CN109755152B - Semiconductor wafer processing apparatus and semiconductor wafer processing method - Google Patents
Semiconductor wafer processing apparatus and semiconductor wafer processing method Download PDFInfo
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- CN109755152B CN109755152B CN201711091289.2A CN201711091289A CN109755152B CN 109755152 B CN109755152 B CN 109755152B CN 201711091289 A CN201711091289 A CN 201711091289A CN 109755152 B CN109755152 B CN 109755152B
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Abstract
The invention provides a semiconductor wafer processing apparatus and a semiconductor wafer processing method. The semiconductor wafer processing device comprises a bearing platform, a liquid supply system and a detection sensor; the bearing table is used for bearing the wafer; the liquid supply system comprises a liquid source and a liquid supply pipeline, and is used for spraying treatment liquid to the surface of the wafer; the detection sensor comprises a transmitting module and a receiving module, is positioned above the bearing table and is used for detecting the distribution condition of the processing liquid on the surface of the wafer. By utilizing the semiconductor wafer processing device, the condition of poor distribution of the processing liquid can be found in time, the problems of poor etching, poor developing, poor cleaning and the like caused by uneven distribution of the processing liquid are avoided, and therefore production personnel can be helped to make improvement countermeasures aiming at the problem of uneven distribution of the processing liquid in time so as to improve the production yield. The semiconductor wafer processing device has the advantages of simple structure, low cost and convenient use. The semiconductor wafer processing method can effectively reduce poor production.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing, and more particularly, to a semiconductor wafer processing apparatus and a semiconductor wafer processing method.
Background
In semiconductor manufacturing, most of the processes are monolithic, i.e., only one wafer is processed at a time in the same reaction chamber. As the process production continues, the surface condition of each wafer may be different, so that the single wafer process production process can adjust the process production conditions according to the condition of each wafer to improve the production yield. However, as the critical dimensions of semiconductor devices become smaller and smaller, the requirements for the manufacturing process become higher and higher, and even when the semiconductor devices are manufactured by the single-chip process, poor manufacturing may still occur. For example, when a wafer is processed in a single-wafer cleaning device, the problem of poor cleaning can occur when the liquid medicine on the surface of the wafer is not normally distributed due to abnormal device; in the single wafer wet etching process, poor etching may be caused when the etching solution on the wafer surface is not distributed normally due to the abnormal equipment. However, in the prior art, there is no technology for sensing whether the liquid medicine is normally distributed, and in most cases, production personnel need to judge according to own experience or detect the wafer in a sampling inspection mode after the relevant process is finished. Obviously, the detection by a manual mode is time-consuming, labor-consuming and large in detection error; after the process is finished, the wafer is subjected to spot inspection again, so that the wafer is difficult to recover due to the defect, and the wafer with the problem is easy to miss inspection in a spot inspection mode; a further problem is that failures cannot be detected in time and improvement measures cannot be taken for different failures, which may lead to an increase in the number of failures and even to a serious production accident.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a semiconductor wafer processing apparatus and a semiconductor wafer processing method, which are used to solve the problem in the prior art that if the chemical liquid is not normally distributed, the etching failure and the like are caused due to the abnormal distribution of the chemical liquid, which cannot be timely improved.
To achieve the above and other related objects, the present invention provides a semiconductor wafer processing apparatus for processing a semiconductor wafer. The semiconductor wafer processing device comprises a bearing table, a liquid supply system and a detection sensor; the bearing table is used for bearing the semiconductor wafer; the liquid supply system comprises a liquid source and a liquid supply pipeline, wherein one end of the liquid supply pipeline is connected with the liquid source, and the other end of the liquid supply pipeline extends to the upper part of the semiconductor wafer and is used for spraying treatment liquid to the surface of the semiconductor wafer; the detection sensor comprises an emitting module and a receiving module, and is positioned above the bearing table and used for detecting the distribution condition of the processing liquid on the surface of the semiconductor wafer according to whether an emitting signal emitted to the surface of the semiconductor wafer by the emitting module can be received by the receiving module.
