CN208422892U - Electrostatic chuck and semiconductor equipment - Google Patents

Electrostatic chuck and semiconductor equipment Download PDF

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Publication number
CN208422892U
CN208422892U CN201721624731.9U CN201721624731U CN208422892U CN 208422892 U CN208422892 U CN 208422892U CN 201721624731 U CN201721624731 U CN 201721624731U CN 208422892 U CN208422892 U CN 208422892U
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CN
China
Prior art keywords
pedestal
electrostatic chuck
chuck
recess portion
main part
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Active
Application number
CN201721624731.9U
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Chinese (zh)
Inventor
史全宇
师帅涛
赵梦欣
赵晋荣
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Beijing Naura Microelectronics Equipment Co Ltd
Beijing North Microelectronics Co Ltd
Original Assignee
Beijing North Microelectronics Co Ltd
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Priority to CN201721624731.9U priority Critical patent/CN208422892U/en
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Publication of CN208422892U publication Critical patent/CN208422892U/en
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Abstract

It includes pedestal and function part, chuck body that the utility model, which provides a kind of electrostatic chuck and semiconductor equipment, support component, pedestal is fixed on by fastener, chuck plate body includes main part, and main part is equipped with protrusion away from the surface of pedestal, and the upper surface of protrusion is used to support workpiece to be processed;Main part is equipped with recess portion, the pipeline that the space that recess portion and pedestal are constituted is used to accommodate function part and connect with function part towards the surface of pedestal.The utility model improves the structural strength of chuck body, it is not thorough to avoid the occurrence of sintering, ceramic particle size is uneven, the case where influencing the intensity and mechanical property of chuck body, it can effectively prevent the diffusion of microcrack, the breaking strength of chuck body is increased, the intensity of chuck body is made to reach the degree that can resist shearing force.

Description

Electrostatic chuck and semiconductor equipment
Technical field
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of electrostatic chucks and semiconductor equipment.
Background technique
Semiconductor equipment is widely used in the manufacture crafts such as current semiconductor, solar battery, FPD.Current Semiconductor equipment in, usually using electrostatic chuck (Electrostatic Chuck, be abbreviated as ESC) realize technical process in The clamping of workpiece to be processed, electrostatic chuck are widely used in integrated circuit (IC) manufacturing equipment.
Electrostatic chuck will appear the different abrasion of degree after being used for a long time and some components damage always, needs to replace on schedule Maintenance.Traditional electrostatic chuck uses welded formula structure, can not be to its inner components maintenance, and ceramic segment is same Sample is not easy repair and replacement, and entirety is needed to remove maintenance and renovation.
Fig. 1 is a kind of existing detachable electrostatic chuck, including electrostatic chuck ceramic segment 100, electrostatic chuck auxiliary 110 and both fixed attachment screw 120.Electrostatic chuck ceramic segment 100 includes chuck funtion part 101, pedestal support Part 103 and the intermediate solder part 102 for being welded to connect the two.
Chuck funtion part 101 uses AlN ceramic, and pedestal support section 103 is subject to processing ability using AlSiC ceramics Limitation, chuck funtion part 101 can not be made to very thick (24mm or more), especially its marginal portion, and thickness is smaller, cannot Resist the shear stress of vertical direction, it is therefore desirable to weld one piece thicker of pedestal support section 103 to increase intensity, resist shearing Power.
