CN208432846U - Photoetching gum coating apparatus - Google Patents
Photoetching gum coating apparatus Download PDFInfo
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- CN208432846U CN208432846U CN201821257336.6U CN201821257336U CN208432846U CN 208432846 U CN208432846 U CN 208432846U CN 201821257336 U CN201821257336 U CN 201821257336U CN 208432846 U CN208432846 U CN 208432846U
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- photoresist
- coating apparatus
- nozzle
- flow detector
- gum coating
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Abstract
The utility model provides a kind of photoetching gum coating apparatus, including wafer carrying platform and photoresist feed system；Photoresist feed system is located at the side of wafer carrying platform, including photoresist supply line, photoresist nozzle, flow control valve, first flow detector and second flow detector；Photoresist supply line one end is connected with a photoresist source of supply；Photoresist nozzle is connected with photoresist supply line far from one end of photoresist source of supply；Flow control valve is located on photoresist supply line；First flow detector is on the photoresist supply line between flow control valve and photoresist nozzle；Second flow detector has spacing on the photoresist supply line between photoresist nozzle and first flow detector between second flow detector and first flow detector.The photoetching gum coating apparatus of the utility model, the technique that can find that the reduction of photoresist coating weight causes caused by rupturing because of photoresist supply line in time is bad, improves production yield.
Description
Technical field
The utility model relates to a kind of semiconductor manufacturing facilities, more particularly to a kind of photoetching gum coating apparatus.
Background technique
Photoetching process be semiconductor chip manufacture in very important one of technique, it be by photoresist (also known as
Photoresist) it in the pattern transfer to substrate on mask plate, will generally undergo substrate surface cleaning, drying, linging, photoresist to apply
Cloth, it is soft dry, alignment exposure, it is rear dry, development, it is hard dry, etching, the processes such as detection.Among these, photoresist coating is it in weight again
Weight, the photoresist of even spread predetermined amount only on substrate could be that subsequent pattern transfer is laid a good foundation.
In existing photoresist coating apparatus, to guarantee that the amount for the photoresist being coated with every time reaches pre-provisioning request, it will usually
The side of regulating valve is provided with photoresist flow detector in photoresist supply line, to supply from the bottle of photoresist source
Photoetching flow adhesive detected.It is connected between flow detector and photoresist nozzle by photoresist supply line, the two
Between have a certain distance, and photoresist coating process be usually by mechanical arm crawl photoresist nozzle be sent to it is scheduled
Nozzle is put back to original position again after completing coating by application place, thus is connected between flow detector and photoresist nozzle
Photoresist supply line is often in the state for being stretched or bending.In use for some time, photoresist supply line is easy
Rupture, the photoetching glue amount for causing photoresist to reveal and finally spray are reduced, and cause wafer gluing abnormal.Existing flow detection
Device detection is only the photoetching glue amount of photoresist source bottle supply, and can not detect to the final amount actually sprayed, thus picture
It is this because photoresist supply line rupture cause photoresist coating weight reduce the problem of be not easy be found at the first time.Once
The amount of photoresist coating does not reach predetermined amount, is difficult to obtain required figure during exposure development, not only can in this way
Increase the cost that wafer is done over again, also easily causes scrapping for wafer, and the photoresist revealed not only causes to waste, and also will cause pipe
The pollution on road and equipment leads to unnecessary cost increase.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of paintings of photoresist to arrange
Set, for solve in the prior art because cannot first time find photoresist pipe breakage caused by photoresist leakage, photoetching
The problems such as reduction of glue coating weight and the coating caused therewith are bad, pipeline pollutes, cost increase.
In order to achieve the above objects and other related objects, the utility model provides a kind of photoetching gum coating apparatus, the light
Photoresist apparatus for coating includes wafer carrying platform and photoresist feed system, and the photoresist feed system is located at the wafer carrying
The side of platform, including photoresist supply line, photoresist nozzle, flow control valve, first flow detector and second flow inspection
Survey device；Photoresist supply line one end is connected with a photoresist source of supply；The photoresist nozzle and the photoresist
Supply line is connected far from one end of the photoresist source of supply；The flow control valve is located at the photoresist supply line
On；The photoresist supply pipe of the first flow detector between the flow control valve and the photoresist nozzle
On the road；The photoresist of the second flow detector between the photoresist nozzle and the first flow detector
On supply line, there is spacing between the second flow detector and the first flow detector.
