CN208440689U - A kind of Sputting film-plating apparatus - Google Patents
A kind of Sputting film-plating apparatus Download PDFInfo
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- CN208440689U CN208440689U CN201820520480.8U CN201820520480U CN208440689U CN 208440689 U CN208440689 U CN 208440689U CN 201820520480 U CN201820520480 U CN 201820520480U CN 208440689 U CN208440689 U CN 208440689U
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Abstract
The utility model provides a kind of Sputting film-plating apparatus, it includes vacuum cavity, sputtering target material, the plated matrix opposite with sputtering target material, air-out apparatus are provided in vacuum cavity, the air inlet for being passed through sputter gas into vacuum cavity is provided on the side wall of vacuum cavity, the gas access being connected with air inlet, at least two gas vents being connected with gas access are provided on air-out apparatus, each gas vent is distributed in at least side of sputtering target material.The Sputting film-plating apparatus of the utility model, it makes sputter gas that can be supplied to sputtering target material through at least two gas vents outflow sputter gas after air inlet, gas access enter air-out apparatus, it effectively increases and the quantity of the gas vent of sputter gas is provided to sputtering target material, so that the highly non-uniform phenomenon of bombardment that sputtering target material surface is subject in the prior art is preferably alleviated, so that the uniformity of the plated film film layer on plated matrix and the uniformity of sputtering target material consumption are improved.
Description
Technical field
The utility model relates to technical field of film preparation, and in particular to a kind of Sputting film-plating apparatus.
Background technique
Sputter coating is to be bombarded by being passed through sputter gas (usually argon gas) in vacuum cavity using sputter gas
Substance on sputtering target material surface is splashed on plated matrix by sputtering target material, forms plated film film layer on plated matrix.So
And existing Sputting film-plating apparatus only have have on the side wall of its vacuum cavity one be passed through into vacuum cavity sputter gas into
Stomata, this makes the degree bombarded on sputtering target material surface by sputter gas can be because of the sputtering target material surface position Shang Ge and air inlet
The difference in the distance between hole and it is different, i.e. the bombardment that is subject to of sputtering target material surface will be very uneven, so that plated base
Plated film film layer on body it is in uneven thickness, while also causing the consumption of sputtering target material uneven.
Utility model content
The purpose of the utility model is to provide a kind of Sputting film-plating apparatus, with solve in the prior art sputtering target material surface by
The highly non-uniform problem of the bombardment arrived.
To achieve the above object, the utility model provides following technical solution:
A kind of Sputting film-plating apparatus comprising vacuum cavity is provided with sputtering target material in the vacuum cavity, splashes with described
Material of shooting at the target opposite plated matrix is provided with for being passed through sputtering gas into the vacuum cavity on the side wall of the vacuum cavity
The air inlet of body further includes air-out apparatus, and the gas access being connected with the air inlet, institute are provided on the air-out apparatus
It states and is additionally provided at least two gas vents being connected with the gas access on air-out apparatus, each gas vent distribution
In at least side of the sputtering target material.
Preferably, each gas vent is evenly distributed on at least side of the sputtering target material.
Preferably, the number of the gas vent is multiple, and the periphery of the sputtering target material is distributed with the gas and goes out
Mouthful.
Preferably, the air-out apparatus is frame structure, and the sputtering target material is located in the frame structure.
Preferably, the frame structure is surrounded by multiple conduits being sequentially connected, and the pore of each conduit is connected；Respectively
The gas vent is arranged on the conduit.
Preferably, the frame structure is rectangular frame, the rectangular frame by be sequentially connected the first conduit, second lead
Pipe, third conduit and the 4th conduit surround, and the sputtering target material is located in the rectangular frame；The gas access setting exists
On first conduit, in first conduit, second conduit, the third conduit and the 4th conduit at least
One is provided at least two gas vents.
Preferably, it has been respectively uniformly distributed at least on second conduit, the third conduit and the 4th conduit
Two gas vents.
Preferably, the medium position of the rectangular frame is arranged in the sputtering target material.