As shown in Figure 1 and Figure 2, electrostatic chuck auxiliary 110 includes welding bellows pedestal 111, graphite guide hotting mask 112, water cooling Disk 113, aqueous cold plate lower wall 114, push-tight spring 115, electrode connection 116, water lines 117, big sealing ring 118, small sealing on disk Ring 119, thermocouple 1101.Pedestal support section 103 uses the biggish customized sealing ring of fitting area (width is generally more than 5mm) Carry out vacuum sealing.Thermocouple 1101 passes through the temperature of the hole measurement chuck funtion part 101 of pedestal support section 103.It is big close The supporting surface of seal ring 118 is the seal groove on 111 top of welding bellows pedestal, and the supporting surface of small sealing ring 119 is on aqueous cold plate Disk 113, disk 113 is welded with aqueous cold plate lower wall 114 using the mode of diffusion welding (DW) on aqueous cold plate, the upward push-tight water of push-tight spring 115 Cold dish lower wall 114, the upward push-tight graphite heat conducting film 112 of disk 113 on aqueous cold plate, make aqueous cold plate top 113, graphite guide hotting mask 112, Pedestal support section 103 is close to seamless.Electrode connection 116, water lines 117 pass through disk 113 and aqueous cold plate lower wall on aqueous cold plate The hole of 114 immediate vicinities is drawn.
In the process of implementing the utility model, it is found by the applicant that the prior art has the following deficiencies:
Electrostatic chuck ceramic segment 100 is welded to obtain by chuck funtion part 101,103 two parts of pedestal support section, weldering Connect that technique is more complex, welding difficulty is big, high rejection rate, product cost are very high.100 electric property of electrostatic chuck ceramic segment is multiple It is miscellaneous, comprising two kinds of ceramics, brazing metal and welding be difficult to it is highly uniform, be not suitable for physical vapour deposition (PVD) (PVD) chamber in have The electricity environment of radio frequency.Bottom support section 103 uses AlSiC ceramic material, and the resistivity of the ceramic material only has E-5 Ω .cm, belong to conductor, and welded with chuck funtion part 101, can not replace easily, the components contacted to other Electric property it is restricted;AlSiC ceramic material compactness itself is bad, loose porous, and common sealing ring can not seal, and needs It to use special customized sealing ring to be bonded therewith and just be able to achieve vacuum sealing.It needs to punch on pedestal support section 103, heat Galvanic couple can just measure the temperature of chuck funtion part 101.
Utility model content
The utility model is intended at least be partially solved the technical problems existing in the prior art, proposes a kind of electrostatic card Disk and semiconductor equipment.
One aspect according to the present utility model provides a kind of electrostatic chuck, comprising: support component, including pedestal and Function part;Chuck body is fixed on the pedestal by fastener, and the chuck plate body includes main part: the main part back Surface from the pedestal is equipped with protrusion, and the upper surface of the protrusion is used to support workpiece to be processed;The main part is towards institute The surface for stating pedestal is equipped with recess portion, the space that the recess portion and the pedestal are constituted for accommodate the function part and with the function The pipeline of energy portion connection.
In some embodiments of the utility model, the base perimeter is circumferentially provided with multiple threaded holes;The fastening Part includes: pressure ring, is circumferentially provided with multiple through-holes;Multiple screws pass through the through-hole of the pressure ring and the threaded hole of the pedestal The pressure ring is fixed on the pedestal, the pressure ring compresses the main part of the chuck body.
In some embodiments of the utility model, the pressure ring includes: fixed part, and the threaded hole is opened in described solid Determine portion;Compressed part compresses the marginal surface that the main part deviates from the pedestal.
In some embodiments of the utility model, the height of the pressure ring is less than the height of the protrusion.
In some embodiments of the utility model, the threaded hole is uniformly distributed circumferentially.
In some embodiments of the utility model, the pressure ring uses ceramic material or metal material.
In some embodiments of the utility model, the pedestal includes: peripheral portion;Protrusion is located at the peripheral portion It is close to the recess portion bottom surface of the main part, and is sealed between the recess portion bottom surface by standard O-ring seal in inside;Cavity, On the inside of the protrusion, for accommodating the function part, the function part is close to the recess portion bottom surface of the main part;Pipe Road is connected to the cavity, for accommodating the pipeline connecting with the function part.
In some embodiments of the utility model, the function part includes: water cooling disk body, and bottom is by holding out against spring It is supported in the cavity, the recess portion bottom surface of the main part is close at top.
