is fixedly connected with U-frame at the top of the bottom plate, and the U-frame inner wall is corresponding
Micromotor is fixedly connected with by fixed frame between two sides, the output shaft of the micromotor is fixedly connected with fan, described
It is fixedly connected with cooling tube at the top of bottom plate, miniature cooling pump, the miniature cooling pump are fixedly connected at the top of the U-frame
Water inlet end and backwater end be respectively communicated with water inlet pipe, return pipe, the water inlet pipe is communicated with far from one end of miniature cooling pump
First tee tube, the return pipe are communicated with the second tee tube, the bottom of first tee tube far from one end of miniature cooling pump
Portion, the second tee tube bottom be fixedly connected at the top of U-frame, the bottom of first tee tube, the second tee tube
Bottom is run through the top of U-frame and is extended to inside it, the bottom of the bottom end of first tee tube, the second tee tube
One end is connected to cooling tube into backwater end respectively, and first tee tube is communicated with the first water pipe far from one end of water inlet pipe,
Second tee tube is communicated with the second water pipe far from one end of return pipe, and CPU is fixedly connected at the top of the bottom plate, described
Heat sink is fixedly connected at the top of CPU, the inside of the heat sink offers S-shaped water channel, and first water pipe is far from first
One end of tee tube is connected to the water inlet end of S-shaped water channel, the one end of second water pipe far from the second tee tube and S-shaped water channel
Backwater end connection, the surface of the heat sink offers heat release hole.
Preferably, the surface side of the U-frame offers air inlet, between the corresponding two sides of the U-frame inner wall
It is fixedly connected with forward filtering net, the top of the bottom plate and is fixedly connected to metal fin positioned at the two sides of CPU, it is described
The surface of bottom plate and S-shaped hole is offered positioned at the bottom position of CPU.
Preferably, the water inlet pipe, return pipe, the first water pipe and the second water pipe are disposed as corrosion-and high-temp-resistant hose.
Preferably, the heat release hole is evenly distributed on the surface of heat sink.
Preferably, the air inlet is evenly distributed on the surface side of U-frame.
Preferably, the S-shaped hole is evenly distributed on the surface of bottom plate and is located at the bottom position of CPU.
(3) beneficial effect
The utility model provides a kind of water-cooled radiator device for computer CPU heat dissipation.Have it is following the utility model has the advantages that
(1), the water-cooled radiator device for being used for computer CPU heat dissipation, it is miniature cold by being fixedly connected at the top of U-frame
But it pumps, the water inlet end and backwater end of miniature cooling pump have been respectively communicated with water inlet pipe, return pipe, and water inlet pipe is far from miniature cooling pump
One end is communicated with the first tee tube, and return pipe is communicated with the second tee tube far from one end of miniature cooling pump, the first tee tube
Bottom end, the second tee tube bottom end be connected to respectively with cooling tube into backwater end, the first tee tube is far from water inlet pipe
One end be communicated with the first water pipe, the second tee tube is communicated with the second water pipe far from one end of return pipe, and the inside of heat sink is opened
Equipped with S-shaped water channel, the one end of the first water pipe far from the first tee tube is connected to the water inlet end of S-shaped water channel, and the second water pipe is far from
One end of two tee tubes is connected to the backwater end of S-shaped water channel, has achieved the effect that radiating efficiency is high, structurally reasonable simple, is used
It is convenient, it realizes wind water cooling and combines, improve radiating efficiency, extend the service life of CPU, reduce economic loss.
(2), water-cooled radiator device for being used for computer CPU heat dissipation, by solid between the corresponding two sides of U-frame inner wall
Surely it is connected with forward filtering net, the surface of bottom plate and the bottom position positioned at CPU, which offer S-shaped hole and reach, prevents dust from entering
Effect, structure is simple, easy to use, has dust reduction capability, effectively prevents dust entrance, extends the service life of CPU.
Detailed description of the invention
Fig. 1 is the utility model structure chart；
Fig. 2 is the utility model top view；
Fig. 3 is A-A cross-sectional view in Fig. 1；
Fig. 4 is cooling tube right view.
