CN208271900U - Display master blank - Google Patents
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- CN208271900U CN208271900U CN201820714843.1U CN201820714843U CN208271900U CN 208271900 U CN208271900 U CN 208271900U CN 201820714843 U CN201820714843 U CN 201820714843U CN 208271900 U CN208271900 U CN 208271900U
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- display
- dike
- cutting line
- master blank
- stress
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Abstract
The utility model relates to a kind of display master blanks.Display master blank includes bearing substrate and several arrangement units being formed on bearing substrate, and arrangement units have cutting line, and arrangement units include the display panel area on the inside of cutting line and the excision area on the outside of cutting line；Wherein, display panel area includes non-display area, and the edge of non-display area is equipped with dykes and dams；Wherein, excision area is equipped with stress dispersion dike.Using the display master blank of technical solutions of the utility model, due to being equipped with dykes and dams and stress dispersion dike in the two sides of cutting line, when being cut to display master blank, the cutting heat radiation of generation and stress are transmitted to two sides simultaneously, to reduce the cutting heat radiation and stress that thin-film packing structure is subject to, it prevents thin-film packing structure from damaging, can be improved the reliability of thin-film package, be conducive to apply.
Description
Technical field
The utility model relates to field of display technology, more particularly to a kind of display master blank.
Background technique
Flexible display panels generally use thin film encapsulation technology, in order to be blocked in the organic film to form thin-film packing structure
Dykes and dams (dam) is arranged usually in the array substrate of flexible display panels in mobility organic material when layer.
The manufacture craft of display panel is usually to cut display panel arranged in arrays on display master blank to obtain, and is
The display panel for obtaining special shape, usually also needs to be cut again.However, being easily destroyed thin during cutting
Film encapsulating structure influences the reliability of thin-film package.
Utility model content
Based on this, it is necessary to which aiming at the problem that how to improve the reliability of thin-film package, providing one kind can be improved film
The display master blank of the reliability of encapsulation.
A kind of display master blank, the display master blank include bearing substrate and be formed on the bearing substrate several
Arrangement units, the arrangement units have cutting line, and the arrangement units include the display panel on the inside of the cutting line
Area and the excision area being located on the outside of the cutting line；
Wherein, the display panel area includes non-display area, and the edge of the non-display area is equipped with dykes and dams；Wherein, described
It cuts off area and is equipped with stress dispersion dike.
The cutting line includes U-shaped section in one of the embodiments, and the stress dispersion dike is set close to described U-shaped section
It sets.
The dykes and dams are symmetrical set with stress dispersion dike along the cutting line in one of the embodiments,.
The stress dispersion dike forms inorganic layer far from the surface of bearing substrate in one of the embodiments,.
The inorganic layer is alumina layer, silicon nitride layer or aln layer in one of the embodiments,.
The number of the dykes and dams is two in one of the embodiments,；The number of stress dispersion dike is two, two
A dykes and dams are symmetrical set along the cutting line respectively with two stress dispersion dikes.
Stress dispersion the distance between the dike and the cutting line are 50 μm~500 μm in one of the embodiments,.
The display panel area includes: in one of the embodiments,
Array substrate；
Packed device, is arranged in the array substrate；
And thin-film packing structure, including the multiple film layers being sealed on the outside of the packed device, the multiple film layer
Including at least one layer of inorganic thin film layer and at least one layer of organic thin film layer, the organic thin film layer and the inorganic thin film layer stackup
Setting.
The packed device is Organic Light Emitting Diode in one of the embodiments,.
Using the display master blank of technical solutions of the utility model, due to being equipped with dykes and dams and stress dispersion in the two sides of cutting line
Dike, when cutting to display master blank, the cutting heat radiation of generation and stress are transmitted to two sides simultaneously, to reduce film
The cutting heat radiation and stress that encapsulating structure is subject to, prevent thin-film packing structure from damaging, can be improved the reliability of thin-film package,
Be conducive to apply.
