CN208300121U

CN208300121U - PCB with anti-Mark point deformation function

Info

Publication number: CN208300121U
Application number: CN201821009629.2U
Authority: CN
Inventors: 李凤明; 姚尧
Original assignee: Wanyuan Kunshan Leads To Electronic Science And Technology Co Ltd
Current assignee: Kunshan wanyuantong Electronic Technology Co.,Ltd.
Priority date: 2018-06-28
Filing date: 2018-06-28
Publication date: 2018-12-28
Anticipated expiration: 2028-06-28
Also published as: AU2018101057A4

Abstract

The utility model discloses a kind of PCB with anti-Mark point deformation function, belong to printed circuit board technology field, including the Mark point being set on PCB, the Mark point includes the spacious area of the circular mark point that diameter is 1.5mm and the circular ring shape concentric with the mark point, the surface of the mark point is covered with label copper foil, the interior diameter in the spaciousness area is 1.5mm and overall diameter is 4.8mm, the spaciousness area periphery is equipped with the Mark point protection area of the circular ring shape concentric with the spacious area, the interior diameter in Mark point protection area is 4.8mm and overall diameter is 10mm, the surface in Mark point protection area is covered with protective layer of the thickness not less than the thickness of the label copper foil.The PCB of the utility model deforms under the action of polish-brush wheel when preventing plate from cleaning polish-brush by the way that protection zone is arranged around independent Mark point, the intact of Mark point is protected, to guarantee accurate positionin when patch operation.

Description

PCB with anti-Mark point deformation function

Technical field

The utility model belongs to printed circuit board technology field, more particularly to a kind of with anti-Mark point deformation function PCB。

Background technique

Printed circuit board, also known as printed circuit board, printed wiring board, are important electronic component, are electronic components Supporter is the supplier of electronic component electrical connection, and PCB is widely used in the prior art, and circuit board keeps circuit mini Change, intuitiveization, the batch production and optimization electrical appliance layout for fixed circuit play an important role；

And as the degree of automation improves, the accurate demand of electronic communication product, fixation and recognition of the operation process to product More important, Mark point is that PCB is applied to the position identification point on automatic placement machine in board design, for undertaking electronics zero For the PCB of part support plate, should more have an accurately positioning function, and the setting of Mark used for positioning point, due to considering operation The disturbed erroneous judgement of Shi Buhui, can be located at that edge spaciousness area is more independent, but when produce PCB can by multiple surface cleaning with It is roughened the process of polish-brush, keeps independent Mark point relatively fragile and be deformed, generate nothing in subsequent automatic attachment operation The phenomenon that method identifies, causes automatic placement machine often to shut down, to influence production efficiency.

Utility model content

The utility model leads to mainly solving the technical problems that provide a kind of PCB with anti-Mark point deformation function It crosses and protection zone is set around independent Mark point, deform under the action of polish-brush wheel when preventing plate from cleaning polish-brush, The intact of Mark point is protected, to guarantee accurate positionin when patch operation.

In order to solve the above technical problems, a technical solution of the use of the utility model is as follows:

A kind of PCB with anti-Mark point deformation function, including the Mark point being set on PCB, the Mark point includes Diameter is the circular mark point of 1.5mm and the spacious area of the circular ring shape concentric with the mark point, the surface of the mark point Be covered with label copper foil, the interior diameter in the spaciousness area is 1.5mm and overall diameter is 4.8mm, the periphery in the spaciousness area be equipped with The Mark point protection area of the concentric circular ring shape in the spaciousness area, the interior diameter in Mark point protection area is 4.8mm and overall diameter For 10mm, the surface in Mark point protection area is covered with the protective layer that thickness is more than or equal to the thickness of the label copper foil.

It further says, the periphery of the protective layer is additionally provided with the copper foil area of coverage, and the copper foil area of coverage is along the PCB's The edge of surrounding is arranged and the width of the copper foil area of coverage is 12mm.

It further says, the copper foil area of coverage is equipped with several thermal troughs for being used to prevent PCB warpage, the thermal trough Width is 1mm.

It further says, the protective layer is copper foil coating, and the thickness of the copper foil coating is equal to the label copper The thickness of foil.

It further says, the protective layer is clad stainless steel cap rock, and the thickness of the clad stainless steel cap rock is greater than the mark Remember the thickness of copper foil.