Preferably, the transmitting module and the receiving module are respectively positioned above two opposite sides of the bearing table.
In another preferred scheme, the transmitting module and the receiving module are positioned above the same side of the bearing platform.
Preferably, the detection sensor is a photosensor.
In another preferred embodiment, the detection sensor is an acoustic wave sensor.
Preferably, the liquid supply system further comprises a nozzle located above the susceptor and connected to an end of the liquid supply line extending above the susceptor.
Preferably, the semiconductor wafer processing device further comprises a tank body, the tank body comprises a liquid outlet, and the bearing table is located at the bottom in the tank body.
Preferably, the semiconductor wafer processing apparatus further comprises a display device, and the display device is connected to the detection sensor and is used for displaying the detection result of the detection sensor.
Preferably, the semiconductor wafer processing apparatus further comprises an alarm device, wherein the alarm device is connected to the detection sensor and is configured to send out alarm information when a detection result of the detection sensor is abnormal.
Preferably, the liquid supply system is used for providing a processing liquid selected from the group consisting of a wet etching liquid, a cleaning liquid and a developing liquid.
Preferably, the liquid supply system has a processing liquid spraying point corresponding to a central point of a semiconductor wafer on the susceptor, the detection sensor has a detection point projected on the susceptor, the detection point is aligned with the processing liquid spraying point, and whether the processing liquid spraying point is sprayed with the processing liquid is determined by whether a receiving module of the detection sensor receives an emission signal from the processing liquid spraying point.
The invention also provides a semiconductor wafer processing method, which comprises the following steps:
1) providing a semiconductor wafer;
2) the semiconductor wafer processing device in any one of the above aspects is used for spraying the processing liquid on the upper surface of the semiconductor wafer and detecting the distribution of the processing liquid on the surface of the semiconductor wafer.
Preferably, in the semiconductor wafer processing method, if the distribution of the processing liquid on the surface of the semiconductor wafer is detected to be abnormal in the step 2), the step of repeating the step 2) one or more times is further included after the step 2).
As described above, the semiconductor wafer processing apparatus and the semiconductor wafer processing method according to the present invention have the following advantageous effects: the semiconductor wafer processing device can detect the distribution condition of the processing liquid on the surface of the semiconductor wafer in real time through the detection of the detection sensor so as to find out the condition of uneven distribution of the processing liquid in time, and avoid the problems of poor etching, poor developing, poor cleaning and the like caused by uneven distribution of the processing liquid, thereby being beneficial to production personnel to make improvement countermeasures aiming at the problem of uneven distribution of the processing liquid in time so as to improve the production yield. The semiconductor wafer processing method can effectively avoid the problem of uneven distribution of the processing liquid on the surface of the semiconductor wafer, thereby reducing poor production.
Drawings
Fig. 1 and 2 are schematic views showing a normal distribution of a processing liquid during a process of processing a semiconductor wafer using a semiconductor wafer processing apparatus according to a first embodiment of the present invention.
Fig. 3 and 4 are schematic views showing abnormal distribution of a processing liquid during a process of processing a semiconductor wafer using the semiconductor wafer processing apparatus according to the first embodiment of the present invention.
FIG. 5 is a flowchart illustrating a semiconductor wafer processing method according to a second embodiment of the present invention.
