CN208337695U - Camera model - Google Patents

Abstract

The disclosure provides a kind of camera model, which includes: shell, accommodates lens barrel in the shell；Circuit board is fixedly mounted on the lower part of the shell；And guiding elements, guide the shell to be fixed to the fixation position of circuit board, wherein the guiding elements includes: solder ball, is formed on the circuit board with prominent along upward optical axis direction；And guiding groove, it is set as along the slot that the upward optical axis direction is recessed in the lower end of the shell, and the solder ball is assembled in the guiding groove.The camera model can improve the combination alignment of shell and circuit board, improve the rigidity of circuit board and the utilization rate of circuit board.

Description

Camera model

Technical field

This disclosure relates to a kind of camera model.

Background technique

Recently, according to the trend of miniaturization and the slimming of the mobile device for including cellular phone, in this industry, reduce The size of the component of installation in the mobile device has become important, in order to realize the function of further improving and be mounted on shifting The miniaturization of component in dynamic device, has applied highly integrated technology.

Specifically, the camera model used in existing mobile device etc. has been used to camera phone, individual digital helps It manages (PDA), smart phone and laptop computer etc., therefore needs to have small size and high performance according to Consumer Preferences Image capture function.

In more detail, the mobile device of cellular phone, laptop computer etc. is already provided with recently wherein installs There is the figure of charge-coupled device (CCD) imaging sensor, complementary metal oxide semiconductor (CMOS) imaging sensor etc. As the camera model of capturing element, and camera model as described above is according to the increase of the quantity of pixel and its improvement of function And there is the performance similar with the common performance of high standard digital camera.

In such trend, in the technique for making shell and plate be bonded to each other, by making protrusion and slot structure in conjunction with next Adjustment constitutes the alignment of the shell and plate of camera model.However, being held in such alignment structures due to mechanical bonding structures It is also easy to produce manufacturing tolerance or assembling tolerance, and needs to form hole in plate, so as to reduce the rigidity of plate and the utilization rate of plate.

Utility model content

At least one of in order to solve the above-mentioned technical problem, the one side of the disclosure can provide one kind can be without in plate Improve the camera model of the combination alignment of shell and plate in the case where forming hole.

According to the one side of the disclosure, a kind of camera model can include: shell accommodates lens barrel in the shell；Circuit Plate is fixedly mounted on the lower part of the shell；And guiding elements, guide the shell to be fixed to the fixation of the circuit board Position, wherein the guiding elements includes: solder ball, is formed on the circuit board with prominent along upward optical axis direction； And guiding groove, it is set as in the lower end of the shell along the slot that the upward optical axis direction is recessed, and the weldering Pellet is assembled in the guiding groove.

According to another aspect of the present disclosure, a method of manufacture camera model can include: form pad on circuit boards； Passive block or imaging sensor are set on the circuit board and solder cream is coated to the pad；To the solder cream Execute reflux technique；And solder ball is formed using the solder cream and is made shell setting on the circuit board described The guiding groove of shell is arranged in part corresponding with the position of the solder ball.

The combination alignment of shell and circuit board can be improved according to the camera model of the disclosure, and the rigidity of circuit board can be improved With the utilization rate of circuit board.

Detailed description of the invention

By the detailed description carried out below in conjunction with the accompanying drawings, the above and other aspects of the disclosure, feature and advantage will be by It is more clearly understood that, in the accompanying drawings:

Fig. 1 is the perspective view for showing camera model according to the exemplary embodiment of the disclosure；

Fig. 2 is the decomposition perspective view for showing circuit board and separating with camera model according to the exemplary embodiment of the disclosure；

Fig. 3 is the assembling sectional view for showing camera model according to the exemplary embodiment of the disclosure；

Fig. 4 is the sectional view for showing the shell of camera model according to the exemplary embodiment of the disclosure；

Fig. 5 is to show the wafer scale (wafer- according to the exemplary embodiment of the disclosure for being used to manufacture camera model Level) the diagram of circuit board and bare die grade (dice-level) circuit board；

Fig. 6 is to show showing for the bare die grade circuit board according to the exemplary embodiment of the disclosure for being used to manufacture camera model Figure；

Fig. 7 is to show solder cream according to the exemplary embodiment of the disclosure to be coated to bare die for manufacturing camera model The diagram of the shape of grade circuit board；

Fig. 8 be show solder cream according to the exemplary embodiment of the disclosure be coated to its for manufacturing camera model Circuit board carries out reflux technique to form the shape of solder ball；And

Fig. 9 is the flow chart for showing the method for manufacturing camera model according to the exemplary embodiment of the disclosure.

Specific embodiment

Hereinafter, the exemplary embodiment of the disclosure is described in detail with reference to the accompanying drawings.

