CN105845606A - Substrate cleaning apparatus and cleaning method - Google Patents
Substrate cleaning apparatus and cleaning method Download PDFInfo
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- CN105845606A CN105845606A CN201610224269.7A CN201610224269A CN105845606A CN 105845606 A CN105845606 A CN 105845606A CN 201610224269 A CN201610224269 A CN 201610224269A CN 105845606 A CN105845606 A CN 105845606A
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- control unit
- air knife
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of semiconductors, and more particularly to a substrate cleaning apparatus and a substrate cleaning method. The cleaning apparatus comprises a wet cleaning unit, an air cutter, a control unit, an executing unit and a monitoring unit. The wet cleaning unit, the executing unit and the monitoring unit are connected to the control unit and the executing unit is also connected to the air cutter. The control unit controls the cleaning process of the wet cleaning unit to the substrate; the monitoring unit transmits the monitoring information that is acquired on the temperature of the substrate after a cleanup to the control unit. The control unit, based on the monitored information, controls the executing unit to change the air flow characters of the air cutter. The substrate cleaning method is applied to the above cleaning apparatus. According to the substrate cleaning apparatus and the cleaning method provided in the invention, a control unit controls an executing unit to change the air flow characters of an air cutter based on the monitored information on the temperature of a substrate from a monitoring unit so that leftover liquid on the surface of the substrate is uniform and that deficiency seen in printed quality in the prior art can be overcome.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of base plate cleaning device and base
Plate cleaning method, relates more specifically to a kind of base plate cleaning device with adjustable air knife
And utilize the substrate-cleaning method of this device.
Background technology
Thin film transistor liquid crystal display screen (English name: Thin Film Transistor Liquid
Crystal Display, english abbreviation: TFT-LCD) principle be utilize liquid crystal with applying
The optical property of change in voltage shows image.TFT-LCD is by liquid crystal board with for by signal
Printed circuit board (PCB) (English name: Printed Circuit Board, the English being applied on liquid crystal board
PCB) etc. abbreviation: constituting, wherein, liquid crystal board is made up of a pair substrate injecting liquid crystal.
In LCD device, in order to obtain brightness evenly and higher contrast
Degree, it is necessary to make the liquid crystal molecule in liquid crystal board arrange according to a certain direction.At liquid crystal cells
In manufacture, the material of the oriented layer on liquid crystal board be polyimides (English name: Polyimide,
English abbreviation: PI) film, PI film is printed on by oriented layer by the transfer printing board of PI film printer
Thin film transistor (TFT) (English name: Thin Film Transistor, english abbreviation: TFT) substrate
With on colored filter (English name: color filter, english abbreviation: CF) substrate, its
In, the material of colored filter substrate be generally glass substrate, quartz base plate, sapphire substrate,
The substrate that the quality such as resin substrate are transparent, before printing substrate need first pass through cleaning device carry out
Clean up, it is thus possible to ensure the printing effect obtained.
Existing base-plate cleaning there is problems in that currently used air knife is all fixed bit
Put, permanent opening angle is arranged on cleaning device, and its gas flow keeps certain.At stream
In the case of amount is certain, it is impossible to cleanout fluid is adjusted, thus is carrying out final stage cleaning
Time, the liquid level heterogeneity that residual moisture is formed, cause in follow-up dry run, liquid level is dried not
Uniformly, making follow-up printing occur abnormal, easily there is bad problem in press quality.
Summary of the invention
(1) to solve the technical problem that
It is an object of the invention to provide a kind of base plate cleaning device and substrate-cleaning method, control single
First monitoring information according to monitoring means to the temperature of substrate, controls performance element and changes air knife
Stream condition so that the residual water liquid level of substrate surface is homogeneous, solve prior art prints
Easily there is bad problem in brush quality.
(2) technical scheme
In order to solve above-mentioned technical problem, the present invention provides a kind of base plate cleaning device and substrate clear
Washing method.
A kind of base plate cleaning device, including washing unit, air knife, control unit, execution list
Unit and monitoring means；Described wash unit, performance element and monitoring means respectively with control unit
Connecting, described performance element connects described air knife；Described control unit washes list described in controlling
Substrate is carried out by unit, the temperature of the described substrate after the cleaning that described monitoring means will collect
The monitoring information of degree passes to described control unit, and described control unit is according to described monitoring information
Control described performance element and change the stream condition of described air knife.