Description of component reference numerals
1 semiconductor wafer processing apparatus
11 semiconductor wafer
12 liquid supply system
121 liquid source
122 liquid supply line
123 nozzle
124 treating liquid
13 detection sensor
131 transmitting module
132 receiving module
133 transmit signal
14 trough body
141 liquid discharge port
142 groove wall
15 bearing table
151 support shaft
16 display device
17 alarm device
S11-S12
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 1 and 2, the present invention provides a semiconductor wafer processing apparatus 1 for processing a semiconductor wafer 11. The semiconductor wafer processing apparatus 1 includes a susceptor 15, a liquid supply system 12, and a detection sensor 13; the bearing table 15 is used for bearing the semiconductor wafer 11; the liquid supply system 12 includes a liquid source 121 and a liquid supply pipe 122, wherein one end of the liquid supply pipe 122 is connected to the liquid source 121, and the other end extends above the susceptor 15 for spraying a processing liquid 124 onto the surface of the semiconductor wafer 11; the detecting sensor 13 includes an emitting module 131 and a receiving module 132, and the detecting sensor 13 is located above the susceptor 15 and is used for detecting the distribution of the processing liquid 124 on the surface of the semiconductor wafer 11 according to whether the emitting signal 133 emitted from the emitting module 131 to the surface of the semiconductor wafer 11 can be received by the receiving module 132.
The detection sensor 13 may be a photoelectric sensor or an acoustic wave sensor. As shown in fig. 1 and 2, the principle of detecting the distribution of the processing liquid 124 on the surface of the semiconductor wafer 11 by the detection sensor 13 is as follows: a signal is transmitted to a certain point on the surface of the semiconductor wafer 11 (for example, a central point on the surface of the semiconductor wafer 11) through the transmitting module 131 of the detecting sensor 13, because the dried surface of the semiconductor wafer 11 is a mirror with a high flatness, if the detecting point on the surface of the semiconductor wafer 11 does not have the processing liquid 124, when light is irradiated onto the surface of the semiconductor wafer 11, the light will be reflected by the mirror and received by the receiving module 132, and if the detecting point has the processing liquid 124, the light will be reflected diffusely and cannot be received by the receiving module 132, so that whether the processing liquid 124 is distributed at the point can be determined according to whether the receiving module 132 receives the light signal; referring to fig. 3 and 4, if the processing liquid 124 is distributed at the position point, when the optical signal is emitted to the position point, the optical signal may be scattered in the liquid, so that the receiving module 132 cannot receive the optical signal, that is, when the receiving module 132 does not receive the optical signal, it may be determined that the processing liquid 124 is sprayed at the position point. Usually, only one point on the surface of the semiconductor wafer 11 can be detected by a single detection sensor 13 to determine whether the processing liquid 124 is sprayed on the surface, and a plurality of detection sensors 13 can be provided to determine whether the processing liquid 124 is distributed on a plurality of points on the surface of the semiconductor wafer 11 or even on the entire surface. Of course, the liquid supply system 12 should have a spraying point of the processing liquid corresponding to the central point of the semiconductor wafer 11 on the susceptor 15, the detection sensor 13 should have a detection point projected on the susceptor 15, and the detection point is aligned with the spraying point of the processing liquid 124, so that it can be determined whether the processing liquid 124 is sprayed on the spraying point of the processing liquid by using whether the receiving module 132 of the detection sensor 13 receives the emission signal 133 from the spraying point of the processing liquid 124. In semiconductor manufacturing, the problem of liquid non-spraying is most likely to occur at the center of the wafer, and one reason for the problem is that the thin film at the center of the wafer may be thicker than the thin film around the wafer after multiple processes, which is likely to cause poor spraying when the liquid is sprayed. Such a problem can be effectively detected by this detection sensor 13 to make subsequent improvement. The installation position of the detecting sensor 13 needs to ensure that the signal sent by the transmitting module 131 can be received by the receiving module 132 after being reflected, and the specific installation thereof may be different according to different use environments and different types of the detecting sensor 13. For example, if the detecting sensor 13 is a photo sensor, and further if the detecting sensor is a slot-type