In some embodiments of the utility model, the function part further include: central gas pedestal tube is set to the water In groove at the top of cold dish body, and it is close to the recess portion bottom surface of the main part, the central gas pedestal tube and the recess portion bottom surface Between sealed by standard O-ring seal.
In some embodiments of the utility model, the function part further include: thermocouple, bottom pass through included bullet Spring structure is supported in the groove floor at the top of the water cooling disk body, and thimble is close to the recess portion bottom surface of the main part.
In some embodiments of the utility model, whole height H1=18~24mm of the chuck body;The master Height H2=10~the 15mm in body portion;Depth H 3=13~15mm of the recess portion.
In some embodiments of the utility model, the protrusion of the main part and recess portion form concentric structure, and institute The diameter for stating recess portion is less than the diameter of the protrusion.
In some embodiments of the utility model, the diameter of the recess portion is 8mm~12mm smaller than the diameter of the protrusion.
In some embodiments of the utility model, the chuck body uses integrally formed single ceramic material.
In some embodiments of the utility model, wherein ceramic material includes AIN ceramics or Al2O3Ceramics.
It further include the main part one sinter molding with the chuck body in some embodiments of the utility model Electrode terminal and potential measurement binding post.
Other side according to the present utility model additionally provides a kind of semiconductor equipment comprising: reaction chamber, Electrostatic chuck is provided in the reaction chamber, the electrostatic chuck uses any of the above-described electrostatic chuck.
The step of the chuck body of the utility model has biggish thickness, improves the structural strength of chuck body, can It is directly fixed in support component and uses, reduce thickness by opening up recess portion in chuck body lower surface, avoid the occurrence of sintering not Thoroughly, the case where ceramic particle size is uneven, influences the intensity and mechanical property of chuck body.Chuck body is solid without punching It is fixed, the probability for microcrack occur is reduced, the diffusion of microcrack is effectively prevent, increases the breaking strength of chuck body, The intensity of chuck body is set to reach the degree that can resist shearing force.Water cooling disk body improves heat transfer directly against chuck body Uniformity;Enhance heat-transfer capability without using the component of similar graphite guide hotting mask, simplify the structure of electrostatic chuck, saves Cost.Chuck body compactness is good, and the sealing with pedestal can be realized using standard items O-ring seal.Thermocouple is directly tight Chuck body is pasted, the uniformity of heat transfer and the accuracy of temperature measurement are improved.
Detailed description of the invention
By referring to the drawings to the description of the utility model embodiment, above-mentioned and other mesh of the utility model , feature and advantage will be apparent from, in the accompanying drawings:
Fig. 1 is the electrostatic chuck structural schematic diagram of the prior art.
Fig. 2 is the electrostatic chuck auxiliary top view of electrostatic chuck shown in Fig. 1.
Fig. 3 is the disassemblying structure figure of the utility model embodiment electrostatic chuck.
Fig. 4 is the sectional structure chart of the utility model embodiment electrostatic chuck.
Fig. 5 is the partial cutaway view of the utility model embodiment electrostatic chuck.
Fig. 6 is the bottom view of the chuck body of the utility model embodiment electrostatic chuck.
Fig. 7 is the dimensional drawing of the chuck body of the utility model embodiment electrostatic chuck.
Fig. 8 is the structural schematic diagram of the utility model embodiment plasma apparatus.
Symbol description
20- electrostatic chuck;
21- fastener;211- pressure ring;2111- fixed part;2112- compressed part;212- screw;
22- chuck body;220- main part;The protrusion 221-;The first fillet of 2211-;The second fillet of 2212-;The center 2213- Stomata;2214- branch stomata;2215- centre hole;222- electrode terminal;223- potential measurement binding post;The marginal portion 224-; 225- recess portion;
23- support component;
231- pedestal;2311- peripheral portion;2312- protrusion;2313- cavity;2314- pipeline;
232- large sealing packing ring;233- water cooling disk body;234- thermocouple;235- small sealing ring;236- central gas pedestal tube; 237- holds out against spring;The center 238- tracheae;239- bellows;
Specific embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, below in conjunction with specific embodiment, and Referring to attached drawing, the utility model is further described.However, it should be understood that these descriptions are merely illustrative, and it is not Limit the scope of the utility model.In addition, in the following description, descriptions of well-known structures and technologies are omitted, to avoid Unnecessarily obscure the concept of the utility model.