Optionally, the photoetching gum coating apparatus further includes by the testing result of the first flow detector and described the
The comparator that the testing result of two flow detectors is compared, the comparator and the first flow detector and described the
Two flow detectors are connected.
Optionally, the photoetching gum coating apparatus further includes alarm, and the alarm is connected with the comparator.
Optionally, the comparator is also connected with the flow control valve.
Optionally, the photoetching gum coating apparatus further includes the photoresist nozzle crawl arm for grabbing photoresist nozzle, described
Photoresist nozzle crawl arm is located at the side of the wafer carrying platform.
Optionally, the photoetching gum coating apparatus further includes the cylinder for driving the photoresist nozzle crawl arm mobile, institute
Cylinder is stated to be connected with the photoresist nozzle crawl arm.
Optionally, the photoetching gum coating apparatus further includes photoresist nozzle card slot, and the photoresist nozzle card slot is located at
The side of the wafer carrying platform.
Optionally, the photoresist nozzle card slot further includes card slot cover.
Optionally, the photoresist feed system is multiple.
Optionally, the photoetching gum coating apparatus further includes rotating basis, the rotating basis and the wafer carrying platform
It is connected.
As described above, the photoetching gum coating apparatus of the utility model, has the advantages that the photoetching of the utility model
Gum coating apparatus can find the problem of photoresist coating weight caused by rupturing because of photoresist supply line is reduced at the first time,
Remind staff at the first time take counter-measure, it is bad to avoid the technique for being coated with bad initiation because of photoresist, and because and
When take counter-measure, pipeline and equipment pollution problem caused by capable of revealing photoresist minimize, and utmostly reducing need not
The cost allowance wanted improves production yield.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the photoetching gum coating apparatus of the utility model.
Component label instructions
11 wafer carrying platforms
12 cavitys
21 photoresist supply lines
22 photoresist nozzles
23 flow control valves
24 photoresist sources of supply
25 first flow detectors
26 second flow detectors
27 comparators
28 alarms
31 photoresist nozzle crawl arms
32 cylinders
33 photoresist nozzle card slots
34 rotating basis
41 carrier gas sources
51 master controllers
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Please refer to Fig. 1.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate
The revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the utility model can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, it should all still fall in the utility model institute
In the range of the technology contents of announcement can be covered.Meanwhile in this specification it is cited as "upper", "lower", "left", "right",
The term of " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than to limit the enforceable range of the utility model,
Its relativeness is altered or modified, under the change of no substantial technological content, when being also considered as the enforceable model of the utility model
Farmland.
As shown in Figure 1, the utility model provides a kind of photoetching gum coating apparatus, the photoetching gum coating apparatus includes wafer
Plummer 11 and photoresist feed system, for carrying wafer, the photoresist feed system is located at the wafer carrying platform 11
The side of the wafer carrying platform 11, for supplying photoetching to the crystal column surface being placed in the wafer carrying platform 11
Glue, the photoresist feed system include photoresist supply line 21, photoresist nozzle 22, flow control valve 23, first flow
Detector 25 and second flow detector 26；Described 21 one end of photoresist supply line is connected with a photoresist source of supply 24；
The photoresist nozzle 22 is connected with the photoresist supply line 21 far from one end of the photoresist source of supply 24；It is described
Flow control valve 23 is located on the photoresist supply line 21；The first flow detector 25 is located at the flow control valve
On the photoresist supply line 21 between 23 and the photoresist nozzle 22；The second flow detector 26 is located at described
On the photoresist supply line 21 between photoresist nozzle 22 and the first flow detector 25, the second flow inspection
Surveying has spacing between device 26 and the first flow detector 25.
The photoetching gum coating apparatus generally comprises a cavity 12, and the wafer carrying platform 11 is located in the cavity 12,
To avoid jet-coating photoresit in the process because photoresist disperses to pollute everywhere.Certainly, the usual company of need of the wafer carrying platform 11
It is connected to a vacuum absorption device (not shown), wafer is firmly adsorbed on to the surface of the wafer carrying platform 11, is avoided in light
It is displaced in photoresist coating process.The photoresist nozzle 22 need to usually extend to the surface of the wafer carrying platform 11 with
Jet-coating photoresit carried out to the crystal column surface that is placed in the wafer carrying platform 11, in photoresist coating process, the photoetching
Linear distance of the glue nozzle 22 apart from the wafer carrying platform 11 is generally less than 2cm, and taper can be selected in the photoresist nozzle 22
Nozzle, so that photoresist can be sprayed on scheduled position.