photo sensor, the transmitting signal 133 is an optical signal, in which case the transmitting module 131 and the receiving module 132 are preferably located above two opposite sides of the carrier 15, respectively, as shown in fig. 1. In other examples, for example, if the detection sensor 13 used is an acoustic wave sensor, different situations need to be considered. The emission signal 133 emitted by the acoustic wave sensor is an acoustic wave, and more specifically, may be an ultrasonic wave (ultrasonic wave is a kind of acoustic wave), because ultrasonic wave is a mechanical oscillation in an elastic medium, and has two forms of transverse oscillation (transverse wave) and longitudinal oscillation (longitudinal wave), which have different propagation speeds in gas, liquid and solid; in addition, ultrasonic waves have refraction and reflection phenomena, and have attenuation in the process of propagation, the attenuation is faster in air, and the attenuation is smaller and the propagation is farther when the ultrasonic waves propagate in liquid and solid. Therefore, the principle can be used to detect whether the processing liquid 124 is distributed on the surface of the semiconductor wafer 11. The transmitting module 131 and the receiving module 132 are preferably located above the same side of the carrier 15 if the principle of longitudinal wave propagation is used, and the transmitting module 131 and the receiving module 132 are preferably located above the opposite sides of the carrier 15 if the principle of transverse wave propagation is used. Of course, the specific installation position of the detection sensor 13 is preferably set according to the selected model, and the types of the acoustic wave sensors on the market are more, so that the acoustic wave sensors are not deployed one by one.
In order to distribute the processing liquid 124 more uniformly on the upper surface of the semiconductor wafer 11, the liquid supply system 12 further includes a nozzle 123, and the nozzle 123 is located above the susceptor 15 and connected to one end of the liquid supply pipe 122 extending above the susceptor 15. The nozzle 123 may extend through the liquid supply pipe 122 to a position right above the susceptor 15, as shown in fig. 1; it may also extend only up to the side of the carrier table 15, as shown in fig. 2. The main function of the nozzle 123 is to atomize the processing liquid 124 to form a liquid mist with a small diameter, so as to increase the contact area between the processing liquid 124 and the surface of the semiconductor wafer 11, so that the processing liquid 124 is more uniformly distributed on the surface of the semiconductor wafer 11, and furthermore, the atomizing by the nozzle 123 not only can reduce the pressure of the processing liquid 124 on the surface of the semiconductor wafer 11 to avoid damage to the semiconductor wafer 11, but also can reduce the usage amount of the processing liquid 124, and of course, because the processing liquid 124 is atomized and may cause that individual points on the surface of the semiconductor wafer 11 are not sprayed to the processing liquid 124 when spraying, such problems can be effectively solved by providing the detection sensor 13. The mounting position of the probe sensor 13 is not determined by the position of the nozzle 123 but is determined by comprehensively considering factors such as the type of the semiconductor wafer 11, the type of the probe sensor 13, and the specific configuration of the semiconductor wafer processing apparatus 1.
In semiconductor manufacturing industry, most of the processes are performed in a dust-free environment, and since the processing liquid 124 is generally harmful to human body and/or environment, and therefore its use and discharge need to be strictly controlled, the semiconductor wafer processing apparatus 1 preferably further comprises a tank 14, the tank 14 generally needs to be provided with a liquid discharge port 141 for discharging waste liquid, the susceptor 15 is located at the inner bottom of the tank 14, and the susceptor 15 is generally supported by a support shaft 151, when the processing liquid 124 is sprayed on the surface of the semiconductor wafer 11 on the upper surface of the susceptor 15, the support shaft 151 can drive the susceptor 15 to rotate, so that the processing liquid 124 is sprayed on the surface of the semiconductor wafer 11 more uniformly. The tank 14 generally includes a tank wall 142, and the detection sensor 13 may be located inside or outside the tank wall 142, considering the specific structure of the tank 14 and the type of the detection sensor 13, and is preferably located inside the tank wall 142 from the viewpoint of detection accuracy. In wet etching equipment used in the semiconductor industry, a plurality of tanks 14 are commonly located in a closed space, and in this case, it may be more appropriate to arrange the detection sensors 13 on both sides of the inner side of the tank wall 142 than on the top of the tank 14.