Preferably, connecting sleeve is provided in the gas access, the centre bore of the connecting sleeve enters with the gas
Mouth is connected.
Preferably, escape pipe, the centre bore of the escape pipe and the gas vent phase are provided in the gas vent
Connection.
The utility model has the beneficial effects that:
The Sputting film-plating apparatus of the utility model is provided with and vacuum cavity with air-out apparatus on the air-out apparatus
The gas vent that the gas access and at least two that air inlet on side wall is connected are connected with gas access, each gas go out
Mouth is distributed in at least side of sputtering target material, this makes sputter gas energy after air inlet, gas access enter air-out apparatus
It is enough to be supplied to sputtering target material through at least two gas vents outflow sputter gas, it effectively increases to sputtering target material and sputtering is provided
The quantity of the gas vent of gas, so that the bombardment that sputtering target material surface is subject in the prior art is highly non-uniform existing
As preferably being alleviated, so that the uniformity of the plated film film layer on plated matrix is improved, it can also make sputtering target
The uniformity of material consumption is improved.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below will be to institute in embodiment
It needs attached drawing to be used to be briefly described, and specific embodiment of the utility model will be made in conjunction with attached drawing further detailed
Illustrate, wherein
Fig. 1 is the schematic diagram of the vacuum cavity of Sputting film-plating apparatus provided by the embodiment of the utility model；
Fig. 2 is the schematic diagram of air-out apparatus provided by the embodiment of the utility model.
It is attached marked in the figure:
11, vacuum cavity 12, side wall 21, air-out apparatus 22, the first conduit
23, the second conduit 24, third conduit 25, the 4th conduit 26, connecting sleeve
27, escape pipe 31, sputtering target material
Specific embodiment
In order to enable those skilled in the art to better understand the technical solutions of the present invention, below in conjunction with specific implementation
This programme is further discussed in detail in example.
As shown in Figure 1, the utility model embodiment provides a kind of Sputting film-plating apparatus comprising vacuum cavity 11, very
It is provided with sputtering target material 31, the plated matrix opposite with sputtering target material 31 in cavity body 11, is set on the side wall 12 of vacuum cavity 11
It is equipped with the air inlet for being passed through sputter gas into vacuum cavity 11, further includes air-out apparatus 21, is set on air-out apparatus 21
It is equipped with the gas access being connected with air inlet, at least two gases being connected with gas access are additionally provided on air-out apparatus 21
Outlet, each gas vent are distributed in at least side of sputtering target material 31.It is understood that air inlet, gas is not shown in the figure
Entrance, gas vent and the pipeline for connecting gas access and air inlet；Gas access can be connected by pipeline with air inlet；
Each gas vent can be connected by different channels with gas access respectively, and each gas vent can also pass through same pipeline
It is connected with gas access, as long as being able to achieve the connection of gas vent and gas access；Other portions of Sputting film-plating apparatus
Part and working principle are identical as Sputting film-plating apparatus in the prior art, and details are not described herein again.
Sputting film-plating apparatus provided by the embodiment of the utility model is set on the air-out apparatus 21 with air-out apparatus 21
It is equipped with the gas access being connected with the air inlet on vacuum cavity side wall and at least two gases that are connected with gas access
Outlet, each gas vent are distributed in at least side of sputtering target material, this enters sputter gas by air inlet, gas access
After air-out apparatus 21 can through at least two gas vents flow out sputter gas be supplied to sputtering target material 31, effectively increase to
Sputtering target material 31 provide sputter gas gas vent quantity so that in the prior art sputtering target material surface by
To the highly non-uniform phenomenon of bombardment preferably alleviated so that the uniformity of the plated film film layer on plated matrix obtains
It improves, the uniformity that can also make sputtering target material 31 consume is improved.
More uniform in order to the bombardment that is subject to 31 surface of sputtering target material, each gas vent can be evenly distributed on
At least side of sputtering target material 31.