Detailed description of the invention
Fig. 1 is the schematic diagram of the display master blank of one embodiment of the utility model；
Fig. 2 is the floor map of the arrangement units of one embodiment of the utility model；
Fig. 3 is the sectional view of the A-A ' along Fig. 1；
Fig. 4 is the schematic cross-section of the arrangement units of another embodiment of the utility model；
Fig. 5 is the schematic cross-section of the arrangement units of another embodiment of the utility model；
Fig. 6 is the floor map of the arrangement units of another embodiment of the utility model.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
Referring to Figure 1~Fig. 3, the display master blank 100 of one embodiment of the utility model include bearing substrate 110 and shape
At in several arrangement units 120 on bearing substrate 110.Wherein, bearing substrate 110 can be glass substrate.
Wherein, as shown in Fig. 2, arrangement units 120 have cutting line (dotted line) 121.Arrangement units 120 include being located at cutting
The display panel area 122 of 121 inside of line and the excision area 123 being located on the outside of cutting line.Display panel area 122 refers to that edge is cut
Region where the display panel retained after the cutting of secant 121.Excision area 123 refers to going after cutting along cutting line 121
The peripheral region removed.
Wherein, display panel area 122 includes non-display area B.The edge of non-display area B is equipped with dykes and dams (dam) 130.In addition,
Display panel area 122 further includes viewing area C.Non-display area B refers to the region in addition to the C of viewing area.Wherein, non-display area B
Edge refer on non-display area B close to cutting line 121 region.Wherein, dykes and dams 130 are set in array substrate.Dykes and dams
130 effect is mobility organic material when being blocked in the organic thin film layer to form thin-film packing structure.
Wherein, excision area 123 is equipped with stress dispersion dike 140.Stress dispersion dike 140 and dykes and dams 130 are located at cutting line
121 two sides, stress dispersion dike 140 plays the role of dispersive stress when cutting when cutting.
On the basis of aforementioned embodiments, dykes and dams 130 are symmetrical set with stress dispersion dike 140 along cutting line 121, such as
Shown in Fig. 3." being symmetrical set " herein refers to the position that dykes and dams 130 and stress disperse dike 140 and size along cutting line
121 are symmetrical set.In this way when being cut by laser, cutting position uniform force can greatly reduce cutting stress, prevent
The damage of thin-film packing structure.
On the basis of aforementioned embodiments, display panel area 122 (does not scheme including array substrate 124, packed device
Show) and thin-film packing structure 125.Wherein, it is packaged device to be arranged in array substrate 124, packed device is located in Fig. 3
The right area of dykes and dams 130.
Wherein, thin-film packing structure 125 includes the multiple film layers being sealed on the outside of packed device, and multiple film layers include extremely
Few one layer of inorganic thin film layer and at least one layer of organic thin film layer, organic thin film layer are stacked with inorganic thin film layer.It is advantageous in this way
Play the role of obstructing layer by layer in extraneous water oxygen.
Referring to Figure 1~Fig. 3, kept between the edge line 126 and cutting line 121 of thin-film packing structure 125 it is certain away from
From, when can be avoided cutting in this way between switch on thin-film packing structure 125 and damage thin-film packing structure 125.
On the basis of aforementioned embodiments, stress disperses dike 140 and forms inorganic layer far from the surface of bearing substrate 110
150, as shown in Figure 3.After being arranged in this way, stress disperses the inorganic layer 150 on dike 140 and the thin-film packing structure on dykes and dams 130
125 is corresponding, and when being cut by laser, cutting position uniform force has been effectively ensured, and can greatly reduce cutting stress, prevents
The only damage of thin-film packing structure 125.
Wherein, the number of plies of inorganic layer 150 can be one layer, and inorganic layer 150 can also include folded two layers or two layers or more
The inorganic sublayer added.It is, of course, also possible to be formed with far from the surface of bearing substrate 110 instead of inorganic layer in stress dispersion dike 140
The film layer of 150 other materials.
Referring to Figure 1~Fig. 3 is maintained a certain distance, in this way between the edge line 151 and cutting line 121 of inorganic layer 150
Symmetrical structure can be formed with thin-film packing structure 125, be more advantageous to uniform force when cutting.
On the basis of aforementioned embodiments, inorganic layer 150 is alumina layer, silicon nitride layer or aln layer.These
The inorganic layer of type is similar with the material of the inorganic thin film layer of thin-film packing structure 125, therefore when being cut by laser, can
It plays and similar with the inorganic thin film layer of thin-film packing structure 125 masterpiece dispersion is answered to use.Certainly, the material of inorganic layer 150 is unlimited
In this.