The semiconductor wafer processing apparatus 1 generally further comprises a display device 16, wherein the display device 16 is connected to the detection sensor 13 for displaying the detection result of the detection sensor 13. The display device 16 and the detection sensor 13 may be connected by wire or wirelessly, or both. In the semiconductor industry, a computer or a mobile phone on duty connected to a machine station may be used as the display device 16, that is, the detection result of the detection sensor 13 is transmitted to an existing device so that a relevant person can receive and view the working condition of the semiconductor wafer processing apparatus 1 in real time.
The semiconductor wafer processing device 1 may further include an alarm device 17, wherein the alarm device 17 is connected to the detection sensor 13, and configured to send an alarm message when a detection result of the detection sensor 13 is abnormal. The alarm device 17 may be an audible and visual alarm and is installed at a position where a relevant person can easily observe the alarm device, and of course, an alarm module may be provided in the display device 16, and the alarm module may send out alarm information when the detection result of the detection sensor 13 is abnormal.
According to the different processes applied by the semiconductor wafer processing apparatus 1, the liquid supply system 12 may provide one of the processing liquids 124 from the group consisting of a wet etching liquid, a cleaning liquid and a developing liquid, and more specifically, the processing liquid 124 in the wet etching process may include an etching liquid such as hydrofluoric acid, oxalic acid, a potassium hydroxide solution and BOE (Buffered-Oxide-Etch; HF: NH4F ═ 1: 6); in the cleaning process, the treatment liquid 124 includes cleaning liquids such as acetone, alcohol and deionized water; the processing solution 124 in the developing process includes a developing solution such as TMAH (tetramethylammonium hydroxide) solution.
When the semiconductor wafer processing device 1 detects that the processing liquid 124 on the surface of the semiconductor wafer 11 is unevenly distributed, the semiconductor wafer processing device 1 can be analyzed in time to find out the reason of uneven spraying as soon as possible and improve the reason; of course, if it can be confirmed that the non-uniformity of the spray coating is not caused by the semiconductor wafer processing apparatus 1, the spray coating may be repeated one or more times to ensure that the desired process is successfully completed.
It should be noted that the detection sensor 13 can be used in the drying process by using the detection principle of the detection sensor 13. For example, when the liquid is detected on the surface of the semiconductor wafer 11, it is determined that the drying is not completed; when no liquid is detected, the drying process is considered to be successfully completed, and in this case, the surface of the semiconductor wafer is usually purged and dried by using a dry gas such as nitrogen.
Example two
As shown in fig. 5, the present invention further provides a semiconductor wafer processing method, which includes the following steps:
1) providing a semiconductor wafer 11;
2) the semiconductor wafer processing apparatus 1 as described in the first embodiment is used to spray the processing liquid 124 on the upper surface of the semiconductor wafer 11 and detect the distribution of the processing liquid 124 on the surface of the semiconductor wafer 11.