Further, aforementioned monitoring means includes thermal imaging system, described thermal imaging system and described base
Plate is correspondingly arranged, and described thermal imaging system is connected with described control unit, described thermal imaging system collection
Described monitoring information also passes to described control unit.
Further, aforementioned performance element includes position adjusting mechanism and flow control device, institute
Stating air knife to be arranged on described position adjusting mechanism, described flow control device is arranged at described
On the gas passage of air knife, described position adjusting mechanism and flow control device are respectively with described
Control unit connects, and described control unit controls described position adjusting mechanism and regulates described air knife
And height, direction and the angle between substrate, described control unit controls described Flow-rate adjustment machine
Structure changes the throughput of described air knife ejection.
Further, described position adjusting mechanism includes support, lift adjustment assembly, rotates and adjust
Joint assembly and angular adjustment assembly, described lift adjustment assembly is installed on described support, described turn
Dynamic adjusting part is installed on described lift adjustment assembly, under the driving of described lift adjustment assembly
Upper movement；Described air knife is installed on described rotation adjusting part by angular adjustment assembly.
Further, described lift adjustment assembly include being arranged at the guide rail on described support and
Guide rail coordinate slide block, be installed on the lifter plate of described slide block and drive the lifting of described lifter plate
Driver；Described rotation adjusting part is installed on described lifter plate；Described lift actuator and institute
State control unit to connect.
Further, described rotation adjusting part includes rotating shaft and rotary driver, described rotating shaft
Rotation is installed on described lifter plate, and described rotary driver is connected with described rotating shaft；Described rotation
Driver is connected with described control unit.
Further, described angular adjustment assembly includes keyset, angle drive and hinge,
Described keyset is installed on described rotating shaft, and described air knife is installed on described turning by described hinge
Fishplate bar, described angle drive is connected with described air knife, is used for driving described air knife around institute
State hinge to rotate.
Further, the aforementioned quantity washing unit is multiple, described in wash unit include injection
First subelement of neutral lotion and the second subelement of injection deionized water.
Further, aforementioned control unit is also associated with alarm unit, when described monitoring information is protected
When holding the equal state different from setting value, described control unit controls described alarm unit and sends
Alarm.
Further, aforementioned control unit is also associated with infrared drying instrument, described control unit control
Make described infrared drying instrument, after described air knife completes work, described substrate is dried place
Reason.
A kind of substrate-cleaning method, comprises the steps:
S1, control unit send clear instruction to washing unit, control to wash unit and enter substrate
Row cleans, and after cleaning, control unit sends enabled instruction to air knife, and air knife starts
Gas is sprayed to substrate；
S2, control unit send Monitoring instruction to monitoring means, and monitoring means starts, and gather base
The monitoring information of the temperature on plate surface, and the monitoring information collected is fed back to control unit；
S3, control unit form the temperature of substrate surface according to the monitoring information that monitoring means detects
Write music line, and temperature curve and the setting value being stored in control unit are compared；
If the parameters of temperature curve is higher than the setting value of control unit, control unit according to than
Relatively value controls the position adjusting mechanism of performance element and drives air knife to move and/or rotate, and changes
The position of air knife and/or angle, control the flow control device regulation and control sky of performance element simultaneously
The throughput of air knife ejection；
If the parameters of temperature curve is identical with the setting value of control unit, control unit controls
Air knife, monitoring means and performance element quit work, and substrate is carried out subsequent treatment.
(3) beneficial effect
A kind of base plate cleaning device that the present invention provides, control unit controls to wash unit to substrate
It is carried out, the monitoring information transmission of the temperature of the substrate after the cleaning that monitoring means will collect
To control unit, control unit controls performance element according to monitoring information and changes the air-flow of air knife
Characteristic, so that the residual water liquid level of substrate surface is homogeneous, improves press quality, solves existing
In technology, easily there is bad problem in press quality.
A kind of substrate-cleaning method that the present invention provides, is first carried out substrate, then by control
Unit processed controls air knife and tentatively dries up it, during drying up, passes through monitoring unit
Collect the monitoring information of temperature of substrate surface, the air-flow of regulation air knife is special in real time
Property, after air knife constantly adjusts, the residual water branch of substrate surface is formed stable, homogeneous
State, thus ensure to clean last to wash liquid level together homogeneous, it is ensured that cleaning performance, to protect
The printing of card alignment films.