In order to further increase the uniformity for the bombardment that sputtering target material surface is subject to, the number of gas vent can be more
A, the periphery of sputtering target material 31 is distributed with gas vent.It is understood that the periphery of sputtering target material 31 is distributed with gas
Outlet be sputtering target material every side be distributed with gas vent, can preferably sputtering target material 31 every side be evenly distributed with it is more
A gas vent, so that the uniformity for the bombardment that 31 surface of sputtering target material is subject to greatly is improved, so that plated
The thickness of plated film film layer on matrix is more uniform, while the consumption of sputtering target material 31 is more uniform, avoids sputtering target material 31
It fails because certain a part consumption is excessive, improves the utilization rate of sputtering target material 31.
In one embodiment provided by the utility model, air-out apparatus 21 can be frame structure, sputtering target material 31
In frame structure, each gas vent will be located at the periphery of sputtering target material 31 at this time, be conducive to the surface of sputtering target material 31 by
More uniform bombardment, while air-out apparatus stable structure, the reliability of frame structure are higher.It is understood that frame knot
The shape of structure can be circle, ellipse, triangle, rectangle etc., as long as frame structure is enabled to be trapped among sputtering target material 31
Wherein；Can preferably frame structure shape it is consistent with the shape of sputtering target material 31, so as to preferably guarantee to splash
The bombardment that 31 surface of material is subject to of shooting at the target is more uniform, while also more saving material, and can be preferred, and gas vent is uniformly distributed
On the frame structure, sputtering target material 31 is located at the medium position of frame structure so that on plated matrix plated film film layer it is uniform
Property is preferable, and the utilization rate of sputtering target material 31 is higher.
Further, frame structure can be surrounded by multiple conduits being sequentially connected, and the pore of each conduit is connected；Each gas
Body outlet is arranged on conduit, is connected by same channel with gas access to preferably realize each gas vent, is had
Structure is simplified to effect, so that the structure of air-out apparatus 21 is relatively simple.It is understood that each conduit can be heating resisting metal
It manages, such as steel pipe, aluminum pipe, can be connected with welding between each conduit, to guarantee bonding strength and leakproofness；Each conduit may be
Heat-resistant rubber hose, such as polyvinyl chloride pipe, that is, pvc pipe.
As depicted in figs. 1 and 2, frame structure can be rectangular frame, rectangular frame by be sequentially connected the first conduit 22,
Second conduit 23, third conduit 24 and the 4th conduit 25 surround, and sputtering target material 31 is located in rectangular frame；Gas access setting
On the first conduit 22, the setting of at least one of the first conduit 22, the second conduit 23, third conduit 24 and the 4th conduit 25
There are at least two gas vents, so as to preferably be suitable for existing common rectangular sputtering target material, while guaranteeing that rectangle splashes
The bombardment that material of shooting at the target is subject to is more uniform.It is understood that at this time the first conduit 22, the second conduit 23, third conduit 24 with
And the 4th the pore of conduit 25 be connected.
In order to make the gas vent of the circumferential distribution of rectangular sputtering target material more, to improve rectangular sputtering target material table
Face by the uniformity bombarded, can be respectively uniformly distributed on the second conduit 23, third conduit 24 and the 4th conduit 25 to
Few two gas vents.
Further, the medium position in rectangular frame can be set in sputtering target material 31, so that the sputtering target of rectangle
The bombardment that 31 surface of material is subject to is more uniform.
Specifically, connecting sleeve 26, centre bore and the gas access phase of connecting sleeve 26 can be set in gas access
Then connection makes pipeline be connected with air inlet to can easily be connected with pipeline by connecting sleeve 26, and then convenient for real
The connection of existing gas access and air inlet.
In another embodiment provided by the utility model, escape pipe 27, escape pipe 27 can be set in gas vent
Centre bore be connected with gas vent.Using the program, by the setting of escape pipe 27, can efficiently avoid respectively leading
When directly opening up gas vent on pipe, the phenomenon that excessive sputter gas is flowed out from from the closer gas vent in gas access, is sent out
It is raw, so that the gas flow flowed out in each gas vent is more consistent, so as to preferably guarantee sputtering target material surface by equal
Even bombardment is conducive to the utilization rate for improving the uniformity of plated film film layer and sputtering target material on plated matrix；It simultaneously but also should
Air-out apparatus 21 is more beautiful.