Specifically, the detailed steps of the semiconductor wafer processing method may include: s11, providing a semiconductor wafer 11, placing the semiconductor wafer 11 in the semiconductor wafer processing apparatus 1 according to the first embodiment, more specifically, on the susceptor 15 and setting the spraying time; then, in step S12, the processing liquid 124 is sprayed onto the surface of the semiconductor wafer 11 by the liquid supply system 12, and at this time, the supporting shaft 151 connected to the susceptor 15 starts to rotate and drives the susceptor 15 and the semiconductor wafer 11 to rotate, so that the processing liquid 124 is uniformly sprayed onto the surface of the semiconductor wafer 11 by the nozzle 123. At the same time as the spraying starts, the detection sensor 13 will start to operate. In the case where a plurality of the detection sensors 13 are provided, if a transmission signal 133 sent from the transmission module 131 is received at a position where the processing liquid 124 is not sprayed on the surface of the semiconductor wafer 11 at the initial stage of spraying, the transmission signal 133 will be naturally reflected to the reception module 132, and the display device 16 can confirm that the reception module 132 receives the signal, but as the spraying progresses, the reception module 132 receives less and less transmission signals 133 until the spraying is completed within a set spraying time, and if the reception module 132 does not receive any transmission signal 133 at all, it is determined that the processing liquid 124 is uniformly sprayed on the surface of the semiconductor wafer 11; if the receiving module 132 continues to receive the transmitting signal 133, it is determined that the processing liquid 124 is not uniformly sprayed on the surface of the semiconductor wafer 11, and at this time, the display device 16 and/or the alarm device 17 will send out an alarm message to remind relevant personnel to take countermeasures as soon as possible. Of course, the detection sensor 13 may be set to start operation after completion of the painting, but a mode of synchronous detection at the time of painting is preferable from the viewpoint of detection efficiency.
When the step S12 detects that the distribution of the processing liquid 124 on the surface of the semiconductor wafer 11 is abnormal, different countermeasures may be taken according to different situations, for example, the operation of the semiconductor wafer processing apparatus 1 may be stopped immediately, and the semiconductor wafer processing apparatus 1 may be analyzed as soon as possible to find out the cause of the uneven spraying and improve the cause; however, if it can be confirmed that the semiconductor wafer processing apparatus 1 does not cause the uneven spraying, the spraying may be repeated one or more times to ensure that the desired process is successfully completed. The process treatment can be wet etching, developing or cleaning, and the semiconductor wafer processing method can be used in any industry involving wet etching, developing or cleaning, such as semiconductor chip manufacturing, liquid crystal panel manufacturing, solar cell manufacturing and the like. The specific method can be adjusted according to different requirements of different processes, industries or different enterprises, and is not limited herein nor further described.
As described above, the semiconductor wafer processing apparatus of the present invention can be used to efficiently process semiconductor wafers. The semiconductor wafer processing device comprises a bearing table, a liquid supply system and a detection sensor; the bearing table is used for bearing the semiconductor wafer; the liquid supply system comprises a liquid source and a liquid supply pipeline, wherein one end of the liquid supply pipeline is connected with the liquid source, and the other end of the liquid supply pipeline extends to the upper part of the bearing table and is used for spraying treatment liquid to the surface of the semiconductor wafer; the detection sensor comprises an emitting module and a receiving module, and is positioned above the bearing table and used for detecting the distribution condition of the processing liquid on the surface of the semiconductor wafer according to whether an emitting signal emitted to the surface of the semiconductor wafer by the emitting module can be received by the receiving module. The semiconductor wafer processing device can detect the distribution condition of the processing liquid on the surface of the semiconductor wafer in real time so as to find out the condition of uneven distribution of the processing liquid in time, and avoid the problems of poor etching, poor developing, poor cleaning and the like caused by uneven distribution of the processing liquid, thereby being beneficial to production personnel to make improvement countermeasures in time so as to improve the production yield. The semiconductor wafer processing method can effectively avoid uneven distribution of the processing liquid on the surface of the semiconductor wafer so as to reduce poor production. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (13)
1. A semiconductor wafer processing apparatus (1) for processing a semiconductor wafer (11), comprising:
a carrying table (15) for carrying the semiconductor wafer;
a liquid supply system (12) including a liquid source (121) and a liquid supply line (122) having one end connected to the liquid source and the other end extending above the susceptor for spraying a processing liquid onto the surface of the semiconductor wafer; and a process for the preparation of a coating,
the detection sensor (13) comprises an emission module (131) and a receiving module (132), and is positioned above the bearing table and used for detecting the distribution condition of the processing liquid on the surface of the semiconductor wafer according to whether an emission signal (133) emitted to the surface of the semiconductor wafer by the emission module can be received by the receiving module; a signal is emitted to a certain point on the surface of the semiconductor wafer (11) through the emitting module (131) of the detecting sensor (13), because the dried surface of the semiconductor wafer (11) is a mirror surface with high flatness, if the detecting point on the surface of the semiconductor wafer (11) does not have the processing liquid (124), when light irradiates on the surface of the semiconductor wafer (11), the light is reflected in the mirror surface and received by the receiving module (132), and if the detecting point has the processing liquid (124), the light is reflected in a diffuse way and cannot be received by the receiving module (132), so that whether the processing liquid (124) is distributed at the point can be judged according to whether the receiving module (132) receives the light signal.