Accompanying drawing explanation
Fig. 1 is the structure chart of base plate cleaning device embodiment of the present invention；
Fig. 2 is the structure chart of the position adjusting mechanism of base plate cleaning device embodiment of the present invention；
Fig. 3 is the position, direction between air knife and the substrate of base plate cleaning device embodiment of the present invention
Put relation；
Fig. 4 is the angle position between air knife and the substrate of base plate cleaning device embodiment of the present invention
Put relation.
In figure, 1: wash unit；11: the first subelements；12: the second subelements；2: empty
Air knife；3: control unit；4: performance element；5: monitoring means；51: thermal imaging system；6:
Infrared drying instrument；7: position adjusting mechanism；71: support；72: lift adjustment assembly；721:
Guide rail；722: slide block；723: lifter plate；724: lift actuator；73: rotate regulation
Assembly；731: rotating shaft；732: rotary driver；74: angular adjustment assembly；741: turn
Fishplate bar；742: angle drive；743: hinge；100: substrate.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is made the most in detail
Describe.Following instance is used for illustrating the present invention, but is not limited to the scope of the present invention.
Embodiment one
As illustrated in fig. 1 and 2, the present embodiment provides a kind of base plate cleaning device, including washing list
Unit 1, air knife 2, control unit 3, performance element 4 and monitoring means 5；Wash unit 1,
Performance element 4 and monitoring means 5 are connected with control unit 3 respectively, and performance element 4 connects sky
Air knife 2；Control unit 3 controls to wash unit 1 and is carried out substrate 100, monitoring means
The monitoring information of the temperature of the substrate 100 after 5 cleanings that will collect passes to control unit 3,
Monitoring information is compared with the setting value being stored in control unit 3, if the prison collected
Measurement information exceedes the setting value of control unit 3 storage, and control unit 3 is automatic according to monitoring information
Control performance element 4 and regulate the stream condition of air knife 2, so that substrate 100 surface is residual
Stay water liquid level homogeneous, improve press quality.
Monitoring means 5 includes that thermal imaging system 51, thermal imaging system 51 are correspondingly arranged with substrate 100, heat
Imager 51 is connected with control unit 3, will be able to adopt according to the heat distribution field on substrate 100 surface
Collect to monitoring information pass to control unit 3, the temperature that control unit 3 is fed back according to thermal imaging system
Degree distributed intelligence forms substrate 100 surface temperature distribution curve, thus reflects the moist journey on surface
Degree distribution, improves the reliability of monitoring information.
As in figure 2 it is shown, performance element 4 includes position adjusting mechanism 7 and flow control device (figure
Not shown), air knife 2 is arranged on position adjusting mechanism 7, and flow control device is arranged at sky
On the gas passage of air knife 2, position adjusting mechanism 7 and flow control device respectively with control unit
3 connect, control unit 3 control position adjusting mechanism 7 regulate described air knife 2 and substrate 100 it
Between height, direction and angle, control unit 3 control flow control device change air knife 2
The throughput of ejection.As shown in Figure 2,3, performance element 4 is by changing the gas of air knife 2 respectively
Distance, direction and angle between body outlet and substrate 100, regulates the air-flow of air knife 2 simultaneously
Amount, solves in prior art that air knife 2 position is fixed, angle is fixed, throughput is fixing leads
Cause the inhomogenous problem of liquid level on substrate 100 surface.
Further, as in figure 2 it is shown, position adjusting mechanism 7 includes support 71, lift adjustment group
Part 72, rotation adjusting part 73 and angular adjustment assembly 74, lift adjustment assembly 72 is installed on and props up
Frame 71, rotates adjusting part 73 and is installed on lift adjustment assembly 72, at lift adjustment assembly 72
Driving under upper mobile；Air knife 2 is installed on rotation adjusting part by angular adjustment assembly 74
73, rotate adjusting part 73 for regulating jet direction and the substrate of the gas outlet of air knife 2
The relative direction of 100, angular adjustment assembly 73 is for regulating gas outlet's ejection of air knife 2
Gas and the angle of substrate 100.
