CN208438580U - A kind of degumming machine splicing smelting tool - Google Patents
A kind of degumming machine splicing smelting tool Download PDFInfo
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- CN208438580U CN208438580U CN201820909984.9U CN201820909984U CN208438580U CN 208438580 U CN208438580 U CN 208438580U CN 201820909984 U CN201820909984 U CN 201820909984U CN 208438580 U CN208438580 U CN 208438580U
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- Prior art keywords
- support rod
- bar
- silicon wafer
- smelting tool
- upper support
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- 238000003723 Smelting Methods 0.000 title claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 64
- 239000010703 silicon Substances 0.000 claims abstract description 64
- 239000013078 crystal Substances 0.000 claims abstract description 34
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 238000012797 qualification Methods 0.000 abstract description 8
- 239000012634 fragment Substances 0.000 abstract description 7
- 206010057071 Rectal tenesmus Diseases 0.000 abstract description 4
- 208000012271 tenesmus Diseases 0.000 abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000446 fuel Substances 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000010893 paper waste Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
This application discloses a kind of degumming machine splicing smelting tools, smelting tool includes end support plate, upper support bar, side supports bar and bottom support rod, and end support plate, upper support bar, side supports bar and bottom support rod surround the groove body for accommodating silicon wafer jointly；It further include vertical support rod, vertical support rod is fixedly connected with upper support bar and side supports bar.The application is by being arranged vertical support rod, it can guarantee that tenesmus deformation will not occur when carrying silicon wafer for splicing smelting tool, prevent silicon wafer from contacting before not having degumming with bottom support rod, it avoids and occurs to squeeze large area chipping and the crack fragment for causing silicon wafer between slice crystal holder and bottom support rod, increase the qualification rate of silicon wafer, entreprise cost is reduced, the performance of enterprises is increased.
Description
Technical field
This application involves the toolings more particularly to a kind of degumming machine splicing smelting tool in a kind of silicon wafer fabrication process.
Background technique
Solar battery is that solar radiant energy is passed through photoelectric effect or photochemical effect is direct by absorbing sunlight
Or indirect conversion, at the device of electric energy, for common batteries and recyclable rechargeable battery, solar battery, which belongs to, more to be saved
The green product of energy environmental protection, therefore develop swift and violent.The main material of most of solar panel is " silicon ", currently, crystalline silicon
Material (including polysilicon and monocrystalline silicon) is main photovoltaic material, and occupation rate of market is 90% or more, and in phase from now on
The mainstay material of solar battery is also still when one long period.And with the fast development of photovoltaic industry, solar-electricity
Pond also significantly increases the demand of crystalline silicon.
Silicon wafer is the basis for constituting solar battery, it is after carrying out cutting and forming processing by silicon ingot, to pass through high-precision
Made of microtomy.The production process of silicon wafer generally comprises following steps: silicon ingot fuel rod is glued to by 1, line evolution sticky stick
In line evolution crystal holder；2, the silicon ingot fuel rod with crystal holder is put into line excavation machine, according to silicon wafer geomery to silicon by line evolution
Ingot fuel rod carries out wire cutting；3, line evolution removes photoresist, and allows the viscose glue on the crystal bar after evolution to melt, removes crystal bar surrounding edge skin material
With line evolution crystal holder, the good crystal bar of butt is taken out；4, barreling, by the good crystal bar clamping to cylindrical grinder of butt, to crystal bar outside
Circle carries out barreling, obtains the crystal bar for meeting every testing requirements；5, crystal bar is bonded to slice crystal holder using adhesive by sticky stick
On, pressurization is fixed；6, it is sliced, bonding crystal bar is installed into wire cutting machine, using multi-wire saw, silicon rod is cut into symbol
Desired silicon wafer is closed, wire cutting is to reach the mesh of cutting silicon wafer with grinding agent friction silicon wafer using running at high speed for diamond wire
's；7, slice removes photoresist, and the crystal bar being sliced is mounted in and is removed photoresist in tooling, and the mortar hydro-peening of silicon wafer outwardly and inwardly is clean, so
The glue of silicon rod viscose is allowed to soften afterwards, then by silicon chip extracting；8, it cleans, the silicon wafer after removing photoresist is cleaned using clear water, it is main
Remove the contamination of the organic matter, metal ion, dust, particle of silicon chip surface；9, it dries, by the silicon chip drying after cleaning；
10, it sorts, cleaned silicon wafer is substantially classified according to sorting standard, remove the waste paper generated in slicing process；11, it wraps
Dress, each classification silicon wafer is packed and stored as required respectively.