As shown in figure 3, according to the electrostatic chuck of the utility model embodiment, including chuck body 22, support component 23 with And fastener 21.Please referring also to Fig. 4, chuck body 22 have a main part 220, and the main structure of support component 23 is pedestal 231, main part 220 is fixed on pedestal 231, is specifically fixed on the upper surface of pedestal 231.The main part 220 deviates from pedestal 231 surface is equipped with protrusion 221, and the upper surface of protrusion 221 supports workpiece to be processed, table of the main part 220 towards pedestal 231 Face is equipped with recess portion 225, and recess portion 225 and pedestal 231 constitute a space, and whole chuck body 22 is in projection shape.
The chuck body 22 of the present embodiment uses integrally formed single ceramic material, ceramic material can be AIN or Al2O3.221 surrounding of protrusion is the marginal portion 224 of body part, and marginal portion 224 has biggish thickness, by increasing edge The thickness of part 224 improves the structural strength of chuck body 22, the ability for resisting shearing force is enhanced, relative to existing skill Art no longer needs to welding base support to increase intensity, can be directly fixed in support component 23 and use.Marginal portion 224 The increase of thickness will lead to the increase of 22 whole height of chuck body, keep the central part of main part 220 blocked up, this, which will lead to, adds Sintering is not thorough when work chuck body 22, is made that rear ceramic particle size is uneven, influences the intensity and mechanics of chuck body 22 Performance.And the present embodiment reduces the thickness of central part, so that main body by opening up recess portion 225 in 220 lower surface of main part The height in portion 220 increases but thickness does not increase, i.e. the increase of 224 thickness of marginal portion but the central part in addition to marginal portion 224 Divide thickness not increase, is in this way not in that sintering is not thorough, and ceramic particle size is uneven, influences the intensity and power of chuck body The case where learning performance.
Chuck body 22 is fixed on pedestal 231 by fastener 21, and the fastener 21 of the present embodiment includes pressure ring 211 and spiral shell Nail 212.Pressure ring 211 pushes down the marginal portion 224 of main part, and pressure ring 211 is circumferentially provided with multiple through-holes, 231 periphery edge of pedestal It is circumferentially provided with equally distributed threaded hole, multiple screws one-to-one correspondence are matched across the threaded hole of the through-hole and pedestal 231 of pressure ring 211 It closes, pressure ring 211 is compressed by screw 212, pressure ring 211 compresses main part 220, so that chuck body 22 is fixed on pedestal 231.
Wherein, if pressure ring through-hole, base threaded bore, the quantity of screw are very few, chuck body can not be effectively reduced Local stress, be unfavorable for enhancing resist shearing force ability;If quantity is excessive, the labor intensity of dismounting will increase.This Pressure ring through-hole, base threaded bore, the screw number preferably 10~50 of embodiment, can both effectively reduce the office of chuck body in this way Portion's stress, and dismounting labor intensity will not be made excessive.Pressure ring 211 can use ceramic material or metal material, pass through selection The pressure ring of unlike material, so that it may which the electric property for easily changing pressure ring adapts to the reaction chamber of different electric conductivity demands.
The present embodiment is welded by pressure ring 211 and the fixed chuck body 22 of screw 212, chuck body compared with the existing technology Be connected to base support, base support punching fixed form, can easily to chuck body carry out dismounting and Replacement, and do not need to punch in chuck body, it reduces in chuck body processing and the probability of microcrack occurs, it is effectively anti- The only diffusion of microcrack increases the breaking strength of chuck body, and shearing force can be resisted by reaching the intensity of chuck body Degree.
