CN208462139U - Electrokinetic cell protection board with trapezoidal reinforcement plate - Google Patents
Electrokinetic cell protection board with trapezoidal reinforcement plate Download PDFInfo
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- CN208462139U CN208462139U CN201821153806.4U CN201821153806U CN208462139U CN 208462139 U CN208462139 U CN 208462139U CN 201821153806 U CN201821153806 U CN 201821153806U CN 208462139 U CN208462139 U CN 208462139U
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- plate
- electrokinetic cell
- stiffening plate
- protection board
- cell protection
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Abstract
The utility model relates to a kind of electrokinetic cell protection boards with trapezoidal reinforcement plate, and including the stiffening plate, AD glue-line and FPC plate stacked gradually from top to bottom, the stiffening plate is trapezoidal.The stiffening plate of the utility model no longer uses edge drop biggish shape up and down, but uses gentle trapezoidal in edge.Protective film is pressed on stiffening plate; since there is inclined-plane at stiffening plate edge; protective film can gently, closely fit on stiffening plate edge along inclined-plane; make stiffening plate edge attachments will not residual gas; when crossing Reflow Soldering; the stability of electrokinetic cell protection board is improved, to guarantee the quality of product.
Description
Technical field
The utility model relates to circuit board technology field more particularly to a kind of power battery protections with trapezoidal reinforcement plate
Plate.
Background technique
Existing electrokinetic cell protection board is typically employed on electric vehicle, during making electrokinetic cell protection board,
It needs to carry out reinforcement solutions to electrokinetic cell protection board, stiffening plate edge is all made of shape as shown in Figure 1 to Figure 2 at present.It will protect
Cuticula presses on stiffening plate, since stiffening plate has certain thickness, causes stiffening plate edge up and down there are biggish drop,
Be easy to appear following problems: 1, stiffening plate edge attachments can residual gas, when pressing, gas is escaped outward, is easy to cause reinforcement
There is lamination in the protective film of plate edge attachments；2, protective film can not be filled up completely stiffening plate edge, be cut into individually at
When product, the phenomenon that side of finished product is easy to appear bleed-out；3, when electrokinetic cell protection board crosses Reflow Soldering, stiffening plate edge attachments
Gas because of high-temperature expansion, be easy to cause the protective film of stiffening plate edge attachments bubble phenomenon occur, problem above will affect
The quality of product.
Utility model content
The power electric with trapezoidal reinforcement plate that the purpose of this utility model is to provide a kind of fittings closely, stability is high
Pond protection board.
In order to solve the above-mentioned technical problem, technical solution provided by the utility model are as follows:
A kind of electrokinetic cell protection board with trapezoidal reinforcement plate, including stiffening plate, the AD glue stacked gradually from top to bottom
Layer and FPC plate, the stiffening plate are trapezoidal.
Wherein, the stiffening plate is any of steel disc, PET sheet and PI plate, and the thickness range of the stiffening plate exists
Between 150um-250um.
Wherein, black insulation cover film is covered on the stiffening plate.
Wherein, the FPC plate include the first protective layer stacked gradually from top to bottom, the first copper plate, the first copper foil layer,
Substrate, the second copper foil layer, the second copper plate and the second protective layer.
Wherein, first protective layer includes the first ink layer and the first PI layer, and second protective layer includes second oily
Layer of ink and the 2nd PI layers.
Wherein, the thickness range of first ink layer and the second ink layer is between 20um-40um.
Wherein, the described first PI layers and the 2nd PI layers of thickness range is between 40um-45um.
Wherein, the substrate is PI substrate or pet substrate, and the thickness range of the substrate is between 20um-30um.
Wherein, the thickness range of first copper plate and the second copper plate is between 15um-20um.
Wherein, the thickness range of first copper foil layer and the second copper foil layer is between 20um-30um.
The utility model has the following beneficial effects: the stiffening plate of the utility model no longer uses the edge biggish shape of drop up and down
Shape, but use gentle trapezoidal in edge.Protective film is pressed on stiffening plate, since there are inclined-plane, protective film in stiffening plate edge
Can it is gentle along inclined-plane, closely fit on stiffening plate edge, make stiffening plate edge attachments will not residual gas, flow back crossing
When weldering, the stability of electrokinetic cell protection board is improved, to guarantee the quality of product.
Detailed description of the invention
Fig. 1 and Fig. 2 is the structural schematic diagram of stiffening plate in the prior art；
Fig. 3 is the structural schematic diagram of the electrokinetic cell protection board described in the utility model with trapezoidal reinforcement plate；
Fig. 4 is the structural schematic diagram of stiffening plate described in the utility model；
1, stiffening plate；2, AD glue-line；3, FPC plate；31, the first protective layer；311, the first ink layer；312, the first PI layers；
32, the first copper plate；33, the first copper foil layer；34, substrate；35, the second copper foil layer；36, the second copper plate；37, the second protection
Layer；371, the second ink layer；372, the 2nd PI layers；4, black insulation cover film.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As the embodiment of the electrokinetic cell protection board described in the utility model with trapezoidal reinforcement plate, such as Fig. 3 to Fig. 4 institute
Show, including the stiffening plate 1, AD glue-line 2 and FPC plate 3 stacked gradually from top to bottom, the stiffening plate 1 is trapezoidal.