Further, lift adjustment assembly 72 include the guide rail 721 that is arranged on support 71 and
The slide block 722 that guide rail 721 coordinates, the lifter plate 723 being installed on slide block 722 and driving lifter plate
The lift actuator 724 of 723；Rotate adjusting part 73 and be installed on lifter plate 723；Lifting drives
Device 724 is connected with control unit 3.During work, lift actuator 724 drives lifter plate 723 to lift
Mobile, thus regulate the distance between the gas outlet of air knife 2 and substrate 100, as it can be seen,
This distance is H, it is preferred that H is 2～10cm.
Further, rotate adjusting part 73 and include rotating shaft 731 and rotary driver 732, rotating shaft
731 rotations are installed on lifter plate 723, and rotary driver 732 is connected with rotating shaft 731, is used for driving
Rotating shaft 731 rotates；Rotary driver 732 is connected with control unit 3.During work, rotate regulation
Assembly 73 drives air knife 2 to rotate, thus adjusts the direction of the gas outlet of air knife 2.Such as figure
Shown in 3, the direction of the gas outlet of air knife 2 has angle ω with the moving direction of substrate 100,
Preferably ω is 5～15 degree.
Further, angular adjustment assembly 74 includes keyset 741, angle drive 742 and hinge
Chain 743, keyset 741 is installed on rotating shaft 731, is rotating being rotated by of adjusting part 73,
Air knife 2 is installed on keyset 741 by hinge 743, and angle drive 742 is with air knife 2 even
Connect, be used for driving air knife 2 to rotate around hinge 743.As shown in Figure 4, during work, angle is driven
Dynamic device 742 starts, and drives air knife 2 to rotate around hinge 743, the gas outlet of speed governing air knife 2
And the size of the angle theta between substrate 100, it is preferred that θ is 45～75 degree.
In addition to the structure that the present embodiment provides, other moving structures commonly used in the art, all belong to
Scope in the present embodiment protection.
Rotating adjusting part and include rotating shaft and rotary driver, rotating shaft is rotatably connected with slide block, empty
Air knife 2 is fixed in rotating shaft, and rotating shaft includes the rotating shaft of horizontal direction and turning of vertical direction respectively
Axle, rotary driver is two, and is individually fixed on slide block, the output shaft of each motor
Connect with the rotating shaft of corresponding horizontal direction or the rotating shaft of vertical direction respectively, rotary driver
Connect control unit 3, it is ensured that air knife 2 in the horizontal direction with the essence of rotational angle on vertical direction
Really property.
The quantity washing unit 1 is multiple, can improve effect and the efficiency of cleaning, wash unit 1
Including spraying the first subelement 11 of neutral lotion and spraying the second subelement 12 of deionized water,
Make hydro-peening unit that substrate 100 can carry out neutral lotion and the flushing of deionized water respectively.
Control unit 3 is also associated with alarm unit, when monitoring information keeps different from setting value
During equal state, control unit 3 controls alarm unit and sends alarm, thus prevents from cleaning device
Break down, it is ensured that staff can understand timely cleaning device produced problem, and and
Time it is keeped in repair.
Control unit 3 is also associated with infrared drying instrument 6, and control unit 3 controls infrared drying instrument
6 are dried process to substrate 100 after air knife 2 completes work, make device have dry
Function, and there is preferable drying effect.Infrared drying instrument 6 is after completing substrate 100
Continuous process, infrared drying instrument 6 is connected with control unit 3, right under the control of control unit 3
Substrate 100 is dried process.
It should be understood that control unit can use Programmable Logic Controller, i.e. PLC；Lifting
Driver preferably employs the combination of motor and linear screw；Flow control device can use electromagnetism
Valve.
Embodiment two
The present embodiment provides a kind of substrate-cleaning method, comprises the steps:
S1, control unit 3 send clear instruction to washing unit 1, control to wash unit 1 to base
Plate 100 is carried out, and after substrate 100 cleans, control unit 3 starts air knife 2, air
Cutter 2 sprays gas to substrate 100；Wherein, the quantity preferably washing unit 1 is multiple, washes
Unit 1 includes that the second son of the first subelement 11 and injection deionized water spraying neutral lotion is single
Unit 12, makes hydro-peening unit that substrate 100 can carry out neutral lotion respectively and deionized water rushes
Wash.