Certainly, in other embodiments, stress dispersion surface of the dike 240 far from bearing substrate 210 can also be not provided with
Inorganic layer, as shown in Figure 4.At this point, being only provided with stress dispersion dike 240 in excision area 223.Meanwhile in the non-of display panel area
Viewing area D is equipped with dykes and dams 230 corresponding with stress dispersion dike 240.Thin-film packing structure 225 is formed on dykes and dams 230.
On the basis of aforementioned embodiments, it is 50 μm~500 μ that stress, which disperses the distance between dike 140 and cutting line 121,
m.At this point, the heat radiation and stress when cutting can be transferred on stress dispersion dike 140, therefore stress dispersion dike 140 can play
The effect of dispersion cutting heat radiation and stress, also helps and keeps the stress intensity on 121 both sides of cutting line consistent.
On the basis of aforementioned embodiments, being packaged device is Organic Light Emitting Diode (Organic Light-
Emitting Diode, OLED).Certainly, packed device can also be other devices.
In above embodiment, the number of dykes and dams 130 and stress dispersion dike 140 is one.Certainly, it dykes and dams 130 and answers
The number of power dispersion dike 140 is not limited to this.
Fig. 5 is referred to, in another embodiment, the number of dykes and dams 330 is two；Stress dispersion dike 340 number be
Two, two dykes and dams 330 are symmetrical set along cutting line 321 respectively with two stress dispersion dikes 340.When being cut by laser
When, it can guarantee cutting position uniform force, can greatly reduce cutting stress, prevent the damage of thin-film packing structure.
Furthermore it should be noted that the stress dispersion dike in above embodiment forms a circle in the periphery of cutting line, but
Its is without being limited thereto.One section of stress can also be set in the periphery of cutting line and disperse dike or the discontinuous stress dispersion dike of multistage.
In addition, the cutting line of the utility model includes the cutting line of rule, such as screen body cutting line.Certainly, this is practical new
The cutting line of type further includes irregular cutting line, such as the cutting line for the slot area (area notch) shielded comprehensively.
Fig. 6 is referred to, in the display master blank of another embodiment, arrangement units 420 have cutting line (dotted line) 421.
Wherein, cutting line 421 includes U-shaped section 422, and stress disperses dike 440 and is arranged close to U-shaped section 422.U-shaped section 422 region surrounded is i.e.
The slot area (area notch) 450 shielded comprehensively.
Wherein, display panel area 424 includes non-display area E and viewing area F.The edge of non-display area E is equipped with dykes and dams (dam)
430.It cuts off area 423 (including the area notch) and is equipped with stress dispersion dike 440.
In present embodiment, since the periphery setting stress at U-shaped section 422 disperses dike 440, slot at U-shaped section 422
The cutting heat radiation generated when cutting and stress are transmitted to two sides simultaneously, to reduce the cutting heat that thin-film packing structure is subject to
Radiation and stress, prevent thin-film packing structure from damaging, can be improved the reliability of thin-film package.
Certainly, in other embodiments, on the basis of the above embodiment, can also be set simultaneously in excision area 423
Circle stress dispersion dike is set, so that cutting line position uniform force when to screen body cutting, prevents thin-film packing structure from damaging, from
And improve the reliability of thin-film package.
Furthermore it should be noted that the cross sectional shape for the position and fluting slotted on screen body is not limited.For example,
A circular slot can also be opened shielding internal portion.At this point it is possible to make in the setting of the inside of circular trough to play stress dispersion
Stress disperses dike.
Using the display master blank of technical solutions of the utility model, due to being equipped with dykes and dams and stress dispersion in the two sides of cutting line
Dike, when cutting to display master blank, the cutting heat radiation of generation and stress are transmitted to two sides simultaneously, to reduce film
The cutting heat radiation and stress that encapsulating structure is subject to, prevent thin-film packing structure from damaging, can be improved the reliability of thin-film package,
Be conducive to apply.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (9)
1. a kind of display master blank, which is characterized in that the display master blank includes bearing substrate and is formed in the bearing substrate
On several arrangement units, the arrangement units have cutting line, and the arrangement units include being located on the inside of the cutting line
Display panel area, be located at the cutting line on the outside of excision area；
Wherein, the display panel area includes non-display area, and the edge of the non-display area is equipped with dykes and dams；Wherein, the excision
Area is equipped with stress and disperses dike.
