CN208283721U - A kind of large area projection lithography system - Google Patents
A kind of large area projection lithography system Download PDFInfo
- Publication number
- CN208283721U CN208283721U CN201820756698.3U CN201820756698U CN208283721U CN 208283721 U CN208283721 U CN 208283721U CN 201820756698 U CN201820756698 U CN 201820756698U CN 208283721 U CN208283721 U CN 208283721U
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- China
- Prior art keywords
- sheet body
- conductive shell
- heating sheet
- thermal conductive
- miniature heating
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Abstract
A kind of large area projection lithography system, including light source, optical fiber, DMD system, beam absorption plate, dmd chip is stuck in the one side of thermal conductive shell, the another side of thermal conductive shell, which then blocks, thermal insulation board, the surface of heat dissipating housing is coated with one layer of reflectorised paint, the heat dissipating housing surface for being close to thermal insulation board is provided with multiple evenly arranged air inlets, miniature heating sheet body is fixed with by fixed block in heat dissipating housing, heat-insulated plate surface is fixed with the heat emission fan dried to miniature heating sheet body, the heat-insulated plate surface in wherein side of heat emission fan is further fixed on micro pump, the liquid feeding end of micro pump is connected to by pipeline with thermal conductive shell, the outlet end of micro pump then passes through a plurality of pipeline and is connected to the sheet body of miniature heating sheet body, the return pipe of a plurality of connection miniature heating sheet body and thermal conductive shell is additionally provided in the other side of heat emission fan.The utility model has flexibility, and exposure area is big, and precision is high, high resolution, and image quality is high, the advantages such as at low cost.
Description
Technical field
The utility model relates to projection lithography technical field, specifically a kind of large area projection lithography system.
Background technique
For the structure of litho pattern from simple to complexity, characteristic size is smaller and smaller, and it is tired that traditional masks photoetching encounters production
The difficult and big problem of cost, has seriously affected research and development of products hair and manufacturing schedule.Wherein DMD chip be most important restriction because
One of element, but current DMD chip cooling ability is poor invents a kind of high-precision, exposure for the prior art there are problem
The big lithography system of area.
Utility model content
To solve the above problems, the purpose of the utility model is to provide a kind of large area projection lithography systems, to existing skill
Art improves, and solves the problems, such as above-mentioned.
The utility model to achieve the above object, a kind of large area projection lithography system, including light source, optical fiber, DMD system
System, beam absorption plate, the light that light source projects is input to even optical lens group through optical fiber, then is irradiated to by the dispersion of even optical lens group
The DMD chip of DMD system, a portion light are reflected into projection objective group through DMD chip, and another part light is then
It is absorbed by beam absorption plate, on the PCB substrate for projecting plateform system after the light of projection objective group is using processing,
DMD chip card is coated with heat conductive silica gel in the one side of thermal conductive shell between thermal conductive shell, and the another side of thermal conductive shell is then
Card has thermal insulation board, and heat-insulated plate surface is then fixed with outwardly open pyramid shape heat dissipating housing, and the surface of heat dissipating housing is coated with one layer instead
Lac varnish, the heat dissipating housing surface for being close to thermal insulation board are provided with multiple evenly arranged air inlets, are fixed in heat dissipating housing by fixed block
Miniature heating sheet body, heat-insulated plate surface are fixed with the heat emission fan dried to miniature heating sheet body, and the wherein side of heat emission fan is heat-insulated
Plate surface is further fixed on micro pump, and the liquid feeding end of micro pump is connected to by pipeline with thermal conductive shell, and micro pump goes out liquid
End is then connected to by a plurality of pipeline with the sheet body of miniature heating sheet body, and it is miniature to be additionally provided with a plurality of connection in the other side of heat emission fan
The return pipe of heating sheet body and thermal conductive shell.