The stiffening plate 1 of the utility model no longer uses the edge biggish shape of drop up and down, but gently using edge
It is trapezoidal.Protective film is pressed on stiffening plate 1, since there is inclined-plane at 1 edge of stiffening plate, protective film can be gentle along inclined-plane, close
Ground fits on 1 edge of stiffening plate, make 1 edge attachments of stiffening plate will not residual gas, cross Reflow Soldering when, improve power electric
The stability of pond protection board, to guarantee the quality of product.
The stiffening plate 1 is any of steel disc, PET sheet and PI plate, and the thickness range of the stiffening plate is in 150um-
Between 250um.In the present embodiment, the stiffening plate 1 is steel disc, and steel disc has the characteristics that intensity height and high temperature resistant；The steel
Piece with a thickness of 200um, by test, which can guarantee the strong of plugging position in the case where steel are using least situation
Degree.
In the present embodiment, black insulation cover film 4 is covered on the stiffening plate 1, due to electrokinetic cell protection board category
In the big product of research and development difficulty, and the R&D cycle is long, in order to improve the confidentiality of electrokinetic cell protection board, so in stiffening plate
One layer of black insulation cover film 4 is covered on 1.
In the present embodiment, the FPC plate 3 includes the first protective layer 31, the first copper plate stacked gradually from top to bottom
32, the first copper foil layer 33, substrate 34, the second copper foil layer 35, the second copper plate 36 and the second protective layer 37.
In the present embodiment, first protective layer 31 include the first ink layer 311 and the first PI layer 312, described second
Protective layer 37 includes the second ink layer 371 and the 2nd PI layer 372.
The thickness range of first ink layer 311 and the second ink layer 371 is between 20um-40um.In the present embodiment
In, first ink layer 311 and the second ink layer 371 with a thickness of 30um.
The thickness range of the first PI layer 312 and the 2nd PI layer 372 is between 40um-45um.In the present embodiment, institute
State the first PI layer 312 and the 2nd PI layer 372 with a thickness of 42.5um.
The substrate 34 is PI substrate or pet substrate, and the thickness range of the substrate 34 is between 20um-30um, at this
In embodiment, the substrate 34 be PI substrate, the substrate 34 with a thickness of 25um.
The thickness range of first copper plate 32 and the second copper plate 36 is between 15um-20um, in the present embodiment,
First copper plate 32 and the second copper plate 36 with a thickness of 18um.
The thickness range of second copper foil layer 35 and the second copper foil layer 35 is between 20um-30um, in the present embodiment,
First copper foil layer 33 and the second copper foil layer 35 with a thickness of 25um.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of electrokinetic cell protection board with trapezoidal reinforcement plate, which is characterized in that including the benefit stacked gradually from top to bottom
Strong plate, AD glue-line and FPC plate, the stiffening plate are trapezoidal.
2. electrokinetic cell protection board according to claim 1, which is characterized in that the stiffening plate is steel disc, PET sheet and PI
Plate it is any, the thickness range of the stiffening plate is between 150um-250um.
3. electrokinetic cell protection board according to claim 1, which is characterized in that be covered with black insulation on the stiffening plate
Cover film.
4. electrokinetic cell protection board according to claim 1, which is characterized in that the FPC plate includes from top to bottom successively
The first protective layer, the first copper plate, the first copper foil layer, substrate, the second copper foil layer, the second copper plate and the second protection of stacking
Layer.
5. electrokinetic cell protection board according to claim 4, which is characterized in that first protective layer includes the first ink
Layer and the first PI layer, second protective layer include the second ink layer and the 2nd PI layers.
6. electrokinetic cell protection board according to claim 5, which is characterized in that first ink layer and the second ink layer
Thickness range between 20um-40um.
7. electrokinetic cell protection board according to claim 5, which is characterized in that the described first PI layers and the 2nd PI layers of thickness
Range is spent between 40um-45um.
8. electrokinetic cell protection board according to claim 4, which is characterized in that the substrate be PI substrate or pet substrate,
The thickness range of the substrate is between 20um-30um.
9. electrokinetic cell protection board according to claim 4, which is characterized in that first copper plate and the second copper plate
Thickness range between 15um-20um.
10. electrokinetic cell protection board according to claim 4, which is characterized in that first copper foil layer and the second copper foil
The thickness range of layer is between 20um-30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153806.4U CN208462139U (en) | 2018-07-19 | 2018-07-19 | Electrokinetic cell protection board with trapezoidal reinforcement plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153806.4U CN208462139U (en) | 2018-07-19 | 2018-07-19 | Electrokinetic cell protection board with trapezoidal reinforcement plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208462139U true CN208462139U (en) | 2019-02-01 |
Family
ID=65180309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821153806.4U Active CN208462139U (en) | 2018-07-19 | 2018-07-19 | Electrokinetic cell protection board with trapezoidal reinforcement plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208462139U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512204A (en) * | 2020-11-30 | 2021-03-16 | 维沃移动通信有限公司 | Flexible circuit board and forming method thereof |
-
2018
- 2018-07-19 CN CN201821153806.4U patent/CN208462139U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512204A (en) * | 2020-11-30 | 2021-03-16 | 维沃移动通信有限公司 | Flexible circuit board and forming method thereof |
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