CN208335119U - A kind of novel CPU heat dissipation device - Google Patents
A kind of novel CPU heat dissipation device Download PDFInfo
- Publication number
- CN208335119U CN208335119U CN201820825275.2U CN201820825275U CN208335119U CN 208335119 U CN208335119 U CN 208335119U CN 201820825275 U CN201820825275 U CN 201820825275U CN 208335119 U CN208335119 U CN 208335119U
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- cylinder
- shaft
- heat
- bottom plate
- heat dissipation
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Abstract
The utility model discloses a kind of novel CPU heat dissipation devices, including cylinder, thermovent above cylinder on face computer cabinet, the cylinder upper end is equipped with mounting rack, bottom plate is equipped with below the cylinder, shaft is equipped between the bottom plate and mounting rack, the shaft lower part is vertically equipped with several groups plane blade, every group of plane blade includes several plane blades being circumferentially uniformly arranged around shaft, several radiating fins are equipped on the outside of the plane blade, the radiating fin is fixedly connected with heat-conducting plate, the shaft top is equipped with axial-flow leaf, heat on CPU is conducted to radiating fin through heat-conducting plate, plane blade inside the radiating fin blow-through radiating fin under shaft rotation, quickly the heat on radiating fin is blown away, the heat being blown away is under the action of axial-flow leaf then flows up, it is constituted through cylinder Computer cabinet is discharged in heat dissipation channel, without impacting to other component temperature.
Description
Technical field
The utility model relates to a kind of radiators, more particularly, to a kind of novel CPU heat dissipation device.
Background technique
The cpu chip of computer can give off heat in use, it is ensured that CPU work normally, just must in time by
Its heat generated distributes.Cooling fin, cooling fin is generally arranged in the structure of traditional CPU radiator above CPU
Fan is arranged in top, is taken away the heat on cooling fin by fan, and the heat dissipation effect of this structure is lower, opposite not as good as fan
The radiating efficiency of cooling fin blow-through is high, if but by fan against cooling fin blow-through, hot-air under existing radiator structure
It is blown to computer cabinet various places inside, influences the temperature of other component such as mainboard, memory, video card etc. inside computer cabinet,
Influence the normal use of computer.
Utility model content
The goal of the invention of the utility model is: " CPU radiator heat dissipation effect is lower, no in the prior art
Radiating efficiency such as fan against cooling fin blow-through is high, if but under existing radiator structure that fan is straight against cooling fin
Blow, then hot-air is blown to computer cabinet various places inside, influences the temperature of other component inside computer cabinet " the problem of,
A kind of novel CPU heat dissipation device is provided.
In order to solve the above technical problems, the technical scheme adopted by the utility model is that, a kind of novel CPU heat dissipation device, packet
Cylinder, the thermovent above cylinder on face computer cabinet are included, the cylinder upper end is equipped with mounting rack, sets below the cylinder
There is bottom plate, the bottom plate is the cross-sectional diameter that round and diameter is less than cylinder, the bottom plate and cylinder coaxial arrangement, the bottom
Shaft is equipped between plate and mounting rack, the upper end of the shaft has been sequentially connected driving motor, and the driving motor is fixedly connected
Mounting rack, the bottom plate and cylinder are connected by the clamping ring of cambered surface, and heat-conducting plate, the heat-conducting plate are equipped at the bottom plate center
Through bottom plate, the lower end rotation of the shaft is connected to the center of heat-conducting plate, and the shaft lower part is vertically equipped with several groups plane
Blade, every group of plane blade include several plane blades being circumferentially uniformly arranged around shaft, are equipped on the outside of the plane blade
Several radiating fins, several radiating fins are circumferentially uniformly distributed around shaft, and the radiating fin is fixedly connected with heat-conducting plate, described
Shaft top is equipped with axial-flow leaf.
Preferably, the cylinder is made of heat-barrier material, is further reduced in the intracorporal heat diffusion to cabinet of cylinder.
Preferably, the cylinder inboard wall is equipped with multilayer aluminum mylar, using the function of heat reflection of multilayer aluminum polyester film,
The intracorporal heat diffusion of cylinder is further reduced to cabinet inside.
Preferably, the shaft lower end connect heat-conducting plate with bearing block by bearing, composition shaft lower end and heat-conducting plate
Rotation connection.
Preferably, the mounting rack includes two crossbeams of orthogonal connection, is equipped with Air Filter between two crossbeams, is prevented outer
Portion's dust enters in cylinder, keeps the cleaning of inner barrel element, dust is avoided to be adhered on the elements such as radiating fin and influence
Radiating efficiency.
The utility model has the advantage of it can overcome the disadvantages of the prior art, novelty reasonable in design.The application's
In technical solution, the heat on CPU is conducted to radiating fin through heat-conducting plate, and the plane blade inside radiating fin is in shaft
Lower blow-through radiating fin is rotated, is quickly blown away the heat on radiating fin, effect of the heat being blown away in axial-flow leaf
Lower to transfer to flow up, computer cabinet is discharged in the heat dissipation channel constituted through cylinder, without impacting to other component temperature.
Detailed description of the invention
The utility model will illustrate by example and with reference to the appended drawing, in which:
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the schematic top plan view of the utility model；
Fig. 3 is the structural schematic diagram of radiating fin described in the utility model.