In figure: 1 bottom plate, 2U shape frame, 3 fixed frames, 4 micromotors, 5 fans, 6 cooling tubes, 7 miniature cooling pumps, 8 water inlets
Pipe, 9 return pipes, 10 first tee tubes, 11 second tee tubes, 12 first water pipes, 13 second water pipes, 14CPU, 15 heat sinks, 16S
Shape water channel, 17 heat release holes, 18 air inlets, 19 forward filtering nets, 20 metal fins, 21S shape hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of water-cooling for computer CPU heat dissipation
Device device, including bottom plate 1, the top of bottom plate 1 are fixedly connected with U-frame 2, pass through between the corresponding two sides of 2 inner wall of U-frame solid
Determine frame 3 and be fixedly connected with micromotor 4, the output shaft of micromotor 4 is fixedly connected with fan 5, and the top of bottom plate 1 is fixedly connected
There is cooling tube 6, cooling tube 6 is set as S-shaped, increases heat dissipation area, improves radiating efficiency, the top of U-frame 2 is fixedly connected with micro-
Type cooling pump 7, the water inlet end and backwater end of miniature cooling pump 7 have been respectively communicated with water inlet pipe 8, return pipe 9, and water inlet pipe 8 is far from micro-
One end of type cooling pump 7 is communicated with the first tee tube 10, and return pipe 9 is communicated with the second threeway far from one end of miniature cooling pump 7
Pipe 11, the bottom of the first tee tube 10, the second tee tube 11 bottom be fixedly connected with the top of U-frame 2, the first tee tube
10 bottom, the second tee tube 11 bottom run through the top of U-frame 2 and extend to inside it, the bottom of the first tee tube 10
Portion one end, second tee tube 11 bottom end be connected to respectively with cooling tube 6 into backwater end, the first tee tube 10 is far from water inlet
One end of pipe 8 is communicated with the first water pipe 12, and the second tee tube 11 is communicated with the second water pipe 13 far from one end of return pipe 9, water inlet
Pipe 8, return pipe 9, the first water pipe 12 and the second water pipe 13 are disposed as corrosion-and high-temp-resistant hose, increase service life, bottom plate 1
Top be fixedly connected with CPU14, heat sink 15 is fixedly connected at the top of CPU14, the inside of heat sink 15 offers S-shaped water
Road 16, S-shaped water channel 16 increase heat dissipation area, improve radiating efficiency, the first water pipe 12 one end and S-shaped far from the first tee tube 10
The water inlet end of water channel 16 is connected to, and the second water pipe 13 is connected to far from one end of the second tee tube 11 with the backwater end of S-shaped water channel 16, is dissipated
The surface of hot plate 15 offers heat release hole 17, and heat release hole 17 is evenly distributed on the surface of heat sink 15, the surface side of U-frame 2
Offer air inlet 18, air inlet 18 is evenly distributed on the surface side of U-frame 2, between the corresponding two sides of 2 inner wall of U-frame
It is fixedly connected with forward filtering net 19, forward filtering net 19 filters out dust, and avoid dust from entering inside device, bottom plate 1
Top and the two sides for being located at CPU14 are fixedly connected to metal fin 20, the surface of bottom plate 1 and the bottom position for being located at CPU14
It sets and offers S-shaped hole 21, S-shaped hole 21 is evenly distributed on the surface of bottom plate 1 and is located at the bottom position of CPU14, and S-shaped hole 21 can be with
Dust will not enter simultaneously for heat dissipation.
In use, starting micromotor 4 is first made its work, fan 5 is driven, is opened first by the output shaft of micromotor 4
Beginning, progress is air-cooled, and opening miniature cooling pump 7 at this time makes its work, and coolant liquid is passed through water inlet pipe 8 to the 1st by miniature cooling pump 7
Siphunculus 10 is respectively enteing cooling tube 6 and the first water pipe 12 through the first tee tube 10, then is entering S-shaped water channel through the first water pipe 12
In 16, the water outlet of S-shaped water channel 16 reaches the second tee tube 11 by the second water pipe 13, returns to using return pipe 9 miniature cold
But in pump 7, circulation is formed, at this time under the action of wind, geomantic omen is carried out and cools down together, heat release hole 17, metal fin 20 and S
Shape hole 21 all has heat sinking function.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or equipment for including element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of water-cooled radiator device for computer CPU heat dissipation, including bottom plate (1), it is characterised in that: the bottom plate (1)
Top be fixedly connected with U-frame (2), connect between the corresponding two sides of U-frame (2) inner wall by the way that fixed frame (3) are fixed
It is connected to micromotor (4), the output shaft of the micromotor (4) is fixedly connected with fan (5), and the top of the bottom plate (1) is solid
Surely it is connected with cooling tube (6), is fixedly connected with miniature cooling pump (7) at the top of the U-frame (2), the miniature cooling pump (7)
Water inlet end and backwater end be respectively communicated with water inlet pipe (8), return pipe (9), the water inlet pipe (8) is far from miniature cooling pump (7)
One end be communicated with the first tee tube (10), the return pipe (9) is communicated with the second threeway far from the one end of miniature cooling pump (7)
It manages (11), the bottom of first tee tube (10), the bottom of the second tee tube (11) are fixed with the top of U-frame (2) and connected
It connects, the bottom of first tee tube (10), the bottom of the second tee tube (11) are run through the top of U-frame (2) and extended to
Inside it, the bottom end of first tee tube (10), the second tee tube (11) bottom end respectively with cooling tube (6)
It being connected into backwater end, first tee tube (10) is communicated with the first water pipe (12) far from the one end of water inlet pipe (8), and described second
Tee tube (11) is communicated with the second water pipe (13) far from the one end of return pipe (9), is fixedly connected at the top of the bottom plate (1)
CPU (14) is fixedly connected with heat sink (15) at the top of the CPU (14), and the inside of the heat sink (15) offers S-shaped water
Road (16), first water pipe (12) is connected to far from the one end of the first tee tube (10) with the water inlet end of S-shaped water channel (16), described
Second water pipe (13) is connected to far from the one end of the second tee tube (11) with the backwater end of S-shaped water channel (16), the heat sink (15)
Surface offer heat release hole (17).