The length of the photoresist supply line 21 according to the photoresist source of supply 24 and the wafer carrying platform 11 away from
From depending on, differed from several tens cm to several meters, the first flow detector 25 it is general as far as possible with the photoresist source of supply 24
It is disposed adjacent to detect the flow for the photoresist supplied from the photoresist source of supply 24, and the second flow detector 26 is most
Amount is disposed adjacent to detect the flow for the photoresist for finally spraying to the crystal column surface with the photoresist nozzle 22, i.e., described
First flow detector 25 and the second flow detector 26 are located at the both ends of the photoresist supply line 21, thus pass through
Compare the testing result of the first flow detector 25 and the second flow detector 26, it can be found that in the photoresist
Whether go wrong on supply line 21, if the detection of the first flow detector 25 and the second flow detector 26
As a result there are greatest differences, for example, the detection flows of the second flow detector 26 are much smaller than the first flow detector
25 detection flows, then it can be assumed that the photoresist supply line 21 there is a problem, in the photoresist supply line 21
Between very likely there is rupture and lead to the leakage of photoresist, thus counter-measure need to be taken as early as possible, for example close the flow
Regulating valve 23 stops the supply of photoresist, and the photoresist supply line 21 is even directly replaced in maintenance, cleans along the photoetching
Pipeline and equipment on glue supply line 21 etc..Certainly, in order to by the testing result of the first flow detector 25 with it is described
The testing result of second flow detector 26 carries out automatic comparison, and the photoetching gum coating apparatus further includes having comparator 27, institute
Comparator 27 is stated to be connected with the first flow detector 25 and the second flow detector 26.Certainly, in other examples
In, the first flow detector 25 can also be connected to same terminal with the second flow detector 26, for example work
On the computer of personnel, judged by staff according to the testing result of the two.It is described for the consistency for guaranteeing examination criteria
The 26 consistent fluid flowmeter of preferred model of first flow detector 25 and the second flow detector.It should be noted that
Since photoresist itself is more sticky liquid, mobility is poor compared to solution such as water, and variation of ambient temperature etc. it is a variety of because
Element may all influence mobility status of the photoresist in the photoresist supply line 21, especially supply in the photoresist
In the longer situation of pipeline 21, the result that the second flow detector 26 detects may actually be slightly less than the first flow
The testing result of detector 25, thus a range of tolerable variance can be set in the comparator 27, such as in the second flow
The result that detector 26 detects is differed with the result that the first flow detector 25 detects is considered qualified when within 5%
Range.In long-term work, inside is easy to be photo-etched glue and block to cause photoresist cannot the photoresist supply line 21
Proper flow causes the photoetching flow adhesive finally sprayed to generate with the photoetching flow adhesive supplied from the photoresist source of supply 24 poor
It is different, thus need real-time perfoming to monitor the supply situation of the photoresist supply line 21.
As an example, the photoetching gum coating apparatus further includes alarm 28, the alarm 28 and the comparator 27
Be connected, for when the first flow detector 25 testing result and the second flow detector 26 testing result not
Alert when consistent.The alarm 28 includes but is not limited to buzzer, and can be simultaneously emitted by acoustical signal and light
The combined aural and visual alarm of signal, it is contemplated that complicated working environment in FAB, audible alarm may cause the alarm of other process sections,
The thus preferred LED lamp alarm device of the alarm 28, and the alarm containing communication module, in time to send abnormality to
Control terminal, for example, equipment master controller 51 and/or operator on duty in factory computer and mobile phone on.
As an example, the comparator 27 can be connected with the flow control valve 23, in the comparator 27
Obtained testing result closes the flow control valve 23 when inconsistent, stop the supply of photoresist, to avoid the wave of photoresist
Take and because photoresist leakage caused by pipeline and equipment pollution.It is of course also possible to by the comparator 27 directly with the master
Controller 51 is connected, and the closing of the flow control valve 23 is controlled by the master controller 51.