S2, control unit 3 send Monitoring instruction to monitoring means 5, and monitoring means 5 starts, prison
Survey the monitoring information that unit 5 gathers the temperature on substrate 100 surface, and the monitoring information that will collect
Feed back to control unit 3.In the present embodiment, monitoring means 5 preferably includes thermal imaging system 51, heat
Imager 51 is correspondingly arranged with substrate 100, can supervise according to the heat distribution field on substrate 100 surface
Survey unit 5 and the monitoring information collected is passed to control unit 3.
S3, control unit 3 form the surface of substrate according to the monitoring information that monitoring means 5 detects
Temperature curve, the temperature distribution information that i.e. control unit 3 is fed back according to thermal imaging system 51 is formed
The surface temperature distribution curve of substrate 100, thus reflect the moist degree distribution shape on surface 100
State, the setting value of temperature curve with control unit 1 is compared by control unit 1.
According to comparative result, if the parameters of temperature curve is higher than the setting value of control unit,
Control unit 3 controls the position adjustments of performance element 4 according to the difference of the parameters of fiducial value
Mechanism 7 drives the air knife 2 that is arranged on to move and/or rotate, change air knife 2 with
The relative position of substrate 100 and/or angle, i.e. concrete, change air knife 2 and substrate 100
Between distance, direction and angle.Control to hold according to the difference of the parameters of fiducial value simultaneously
The flow control device of row unit 4 changes the throughput of connected air knife 2 ejection, thus
Improve the accuracy that stream condition changes.
Wherein, when air knife 2 purges, real-time monitoring substrate 100 surface of thermal imaging system 51
State of temperature, makes the monitoring of thermal imaging system 51 change formation with the stream condition of air knife 2 and closes
Ring feedback control, until the residual water liquid level of substrate surface is homogeneous, it is ensured that drying effect is steady
Fixed.Further, owing to adding feedback control system in production line balance, it is possible to reduce artificially because of
The impact that manufacturing parameter is caused by element, it is also possible to warning feedback control synergism, it is achieved high
Degree integrated automation controls；It addition, feedback control can also be calculated by accurate, find
Suitable manufacturing parameter, improves the utilization rate of resource；Meanwhile, feedback control can effectively suppress
The product yield loss caused due to manufacturing parameter fluctuation, avoids fluctuation extension as far as possible, thus
Reduce the manufacturing parameter amount of change caused because of feedback disappearance, thus improve yields.
If the parameters of temperature curve is identical with the setting value of control unit 3, control unit 3
Control air knife 2, monitoring means 5, performance element 4 quit work, and carry out follow-up to substrate
Process, i.e. substrate 100 is dried.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention,
All within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made,
Should be included within the scope of the present invention.
Claims (11)
1. a base plate cleaning device, it is characterised in that include washing unit, air knife,
Control unit, performance element and monitoring means；Described wash unit, performance element and monitoring list
Unit is connected with control unit respectively, and described performance element connects described air knife；Described control is single
Wash unit described in unit's control substrate is carried out, the cleaning that described monitoring means will collect
After the monitoring information of temperature of described substrate pass to described control unit, described control unit
Control described performance element according to described monitoring information and change the stream condition of described air knife.
2. base plate cleaning device as claimed in claim 1, it is characterised in that described monitoring list
Unit includes that thermal imaging system, described thermal imaging system are correspondingly arranged with described substrate, described thermal imaging system
Being connected with described control unit, described thermal imaging system gathers described monitoring information and passes to described
Control unit.
3. base plate cleaning device as claimed in claim 2, it is characterised in that described execution list
Unit includes that position adjusting mechanism and flow control device, described air knife are arranged at described position and adjust
In joint mechanism, described flow control device is arranged on the gas passage of described air knife, described
Position adjusting mechanism and flow control device are connected with described control unit respectively, and described control is single
Unit control described position adjusting mechanism regulate the height between described air knife and substrate, direction and
Angle, described control unit controls described flow control device and changes the gas of described air knife ejection
Flow.
4. base plate cleaning device as claimed in claim 3, it is characterised in that described position is adjusted
Joint mechanism includes support, lift adjustment assembly, rotates adjusting part and angular adjustment assembly, institute
Stating lift adjustment assembly and be installed on described support, described rotation adjusting part is installed on described lifting
Adjusting part, under the driving of described lift adjustment assembly on move；Described air knife passes through angle
Degree adjusting part is installed on described rotation adjusting part.