Fig. 1 is the perspective view for showing camera model according to the exemplary embodiment of the disclosure, Fig. 2 be show circuit board with The separated decomposition perspective view of camera model according to the exemplary embodiment of the disclosure；Fig. 3 is the example shown according to the disclosure The assembling sectional view of the camera model of property embodiment；Fig. 4 shows camera model according to the exemplary embodiment of the disclosure The sectional view of shell.

Camera model 100 according to the exemplary embodiment of the disclosure can include: shell 110, wherein accommodating lens barrel 111；And circuit board 130, it is integrated to the lower part of shell 110.In addition, shell 110 and circuit board 130 can be viscous by such as thermosetting property The adhesive of mixture, ultraviolet light (UV) adhesive etc. is bonded to each other and combines.

The inside of shell 110 can have hollow shape, and lens barrel 111 may be housed in shell 110, and lens barrel 111 wraps Include: at least one lens is stacked along optical axis direction；First actuator, by driving lens barrel 111 to execute along optical axis direction Automatic focusing (AF) function；Second actuator, by driving lens barrel 111 to execute optics along the direction vertical with optical axis direction Image stabilization (OIS) function；And optical filter 116 etc..

In addition, imaging sensor 137, various passive blocks etc. are mountable on circuit board 130.

Lens barrel 111 be may include the multiple lens being embedded in, be caught using the imaging sensor 137 in camera model 100 The image of subject is caught, and lens barrel 111 can be threadedly coupled to shell 110 by forming screw thread on its outer circumferential surface.

Shell 110 can generally support lens barrel 111, and lens barrel 111 can be protected from external impact, and can be fixably coupled To circuit board 130 to protect the group by taking the optical filter 116 of infrared (IR) optical filter waits as an example being mounted on circuit board 130 Part.

Here, the lens barrel 111 that the thread groove engaged with the screw thread of lens barrel 111 may be formed at shell 110 is integrated to its portion In the inner peripheral surface divided.

Optical filter 116 can be needed, to remove the light in infrared light district.In more detail, the camera of camera phone uses charge Coupled apparatus (CCD) or complementary metal oxide semiconductor (CMOS) convert optical signals to electric signal to form image, these Optical signal infrared light district (up to 1150nm) and the visible visible region of human eye (400nm is sensed into 700nm), from And the signal (for example, optical signal in infrared light district) unrelated with actual color or image can be such that sensor is saturated.Therefore, it can need Want infrared (IR) cut-off filter to remove the light in infrared light district.

External image can be converted to electric signal and store electric signal by imaging sensor 137, and can store exterior view As to replace existing film.Imaging sensor can be divided into ccd image sensor and cmos image sensor (CIS).Here, CCD can be charge-coupled device.In addition, complementary metal oxide semiconductor (CMOS) can be used in CIS.

Circuit board 130 is mountable on the lower part of shell 110, and can have circuit mounted thereto, various passive Component and integrated circuit, to send and receive electric signal.

Circuit board 130 can be fixedly joined to the lower part of shell 110.In addition, making shell 110 and circuit board 130 each other In conjunction with technique in, shell 110 and circuit board 130 needs be in alignment with each other so that being stacked on lens barrel 111 (is contained in shell 110 In) in the centers of optical axis and the imaging sensor 137 being mounted on circuit board 130 of lens coincide with one another, then, make shell 110 and circuit board 130 combine with being fixed to one another.In other words, shell 110 and circuit board 130 need to be based at them scheduled Position combines with being fixed to one another in the state of being in alignment with each other.

It therefore, may include guiding elements according to the camera model of the disclosure 100, so that shell 110 and circuit board 130 are each other Alignment.Guiding elements may include the guiding groove 113 of the solder ball 135 being arranged on circuit board 130 and setting within the case 110.

In addition, at least two guiding elements can be arranged along the periphery of the lower end of shell.It is shown in the accompanying drawings according to this The camera model 100 of exemplary embodiment can have substantially rectangular frame shape.As an example, can be with substantially rectangular frame shape Shell 110 corner part in be respectively set guiding groove 113, and solder ball 135 may be provided on circuit board 130 and with guidance Slot 113 is corresponding, thus settable four guiding elements in camera model 100.

Guiding groove 113 may be configured as along the slot that upward optical axis direction is recessed in the lower end of shell 110, and In the technique for making shell 110 and circuit board 130 be bonded to each other, solder ball 135 can make while being mounted in guiding groove 113 Shell 110 and circuit board 130 (automatically) are aligned naturally each other.

After shell 110 and circuit board 130 are in alignment with each other by solder ball 135 and guiding groove 113, can additionally it need The technique for pressing shell 110 and circuit board 130 each other is so that shell 110 and circuit board 130 are bonded to each other by adhesive.Cause This, the top of solder ball 135 can be pressed by guiding groove 113, so that the shape on the top of solder ball 135 can be according to guiding groove 113 shape and change.

The coniform shape or polygonal pyramid shape shape that guiding groove 113 can have its sharp portion to be directed toward upward optical axis direction Shape.Therefore, guiding groove 113 can have the diameter to become smaller from bottom towards top, and solder ball 135 is being assembled to guiding groove In technique in 113, while the center of guiding groove 113 and the center of solder ball 135 are aligned naturally each other, shell 110 It can therefore be in alignment with each other in predetermined position with circuit board 130.

Solder ball 135 may be formed on circuit board 130 with prominent along upward optical axis direction.Solder ball 135 can with It is formed naturally in the reflux technique of passive block, the imaging sensor 137 that welding is mounted on circuit board 130 etc..

That is, solder ball will be being formed when installing passive block, imaging sensor 137 etc. on circuit board 130 Pad 131 is formed at 135 position, coated with solder cream (soldering paste) 133, then executes reflux technique, in solder on pad 131 While cream 133 is melted and hardens, solder ball 135 can be formed naturally.It in this case, can be without being executed separately Solder ball 135 is readily formed in the case where additional technique.

In addition, though the solder ball 135 formed as described above can substantially have a spherical form, but solder ball 135 The placement department being placed on circuit board 130 can have automatic adjustment shape.Therefore, solder ball 135 can have dome shape, and And the height in the direction of the optical axis of solder ball 135 can greater than, equal to or less than solder ball 135 radius, and solder ball 135 height in the direction of the optical axis is smaller than the diameter of solder ball 135.Although solder ball 135 can have in the blown state Spherical form, but the power by being acted on downwards due to gravity etc. can also be hard with micro- flattened spherical shape (that is, oval shape) Change.In this case, the placement department of solder ball 135 can have general oval shape.

Meanwhile pad 131 may be used on circuit board 130 to form solder ball 135.Pad 131 can be formed using metal, and And there can be the construction for being wherein stacked with copper, nickel, gold etc..

In addition, the shape of the center of pad 131 and the central alignment of the guiding groove 113 of shell 110 can be most accurate It is aligned shape.

Pad 131 can have automatic adjustment shape, and can have straight less than or equal to the placement department of solder ball 135 The size of diameter.In other words, when the solder cream 133 being coated on pad 131 melts, spherical liquid ball can be formed, and can Solder ball 135 is formed while the hardening of spherical liquid ball.It is often necessary in the center and spherical liquid ball of pad 131 Setting pad 131 and spherical liquid ball in the state that centre coincides with one another, so that solder ball 135 and guiding groove 113 are each other accurately Alignment.That is, solder ball 135 can be formed to cover the entirety of pad 131.

For this purpose, the amount of the solder cream 133 of the size and coating of adjustable pad 131, so that the size of pad 131 is less than Or the diameter of the placement department equal to solder ball 135.Due to the upper table for being provided with pad 131 of pad 131 and circuit board 130 Face is provided with different characteristics, therefore only when solder cream 133 is coated around pad 131, solder ball 135 just can be molten Center in the technique of change and hardening solder cream 133 based on pad 131 is substantially formed naturally.

For example, when being exposed to external situation after the formation of solder ball 135 in view of pad 131, due to pad 131 It is very big, therefore in the case where opposite with above situation, due to solder ball 135 be formed in pad 131 have and solder ball On the upper surface for the characteristic that 135 characteristic is substantially the same, thus pad 131 and solder ball 135 can not with the center of pad 131 and The state setting that the center of solder ball 135 is in alignment with each other, and solder ball 135 may be formed at any of the upper surface of pad 131 On position.Therefore, the alignment between shell 110 and circuit board 130 can become impossible.

Fig. 5 be show it is according to the exemplary embodiment of the disclosure for manufacturing the wafer scale circuit board of camera model and naked The diagram of chip level circuit board, Fig. 6 are to show the bare die grade according to the exemplary embodiment of the disclosure for being used to manufacture camera model The diagram of circuit board；Fig. 7 is to show solder cream according to the exemplary embodiment of the disclosure to be coated to for manufacturing camera model Bare die grade circuit board shape diagram；Fig. 8 is to show solder cream according to the exemplary embodiment of the disclosure to be coated to it The circuit board for manufacturing camera model carry out reflux technique to form the shape of solder ball.

Referring to Fig. 5, according to the exemplary embodiment of the disclosure for manufacturing the circuit board of camera model can be wafer Grade circuit board 120.That is, can be to the integrated circuit including multiple circuit boards (being respectively used in single camera module 100) Plate executes the technique of installation passive block and imaging sensor and forms both the technique of solder ball.Then, integrated circuit board Bare die grade circuit board 130 can be cut into so that bare die grade circuit board 130 is provided separately, it then, can be by bare die grade circuit board 130 It is integrated to single housing 110.

Referring to Fig. 6, (single) electricity of the bare die grade according to the exemplary embodiment of the disclosure for camera model is shown Road plate 130.As can be seen from Figure 6, pad 131 is arranged at the corner part of the bare die grade circuit board 130 with rectangular shape.

Referring to Fig. 7, it will be seen that solder cream 133 is applied to according to the exemplary embodiment of the disclosure be used for The circuit board 130 of camera model, and it can be seen that solder cream 133 is sufficiently coated the placement so that solder ball 135 The diameter in portion is greater than the size of pad 131.

Referring to Fig. 8, the example for the solder ball 135 being formed on circuit board 130 is shown.

Fig. 9 is the flow chart for showing the method for manufacturing camera model according to the exemplary embodiment of the disclosure.

Referring to Fig. 9, the method for manufacturing camera model according to the exemplary embodiment of the disclosure can include: on circuit boards Pad is formed, passive block or imaging sensor are set on circuit boards and solder cream is coated to pad, pad is executed Reflux technique, and form solder ball using solder cream and shell is arranged on circuit boards, shell includes being formed in and welding Guiding groove at the corresponding part in the position of pellet.

Here, the method for manufacturing camera model may also include that before by shell setting on circuit boards, and adhesive is applied It is added to the lower end of shell or the top of circuit board, and the method for manufacturing camera model may also include that and be arranged by shell After on circuit boards, presses shell and circuit board and shell and circuit board is made to be bonded to each other.

Here, circuit board can be wafer scale circuit board, and when shell is integrated to circuit board, can cut circuit board It is segmented into bare die grade circuit board.

In addition, coniform shape or polygonal pyramid shape shape that guiding groove can have its sharp portion to be directed toward upward optical axis direction Shape.Therefore, when shell to be arranged on circuit boards so that guiding groove is arranged on part corresponding with the position of solder ball, The center of solder ball and the center of guiding groove can (automatically) be aligned naturally each other.

In addition, the guidance of shell can be passed through when pressing shell and circuit board and shell and circuit board being made to be bonded to each other Slot presses the top of solder ball, thus the shape on the top of changeable solder ball.

As explained above, according to an exemplary embodiment of the present disclosure, it can be used and be necessarily included in manufacture camera model Technique in technique (for example, reflux technique) further improve the combination alignment of shell and circuit board.

According to an exemplary embodiment of the present disclosure, due to not needing to form hole in the circuit board, circuit board can be improved Rigidity and circuit board utilization rate.

It, for a person skilled in the art will be apparent although exemplary embodiment illustrated and described above It is that, in the case where not departing from the scope of the present disclosure being defined by the following claims, can modify and modification.

Claims (12)

1. a kind of camera model, which is characterized in that the camera model includes:

Shell accommodates lens barrel in the shell；

Circuit board is fixedly mounted on the lower part of the shell；And

Guiding elements guides the shell to be fixed to the fixation position of the circuit board,

Wherein, the guiding elements includes: solder ball, is formed on the circuit board with prominent along upward optical axis direction； And guiding groove, it is set as in the lower end of the shell along the slot that the upward optical axis direction is recessed, and the weldering Pellet is assembled in the guiding groove.

2. camera model according to claim 1, which is characterized in that set along the periphery of the lower end of the shell It is equipped at least two guiding elements.

3. camera model according to claim 1, which is characterized in that be provided with pad, and institute on the circuit board Solder ball is stated to be arranged on the pad.

4. camera model according to claim 3, which is characterized in that the pad has automatic adjustment shape.

5. camera model according to claim 4, which is characterized in that the solder ball is placed on the circuit board Placement department has automatic adjustment shape, and

The diameter of the placement department is greater than or equal to the diameter of the pad.

6. camera model according to claim 3, which is characterized in that the solder ball is formed to cover the pad It is whole.

7. camera model according to claim 1, which is characterized in that the solder ball has dome shape.

8. camera model according to claim 1, which is characterized in that the top of the solder ball passes through the guiding groove quilt Pressing.

9. camera model according to claim 1, which is characterized in that the guiding groove has coniform shape or more ribs The sharp portion of conical by its shape, the coniform shape or the polygonal pyramid shape shape is directed toward the upward optical axis direction.

10. camera model according to claim 1, which is characterized in that the shell has rectangular frame shape, and

The guiding elements is arranged at least two corner parts of the lower end of the shell.

11. camera model according to claim 1, which is characterized in that be equipped on the circuit board passive block or Imaging sensor.

12. camera model according to claim 1, which is characterized in that the circuit board and the shell pass through adhesive It is bonded to each other and combines.