Wherein, it is mounted on degumming machine splicing smelting tool in the slice crystal bar in step, being sliced that removes photoresist by being sliced crystal holder,
It is then placed in degumming machine and removes photoresist.Be sliced crystal holder own wt in 120kg or so, crystal bar be monolith be sticked to slice crystal holder on after again
Dicing, therefore it is bigger to be stained with the slice crystal holder weight after silicon wafer.Being sliced crystal holder, there are many sizes, correspond to different yield,
Such as have 100cm's and 80cm.And the lesser slice crystal holder of size is shorter than degumming machine splicing smelting tool, when the slice with silicon wafer is brilliant
Support it is projecting on the upper support bar of existing degumming smelting tool when, two upper support bars of degumming smelting tool middle position can because
The excessive generation tenesmus deformation of load, causes silicon wafer just to contact with the bottom support rod of degumming smelting tool before there be not degumming, slice is brilliant
Squeezed between the meeting of resin streak face and bottom support rod of support, and silicon wafer is very crisp, will lead to silicon wafer occur large area chipping and
Crack fragment seriously affects silicon wafer qualification rate.
It should be noted that above content belongs to the technology category of cognition of inventor, the prior art is not necessarily constituted.
Utility model content
To solve the above-mentioned problems, the purpose of the application is to provide a kind of degumming machine splicing smelting tool, it is ensured that smelting tool exists
Tenesmus deformation will not occur when carrying silicon material, prevent silicon wafer from contacting before not having degumming with bottom support rod, not will cause silicon wafer
Large area chipping and crack fragment, increase the qualification rate of silicon wafer.
To achieve the above object, present applicant proposes a kind of degumming machine splicing smelting tool, smelting tool include end support plate, on
Portion's support rod, side supports bar and bottom support rod, the end support plate, upper support bar, side supports bar and bottom branch
Strut surrounds the groove body for accommodating silicon wafer jointly；It further include vertical support rod, the vertical support rod and the upper support
Bar is fixedly connected with side supports bar.
In one example, the groove body two sides are provided with the vertical support rod, and the vertical support of two sides
Bar is parallel to each other to misplace and arrange.
In one example, the vertical support rod is arranged in the longitudinal middle part of the upper support bar and side supports bar
Position.
In one example, the vertical support rod is arranged in the outside of the groove body two sides.
In one example, the distance between plane where the upper support bar and bottom support rod place plane
For 159mm.
In one example, slice crystal holder limiting device is additionally provided on the upper support bar.
In one example, the two sides of the end support plate are additionally provided with handle.
In one example, the outer surface of the upper support bar, side supports bar and bottom support rod is enclosed with corrosion resistant
Lose protective layer.
A kind of degumming machine splicing smelting tool proposed by the application can be brought the following benefits:
1. by the way that vertical support rod is arranged, it is ensured that tenesmus deformation will not occur when carrying silicon wafer for splicing smelting tool, keep away
Large area chipping and the crack fragment for having exempted to cause silicon wafer, increase the qualification rate of silicon wafer, reduce entreprise cost, increase enterprise
Industry benefit.
2. being adjusted to 2cm or so by the distance by silicon wafer bottom edge apart from bottom support rod, the silicon wafer after preventing degumming
While breaking into pieces, enough distances have been reserved, has further prevented silicon wafer to contact before not having degumming with bottom support rod, avoids
A large amount of chippings of silicon wafer and crack fragment, increase the qualification rate of silicon wafer.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of degumming machine splicing smelting tool provided by the embodiments of the present application.
Specific embodiment
For the clearer general idea for illustrating the application, carry out in an illustrative manner with reference to the accompanying drawings of the specification detailed
It describes in detail bright.
As shown in Figure 1, embodiments herein proposes a kind of degumming machine splicing smelting tool, entirety is in frame shape, including phase
Mutually it is arranged in parallel in the end support plate 1 at both ends, is fixedly connected between both ends support plate 1 perpendicular to 1 ground of end support plate
Upper support bar 2, side supports bar 3 and bottom support rod 4, and upper support bar 2, side supports bar 3 and bottom support rod 4
It is parallel to each other；End support plate 1, upper support bar 2, side supports bar 3 and bottom support rod 4 are surrounded jointly for accommodating silicon wafer
Groove body 5；The upper support bar 2 of 5 both sides external of groove body is also fixedly connected with perpendicular with the longitudinal middle point of side supports bar 3
Support bars 6 can effectively reinforce the support stiffness and bearing capacity of upper support bar 2, preferably to support slice crystal holder, prevent
Only there is falling phenomenon since load is excessive in the middle part of upper support bar 2, prevents silicon wafer from supporting before not having degumming with bottom
Bar 4 contacts and silicon wafer is caused a large amount of chippings and crack fragment occur, effectively improves silicon wafer qualification rate, realizes cost efficiency.
Specifically, vertical support rod 6 is parallel to each other to misplace and arrange in the two sides of groove body 5.Crystal bar is that monolith is sticked to slice crystalline substance
In support, be then cut into piece, may once have 2500 it is even more；If degumming is got off, can all be packed together, it can not
It is a monolith which, which is differentiated,.Therefore, the silicon wafer in slice crystal holder needs to place between silicon wafer before entering degumming machine
Partition.Vertical support rod 6 is parallel to each other to misplace in the two sides of groove body 5 and is arranged, can be prevented between partition and vertical support rod 6
It clashes and is not available.