2. The semiconductor wafer processing apparatus of claim 1, wherein: the transmitting module and the receiving module are respectively positioned above the two opposite sides of the bearing table.
3. The semiconductor wafer processing apparatus of claim 1, wherein: the transmitting module and the receiving module are positioned above the same side of the bearing table.
4. The semiconductor wafer processing apparatus of claim 1, wherein: the detection sensor is a photoelectric sensor.
5. The semiconductor wafer processing apparatus of claim 1, wherein: the detection sensor is an acoustic wave sensor.
6. The semiconductor wafer processing apparatus of claim 1, wherein: the liquid supply system also comprises a nozzle (123) which is positioned above the bearing platform and is connected with one end of the liquid supply pipeline extending to the position above the bearing platform.
7. The semiconductor wafer processing apparatus of claim 1, wherein: the semiconductor wafer processing device further comprises a groove body (14), the groove body comprises a liquid outlet (141), and the bearing table is located at the bottom in the groove body.
8. The semiconductor wafer processing apparatus of claim 1, wherein: the semiconductor wafer processing device further comprises a display device (16), wherein the display device is connected with the detection sensor and used for displaying the detection result of the detection sensor.
9. The semiconductor wafer processing apparatus of claim 1, wherein: the semiconductor wafer processing device further comprises an alarm device (17), wherein the alarm device is connected with the detection sensor and used for sending alarm information when the detection result of the detection sensor is abnormal.
10. The semiconductor wafer processing apparatus of claim 1, wherein: the liquid supply system is used for providing a processing liquid (124) selected from the group consisting of a wet etching liquid, a cleaning liquid and a developing liquid.
11. The semiconductor wafer processing apparatus of any one of claims 1 to 10, wherein: the liquid supply system is provided with a processing liquid spraying point corresponding to the central point of the semiconductor wafer on the bearing platform, the detection sensor is provided with a detection point projected on the bearing platform, the detection point is aligned with the processing liquid spraying point, and whether the processing liquid spraying point is sprayed with the processing liquid or not is judged by utilizing whether a receiving module of the detection sensor receives an emission signal from the processing liquid spraying point or not.
12. A semiconductor wafer processing method, comprising:
1) providing a semiconductor wafer (11);
2) using the semiconductor wafer processing apparatus of claim 1, spraying a processing fluid (124) onto the top surface of the semiconductor wafer and detecting a distribution of the processing fluid on the top surface of the semiconductor wafer.
13. The semiconductor wafer processing method of claim 12, wherein: if the distribution of the treatment liquid on the surface of the semiconductor wafer is detected to be abnormal in the step 2), the step 2) is followed by a step of repeating the step 2) for one or more times.
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| CN111750786B (en) * | 2020-07-06 | 2022-03-01 | 上海新昇半导体科技有限公司 | Thickness measuring equipment, polishing system and polishing material management method |
| CN114077164B (en) * | 2020-08-21 | 2023-03-24 | 长鑫存储技术有限公司 | Semiconductor machine cleaning system and semiconductor machine cleaning method |
| CN112103220B (en) * | 2020-11-09 | 2021-04-09 | 晶芯成(北京)科技有限公司 | Monitoring device and monitoring method for wafer cleaning position |
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