5. base plate cleaning device as claimed in claim 4, it is characterised in that described rising-falling tone
Joint assembly includes slide block that the guide rail being arranged on described support coordinates with guide rail, is installed on institute
State the lifter plate of slide block and drive the lift actuator of described lifter plate；Described rotation adjusting part
It is installed on described lifter plate；Described lift actuator is connected with described control unit.
6. base plate cleaning device as claimed in claim 5, it is characterised in that described rotation is adjusted
Joint assembly includes that rotating shaft and rotary driver, described axis of rotation are installed on described lifter plate, institute
State rotary driver to be connected with described rotating shaft；Described rotary driver is with described control unit even
Connect.
7. base plate cleaning device as claimed in claim 6, it is characterised in that described angle is adjusted
Joint assembly includes that keyset, angle drive and hinge, described keyset are installed on described rotating shaft,
Described air knife is installed on described keyset by described hinge, and described angle drive is with described
Air knife connects, and is used for driving described air knife to rotate around described hinge.
8. base plate cleaning device as claimed in claim 4, it is characterised in that described in wash list
The quantity of unit is multiple, described in wash unit and include spraying the first subelement and the spray of neutral lotion
Shoot the second subelement of ionized water.
9. base plate cleaning device as claimed in claim 8, it is characterised in that described control list
Unit is also associated with alarm unit, when described monitoring information keeps the equal state different from setting value
Time, described control unit controls described alarm unit and sends alarm.
10. base plate cleaning device as claimed in claim 8, it is characterised in that described control
Unit is also associated with infrared drying instrument, and described control unit controls described infrared drying instrument described
Air knife is dried process to described substrate after completing work.
11. 1 kinds of substrate-cleaning methods, it is characterised in that comprise the steps:
S1, control unit send clear instruction to washing unit, control to wash unit and enter substrate
Row cleans, and after cleaning, control unit sends enabled instruction to air knife, and air knife starts
Gas is sprayed to substrate；
S2, control unit send Monitoring instruction to monitoring means, and monitoring means starts, and gather base
The monitoring information of the temperature on plate surface, and the monitoring information collected is fed back to control unit；
S3, control unit form the temperature of substrate surface according to the monitoring information that monitoring means detects
Write music line, and temperature curve and the setting value being stored in control unit are compared；
If the parameters of temperature curve is higher than the setting value of control unit, control unit according to than
Relatively value controls the position adjusting mechanism of performance element and drives air knife to move and/or rotate, and changes
The position of air knife and/or angle, control the flow control device regulation and control sky of performance element simultaneously
The throughput of air knife ejection；
If the parameters of temperature curve is identical with the setting value of control unit, control unit controls
Air knife, monitoring means and performance element quit work, and substrate is carried out subsequent treatment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224269.7A CN105845606A (en) | 2016-04-12 | 2016-04-12 | Substrate cleaning apparatus and cleaning method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224269.7A CN105845606A (en) | 2016-04-12 | 2016-04-12 | Substrate cleaning apparatus and cleaning method |
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| CN105845606A true CN105845606A (en) | 2016-08-10 |
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| CN201610224269.7A Pending CN105845606A (en) | 2016-04-12 | 2016-04-12 | Substrate cleaning apparatus and cleaning method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108568419A (en) * | 2018-03-30 | 2018-09-25 | 昆山国显光电有限公司 | Basal plate cleaning system and cleaning method |
| CN110047778A (en) * | 2018-01-15 | 2019-07-23 | 东京毅力科创株式会社 | Substrate processing device, processing method for substrate and storage medium |
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| CN201837216U (en) * | 2010-11-01 | 2011-05-18 | 北京京东方光电科技有限公司 | Air knife device |
| CN102651303A (en) * | 2011-05-09 | 2012-08-29 | 京东方科技集团股份有限公司 | Base plate temperature management and control system and method |
| US20140130825A1 (en) * | 2012-11-09 | 2014-05-15 | Tokyo Electron Limited | Substrate cleaning method and system using atmospheric pressure atomic oxygen |
| CN203421909U (en) * | 2013-08-12 | 2014-02-05 | 蒋佳音 | Adjustable steel wire rope air knife dehumidifying device |
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| CN110047778B (en) * | 2018-01-15 | 2024-03-22 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| CN108568419A (en) * | 2018-03-30 | 2018-09-25 | 昆山国显光电有限公司 | Basal plate cleaning system and cleaning method |
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