Specifically, the distance between 2 place plane of upper support bar and 4 place plane of bottom support rod are 159mm.Silicon
Piece is generally square, side length maximum 15.7cm, is normally 15.65cm or so；Then when the slice crystal holder for being bonded with silicon wafer is hung up
After on the upper support bar 2 of degumming smelting tool, distance of the silicon wafer bottom edge apart from bottom support rod is 2cm or so, is preventing degumming
Silicon wafer afterwards has reserved enough distances while breaking into pieces, can further prevent silicon wafer before not having degumming with bottom support rod
4 contact, avoid slice crystal holder resin streak face and bottom support rod 4 between occur squeeze cause silicon wafer occur large area chipping and
Crack fragment.
Specifically, slice crystal holder limiting device 7 is additionally provided on upper support bar 2, for example, it may be being set in top branch
Limited block on strut 2.In use, adjusting the position between limited block according to the size of slice crystal holder first, then gluing again
The slice crystal holder for having silicon wafer is hung up between the limited block on the upper support bar 2 of degumming smelting tool, to make to be sliced crystal holder
Position is relatively fixed, and crystal holder is sliced during carrying arbitrarily to shake, and avoids silicon wafer and the collision of degumming smelting tool and goes out
Existing fragmentation, ensure that silicon wafer qualification rate.
Specifically, the two sides of end support plate 1 are additionally provided with handle 8, carry more convenient when operation.
Specifically, it is anti-to be enclosed with corrosion-resistant elasticity for the outer surface of upper support bar 2, side supports bar 3 and bottom support rod 4
Sheath (not shown), such as rubber, foamed plastics etc., silicon wafer be it is very crisp, anticorrosion elastic protection layer can buffer silicon
Contact impact between piece and upper support bar 2, side supports bar 3 and bottom support rod 4 prevents silicon wafer stress from damaging, and guarantees
Silicon wafer qualification rate.
All the embodiments in this specification are described in a progressive manner, same and similar portion between each embodiment
Dividing may refer to each other, and each embodiment focuses on the differences from other embodiments.Especially for system reality
For applying example, since it is substantially similar to the method embodiment, so being described relatively simple, related place is referring to embodiment of the method
Part explanation.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (8)
1. a kind of degumming machine splicing smelting tool, which is characterized in that the smelting, which has, includes
End support plate, upper support bar, side supports bar and bottom support rod, the end support plate, upper support bar, side
Portion's support rod and bottom support rod surround the groove body for accommodating silicon wafer jointly；It further include vertical support rod, the vertical support
Bar is fixedly connected with the upper support bar and side supports bar.
2. a kind of degumming machine splicing smelting tool according to claim 1, which is characterized in that
The groove body two sides are provided with the vertical support rod, and the vertical support rod of two sides is parallel to each other the cloth that misplaces
It sets.
3. a kind of degumming machine splicing smelting tool according to claim 2, which is characterized in that
The vertical support rod is arranged in the longitudinal middle point of the upper support bar and side supports bar.
4. a kind of degumming machine splicing smelting tool according to claim 3, which is characterized in that
The vertical support rod is arranged in the outside of the groove body two sides.
5. a kind of degumming machine splicing smelting tool according to claim 1 or 2 or 3 or 4, which is characterized in that
The distance between plane is 159mm where plane where the upper support bar and the bottom support rod.
6. a kind of degumming machine splicing smelting tool according to claim 5, which is characterized in that
Slice crystal holder limiting device is additionally provided on the upper support bar.
7. a kind of degumming machine splicing smelting tool according to claim 6, which is characterized in that
The two sides of the end support plate are additionally provided with handle.
8. a kind of degumming machine splicing smelting tool according to claim 7, which is characterized in that
The outer surface of the upper support bar, side supports bar and bottom support rod is enclosed with corrosion-resistant elastic protection layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820909984.9U CN208438580U (en) | 2018-06-12 | 2018-06-12 | A kind of degumming machine splicing smelting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820909984.9U CN208438580U (en) | 2018-06-12 | 2018-06-12 | A kind of degumming machine splicing smelting tool |
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| Publication Number | Publication Date |
|---|---|
| CN208438580U true CN208438580U (en) | 2019-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820909984.9U Expired - Fee Related CN208438580U (en) | 2018-06-12 | 2018-06-12 | A kind of degumming machine splicing smelting tool |
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| Country | Link |
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| CN (1) | CN208438580U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114932110A (en) * | 2022-04-27 | 2022-08-23 | 中锗科技有限公司 | Germanium mud cleaning method after gold steel wire slicing |
| WO2023174244A1 (en) * | 2022-03-15 | 2023-09-21 | 高景太阳能股份有限公司 | Silicon wafer carrying jig and carrying device |
-
2018
- 2018-06-12 CN CN201820909984.9U patent/CN208438580U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023174244A1 (en) * | 2022-03-15 | 2023-09-21 | 高景太阳能股份有限公司 | Silicon wafer carrying jig and carrying device |
| CN114932110A (en) * | 2022-04-27 | 2022-08-23 | 中锗科技有限公司 | Germanium mud cleaning method after gold steel wire slicing |
| CN114932110B (en) * | 2022-04-27 | 2024-03-22 | 中锗科技有限公司 | Method for cleaning germanium mud after slicing gold steel wires |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190129 |