The pedestal 231 of support component 23 includes peripheral portion 2311, the protrusion 2312 on the inside of peripheral portion 2311, is located at The cavity 2313 of 2312 inside of protrusion, the pipeline 2314 being connect with cavity 2313.
The threaded hole of pedestal 231 is circumferentially opened in the periphery of peripheral portion 2311, pressure ring 211 and screw 212 for chuck sheet Body 22 is fixed on the peripheral portion 2311 of pedestal.Protrusion 2312 is close to the bottom surface of main part recess portion 225, protrusion 2312 and recess portion Sealing is realized by large sealing packing ring 232 between 225 bottom surface, make the peripheral portion 2311 of pedestal, protrusion 2312, main part it is recessed The region surrounded between portion 225 and large sealing packing ring 232 is vacuum state.
Support component 23 further includes the function parts such as water cooling disk body 233, thermocouple 234, central gas pedestal tube 236 and and function The pipeline of energy portion connection.The pipeline that the space that recess portion and pedestal are constituted is used to accommodate function part and connect with function part.
Specifically, cavity 2313 is for accommodating function part.For example, the bottom of water cooling disk body 233 is by holding out against spring 237 It is supported in cavity 2313, spring 237 is held out against and is in compressive state, upward push-tight aqueous cold plate body 233.Due to the chuck of the present embodiment Ontology does not weld the base support of AlSiC ceramic material, and water cooling disk body 233 is directly against at the bottom of main part recess portion 225 Face.The ceramic material compactness of chuck body 22 is good, ensure that between chuck body 22 and water cooling disk body 233 without fine gap, Improve the uniformity of heat transfer;It does not need to enhance heat-transfer capability using the component of similar graphite guide hotting mask simultaneously yet, simplify The structure of electrostatic chuck, saves cost.
Central gas pedestal tube 236 is set in the groove at water cooling disk body center, and directly against in main part recess portion 225 Bottom surface realizes sealing by small sealing ring 235 between central gas pedestal tube 236 and the bottom surface of recess portion 225, makes the recess portion of main part 225, form vacuum state between small sealing ring 235 and central gas pedestal tube 236, the recess portion 225 of main part, small sealing ring 235, The region that central gas pedestal tube 236, base cavity 2313, protrusion 2312, large sealing packing ring 232 surround is atmospheric condition.
Since the chuck body of the present embodiment does not weld the base support of AlSiC ceramic material, large sealing packing ring 232 and small sealing ring 235 use standard items O-ring, do not need that sealing can be realized using special customized sealing ring.
The thermocouple 234 of included spring mechanism, the top on 234 top of thermocouple are additionally provided in the groove at water cooling disk body center Needle is tightly attached to 225 bottom surface of recess portion of main part, can measure the temperature of chuck body 22.The ceramic material of chuck body 22 causes Close property is good, improves the uniformity of heat transfer and the accuracy of temperature measurement.Since the chuck body of the present embodiment is not welded Base support, thermocouple 234 can directly contact chuck body 22, therefore not need the step punched in base support Suddenly, so that the processing technology of electrostatic chuck is simplified.
2314 outer cover of pipeline is equipped with bellows 239, for accommodating the various pipelines in linkage function portion.For example, pipeline Centre porosity 2213 (referring to Fig. 6) of the center tracheae 238 through 236 connecting chuck ontology of central gas pedestal tube in 2314, with card Gas circuit connection in disk ontology 22, for being passed through cooling gas.In addition, the water pipe in pipeline 2314 is connected to water cooling disk body 233, For providing cooling water;Conducting wire and thermocouple 234 in pipeline 2314 are electrically connected, and are used for transmission 234 signal of thermocouple.
Referring to Fig. 5, the electrostatic chuck of the present embodiment is described further.Pressure ring 211 includes fixed part 2111 and compresses Portion 2112, threaded hole are opened in fixed part 2111, and compressed part 2112 presses the marginal portion 224 of main part.Wherein pressure ring 211 Height should be less than 221 height of protrusion of main part, in order to avoid influence to place the other components such as focusing ring in the surrounding of main part 220.
The intersection of 224 upper surface of main part marginal portion and 221 side of protrusion forms the first fillet 2211, recess portion 225 The intersection of bottom surface and side forms the second fillet 2212, is chuck by the section of the first fillet 2211 and the second fillet 2212 The shear surface of ontology 22, the part between the first fillet 2211 and the second fillet 2212 are the structural weak portion of chuck body 22 Point, the intensity of the structural weak part is lower than the other parts of chuck body 22.To guarantee that chuck body 22 has enough knots Structure intensity resists shearing force, and 225 diameter of recess portion of the present embodiment is less than the diameter of protrusion 221, i.e. the side of recess portion 225 should compare The side of protrusion 221 is closer to the center of chuck body 22, so that structural weak part has biggish thickness, shear surface With bigger area, it ensure that chuck body 22 has enough structural strengths, being directly fixed on support component 23 also has Resist the ability of shearing force.
Referring to Fig. 6 and Fig. 7, the chuck body of the present embodiment is described further.The center of main part 220 opens up The three equally distributed branch stomatas 2214 for having centre porosity 2213 and being connected to centre porosity 2213, composition run through chuck The gas circuit of ontology 22.The cooling gas of center tracheae 238 can be through centre porosity 2213 and each stomata 2214 by main part 220 upper surface outflow, cools down workpiece to be processed in technique.
Main part 220 further includes two electrode terminals 222 and potential measurement binding post 223.Electrode terminal 222 is by recessed The insertion of 225 side of portion but not through-body portion 220.Main part 220 is internally provided with electrode, electrically connects with electrode terminal 222 It connecing, the electrode cable in support component pipeline 2314 and electrode terminal 222 are electrically connected, and electrode cable is also connected with power supply, For transmitting power to electrode.The electrode terminal 222 is direct current (DC) electrode terminal, and electrode is DC electrode, directly Galvanic electricity source is powered by electrode cable to DC electrode to generate electrostatic force.The electrode terminal 222 is also possible to direct current/radio frequency (DC/RF) electrode terminal, electrode include DC electrode and radio-frequency electrode, and DC power supply and radio-frequency power supply pass through electrode cable point It does not power to DC electrode and radio-frequency electrode.Potential measurement binding post 223 is by the insertion of 225 side of recess portion and through-body portion 220, it is measured for the current potential to workpiece to be processed.Electrode terminal 222 and potential measurement binding post 223 are by being sintered It is embedded into when chuck body 22 wherein and integrated thermal sintering.
Main part 220 further includes three centre holes being uniformly distributed circumferentially 2215, is passed through for ejector pin mechanism thimble, is used In lifting workpiece to be processed.
Please with further reference to Fig. 7, the first 2211 radiuses of fillet=R1~R3 (mm), the second 2212 radiuses of fillet=R1~R3 (mm);The recess portion 225 of main part, protrusion 221, marginal portion 224 form concentric structure, wherein 221 diameter D1=Φ of protrusion 292~298 (mm), 220 diameter D2=Φ 308~330 (mm) of main part, 2215 diameter D3=R3~R5 (mm) of centre hole it Between;225 diameter D4=D1- (8mm~12mm) of recess portion;Chuck body 22 is whole (under 221 upper surface to marginal portion 224 of protrusion The linear distance on surface) height H1=18~24 (mm), 224 height H2=10~15 (mm) of marginal portion, 225 depth H 3 of recess portion =13~15mm.
Using the chuck body of above-mentioned size, 221 diameter of protrusion is 8mm~12mm bigger than 225 diameter of recess portion, chuck body 22 Structural weak part there is enough width, shear surface has sufficiently large area, and it is enough to ensure that chuck body 22 has Structural strength, be directly fixed on support component 23 also have resist shearing force ability.The thickness of protrusion 221 is no more than 11mm, and the distance of any point inside main part 220 to its any surface is no more than 12mm, sintering when ensure that processing Thoroughly, ceramic particle is uniform in size, and mechanical property is preferable.
It can be seen that the present embodiment electrostatic chuck, chuck main body does not need the ceramics of welding other materials, the chuck main body Shape and size can resist shearing force and have good processing technology, can by sintering obtain with single-size Ceramic chuck body, simplify manufacturing process, reduce processing cost.Chuck main body uses single ceramic material, has steady Fixed electric property will not bring the difference of electric property because of the difference of AlN and AlSiC the material welding procedure of different batches Property, be conducive to radio frequency environment in reaction chamber and control electric field.Chuck body absolutely not cavernous structure can be reduced effectively and be added The microcrack that work generates, is effectively prevented the diffusion of ceramic microcrack, increases the breaking strength of chuck body.
Another embodiment of the utility model provides a kind of semiconductor equipment, referring to Fig. 8 comprising reaction chamber, anti- It answers and is provided with electrostatic chuck 20 in chamber, which uses electrostatic chuck provided by the embodiment of the utility model.
Particular embodiments described above has carried out into one the purpose of this utility model, technical scheme and beneficial effects Step is described in detail, it should be understood that being not limited to this foregoing is merely specific embodiment of the utility model Utility model, within the spirit and principle of the utility model, any modification, equivalent substitution, improvement and etc. done should all wrap Containing being within the protection scope of the utility model.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ", " right side " etc. is only the direction with reference to attached drawing, is not used to limit the protection scope of the utility model.Through attached drawing, identical member Element is indicated by same or similar appended drawing reference.When may cause the understanding to the utility model and cause to obscure, will omit Conventional structure or construction.
It unless there are known entitled phase otherwise anticipates, the numerical parameter in this specification and appended claims is approximation, energy The resulting required characteristic changing of content that enough bases pass through the utility model.Specifically, all be used in specification and right The number of content, reaction condition of composition etc. is indicated in it is required that, it is thus understood that be the term by " about " in all situations It is modified.Under normal circumstances, express meaning refer to comprising by specific quantity ± 10% variation in some embodiments, ± 5% variation in some embodiments, ± 1% variation in some embodiments, in some embodiments ± 0.5% change Change.
Furthermore word "comprising" does not exclude the presence of element or step not listed in the claims.It is located in front of the element Word "a" or "an" does not exclude the presence of multiple such elements.
The word of ordinal number such as " first ", " second ", " third " etc. used in specification and claim, with modification Corresponding element, itself simultaneously unexpectedly contains and represents the element and have any ordinal number, does not also represent a certain element and another element Sequence or manufacturing method on sequence, the use of those ordinal numbers is only used to enable the element and separately with certain name One element with identical name can make clear differentiation.
Similarly, it should be understood that in order to simplify the utility model and help to understand one in each utility model aspect Or it is multiple, in the description above to the exemplary embodiment of the utility model, each feature of the utility model is sometimes by one It rises and is grouped into single embodiment, figure or descriptions thereof.However, the method for the utility model should not be construed to instead Reflect following intention: the requires of the utility model i.e. claimed is more than feature expressly recited in each claim Feature.More precisely, as reflected in the following claims, being in terms of utility model practical less than front All features of novel single embodiment.Therefore, it then follows thus claims of specific embodiment are expressly incorporated in this Specific embodiment, wherein separate embodiments of each claim as the utility model itself.

Claims (17)

1. a kind of electrostatic chuck, comprising:
Support component, including pedestal and function part;
Chuck body is fixed on the pedestal by fastener, and the chuck body includes main part,
The main part is equipped with protrusion away from the surface of the pedestal, and the upper surface of the protrusion is used to support workpiece to be processed;
The main part is equipped with recess portion towards the surface of the pedestal, and the space that the recess portion and the pedestal are constituted is for accommodating The function part and the pipeline being connect with the function part.
2. electrostatic chuck as described in claim 1, the base perimeter is circumferentially provided with multiple threaded holes;
The fastener includes:
Pressure ring is circumferentially provided with multiple through-holes;
The pressure ring is fixed on the pedestal, institute by the through-hole of the pressure ring and the threaded hole of the pedestal by multiple screws State the main part that pressure ring compresses the chuck body.
3. electrostatic chuck as claimed in claim 2, the pressure ring include:
Fixed part, the threaded hole are opened in the fixed part;
Compressed part compresses the marginal surface that the main part deviates from the pedestal.
4. electrostatic chuck as claimed in claim 2, the height of the pressure ring is less than the height of the protrusion.
5. electrostatic chuck as claimed in claim 2, the threaded hole is uniformly distributed circumferentially.
6. electrostatic chuck as claimed in claim 2, the pressure ring uses ceramic material or metal material.
7. electrostatic chuck as described in claim 1, the pedestal include:
Peripheral portion;
Protrusion is located on the inside of the peripheral portion, is close to the recess portion bottom surface of the main part, and leads between the recess portion bottom surface Cross the sealing of standard O-ring seal;
Cavity is located on the inside of the protrusion, and for accommodating the function part, the function part is close to the recess portion of the main part Bottom surface;
Pipeline is connected to the cavity, for accommodating the pipeline connecting with the function part.
8. electrostatic chuck as claimed in claim 7, the function part include:
Water cooling disk body, by holding out against spring supporting in the cavity, the recess portion bottom surface of the main part is close at top for bottom.
9. electrostatic chuck as claimed in claim 8, the function part further include:
Central gas pedestal tube is set in the groove at the top of the water cooling disk body, and is close to the recess portion bottom surface of the main part, institute It states and is sealed between central gas pedestal tube and the recess portion bottom surface by standard O-ring seal.
10. electrostatic chuck as claimed in claim 9, the function part further include:
Thermocouple, bottom are supported in the groove floor at the top of the water cooling disk body by included spring structure, and thimble is tight Paste the recess portion bottom surface of the main part.
11. electrostatic chuck as described in claim 1, whole height H1=18~24mm of the chuck body;The main body Height H2=10~the 15mm in portion;Depth H 3=13~15mm of the recess portion.
12. electrostatic chuck as described in claim 1, the protrusion of the main part and recess portion form concentric structure, and described The diameter of recess portion is less than the diameter of the protrusion.
13. the diameter of electrostatic chuck as claimed in claim 12, the recess portion is 8mm~12mm smaller than the diameter of the protrusion.
14. electrostatic chuck as described in claim 1, the chuck body uses integrally formed single ceramic material.
15. electrostatic chuck according to claim 14, wherein ceramic material includes AIN ceramics or Al2O3Ceramics.
16. electrostatic chuck as claimed in claim 14 further includes the main part one sinter molding with the chuck body Electrode terminal and potential measurement binding post.
17. a kind of semiconductor equipment comprising: reaction chamber is provided with electrostatic chuck, the electrostatic in the reaction chamber Chuck is using electrostatic chuck described in any one of claim 1 to 16 claim.
CN201721624731.9U 2017-11-28 2017-11-28 Electrostatic chuck and semiconductor equipment Active CN208422892U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721624731.9U CN208422892U (en) 2017-11-28 2017-11-28 Electrostatic chuck and semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721624731.9U CN208422892U (en) 2017-11-28 2017-11-28 Electrostatic chuck and semiconductor equipment

Publications (1)

Publication Number Publication Date
CN208422892U true CN208422892U (en) 2019-01-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN208422892U (en)

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