It further says, the PCB has mounting hole, and the reinforcement for reinforcing mounting hole is equipped with around the mounting hole Copper foil.

It further says, the backsize of the PCB has graphene heat-conducting layer.

It further says, the surface of the graphene heat-conducting layer is equipped with copper foil heat dissipating layer.

It further says, the copper foil heat dissipation layer surface is equipped with multiple heat dissipation copper billets with a thickness of 2.5mm, the radiating copper Heat-conducting silicone grease is equipped between block and the copper foil heat dissipating layer.

It further says, the surface of the label copper foil has nickel coating, and flatness≤12 μm of the nickel coating.

The utility model has the beneficial effects that

One, the PCB of the utility model is provided with the protection zone for protecting Mark point, this protection zone around Mark point It, will not due to being equipped with protective layer of the thickness not less than the copper thickness of Mark point, therefore when PCB is by cleaning polish-brush process Worn caused by causing because of the independent stress of Mark point and deformation, so as to guarantee PCB when next patch process, The shutdown that not will cause machine read error and generate, improves the efficiency of production；

Two, the PCB of the utility model is equipped with the copper foil area of coverage in the edge region of plate body, this area of coverage is because have Biggish area, so in cleaning polish-brush process Mark point protection area can not only be assisted to protect Mark point, moreover it is possible to certain journey The land of the protection PCB of degree, in addition the copper foil area of coverage of large area also can increase the heat dissipation performance of PCB；

Three, the copper foil area of coverage of the PCB of the utility model is equipped with thermal trough, and the copper foil institute in big region is dispersed by thermal trough The heat having, can effectively prevent PCB occur warpage, can also prevent copper foil as overheat and caused by removing；

Four, the back side of the PCB of the utility model is equipped with the heat radiation combination of graphene layer and copper foil layer, to effectively guarantee The radiating efficiency of entire PCB, is in addition additionally provided with multiple heat dissipation copper billets in copper foil surface place corresponding with high heating element, leads to It is poor come heat dissipation performance caused by solving the problems, such as pcb board body due to material to cross this combination.

The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model Art means, and can be implemented in accordance with the contents of the specification, below on the preferred embodiment of the present invention and the accompanying drawings in detail It describes in detail bright as after.

Detailed description of the invention

Fig. 1 is the PCB construction schematic diagram of the utility model；

Fig. 2 is the portion the A enlarged drawing of Fig. 1；

Fig. 3 is the portion the B-B cross-sectional view of Fig. 2；

Fig. 4 is the cross-sectional view of the PCB of the utility model；

Each section label is as follows in attached drawing:

PCB1, graphene heat-conducting layer 11, copper foil heat dissipating layer 12, heat dissipation copper billet 13, Mark point 2, mark point 21, label copper foil 211, spacious area 22, Mark point protection area 23, protective layer 231, the copper foil area of coverage 24, thermal trough 241, mounting hole 3 and reinforcement copper Foil 31.

Specific embodiment

The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear Define.

Embodiment: a kind of PCB with anti-Mark point deformation function, as shown in fig. 1 to fig. 4: including being set on PCB 1 Mark point 2, the Mark point include diameter be 1.5mm circular mark point 21 and the circular ring shape concentric with the mark point Spacious area 22, the surface of the mark point be covered with label copper foil 211, it is described spaciousness area interior diameter be 1.5mm and overall diameter For 4.8mm, the periphery in the spaciousness area is equipped with the Mark point protection area 23 of the circular ring shape concentric with the spacious area, the Mark The interior diameter in point protection area is 4.8mm and overall diameter is 10mm, and the surface in Mark point protection area is covered with thickness and is more than or equal to The protective layer 231 of the thickness of the label copper foil.

The periphery of the protective layer is additionally provided with the copper foil area of coverage 24, the side of surrounding of the copper foil area of coverage along the PCB The width of edge setting and the copper foil area of coverage is 12mm.

The copper foil area of coverage is equipped with several thermal troughs 241 for being used to prevent PCB warpage, and the width of the thermal trough is 1mm。

The protective layer is copper foil coating, and the thickness of the copper foil coating is equal to the thickness of the label copper foil.

The protective layer is clad stainless steel cap rock, and the thickness of the clad stainless steel cap rock is greater than the thickness of the label copper foil Degree.

The PCB has mounting hole 3, and the reinforcement copper foil 31 for reinforcing mounting hole is equipped with around the mounting hole.

The backsize of the PCB has graphene heat-conducting layer 11.

The surface of the graphene heat-conducting layer is equipped with copper foil heat dissipating layer 12.

Copper foil heat dissipation layer surface is equipped with multiple heat dissipation copper billets 13 with a thickness of 2.5mm, the heat dissipation copper billet and described Heat-conducting silicone grease is equipped between copper foil heat dissipating layer.

The surface of the label copper foil has nickel coating, and flatness≤12 μm of the nickel coating.

The course of work and working principle of the utility model are as follows:

The PCB of the utility model is provided with the protection zone for protecting Mark point around Mark point, this protection zone by In the protective layer equipped with thickness not less than the copper thickness of Mark point, therefore when PCB is by cleaning polish-brush process, Bu Huizao Caused by the independent stress of the origin cause of formation Mark point abrasion and deform, so as to guarantee PCB when next patch process, no The shutdown that will cause machine read error and generate, improves the efficiency of production；

The PCB of the utility model the edge region of plate body be equipped with the copper foil area of coverage, this area of coverage because have compared with Big area, so in cleaning polish-brush process Mark point protection area can not only be assisted to protect Mark point, moreover it is possible to a certain degree Protection PCB land, in addition the copper foil area of coverage of large area also can increase the heat dissipation performance of PCB；

The copper foil area of coverage of the PCB of the utility model is equipped with thermal trough, and dispersing big region copper foil by thermal trough is had Heat, can effective PCB warpage occurs, can also prevent copper foil as overheat and caused by removing；

The back side of the PCB of the utility model is equipped with the heat radiation combination of graphene layer and copper foil layer, to effectively guarantee whole In addition the radiating efficiency of a PCB is additionally provided with multiple radiating blocks in copper foil surface place corresponding with high heating element, passes through this Combination is poor come heat dissipation performance caused by solving the problems, such as pcb board body due to material.

The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all Equivalent structure transformation made based on the specification and figures of the utility model, it is relevant to be applied directly or indirectly in other Technical field is also included in the patent protection scope of the utility model.

Claims

1. a kind of PCB with anti-Mark point deformation function, it is characterised in that: including the Mark point (2) being set on PCB (1), The Mark point includes the spacious area of the circular mark point (21) that diameter is 1.5mm and the circular ring shape concentric with the mark point (22), the surface of the mark point is covered with label copper foil (211), and the interior diameter in the spaciousness area is 1.5mm and overall diameter is 4.8mm, the periphery in the spaciousness area are equipped with the Mark point protection area (23) of the circular ring shape concentric with the spacious area, the Mark The interior diameter in point protection area is 4.8mm and overall diameter is 10mm, and the surface in Mark point protection area is covered with thickness and is more than or equal to The protective layer (231) of the thickness of the label copper foil.

2. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: outside the protective layer It encloses and is additionally provided with the copper foil area of coverage (24), the edge setting and copper foil covering of surrounding of the copper foil area of coverage along the PCB The width in area is 12mm.

3. the PCB according to claim 2 with anti-Mark point deformation function, it is characterised in that: the copper foil area of coverage Equipped with several for preventing the thermal trough (241) of PCB warpage, the width of the thermal trough is 1mm.

4. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: the protective layer is copper Foil coating, the thickness of the copper foil coating are equal to the thickness of the label copper foil.

5. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: the protective layer is not Become rusty steel coating, and the thickness of the clad stainless steel cap rock is greater than the thickness of the label copper foil.

6. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: the PCB has installation Hole (3) is equipped with the reinforcement copper foil (31) for reinforcing mounting hole around the mounting hole.

7. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: the back side of the PCB applies It is furnished with graphene heat-conducting layer (11).

8. the PCB according to claim 7 with anti-Mark point deformation function, it is characterised in that: the graphene is thermally conductive The surface of layer is equipped with copper foil heat dissipating layer (12).

9. the PCB according to claim 8 with anti-Mark point deformation function, it is characterised in that: the copper foil heat dissipating layer Surface is equipped with multiple heat dissipation copper billets (13) with a thickness of 2.5mm, is equipped with and leads between the heat dissipation copper billet and the copper foil heat dissipating layer Hot silicone grease.

10. the PCB according to claim 1 with anti-Mark point deformation function, it is characterised in that: the label copper foil Surface has nickel coating.