As an example, the photoetching gum coating apparatus further includes the photoresist nozzle crawl for grabbing the photoresist nozzle 22
Arm 31, the photoresist nozzle crawl arm 31 are located at the side of the wafer carrying platform 11, and can be by the photoresist nozzle
Crawl arm 31 is connected with a cylinder 32, to drive the photoresist nozzle crawl arm 31, the photoresist nozzle crawl arm 31
It can be rotated on direction up and down under the driving of the cylinder 32, and the cylinder 32 also needs to be connected to the master control
Device 51 processed, with the operation set under the control of the main controller 51, the main controller 51 can be the electricity of connection equipment
Brain is inside stored with related process parameters.A nozzle rack (not shown) can be equipped on the photoresist crawl arm 31, suitable for putting
The photoresist nozzle 22 is set, the distance of the photoresist crawl arm 31 needs enough to extend to the photoresist nozzle 22 described
The surface of wafer carrying platform 11.The photoresist nozzle crawl arm 31 grabs the photoresist nozzle 22 from predetermined position, so
It is moved to the surface of the wafer carrying platform 11 afterwards, again sends the photoresist nozzle 22 back to after completing photoresist coating operations
Original position, thus the photoresist supply line 21 being connected with the photoresist nozzle 22 is often in being stretched or bend
State, exacerbate the photoresist supply line 21 break down even rupture possibility, cause coating photoetching glue amount subtract
Cause the problems such as technique is bad and photoresist reveals caused pipeline and equipment pollution, cost increase less.The application is by changing
Into structure setting, can find the exception of the photoresist supply line 21 in time, to make improvement measure in time, avoid asking
The expansion of topic.
As an example, the photoresist feed system is generally multiple, multiple photoresist feed systems can be used for
Supply the photoresist of different model.When there is multiple photoresist feed systems, correspondingly, the photoresist nozzle 22 also has
Multiple, to place the multiple photoresist nozzle 22, the photoetching gum coating apparatus further includes photoresist nozzle card slot 33, described
There are multiple bayonets on photoresist nozzle card slot 33, for placing multiple photoresist nozzles 22, the photoresist nozzle card slot
33 are located at the side of the wafer carrying platform 11, are generally disposed adjacent with the photoresist crawl arm 31, in order to the photoetching
Nozzle crawl arm 31 grabs the photoresist nozzle 22, the schematic diagram emphasis of the present embodiment from the photoresist nozzle card slot 33
Each interstructural actual positional relationship is not illustrated completely to illustrate each structure.The photoresist nozzle card slot 33 also wraps
Include card slot cover (not shown), the photoresist nozzle 22 for being located at stand-by operation state covered, avoid environmental pollution and
It avoids the photoresist nozzle 22 because of standby mode from exposing in air, remains in the photoetching adhesive curing on its surface and lead to institute
State the problem of nozzle of photoresist nozzle 22 is enclosed and can not spray photoresist.In other examples, the photoresist spray
Mouth card slot 33 can also be connected with a detergent line (not shown), when the photoresist nozzle for completing photoresist coating operations
After 22 are placed on the photoresist nozzle card slot 33, are sprayed and cleaned to the photoresist nozzle 22 by the detergent line
Medical fluid avoids remaining photoetching adhesive curing by 22 nozzle of photoresist nozzle to clean to the photoresist nozzle 22
Place is blocked.It should be strongly noted that in the diagram of the utility model, will not be placed on institute to keep schematic diagram succinct as far as possible
The structure for stating other photoresist feed systems on photoresist nozzle card slot 33 is illustrated completely, actually multiple photoetching
Glue feed system is adjusted comprising photoresist source of supply 24 above-mentioned, photoresist supply line 21, photoresist nozzle 22, flow
Valve 23, first flow detector 25 and second flow detector 26 and other structures.The photoresist source of supply 24 is additionally coupled to
One carrier gas source 41 supplies carrier gas into the photoresist source of supply 24 by the carrier gas source 41, to supply in the photoresist
Pressure difference is generated in source 24 and the photoresist in the photoresist source of supply 24 is transported in the photoresist supply line 21.It is more
A photoresist feed system can connect to the same carrier gas source 41, be carried out by different gas pipings and valve
It controls respectively, since this partial knowledge is well known to those skilled in the art, thus it is specific not reinflated.
As an example, the photoetching gum coating apparatus further includes rotating basis 34, the rotating basis 34 and the wafer
Plummer 11 is connected, and to drive the wafer carrying platform 11 to rotate during carrying out photoresist coating, applies photoresist
Cloth is more evenly.Certainly, in other examples, it can also be rotated by the photoresist nozzle 22 or both and all to be rotated, specifically not
It is limited.