2. a kind of water-cooled radiator device for computer CPU heat dissipation according to claim 1, it is characterised in that: the U
The surface side of shape frame (2) offers air inlet (18), and U-frame (2) inner wall is fixedly connected between corresponding two sides
Forward filtering net (19), the top of the bottom plate (1) and the two sides for being located at CPU (14) are fixedly connected to metal fin
(20), the surface of the bottom plate (1) and be located at CPU (14) bottom position offer S-shaped hole (21).
3. a kind of water-cooled radiator device for computer CPU heat dissipation according to claim 1, it is characterised in that: described
Water inlet pipe (8), return pipe (9), the first water pipe (12) and the second water pipe (13) are disposed as corrosion-and high-temp-resistant hose.
4. a kind of water-cooled radiator device for computer CPU heat dissipation according to claim 1, it is characterised in that: described
Heat release hole (17) is evenly distributed on the surface of heat sink (15).
5. a kind of water-cooled radiator device for computer CPU heat dissipation according to claim 2, it is characterised in that: described
Air inlet (18) is evenly distributed on the surface side of U-frame (2).
6. a kind of water-cooled radiator device for computer CPU heat dissipation according to claim 2, it is characterised in that: the S
Shape hole (21) is evenly distributed on the surface of bottom plate (1) and is located at the bottom position of CPU (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821197273.XU CN208477468U (en) | 2018-07-27 | 2018-07-27 | A kind of water-cooled radiator device for computer CPU heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821197273.XU CN208477468U (en) | 2018-07-27 | 2018-07-27 | A kind of water-cooled radiator device for computer CPU heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208477468U true CN208477468U (en) | 2019-02-05 |
Family
ID=65208940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821197273.XU Active CN208477468U (en) | 2018-07-27 | 2018-07-27 | A kind of water-cooled radiator device for computer CPU heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208477468U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262644A (en) * | 2019-05-23 | 2019-09-20 | 赣州市翔义科技有限公司 | A kind of air-cooled computer radiator |
| CN111381638A (en) * | 2020-03-03 | 2020-07-07 | 戴森信息科技（杭州）有限公司 | Dustproof case for computer |
-
2018
- 2018-07-27 CN CN201821197273.XU patent/CN208477468U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262644A (en) * | 2019-05-23 | 2019-09-20 | 赣州市翔义科技有限公司 | A kind of air-cooled computer radiator |
| CN111381638A (en) * | 2020-03-03 | 2020-07-07 | 戴森信息科技（杭州）有限公司 | Dustproof case for computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208477468U (en) | A kind of water-cooled radiator device for computer CPU heat dissipation | |
| CN207780708U (en) | A kind of server liquid-cooling heat radiator | |
| CN210348391U (en) | Water-cooling radiator for radiating computer CPU | |
| CN108958437A (en) | Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method | |
| CN104571423B (en) | A kind of computer heat radiation system | |
| CN205583907U (en) | High -efficient radiating PMSM | |
| CN209447114U (en) | A kind of radiator for computer CPU | |
| CN208044530U (en) | A kind of computer radiator easy to disassemble and clean | |
| CN206178624U (en) | Computer radiating device | |
| CN208477437U (en) | A kind of computer host box convenient for heat dissipation | |
| CN209461449U (en) | A kind of computer chip water-cooling radiating structure | |
| CN205910664U (en) | Heat radiator for computer | |
| CN208175208U (en) | Electronic component radiator | |
| CN216371513U (en) | Tooth tool grinding device | |
| CN210861940U (en) | High-efficient industry polymer radiator | |
| CN215301281U (en) | Liquid cooling heat dissipation device and electronic equipment | |
| CN201780545U (en) | Computer and computer all-in-one machine | |
| CN201184991Y (en) | Efficient radiator | |
| CN209821750U (en) | Server with heat radiation structure | |
| CN207096922U (en) | Computer cabinet cooling system | |
| CN207476101U (en) | It is a kind of to integrate water cooling and air-cooled radiator | |
| CN218827081U (en) | MOS chip temperature control fin | |
| CN208141326U (en) | A kind of novel computer CPU radiator | |
| CN209070479U (en) | A kind of integrated water-cooling device of mainboard and video card | |
| CN216795534U (en) | Cooling device for cabinet of electronic computer server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |