CN208351527U - A kind of core material structure of electronic tag - Google Patents
A kind of core material structure of electronic tag Download PDFInfo
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- CN208351527U CN208351527U CN201820036506.1U CN201820036506U CN208351527U CN 208351527 U CN208351527 U CN 208351527U CN 201820036506 U CN201820036506 U CN 201820036506U CN 208351527 U CN208351527 U CN 208351527U
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- electronic tag
- substrate
- core material
- chip
- material structure
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Abstract
The utility model belongs to electronic tag product technical field, a kind of core material structure of electronic tag is specifically disclosed, the core material structure includes substrate, inversion and fixed chip on base material, the substrate is equipped with antenna, the chip is equipped with the salient point that plating is formed, and the salient point is electrically connected with antenna on substrate.Electronic tag electric conductivity with higher and unfailing performance, in addition, cost of manufacture is lower, product can accomplish frivolous miniaturization, meet the high use occasion of some small form factor requirements degree.
Description
Technical field
The utility model belongs to electronic tag product technical field, in particular to the core material structure of a kind of electronic tag.
Background technique
In the prior art, the packaged type of electronic tag core material is roughly divided into two kinds: formal dress Chip package and upside-down mounting core
There is the deficiency of following technology in chip package, two kinds of packaged types:
The first, formal dress Chip package is to need for chip to be packaged first, at this time due to electrode when encapsulating
Positioned at the upper end of chip, it is necessary to the bracket that conducting wire is connected to encapsulation is first passed through, the element (such as antenna) being connected on substrate,
The volume and thickness of entire electronic chip are increased in this way, are unable to satisfy the demand that some occasions need frivolous electronic tag,
Meanwhile conducting wire also will increase cost of manufacture, production process is comparatively laborious.
Second, Flip-Chip package is logical by the salient point (electrode is gold-plated) on electronic label chip first when encapsulating
Conducting resinl is crossed to be electrically connected with the element on substrate, compared with metallic conduction mode, resistance is larger, electric conductivity and reliability compared with
Difference；And conducting resinl price is more expensive, greatly increases cost of manufacture.
Therefore, research and develop it is a kind of conduct electricity very well, the core of the electronic tag of good reliability, low manufacture cost and frivolous miniaturization
Expect that structure is extremely urgent.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, specifically disclose a kind of core material structure of electronic tag,
The core material structure electric conductivity with higher and unfailing performance of the electronic tag, in addition, cost of manufacture is lower, product can be accomplished
Frivolous miniaturization meets the high use occasion of some small form factor requirements degree, applied widely.
In order to reach above-mentioned technical purpose, the utility model is realized by following technical scheme:
A kind of core material structure of electronic tag described in the utility model, including substrate, inversion and fixation are on base material
Chip, the substrate are equipped with antenna, and the chip is equipped with the salient point that plating is formed, and the salient point is electrically connected with antenna on substrate
It connects.
As the further improvement of above-mentioned technology, tin cream is brushed on the pad of the substrate, the chip is placed into substrate
On, the salient point is corresponding with the position on pad, using smt technique by Reflow Soldering, chip is made to be electrically connected with the antenna on substrate
It connects.
As the further improvement of above-mentioned technology, the salient point is the column formula knot of the gold that plating is formed or silver or copper
Structure.
In the present invention, the thickness range of the electronic tag core material structure be 0.10mm to 0.5mm, thickness compared with
It is thin.
In the present invention, electronic tag made from the core material structure can be flexible electronic label, and it is suitable for appointing
It what is the need for and want the use occasion of electronic tag.
Compared with prior art, the utility model has the beneficial effects that
Electronic tag core material structure described in the utility model, it is described since chip is equipped with the salient point that plating is formed
It is brushed with tin cream on the pad of substrate, chip is placed on substrate, keeps salient point corresponding with the position on pad, using smt technique
It by Reflow Soldering, is electrically connected chip with the antenna on substrate, on the basis of ensuring higher electric conductivity, effectively improves
Its unfailing performance, and manufacturing process simplifies, low manufacture cost, electronic tag product thickness obtained is relatively thin, be able to satisfy
Needs of higher miniaturization occasion, such as the ticketing spot of automatic ticket checker etc..
Detailed description of the invention
The utility model is described in detail in the following with reference to the drawings and specific embodiments:
Fig. 1 is the core material structural schematic diagram of electronic tag described in the utility model.
Specific embodiment
As shown in Figure 1, a kind of core material structure 10 of electronic tag described in the utility model, including substrate 1, it is inverted and solid
The chip 2 being scheduled on substrate 1, the substrate 1 are equipped with antenna (not shown), and the chip 2 is equipped with what plating was formed
Salient point 3, the salient point 3 are electrically connected with the antenna on substrate 1.
In the utility model, it is brushed with tin cream 4 on the pad of the substrate 1, chip 2 is placed on substrate 1, salient point 3 is made
It is corresponding with the position on pad, then chip 2 is electrically connected with the antenna on substrate 1 by Reflow Soldering using smt technique, it is described
Salient point 3 is the column formula structure of the gold that plating is formed or silver or copper, and pad is secured, it is ensured that the stability of product structure.
In the present invention, the value range of the thickness H of the core material structure 10 of the electronic tag be 0.10mm extremely
0.5mm。
Electronic tag made of the core material structure 10 of electronic tag described in the utility model, frequency range include HF high
Frequently, UHF hyperfrequency and microwave frequency, status can be card form or any other not specification status, can be flexible electrical
Subtab, in addition, its electric conductivity is high, good reliability, manufacturing process simplifies, low manufacture cost, and product degree of miniaturization is high, fits
It is wide with range, it is able to satisfy the demand used in the miniaturization place of any high request.
The utility model is not limited to above embodiment, and all various changes or modifications to the utility model do not take off
Spirit and scope from the utility model, if these modification and variations belong to the claims and equivalents of the utility model
Within the scope of, then the utility model is also implied that comprising these modification and variations.
Claims (3)
1. a kind of core material structure of electronic tag, it is characterised in that: including substrate, inversion and fixed chip on base material, institute
Substrate is stated equipped with antenna, the chip is equipped with the salient point that plating is formed, and the salient point is electrically connected with antenna on substrate；
Tin cream is brushed on the pad of the substrate, the chip is placed on substrate, and the salient point is corresponding with the position on pad,
Using smt technique by Reflow Soldering, it is electrically connected chip with the antenna on substrate.
2. the core material structure of electronic tag according to claim 1, it is characterised in that: the salient point is the gold that plating is formed
Or the column formula structure of silver or copper.
3. the core material structure of electronic tag according to claim 1, it is characterised in that: the core material structure of the electronic tag
Thickness range value be 0.10mm to 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820036506.1U CN208351527U (en) | 2018-01-09 | 2018-01-09 | A kind of core material structure of electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820036506.1U CN208351527U (en) | 2018-01-09 | 2018-01-09 | A kind of core material structure of electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208351527U true CN208351527U (en) | 2019-01-08 |
Family
ID=64873073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820036506.1U Active CN208351527U (en) | 2018-01-09 | 2018-01-09 | A kind of core material structure of electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208351527U (en) |
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2018
- 2018-01-09 CN CN201820036506.1U patent/CN208351527U/en active Active
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