In conclusion the utility model provides a kind of photoetching gum coating apparatus, the photoetching gum coating apparatus includes wafer
Plummer and photoresist feed system, the photoresist feed system are located at the side of the wafer carrying platform, including photoresist
Supply line, photoresist nozzle, flow control valve, first flow detector and second flow detector；The photoresist supply
Pipeline one end is connected with a photoresist source of supply；The photoresist nozzle and the photoresist supply line are far from the photoetching
One end of glue source of supply is connected；The flow control valve is located on the photoresist supply line；The first flow detection
Device is on the photoresist supply line between the flow control valve and the photoresist nozzle；The second flow inspection
Device is surveyed on the photoresist supply line between the photoresist nozzle and the first flow detector, described second
There is spacing between flow detector and the first flow detector.The photoetching gum coating apparatus of the utility model, Neng Gou
The problem of photoresist coating weight is reduced caused by the discovery of one time is ruptured because of photoresist supply line, when reminding staff the first
Between take counter-measure, it is bad to avoid the technique for being coated with bad initiation because of photoresist, and because taking counter-measure in time, can will
Pipeline caused by photoresist is revealed and equipment pollution problem minimize, and utmostly reduce unnecessary cost allowance, improve life
Produce yield.The photoetching gum coating apparatus structure of the utility model is simple, easy to use.So the utility model effectively overcomes
Various shortcoming in the prior art and have high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of photoetching gum coating apparatus characterized by comprising
Wafer carrying platform；
Photoresist feed system, positioned at the side of the wafer carrying platform, including photoresist supply line, photoresist nozzle, stream
Adjustable valve, first flow detector and second flow detector；Photoresist supply line one end and a photoresist are supplied
Source is connected；The photoresist nozzle is connected with the photoresist supply line far from one end of the photoresist source of supply；
The flow control valve is located on the photoresist supply line；The first flow detector be located at the flow control valve and
On the photoresist supply line between the photoresist nozzle；The second flow detector is located at the photoresist nozzle
On the photoresist supply line between the first flow detector, the second flow detector and described first-class
There is spacing between amount detector.
2. photoetching gum coating apparatus according to claim 1, it is characterised in that: the photoetching gum coating apparatus further include by
The comparator that the testing result of the first flow detector is compared with the testing result of the second flow detector, institute
Comparator is stated to be connected with the first flow detector and the second flow detector.
3. photoetching gum coating apparatus according to claim 2, it is characterised in that: the photoetching gum coating apparatus further includes report
Alert device, the alarm are connected with the comparator.
4. photoetching gum coating apparatus according to claim 2, it is characterised in that: the comparator is also adjusted with the flow
Valve is connected.
5. photoetching gum coating apparatus according to claim 1, it is characterised in that: the photoetching gum coating apparatus further includes grabbing
The photoresist nozzle crawl arm of photoresist nozzle is taken, the photoresist nozzle crawl arm is located at the side of the wafer carrying platform.
6. photoetching gum coating apparatus according to claim 5, it is characterised in that: the photoetching gum coating apparatus further includes driving
The mobile cylinder of the photoresist nozzle crawl arm is moved, the cylinder is connected with the photoresist nozzle crawl arm.
7. photoetching gum coating apparatus according to claim 5, it is characterised in that: the photoetching gum coating apparatus further includes light
Photoresist nozzle card slot, the photoresist nozzle card slot are located at the side of the wafer carrying platform.
8. photoetching gum coating apparatus according to claim 7, it is characterised in that: the photoresist nozzle card slot further includes card
Slot cover.
9. photoetching gum coating apparatus according to claim 1, it is characterised in that: the photoresist feed system is multiple.
10. photoetching gum coating apparatus according to any one of claims 1 to 9, it is characterised in that: the photoresist painting arranges
Setting further includes rotating basis, and the rotating basis is connected with the wafer carrying platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821257336.6U CN208432846U (en) | 2018-08-06 | 2018-08-06 | Photoetching gum coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821257336.6U CN208432846U (en) | 2018-08-06 | 2018-08-06 | Photoetching gum coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208432846U true CN208432846U (en) | 2019-01-25 |
Family
ID=65097853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821257336.6U Active CN208432846U (en) | 2018-08-06 | 2018-08-06 | Photoetching gum coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208432846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115487998A (en) * | 2021-06-17 | 2022-12-20 | 上海集成电路材料研究院有限公司 | High-flux photoresist matching and exposure integrated equipment and photoetching process |
-
2018
- 2018-08-06 CN CN201821257336.6U patent/CN208432846U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115487998A (en) * | 2021-06-17 | 2022-12-20 | 上海集成电路材料研究院有限公司 | High-flux photoresist matching and exposure integrated equipment and photoetching process |
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