Light source is semiconductor laser, issues light beam after overcoupling optical fiber from semiconductor laser, collimated system is quasi-
After straight, light beam is irradiated by reflecting mirror onto DMD chip, after light beam is modulated by DMD chip, will be needed through projection objective
Exposure image projects on PCB substrate, and control precision stage can form required figure, the DMD core of the utility model
The cooling system of piece design is formed the radiating mode of active cycle, and is further increased outward using heat radiation principle of reflection
The ability of boundary's heat dissipation, greatly strengthens the radiating efficiency of DMD chip, meets the work need of DMD chip high efficiency large area
It wants, compared with prior art, the utility model has flexibility, and exposure area is big, and precision is high, high resolution, and image quality is high,
The advantages such as at low cost.
Detailed description of the invention
Fig. 1 is the principles of the present invention figure；
Fig. 2 is the structural schematic diagram of this practical DMD die sites；
Fig. 3 is the structural schematic diagram of this Practical miniature heating sheet body.
Specific embodiment
As shown in Fig. 1-3, a kind of large area projection lithography system, including light source 1, optical fiber 2, DMD system, light beam
Baffle 3, the light that light source 1 projects is input to even optical lens group 4 through optical fiber 2, then disperses to shine by even optical lens group 4
It is mapped to the DMD chip 5 of DMD system, a portion light is reflected into projection objective group 6 through DMD chip 5, separately
A part of light is then absorbed by beam absorption plate 3, projects platform after the light of projection objective group 6 is using processing
On the PCB substrate 8 of system 7, DMD chip 5 is stuck in the one side of thermal conductive shell 9, and with thermal conductive shell 9 it
Between be coated with heat conductive silica gel, thermal conductive shell 9 is cuboid, and inner hollow, the another side of thermal conductive shell 9 then block have it is heat-insulated
Plate 10,10 surface of thermal insulation board are then fixed with outwardly open pyramid shape heat dissipating housing 11, thermal insulation board 10 and heat dissipating housing 11
It is integrated and is molded, the surface of heat dissipating housing 11 is coated with one layer of reflectorised paint 12, is close to 11 table of heat dissipating housing of thermal insulation board 10
Face is provided with multiple evenly arranged air inlets 13, passes through fixed block 14 in heat dissipating housing 11 and is fixed with miniature heating sheet body
15, such as heating sheet body common currently on the market of miniature heating sheet body 15, mainly by hollow cuboid main leaf be connected to
The tube body of multiple main leaves forms, and difference is the size of volume, and can require to be had made to order according to size, thermal insulation board 10
The heat emission fan 16 that the fixed oriented miniature heating sheet body 15 in surface is dried, 10 table of wherein side thermal insulation board of heat emission fan 16
Face is further fixed on micro pump 17, and the liquid feeding end of micro pump 17 is connected to by pipeline with thermal conductive shell 9, micro pump
17 outlet end then passes through a plurality of pipeline and is connected to the sheet body of miniature heating sheet body 15, also sets in the other side of heat emission fan 16
It is equipped with the return pipe 18 of a plurality of connection miniature heating sheet body 15 and thermal conductive shell 9, miniature heating sheet body 15 and thermally conductive outer
Shell 9 is made of aluminium alloy, and miniature heating sheet body 15, thermal conductive shell 9, micro pump 17 and each return pipe 18,
Superconducting fluid is full of in pipeline.
Light source 1, optical fiber 2: main function provides Uniform Illumination for whole system, mainly includes light source and even optical lens group
4.The LD fiber coupling light source of 405nm is homogenized light beam using the light square tube of even optical lens group 4, and light beam is with circle
Hot spot input, square focus spot output, uniformity are greater than 90%.
DMD chip 5: major function is that the exposure data for sending computer is handled, and controls digital space light tune
The deflection of each micro mirror of device DMD processed forms required mask graph, while controlling the work of work stage, carries out graphic joining, most
End form is at exposure figure.