Above are merely preferred embodiments of the utility model, it should be pointed out that these embodiments are merely to illustrate this
Utility model rather than limitation the scope of the utility model, moreover, after having read the content of the utility model, this field
Related technical personnel can make various changes or modification to the utility model, and such equivalent forms are equally fallen into appended by the application
Claims limited range.
Claims (10)
1. a kind of Sputting film-plating apparatus comprising vacuum cavity, be provided in the vacuum cavity sputtering target material, with the sputtering
Target opposite plated matrix is provided with for being passed through sputter gas into the vacuum cavity on the side wall of the vacuum cavity
Air inlet, which is characterized in that it further includes air-out apparatus, and the gas being connected with the air inlet is provided on the air-out apparatus
Body entrance is additionally provided at least two gas vents being connected with the gas access, each gas on the air-out apparatus
Body exports at least side for being distributed in the sputtering target material.
2. Sputting film-plating apparatus according to claim 1, which is characterized in that each gas vent is evenly distributed on described
At least side of sputtering target material.
3. Sputting film-plating apparatus according to claim 1, which is characterized in that the number of the gas vent is multiple, institute
The periphery for stating sputtering target material is distributed with the gas vent.
4. Sputting film-plating apparatus according to claim 3, which is characterized in that the air-out apparatus is frame structure, described
Sputtering target material is located in the frame structure.
5. Sputting film-plating apparatus according to claim 4, which is characterized in that the frame structure is sequentially connected by multiple
Conduit surrounds, and the pore of each conduit is connected；Each gas vent is arranged on the conduit.
6. Sputting film-plating apparatus according to claim 5, which is characterized in that the frame structure is rectangular frame, described
Rectangular frame is surrounded by the first conduit, the second conduit, third conduit and the 4th conduit being sequentially connected, the sputtering target material position
In the rectangular frame；The gas access is arranged on first conduit, first conduit, second conduit,
At least one of the third conduit and the 4th conduit are provided at least two gas vents.
7. Sputting film-plating apparatus according to claim 6, which is characterized in that second conduit, the third conduit with
And at least two gas vents have been respectively uniformly distributed on the 4th conduit.
8. Sputting film-plating apparatus according to claim 7, which is characterized in that the sputtering target material is arranged in the rectangle frame
The medium position of frame.
9. Sputting film-plating apparatus according to claim 6, which is characterized in that be provided with connector sleeve in the gas access
Pipe, the centre bore of the connecting sleeve are connected with the gas access.
10. according to the described in any item Sputting film-plating apparatus of claim 5 to 9, which is characterized in that be arranged in the gas vent
There is escape pipe, the centre bore of the escape pipe is connected with the gas vent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820520480.8U CN208440689U (en) | 2018-04-12 | 2018-04-12 | A kind of Sputting film-plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820520480.8U CN208440689U (en) | 2018-04-12 | 2018-04-12 | A kind of Sputting film-plating apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN208440689U true CN208440689U (en) | 2019-01-29 |
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ID=65093467
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820520480.8U Active CN208440689U (en) | 2018-04-12 | 2018-04-12 | A kind of Sputting film-plating apparatus |
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| Country | Link |
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| CN (1) | CN208440689U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093819A1 (en) * | 2022-10-31 | 2024-05-10 | 陈�峰 | Sputtering apparatus for reflective layer of light guide plate |
-
2018
- 2018-04-12 CN CN201820520480.8U patent/CN208440689U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093819A1 (en) * | 2022-10-31 | 2024-05-10 | 陈�峰 | Sputtering apparatus for reflective layer of light guide plate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee before: Beijing Chuangyu Technology Co.,Ltd. Address after: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210219 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |