KR20080093679A - Camera module and method of manufacturing the same - Google Patents

Abstract

A camera module and a manufacturing method thereof are provided to prevent inflow of foreign materials in a housing/lens barrel assembling process and a focus control process. A plurality of holes are formed in a constant interval on an upper surface of a CSP(Chip Size Package) type image sensor module(120). A flange is formed in a lower end of a barrel coupling unit having a cylindrical structure of a housing(110). A plurality of bosses are protruded from a lower surface of the housing. A lens barrel(130) includes a housing coupling part coupled with the barrel coupling unit of the housing. A circular groove is formed at a lower surface of the inside of the lens barrel. A lens insertion hole is formed at a center of the lens barrel. A wafer lens(140) is installed in the inside of the lens insertion hole of the lens barrel. A lens fixing cap(150) is formed to open and close an upper end of the lens barrel.

Description

Camera module and method of manufacturing the same

1 is an assembled perspective view showing a state of assembly of a conventional COF camera module.

Figure 2 is a partial cutaway cross-sectional view of a conventional COF camera module.

3 is an exploded perspective view of a camera module manufactured by a conventional COB method.

Figure 4 is a schematic cross-sectional view of a conventional COB type camera module.

5 is an assembled perspective view of a first embodiment of a camera module according to the present invention;

6 is a sectional view of a first embodiment of a camera module according to the present invention;

7 is a sectional view of a second embodiment according to the present invention;

8 is a step-by-step assembly cross-sectional view of the camera module according to the present invention,

8A is a cross-sectional view of the image sensor module,

8B is an assembled sectional view of the lens barrel;

8C is an assembled sectional view of the housing and the lens barrel;

8D is a cross-sectional view of the camera module in which the housing and the image sensor module are assembled.

8E is a cross-sectional view of the camera module to which the reinforcing material is applied.

<Explanation of symbols for main parts of the drawings>

110. Housing 111. Barrel Coupling

112. Flange 120. Image sensor module

130. Lens barrel 131. Housing joint

133, lens insert 134. rib

135. Circular groove 140. Wafer lens

150. Lens fixing cap 151. Lens support

160.IR filter layer

The present invention relates to a camera module that can be directly mounted on a main board, and more specifically, to a CSP (Chip Size Pakage) type image sensor module, a housing and a lens barrel are sequentially coupled to the camera module to manufacture a CSP type image. The present invention relates to a camera module and a method of manufacturing the same, which allow surface mounter technology (SMT) to be directly mounted on a main substrate through a sensor, and can reduce the size of a camera module according to the width of an image sensor.

Currently, camera modules are installed in the production of automobiles and endoscopes, including mobile communication terminals, IT devices such as PDAs and MP3 players, and these camera modules are centered on high pixels with the development of technology at 300,000 pixels (VGA level). At the same time, miniaturization and thinning are being progressed according to the mounting target, and various additional functions such as auto focusing (AF) and optical zoom (OPTICAL ZOOM) are being implemented at low cost.

In addition, the current camera module is equipped with an image sensor module manufactured by a wire bonding method (COB; chip of board), flip chip method (COF; Chip Of Flexible) and chip scale package (CSP) It is mainly manufactured in the form of being connected to the main board through electrical connection means such as a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

However, in recent years, a camera module that can simplify the manufacturing process and reduce the manufacturing cost has been demanded from the user by allowing it to be directly mounted on the main substrate as in a general passive element.

In such a camera module, an image sensor such as a CCD or a CMOS is mainly manufactured in a state of being attached to a substrate by a wire bonding or flip chip method. The data is stored on the image, and the stored data is converted into an electrical signal and displayed as an image on a display medium such as an LCD or a PC monitor in the device.

Below is a brief structure of the representative camera module manufacturing method COF and COB method with reference to the drawings shown below as follows.

1 is an assembled perspective view illustrating a state of assembling a camera module of a conventional COF method, and FIG.

As shown in the drawing, the conventional camera module 1 includes a housing 2 in which an image sensor 3 for converting an image signal input through a lens into an electrical signal is supported on a bottom thereof, and the image sensor 3 of the subject. The lens group 4 for collecting the image signal and the barrel 5 in which the lens group 4 is stacked are sequentially formed.

At this time, a lower portion of the housing 2 is electrically coupled to a mounting substrate (FPCB) 6 to which a capacitor, which is an electric component for driving an image sensor 3 made of CCD or CMOS, and a chip component of a resistor are attached. .

The conventional camera module 1 configured as described above has an anisotropic conductive film (ACF) between the substrate 6 and the image sensor 3 in a state where a plurality of circuit components are mounted on the mounting substrate FPCB 6. Film) 8 is inserted and adhesively fixed so as to be energized by applying heat and pressure, and an IR filter 7 is attached to the opposite side.

Further, as described above in the state in which the barrel 5 in which the plurality of lens groups 4 are built and the housing 2 are temporarily coupled by screwing, the pre-assembled mounting substrate 6 is placed on the bottom of the housing. It is adhesively fixed by a separate adhesive.

On the other hand, after fixing the mounting substrate 6 to which the image sensor 3 is attached and the housing 2 to which the barrel 5 is coupled, the subject (resolution chart) is placed at a predetermined distance in front of the barrel 5. The focus adjustment of the camera module 1 is performed by adjusting the vertical feed amount by the rotation of the barrel 5 screwed to the housing 2, thereby adjusting the lens group 4 and the image sensor ( 3) focusing is done.

In this case, the distance of the subject is approximately 50 cm at an infinite distance from the focus adjustment is made, and after the final focus is adjusted by injecting an adhesive between the housing 2 and the barrel 5 in the focused state Adhesive is fixed.

However, in order to adjust the focus of the image of the barrel 5 on which the lens group 4 is mounted to the image sensor 3 after assembling with the housing 2, the barrel 5 screwed to the housing 2 is left. When the roller is rotated and vertically transferred, foreign substances such as particles generated by friction between the screw coupling portion of the housing 2 and the barrel 5 fall to the upper surface of the IR filter 7 or the image sensor 3. There is a disadvantage in that a foreign material defect occurs as it is exposed on the light receiving area of the image sensor 3.

In addition, an assembly criterion of the mounting substrate 6 and the housing 2 is determined by the IR filter 7, and the IR filter 7 forms the center of the image sensor 3 and the lens group 4. It plays an important role, and has a great influence on the foreign matter depending on the mounting position of the IR filter (7).

That is, the closer the mounting position of the IR filter 7 is to the image sensor 3, the more foreign matter dropped on the upper surface of the IR filter 7 is easily recognized, and conversely, the farther the IR filter 7 is from the image sensor 3. As the influence on the foreign material becomes less sensitive, a camera module design is required so that the distance between the IR filter 7 and the image sensor 3 can be kept to the maximum within the camera module.

Meanwhile, FIG. 3 and FIG. 4 are views illustrating a camera module manufactured by a COB method, and FIG. 3 is an exploded perspective view of a camera module manufactured by a conventional COB method, and FIG. 4 schematically illustrates a camera module of a conventional COB method. As a sectional view of the related art, the conventional camera module 10 includes a printed circuit board 11 having a CCD or CMOS image sensor 12 mounted by a wire bonding method, coupled to a lower portion of a plastic housing 13, and the housing 13. The lens barrel 16 is extended by the cylindrical body 15 is extended to the bottom barrel 14 is extended to the top is produced.

The camera module 10 has a housing 13 and a lens barrel 16 formed by screwing a female screw portion 14a formed on the inner circumferential surface of the barrel 14 and a male screw portion 15a formed on the outer circumferential surface of the cylindrical body 15. Combined.

In this case, an IR filter 18 is disposed between the upper surface of the printed board 11, that is, the lens L mounted on the lower end of the lens barrel 16 and the image sensor 12 attached to the lower surface of the printed board 11. By being combined, the infrared rays of excessive long wavelength flowing into the image sensor 12 are blocked.

In the camera module assembled as described above, light flowing from a specific object passes through the lens L and the image is inverted to focus on the surface of the image sensor 12. While rotating the lens barrel 16, an adhesive is injected between the housing 13 and the lens barrel 16 at the point where the optimal focus is achieved, and the housing 13 and the lens barrel 16 are adhesively fixed to the final camera. Modular products are produced.

On the other hand, as the resolution and number of pixels of a camera that a consumer demands have increased in recent years, it has been emphasized whether the material itself manages foreign materials during the manufacturing process of the camera module.

However, there is a limit to supply and demand management of materials that do not substantially generate foreign matters, and as the foreign material management regulations of the assembled materials are strengthened, the unit price of materials increases, resulting in a product price increase.

Therefore, in order to minimize the increase in the price of the product is generally used materials and parts that are widely used, the problem that occurs during the inspection process, such as assembly of the camera module or image inspection is as follows.

The conventional camera module is mainly composed of a rotating structure in which the coupling of the barrel 16 and the housing 13 for performing the focus adjustment process is performed by the corresponding coupling of the female and male threads 14a and 15a inside the camera module. Therefore, there is a disadvantage in that the assembling property such as foreign matter defects due to the generation of fine particles (P) as the engagement portion is worn by the friction of the female and male screw parts (14a, 15a) is significantly reduced.

As such, the particles P generated between the housing 13 and the lens barrel 16 are forced to enter the upper surface of the IR filter 18 or the light receiving region of the image sensor 12. Problems that act as defects such as black spots or color spots have been pointed out when reproducing images.

Accordingly, the present invention has been made to solve the above-mentioned disadvantages and problems raised in the conventional camera module, the housing on the top of the image sensor module of the CSP (Chip Size Pakage) type having a plurality of holes on the upper surface at equal intervals As the lens barrel is sequentially combined, the lower surface of the image sensor module is directly seated on the main board, thereby enabling the surface mounting of the camera module and providing a camera module capable of miniaturization according to the width of the image sensor module. There is an object of the invention.

In addition, the object of the present invention is to provide a camera module that is coupled to the lens barrel and the housing on the outer circumferential surface of the housing, thereby preventing the inflow of foreign substances generated during the coupling and focus adjustment of the housing and lens barrel. have.

The object of the present invention is a CSP type image sensor module having a plurality of holes arranged at equal intervals on the upper surface, a flange is provided at the lower end of the cylindrical barrel coupling portion, the housing is formed with a plurality of bosses projecting on the lower surface, and A housing barrel, which is closely coupled to the barrel coupling part of the housing, extends downward, has a circular groove formed on an inner bottom thereof, and has a lens barrel including a lens insertion hole having a rib extending inwardly in the center thereof, and mounted in the lens insertion hole of the lens barrel. It is achieved by providing a camera module including a wafer lens and a lens fixing cap to be covered at the upper end of the lens barrel.

The housing has a male screw portion formed on an outer circumferential surface of the barrel engaging portion.

In addition, the lens barrel is provided with a female screw portion on the inner peripheral surface of the housing coupling portion of the lower portion.

The lens barrel coupled to the upper portion of the housing is vertical by rotating the lens barrel about the screw engaging portion of the contact interface in a state in which the female barrel portion and the male screw portion formed on the inner and outer peripheral surfaces of the lens barrel and the housing are closely coupled. As the lens is moved, focusing of the lens is performed.

The image sensor module coupled to the lower part of the housing is a series of lamination processes and assembly processes such as die bonding, wire bonding and molding in a wafer state in which a plurality of chips are mounted. When this is completed, it is composed of a CSP type image sensor module that is manufactured by dicing it into an individual image sensor module.

At this time, the image sensor module is provided with electrical connection means such as solder balls or pads and bumps on the lower surface, a plurality of holes on the upper surface is arranged at equal intervals.

In addition, the boss protruding from the lower surface of the flange of the housing is disposed at a position corresponding to the hole of the upper surface of the image sensor module.

Therefore, the housing and the image sensor module are firmly coupled to each other without distortion of the optical axis by the hole insertion of the boss.

On the other hand, the housing coupled to the image sensor module is directly bonded to the lower surface of the image sensor module provided with the electrical connection means on the main substrate, it can be mounted directly on the main substrate through a reflow process or the like.

The wafer lens mounted in the lens barrel is manufactured by injection molding at a wafer level in a replica process, and is cut into a rectangular unit wafer lens and mounted in a lens insertion hole formed in the lens barrel.

The wafer lens is deposited or coated with an IR filter layer on either of its upper and lower surfaces.

The wafer lens is seated and supported on an upper surface of the rib extending inwardly from the inner circumferential surface of the lens insertion port.

In addition, a lens cap for fixing a circular ring is mounted on an upper portion of the lens barrel, and the lens support of the inner ring presses the upper surface of the wafer lens inserted into the lens barrel so that the wafer lens is firmly fixed.

In addition, another object of the present invention, the image sensor module with a plurality of holes arranged at equal intervals on the upper surface, a housing provided with a flange is provided at the lower end of the cylindrical barrel coupling portion and a plurality of bosses projecting on the lower surface, and the housing A housing barrel coupled tightly with the barrel coupling portion of the lens barrel, the lens barrel being integrally formed at the upper portion thereof, and having a lens insertion hole provided with an adhesive injection hole therein; and a lens insertion hole of the lens barrel. This is achieved by providing a camera module comprising a wafer lens mounted therein.

On the other hand, another object of the present invention,

Camera Module Structure

First embodiment

First, Figure 5 is a perspective view of the assembly of the first embodiment of the camera module according to the present invention, Figure 6 is a cross-sectional view of the first embodiment of the camera module according to the present invention.

The camera module 100 of the present embodiment includes a housing 110 coupled to an upper portion of the CSP type image sensor module 120 and a lens barrel 130 into which a wafer lens 140 is inserted into an inner center thereof.

At this time, the upper end and the lower end of the housing 110 and the lens barrel 130 are coupled to each other, and the distance is adjusted while the lens barrel 130 is vertically transferred from the upper portion of the housing 110.

Accordingly, focus adjustment is performed by adjusting a gap between the wafer lens 140 in the lens barrel 130 and the image sensor 121 mounted in the image sensor module 120 positioned below the housing 110.

The housing 110 is mainly produced by injection molding in a form in which the flange 112 is horizontally extended at the lower end of the cylindrical barrel coupling portion 111, and a plurality of bosses are formed at equal intervals on the lower surface of the flange 112. 113 is protruded.

At this time, the external threaded portion 111a is formed on the outer circumferential surface of the barrel engaging portion 111.

A rectangular image sensor module 120 is tightly coupled to the lower portion of the housing 110, wherein the XY axis width of the flange 112 formed in the housing 110 is the entire upper surface of the image sensor module 120. It is preferable to be formed to be the same as or larger than the width of the XY axis of the upper surface to be covered.

The image sensor module 120 is mounted to the CSP type image sensor module 120 that can be directly mounted by a bonding method such as soldering on the main substrate.

The image sensor module 120 includes a wafer 122 having an image sensor 121 on an upper surface thereof, and a glass 123 seated to have an air cavity on the wafer 122. An electrical connection means 124, such as solder balls or pads and bumps, is formed on the bottom surface.

In this case, the image sensor module 120 corresponds to the boss 113 formed in the housing 110 on the upper surface of the glass 123 seated on the wafer 122 with the image sensor 121 interposed therebetween. A plurality of holes 125 is provided in the.

The housing 110 on which the image sensor module 120 is mounted is directly seated on the main substrate (not shown), and then passes through a reflow that maintains a predetermined temperature. The lower surface of the image sensor module 120 is directly soldered to the upper surface of the main substrate to fix the junction.

Therefore, the camera module 100 of the present embodiment can be mounted on the surface of the camera module (SMT) without any connection means such as a socket or a flexible printed circuit board (FPCB) for electrically connecting the main board and the camera module 100. Do.

On the other hand, the lens barrel 130 is coupled to the upper end of the housing 110, the housing coupling portion 131 having a female threaded portion (131a) is formed on the inner peripheral surface extending downward, the lens 140 is inserted into the central portion The insertion hole 133 is provided.

The lens barrel 130 is formed in a cylindrical shape to be able to be combined with the barrel coupling portion 111, the lens insertion hole 133 formed therein may vary depending on the shape of the lens 140, in the present embodiment is cut into a square As the wafer lens 140 is mounted, the wafer lens 140 is formed of a square groove or a hole.

In addition, a rib 134 extending inwardly is formed below the lens insertion hole 133, and a circular groove 135 is provided on the bottom surface of the lens barrel 130 outside the rib 134.

At this time, the diameter of the lens barrel 130 is preferably to have a diameter equal to the width of the flange 112 of the housing 110 coupled to the upper portion of the image sensor module 120, the lens barrel 130 The diameter of the outer circumferential surface may be determined to be equal to the width of the image sensor module 120 or the width of the flange 112 of the housing 110. The wafer lens 140 may have the same focal length while reducing its width as compared with the conventional conventional injection lens. Is employed in the lens barrel 130.

In addition, a cap for fixing a lens having a circular ring shape is formed on the upper portion of the lens barrel 130 such that external light is incident only through the central portion of the lens 140 at the same time as the lens 140 embedded in the lens insertion hole 133 is fixed. 150 is combined.

The lens fixing cap 150 allows a portion of the lens support 151 of the inner ring to be firmly fixed to the lens 140 by pressing the upper surface of the lens 140, and the lens fixing cap 150. ) Is fixed by the adhesive injected into the adhesive injection groove 136 provided on the upper surface of the lens barrel 130.

In addition, the lens fixing cap 150 has a multi-stepped stepped portion to guide the incident angle of light incident from the outside to the center portion of the lens 140, and through the portion except the center portion of the lens 140 It is composed of a black series to prevent it from penetrating.

Here, the wafer lens 140 mounted in the lens barrel 130 is manufactured by a replica method in a wafer level state using a heat resistant material that can withstand high temperatures (300 ° C.), and is mainly cut in a rectangular shape.

In addition, the wafer lens 140 is included in the incident light received by the image sensor 121 in the housing 110 and the lens barrel 130 by depositing or coating the IR filter layer 160 on one of an upper surface and a lower surface. There is no separate IR filter to block the infrared rays.

Meanwhile, the housing 110 and the lens barrel 130 are coupled to each other in a state where the wafer lens 140 and the image sensor module 120 are mounted, respectively, and a barrel coupling part extending to an upper portion of the housing 110. 111 and the housing coupling portion 131 extending to the lower portion of the lens barrel 130 is in close contact with each other.

The housing 110 and the lens barrel 130 are fixed by screwing the male threaded portion 111a and the female threaded portion 131a formed in the barrel engaging portion 111 and the housing engaging portion 131, and the housing 110. The lens barrel 130 is rotated at an upper portion thereof, and thus the lens barrel 130 is driven up and down, thereby adjusting focus as the distance between the lens 140 and the image sensor 121 is adjusted.

At this time, as the screw coupling of the housing 110 and the lens barrel 130 is made on the outer circumferential surface of the housing 110, foreign matters that may be generated at the screw coupling portion may be prevented from flowing into the camera module 100. do.

On the other hand, when the housing 110 and the lens barrel 130 is coupled, the upper end of the barrel coupling portion 111 is inserted into the circular groove 135 during the up, down movement of the lens barrel 130.

That is, the circular groove 135 is the barrel coupling portion 111 as the length of the housing coupling portion 131 extending to the lower portion of the lens barrel 130 is limited to a predetermined length by a predetermined height of the camera module 100. The upper end of the lens barrel 130 is prevented from contacting to improve the assembly.

This is because, when the housing 110 and the lens barrel 130 are coupled to each other by the screwing of the male threaded portion 111a and the female threaded portion 131a, the pitch of the threads constituting each of the threaded portions 111a and 131a. Since the smaller the amount of the up and down moving by rotating the lens barrel 130 is smaller, the rotation amount of the lens barrel 130 for focusing the lens 140 is increased.

Therefore, the smaller the pitch of the screw coupling portion of the housing 110 and the lens barrel 130, the longer the process time required for focusing, and thus the lower the productivity. For this reason, the thread pitch of the screw engagement portion is 0.3 탆, so that at least three pitches are secured, which is most efficient for smooth focusing.

As described above, in order to secure a thread having a pitch of 0.3 μm at least three pitches, the housing 110 has to have a barrel coupling portion 111 of a sufficient length as shown in FIG. 6. A circular groove 135 into which the upper end of the portion 111 can be inserted is formed on the lower surface of the lens barrel 130, thereby canceling the transfer range limitation of the lens barrel 111.

Second embodiment

7 is a sectional view of a second embodiment according to the present invention.

Like the camera module 100 of the first embodiment, the camera module 200 of the present embodiment includes a housing 110 in which the CSP type image sensor module 120 is mounted at a lower portion thereof, and a wafer lens 140 inserted in the center thereof. It is composed of a lens barrel 130.

In the camera module 200 according to the present embodiment, detailed descriptions that may overlap with the same technical configuration as those of the first embodiment will be omitted. In addition, the same referential mark was attached | subjected about the same technical structure.

The housing 110 is composed of a cylindrical barrel coupling portion 111 provided with a male screw portion 111a on an outer circumferential surface thereof, and a flange 112 is formed at a lower end thereof. At this time, the barrel coupling portion 111 has a thread of the threaded portion 111a formed on the outer circumferential surface thereof and has a pitch of 0.3 μm and has a length of at least three pitches, and is correspondingly coupled to the barrel coupling portion 111. The female threaded portion 131a formed in the housing coupling portion 131 also has the same number of threads and pitch.

The lens barrel 130 coupled to the top of the housing 110 has a lens support 138 extending inwardly on the lens insertion hole 133 into which the rectangular wafer lens 140 is inserted, and the lens insertion hole 133. Adhesive injection hole 139 is provided at the lower periphery of the bottom.

The wafer lens 140 inserted into the lens barrel 130 is tightly coupled to the lens insertion hole 133 by curing of the adhesive injected into the adhesive injection hole 139, and the upper end of the lens 140 receives external light. The edge portion except for the incident central portion is supported by the lens support 138.

As the camera module 300 of the present embodiment has the same length of the barrel coupling portion 111 as the camera module 200 of the first embodiment, the barrel coupling portion 111 cancels contact with the lens barrel 130. In order to make the lower surface of the wafer lens 140 and the lower surface of the barrel coupling portion 111 to form the same plane.

That is, the configuration of the rib 134 formed in the camera module 100 of the first embodiment is removed, and thus the support of the wafer lens 140 is made such that the adhesive injected into the adhesive injection hole 139 is cured.

Therefore, the camera module 300 of the present embodiment has the same height as the camera module 100 of the first embodiment while reducing the rotation speed of the lens barrel 130 by the increased thread distance, thereby shortening the focusing time. By simplifying the structure of the lower surface of the lens barrel 130, it is possible to reduce the manufacturing cost by simplifying the mold.

Meanwhile, the manufacturing method of the camera module of the present invention having the above technical configuration will be briefly described with reference to FIG. 9 shown below.

Manufacturing method of camera module

8 is a cross-sectional view of the assembly of the camera module according to the present invention, Figure 8a is a cross-sectional view of the image sensor module, Figure 8b is an assembly cross-sectional view of the lens barrel, Figure 8c is an assembly cross-sectional view of the housing and the lens barrel, Figure 8d FIG. 8E is a cross-sectional view of the camera module to which the housing and the image sensor module are assembled. FIG.

At this time, the step-by-step assembly sequence of the present invention will be described with reference to the camera module 100 of the first embodiment.

As shown, the image sensor module 120 is prepared in a wafer level state and has a plurality of holes 125 on the upper surface of the glass 123.

In this case, the hole 125 formed in the image sensor module 120 should be formed outside the light receiving area of the image sensor 121 interposed below the glass 123, and is coupled to the upper portion of the image sensor module 120. In consideration of the position of the boss 113 to be formed below the flange 112 of the housing 110, it is preferably formed at the top edge of the glass 123.

Next, the unit wafer lens 140 diced into a rectangle is inserted into and fixed into a square groove-shaped lens insertion hole 133 formed in a cylindrical lens barrel 130, and a circular ring shape is formed at an upper end of the lens barrel 130. Lens fixing cap 150 is coupled.

At this time, the lower end portion of the wafer lens 140 is seated on the upper surface of the rib 134 extending into the lens insertion hole 133.

In addition, before the lens fixing cap 150 is covered in the upper end of the lens barrel 130, the adhesive is injected through the adhesive injection hole 136 formed on the lens barrel 130, and then the cap fixing cap is formed by curing the adhesive. The fixing of the 150 is made, thereby allowing the lens support 151 of the lens fixing cap 150 to support the upper surface of the lens 140.

In addition, a housing 110 formed of a cylindrical barrel coupling portion 111 and a flange 112 is coupled to a lower portion of the lens barrel 130.

The lens barrel 130 and the housing 110 are screwed to the male and male threads 111a and 132 formed on the inner and outer circumferential surfaces of the barrel coupling portion 111 and the housing coupling portion 131 extending to the opposite surfaces. Are mutually coupled by

On the other hand, the image sensor module 120 is bonded to the lower portion of the housing 130, the bottom of the flange 112 of the housing 110 into a plurality of holes (125) formed on the upper surface of the image sensor module 120 By inserting the boss 113 protruding therein, the image sensor module 120 and the housing 110 and the lens barrel 130 are coupled without the optical axis being distorted.

Next, by rotating the lens barrel 130 in one direction on the upper portion of the housing 110, the focus adjustment is performed by adjusting the distance between the lens 140 and the image sensor 121 mounted therein.

Then, fixing is performed using an epoxy or UV adhesive at the point where the focus adjustment is completed, and the camera module 100 in which the focus adjustment is completed is mounted on a main substrate (not shown) to be mounted.

Next, by selectively forming a side fill (side fill, 170) using a black-based adhesive that can block external light on the side of the image sensor module 120, the housing 110 and the image sensor module ( At the same time to ensure a firm fixation of the external light is prevented from penetrating into the image sensor module 120.

Thereafter, the passive elements including the camera module 100 are mounted on the main substrate, and the bonding is performed by passing through a reflow in which the inside is heated to a predetermined temperature (170 to 180 ° C.).

In this case, the camera module 100 is electrically connected to the main substrate by the electrical connection means 124 such as solder balls, pads and bumps exposed to the lower surface of the housing 110 directly, the joint portion by internal heat during reflow Is soldered to enable surface mounting (SMT) of the camera module 100.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As described above, the camera module of the present invention is to be screwed on the outer peripheral surface of the housing when the lens barrel is coupled, the advantage of preventing the inflow of foreign substances generated during the housing and lens barrel assembly and focus adjustment process at the source There is this.

In addition, the camera module of the present invention is a CSP type image sensor module is mounted on the lower portion of the housing and the surface of the lower surface of the housing directly by surface mount (SMT) to the reflow by electrical connection means such as solder balls, etc. As it can be easily bonded through the process, a separate connecting means for electrical connection to the main board is unnecessary, thereby reducing manufacturing costs and reducing process losses.

In addition, the camera module of the present invention is manufactured by a replica method using a high heat-resistant material that can withstand 300 ° C heat when the wafer lens mounted inside the camera module during surface mounting through a reflow process, thereby achieving 170 to 180 ° C It is possible to mount the camera module surface without damaging the lens during the reflow through which maintains the internal temperature.

Claims (23)

A CSP type image sensor module in which a plurality of holes are disposed at equal intervals on the upper surface; A housing having a flange at a lower end of the barrel engaging portion formed in a cylindrical shape, the housing having a plurality of bosses protruding from the bottom thereof; A lens barrel having a housing coupling part which is closely coupled to the barrel coupling part of the housing and is downwardly formed, a circular groove is formed at an inner bottom thereof, and a lens insertion hole having a rib extending inwardly at a central portion thereof; A wafer lens mounted in the lens insertion hole of the lens barrel; And Lens fixing cap that is covered in the upper end of the lens barrel Camera module comprising a. The method of claim 1, The housing is a camera module, characterized in that the male screw portion is formed on the outer peripheral surface of the barrel engaging portion. The method of claim 1, The lens barrel is a camera module, characterized in that the female screw portion is provided on the inner peripheral surface of the housing coupling portion extending downward. The method of claim 1, The boss formed on the lower surface of the flange of the housing is formed to protrude at a position corresponding to the hole provided on the upper surface of the image sensor module, the image sensor module is tightly coupled to the lower portion of the housing by the boss is inserted into the hole. Camera module. The method of claim 4, wherein X-Y axis width of the flange is a camera module, characterized in that formed in the same or larger than the X-Y axis width of the upper surface of the image sensor module. The method of claim 1, In the image sensor module, a stacking process and an assembly process such as die bonding, wire bonding, and molding are performed in a wafer state in which a plurality of chips are mounted, and dies are individually after the process is completed. Camera module, characterized in that consisting of image sensor module of the Chip Size Pakage (CSP) type. The method of claim 6, The image sensor module includes a wafer having an image sensor on an upper surface thereof, and a glass having a plurality of holes on an upper surface thereof, which is seated to have an air cavity on the wafer, and a solder ball or pad and bumps on a lower surface of the wafer. Camera module, characterized in that the electrical connection means formed. The method of claim 1, The wafer lens is manufactured by injection molding in a wafer level state using a heat resistant material through a replica method, and cut into a rectangular unit wafer lens. The method of claim 8, The wafer lens is a camera module, characterized in that the IR filter layer is deposited or coated on any one of the upper surface and the lower surface. The method of claim 1, The lens barrel is a camera module, characterized in that a rib extending inwardly is formed in the lower portion of the lens insertion hole, the lower surface of the wafer lens embedded in the lens insertion hole is seated. The method of claim 10, The lens fixing cap is a camera module, characterized in that fixed by the adhesive injected into the adhesive injection groove provided on the upper surface of the lens barrel. The method of claim 10, The lens fixing cap has a multi-stepped stepped portion inclined at a central portion thereof, and comprises a black series to prevent light from penetrating. The method according to claim 2 or 3, The thread pitch of each of the male thread portion and the female thread portion has a minimum pitch of 3, and each pitch is 0.3 탆. The method of claim 1, The camera module is a camera module, characterized in that the surface is directly mounted on the main substrate to be mounted and soldered through a reflow process. A CSP type image sensor module in which a plurality of holes are disposed at equal intervals on the upper surface; A housing having a cylindrical shape and having a flange at a lower end of the barrel engaging portion having a male screw portion formed on an outer circumferential surface thereof, the housing having a plurality of bosses protruding from the lower surface thereof; A lens barrel having a housing coupling part provided with a female screw part to be tightly coupled to the barrel coupling part of the housing, and having a lens support part integrally formed therein at an upper part thereof, and having a lens insert hole formed with an adhesive injection hole in a central portion thereof; And A wafer lens mounted in the lens insertion hole of the lens barrel; Camera module comprising a. The method of claim 15, The boss formed on the lower surface of the flange of the housing is formed to protrude at a position corresponding to the hole provided on the upper surface of the image sensor module, the image sensor module is tightly coupled to the lower portion of the housing by the boss is inserted into the hole. Camera module. The method of claim 15, X-Y axis width of the flange is a camera module, characterized in that formed in the same or larger than the X-Y axis width of the upper surface of the image sensor module. The method of claim 15, The image sensor module includes a wafer having an image sensor on an upper surface thereof, and a glass having a plurality of holes on an upper surface thereof, which is seated to have an air cavity on the wafer, and a solder ball or pad and bumps on a lower surface of the wafer. Camera module, characterized in that the electrical connection means formed. The method of claim 15, The wafer lens is manufactured by injection molding in a wafer level state using a heat resistant material through a replica method, and cut into a rectangular unit wafer lens. The method of claim 15, The wafer lens is a camera module, characterized in that the IR filter layer is deposited or coated on any one of the upper surface and the lower surface. The method of claim 15, The thread pitch of each of the male thread portion and the female thread portion has a minimum pitch of 3, and each pitch is 0.3 탆. The method of claim 15, The camera module is a camera module, characterized in that the surface is directly mounted on the main substrate to be mounted and soldered through a reflow process. Manufacturing an image sensor module having a plurality of holes on an upper surface thereof in a wafer level state; Inserting and fixing a wafer lens in a lens insertion hole formed in a central portion of the lens barrel; Attaching a lens fixing cap having a circular ring shape to an upper end of the lens barrel; Inserting an image sensor module of a CSP type in an interior of a housing to which the lens barrel is coupled; The lens barrel and the housing are coupled to each other by screwing the female and male threads formed on the inner and outer circumferential surfaces of the barrel coupling portion and the housing coupling portion; Closely coupling the image sensor module to the lower portion of the housing without distortion of the optical axis by correspondence of a boss and a hole; Rotating the lens barrel in one direction at an upper portion of the housing to perform focus adjustment by adjusting an interval between a lens mounted therein and an image sensor; Fixing using an epoxy or UV adhesive at the point where the focus adjustment is completed, and mounting the camera module on which the focus adjustment is completed on the main substrate to be mounted; And Mounting passive elements including the camera module on the main substrate, and then performing reflow to perform soldering bonding; Method of manufacturing a camera module comprising a.

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