Digital micro-mirror (i.e. DMD chip), it is made of the micro mirror array of micron-scale, and outside is sealed by glass window
Dress.These micro mirrors are closely aligned in rows and columns, and filling rate is more than 90%, each micro mirror represents DMD pixel, and by phase
The storage unit answered controls the state of its on (1) or off (0), to achieve the purpose that control light output.DMD micro mirror unit
Structure, each unit are divided into four layers, are respectively as follows: mirror unit, addressing electrode, metal layer, static state from first layer to the 4th layer
Storage unit；Micro mirror unit is to be connected by through-hole with next layer of torsion hinge；Addressing electrode is in specific position
Keep and control the state of micro mirror unit.Micro mirror unit is all integrated on CMOS static memory, and the state of storage unit is straight
Connect the state that decide micro mirror.Micro-reflector unit is connected with torque arm beam, and torque arm beam is suspended in two hinges by hinge
On support column, DMD can be rotated around hinge axis.Hinge support axis connection is that each is micro- to biasing, reset electrode
Mirror unit provides bias voltage.For each micro-reflector unit, all there are two conductive channel, and torque arm beam is sought
The addressing electrode of location electrode and digital micro-mirror is connected on the COMS static memory of bottom.
The optical axis of the light and optical system that issue from light source has certain angle, and oblique illumination is on DMD, and DMD is just
Such as the optical switch of a semiconductor-type, there are three types of possible state, i.e. on, off and reset, these shapes for each micro mirror
State is controlled by being input to the binary signal of addressing electrode；When not having binary signal, mirror member is in reset state；
When binary signal is 1, mirror member is on state, rotates 12 ° around yawing axis, and then the light beam irradiated is reflected
Into projection objective；When binary signal is 0, mirror member is in off state, rotates -12 ° around yawing axis, irradiation
Light beam is reflected onto except the aperture of object lens, and is absorbed device absorption.
Projection objective group 6: image on DMD is imaged in substrate surface, realization pair by main function after final minification zoom
The exposure of image is the key that resolving power and image quality are guaranteed.
Plateform system 7: its major function is to carry out the high-precision alignment of print and mask, realizes automatic focusing leveling, figure
The accurate positionin of shape splicing.Since figure is that multiple spirtes is needed to be spliced, connecting method and the direct shadow of positioning accuracy
Ring final graphics quality.
Projection lithography system working principle, light source 2 are semiconductor laser, issue light beam from semiconductor laser and pass through
After coupling optical fiber 2, after collimated system collimation, light beam is irradiated by reflecting mirror onto DMD chip 5, and light beam is by dmd chip
After 5 are modulated, exposure image will be needed to project on PCB substrate 8 through projection objective group 6, control platform system 7
Required figure can be formed.DMD chip 5 is carried out as variable number mask by the light to device illuminated area different zones empty
Between modulate, formed required for pattern.
Cooling system working principle: by 9 → micro pump of thermal conductive shell 17 → miniature heating 15 → return pipe of sheet body
18 → thermal conductive shell 9 forms the superconducting fluid circulation canal of closure, and the heat that DMD chip 5 is distributed is by thermal conductive shell 9
It absorbs, then micro pump 17, which is transmitted to, is transported at miniature heating sheet body 15, by heat emission fan 16 to miniature heating
Sheet body 15 cools down, and is reflected into miniature 15 heat of heating sheet body under the effect of 11 reflectorised paint 12 of heat dissipating housing
The external world, so that the miniature heating sheet body 15 of effective temperature-reducing, cools down the superconducting fluid flowed back into thermal conductive shell 9 again, from
And it constantly recycles and realizes the cooling lasting to DMD chip 5.
The standardized element that the utility model uses can commercially, shaped piece according to specification and attached drawing
Record can carry out customized, the specific connection type of each part is all made of in the prior art mature bolt, rivet, weldering
Equal conventional means are connect, mechanical, part and equipment are all made of in the prior art, conventional model, if be related to being not described in detail
Circuit, the circuit connection are also using connection type conventional in the prior art, and this will not be detailed here.