Specific embodiment
The utility model is described in further detail presently in connection with attached drawing.These attached drawings are simplified schematic diagram,
Only illustrate the basic structure of the utility model in a schematic way, therefore it only shows composition related with the utility model.
As shown in Figure 1-3, the utility model is a kind of novel CPU heat dissipation device, including cylinder 1,1 top face meter of cylinder
Thermovent on calculation machine cabinet, 1 upper end of cylinder are equipped with mounting rack 2, are equipped with bottom plate 3, the bottom plate 3 below the cylinder 1
It is less than the cross-sectional diameter of cylinder 1 for round and diameter, the bottom plate 3 and cylinder 1 are coaxially disposed, the bottom plate 3 and mounting rack 2
Between be equipped with shaft 4, the upper end of the shaft 4 has been sequentially connected driving motor 5, and the driving motor 5 is fixedly connected with mounting rack
2, the bottom plate 3 and cylinder 1 are connected by the clamping ring 6 of cambered surface, and heat-conducting plate 7, the heat-conducting plate are equipped at 3 center of bottom plate
7 run through bottom plate 3, and the lower end rotation of the shaft 4 is connected to the center of heat-conducting plate 7, and 4 lower part of shaft is vertically equipped with several groups
Plane blade 8, every group of plane blade 8 include several plane blades 8 being circumferentially uniformly arranged around shaft 4, the plane blade 8
Outside is equipped with several radiating fins 9, and several radiating fins 9 are circumferentially uniformly distributed around shaft 4, and the radiating fin 9 is fixed to be connected
Heat-conducting plate 7 is connect, 4 top of shaft is equipped with axial-flow leaf 10.
The cylinder 1 is made of heat-barrier material.
1 inner wall of cylinder is equipped with multilayer aluminum mylar.
4 lower end of shaft connects heat-conducting plate 7 by bearing and bearing block 13.
The mounting rack 2 includes two crossbeams of orthogonal connection, is equipped with Air Filter 12 between two crossbeams 11.
The utility model has the advantage of it can overcome the disadvantages of the prior art, novelty reasonable in design.The application's
In technical solution, the heat on CPU is conducted to radiating fin through heat-conducting plate, and the plane blade inside radiating fin is in shaft
Lower blow-through radiating fin is rotated, is quickly blown away the heat on radiating fin, effect of the heat being blown away in axial-flow leaf
Lower to transfer to flow up, computer cabinet is discharged in the heat dissipation channel constituted through cylinder, without impacting to other component temperature.
Above-mentioned foundation the utility model is enlightenment, and through the above description, relevant staff completely can be not
In the range of deviateing this item utility model technical idea, various changes and amendments are carried out.This item utility model it is technical
Range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (5)
1. a kind of novel CPU heat dissipation device, it is characterised in that: including cylinder, the cylinder upper end is equipped with mounting rack, the cylinder
Lower section is equipped with bottom plate, and the bottom plate is the cross-sectional diameter that round and diameter is less than cylinder, and the bottom plate and cylinder are coaxially disposed,
Shaft is equipped between the bottom plate and mounting rack, the upper end of the shaft has been sequentially connected driving motor, and the driving motor is solid
Surely mounting rack is connected, the bottom plate is connected with cylinder by the clamping ring of cambered surface, and heat-conducting plate is equipped at the bottom plate center, described
Heat-conducting plate runs through bottom plate, and the lower end rotation of the shaft is connected to the center of heat-conducting plate, and the shaft lower part is vertically equipped with several
Group plane blade, every group of plane blade include several plane blades being circumferentially uniformly arranged around shaft, outside the plane blade
Side is equipped with several radiating fins, and several radiating fins are circumferentially uniformly distributed around shaft, and the radiating fin is fixedly connected thermally conductive
Plate, the shaft top are equipped with axial-flow leaf.
2. novel CPU heat dissipation device according to claim 1, it is characterised in that: the cylinder is made of heat-barrier material.
3. novel CPU heat dissipation device according to claim 1, it is characterised in that: the cylinder inboard wall is poly- equipped with multilayer aluminum
Membrane of lipoprotein.
4. novel CPU heat dissipation device according to claim 1, it is characterised in that: the shaft lower end passes through bearing and axis
Hold seat connection heat-conducting plate.
5. novel CPU heat dissipation device according to claim 1, it is characterised in that: the mounting rack includes orthogonal connection
Two crossbeams are equipped with Air Filter between two crossbeams.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820825275.2U CN208335119U (en) | 2018-05-31 | 2018-05-31 | A kind of novel CPU heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820825275.2U CN208335119U (en) | 2018-05-31 | 2018-05-31 | A kind of novel CPU heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208335119U true CN208335119U (en) | 2019-01-04 |
Family
ID=64772287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820825275.2U Active CN208335119U (en) | 2018-05-31 | 2018-05-31 | A kind of novel CPU heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208335119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972452A (en) * | 2019-12-10 | 2020-04-07 | 深圳市晟睿通信有限公司 | All-pass communication filter structure |
-
2018
- 2018-05-31 CN CN201820825275.2U patent/CN208335119U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972452A (en) * | 2019-12-10 | 2020-04-07 | 深圳市晟睿通信有限公司 | All-pass communication filter structure |
| CN110972452B (en) * | 2019-12-10 | 2022-12-13 | 深圳市晟睿通信有限公司 | All-pass communication filter structure |
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