2. display master blank according to claim 1, which is characterized in that the cutting line includes U-shaped section, the stress dispersion
Dike is arranged close to described U-shaped section.
3. display master blank according to claim 1, which is characterized in that the dykes and dams are cut described in stress dispersion dike
Secant is symmetrical set.
4. display master blank according to claim 1, which is characterized in that the stress disperses surface of the dike far from bearing substrate
Form inorganic layer.
5. display master blank according to claim 4, which is characterized in that the inorganic layer be alumina layer, silicon nitride layer or
Person's aln layer.
6. display master blank according to claim 1, which is characterized in that the number of the dykes and dams is two；The stress point
The number for dissipating dike is two, and two dykes and dams are symmetrical set along the cutting line respectively with two stress dispersion dikes.
7. display master blank according to claim 1, which is characterized in that between the stress dispersion dike and the cutting line
Distance is 50 μm~500 μm.
8. display master blank according to claim 1, which is characterized in that the display panel area includes:
Array substrate；
Packed device, is arranged in the array substrate；
And thin-film packing structure, including the multiple film layers being sealed on the outside of the packed device, the multiple film layer includes
At least one layer of inorganic thin film layer and at least one layer of organic thin film layer, the organic thin film layer are set with the inorganic thin film layer stackup
It sets.
9. display master blank according to claim 8, which is characterized in that the packed device is Organic Light Emitting Diode.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820714843.1U CN208271900U (en) | 2018-05-14 | 2018-05-14 | Display master blank |
| PCT/CN2018/116525 WO2019218629A1 (en) | 2018-05-14 | 2018-11-20 | Display panel, display terminal, and display motherboard |
| US16/565,506 US20200006703A1 (en) | 2018-05-14 | 2019-09-10 | Display panels, display terminals and display motherboards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820714843.1U CN208271900U (en) | 2018-05-14 | 2018-05-14 | Display master blank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271900U true CN208271900U (en) | 2018-12-21 |
Family
ID=64682704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820714843.1U Active CN208271900U (en) | 2018-05-14 | 2018-05-14 | Display master blank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271900U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109962180A (en) * | 2019-03-01 | 2019-07-02 | 昆山国显光电有限公司 | A kind of preparation method of display panel |
| CN109979333A (en) * | 2019-05-17 | 2019-07-05 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN113823643A (en) * | 2021-09-17 | 2021-12-21 | 京东方科技集团股份有限公司 | Array substrate mother board, array substrate, display panel and display device |
| WO2022032785A1 (en) * | 2020-08-11 | 2022-02-17 | Tcl华星光电技术有限公司 | Display motherboard |
-
2018
- 2018-05-14 CN CN201820714843.1U patent/CN208271900U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109962180A (en) * | 2019-03-01 | 2019-07-02 | 昆山国显光电有限公司 | A kind of preparation method of display panel |
| CN109962180B (en) * | 2019-03-01 | 2020-11-10 | 昆山国显光电有限公司 | Preparation method of display panel |
| CN109979333A (en) * | 2019-05-17 | 2019-07-05 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN109979333B (en) * | 2019-05-17 | 2022-01-28 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| WO2022032785A1 (en) * | 2020-08-11 | 2022-02-17 | Tcl华星光电技术有限公司 | Display motherboard |
| US11758753B2 (en) | 2020-08-11 | 2023-09-12 | Tcl China Star Optoelectronics Technology Co., Ltd. | Display motherboard |
| CN113823643A (en) * | 2021-09-17 | 2021-12-21 | 京东方科技集团股份有限公司 | Array substrate mother board, array substrate, display panel and display device |
| CN113823643B (en) * | 2021-09-17 | 2024-03-01 | 京东方科技集团股份有限公司 | Array substrate mother board, array substrate, display panel and display device |
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