Certainly, the above description is not intended to limit the present invention, and the utility model is also not limited to the example above, this
The those of ordinary skill of technical field, in the essential scope of the utility model, variation, change, addition or the replacement made, all
It should belong to the protection scope of the utility model.
Claims (3)
1. a kind of large area projection lithography system, it is characterised in that: including light source (1), optical fiber (2), DMD system, beam absorption
Plate (3), the light that light source (1) projects is input to even optical lens group (4) through optical fiber (2), then disperses to irradiate by even optical lens group (4)
To the dmd chip (5) of DMD system, a portion light is reflected into projection objective group (6), another part through dmd chip (5)
Light is then absorbed by beam absorption plate (3), projects plateform system after the light of projection objective group (6) is using processing
(7) in PCB substrate (8), dmd chip (5) is stuck in the one side of thermal conductive shell (9), and is coated with and is led between thermal conductive shell (9)
Hot silica gel, the another side of thermal conductive shell (9), which then blocks, to be had thermal insulation board (10), and thermal insulation board (10) surface is then fixed with outwardly open four
Pyramid heat dissipating housing (11), the surface of heat dissipating housing (11) are coated with one layer of reflectorised paint (12), are close to the heat dissipating housing of thermal insulation board (10)
(11) surface is provided with multiple evenly arranged air inlets (13), passes through fixed block (14) in heat dissipating housing (11) and is fixed with miniature heating
Sheet body (15), the heat emission fan (16) of fixed oriented miniature heating sheet body (15) blowing in thermal insulation board (10) surface, heat emission fan (16)
Wherein side thermal insulation board (10) surface is further fixed on micro pump (17), the liquid feeding end of micro pump (17) by pipeline with it is thermally conductive
Shell (9) connection, the outlet end of micro pump (17) then pass through a plurality of pipeline and are connected to the sheet body of miniature heating sheet body (15),
The other side of heat emission fan (16) is additionally provided with the return pipe (18) of a plurality of connection miniature heating sheet body (15) and thermal conductive shell (9).
2. a kind of large area projection lithography system according to claim 1, it is characterised in that: miniature heating sheet body (15) and
Thermal conductive shell (9) is made of aluminium alloy, and miniature heating sheet body (15), thermal conductive shell (9), micro pump (17) and each item return
Superconducting fluid is full of in flow tube (18), pipeline.
3. a kind of large area projection lithography system according to claim 1, it is characterised in that: thermal insulation board (10) and heat dissipating housing
(11) it is integrated and is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820756698.3U CN208283721U (en) | 2018-05-21 | 2018-05-21 | A kind of large area projection lithography system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820756698.3U CN208283721U (en) | 2018-05-21 | 2018-05-21 | A kind of large area projection lithography system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208283721U true CN208283721U (en) | 2018-12-25 |
Family
ID=64730707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820756698.3U Expired - Fee Related CN208283721U (en) | 2018-05-21 | 2018-05-21 | A kind of large area projection lithography system |
Country Status (1)
| Country | Link |
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| CN (1) | CN208283721U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376171A (en) * | 2019-07-15 | 2019-10-25 | 上海理工大学 | Transmission-type fluorescence detection imaging system applied to dPCR detector |
| CN114076750A (en) * | 2020-08-20 | 2022-02-22 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
-
2018
- 2018-05-21 CN CN201820756698.3U patent/CN208283721U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376171A (en) * | 2019-07-15 | 2019-10-25 | 上海理工大学 | Transmission-type fluorescence detection imaging system applied to dPCR detector |
| CN110376171B (en) * | 2019-07-15 | 2021-11-19 | 上海理工大学 | Transmission type fluorescence detection imaging system applied to dPCR detector |
| CN114076750A (en) * | 2020-08-20 | 2022-02-22 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
| CN114076750B (en) * | 2020-08-20 | 2024-05-10 | 深圳华大智造科技股份有限公司 | Super-resolution imaging device and method, biological sample identification system and identification method |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181225 Termination date: 20190521 |