CN208271879U - A kind of encapsulating structure of highly reliable RF power device - Google Patents
A kind of encapsulating structure of highly reliable RF power device Download PDFInfo
- Publication number
- CN208271879U CN208271879U CN201820306211.1U CN201820306211U CN208271879U CN 208271879 U CN208271879 U CN 208271879U CN 201820306211 U CN201820306211 U CN 201820306211U CN 208271879 U CN208271879 U CN 208271879U
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- CN
- China
- Prior art keywords
- dao
- frame
- power device
- highly reliable
- muscle
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of encapsulating structures of highly reliable RF power device in chip manufacturing field, including plastic packaging in the intracorporal lead frame of plastic packaging, chip and bonding wire, lead frame includes the pin for being arranged in the periphery Ji Dao, Ji Dao and pin pass through middle muscle and are connected on frame, position is sheared on middle muscle is machined with groove, the utility model is by opening up groove on middle muscle, so that device is when carrying out rib cutting, it is sheared from the groove, so that plastic-sealed body is more easier to be detached from frame, it ensure that the reliability of device, substantially increase the yields of device, it can be used in high power device production.
Description
Technical field
The utility model relates to a kind of chip-packaging structure, in particular to a kind of encapsulation knot of highly reliable RF power device
Structure.
Background technique
The 5G epoch have arrived, this is a kind of huge promotion and challenge for existing radio-frequency technique.This equipment
Update is not singly to refer to the replacement of smart machine, more refers to that single power is more than the radio communication device of 3W.5G is
RF power device market provides huge business opportunities.But 5G technology still there is a problem of it is some have it is to be solved.So
And some of problems have had very specific answer: new communication network needs more base station equipments and higher frequency
Rate response.Therefore, these demands will expedite the emergence of the huge commercial opportunities of semicon industry, especially RF power device market.
Power radio-frequency device has the features such as high power, high current, big bandwidth, High Linear, low energy consumption, to device encapsulation
Radiator structure has very high requirement.Simultaneously as device power is big, voltage is high, and frequency is high.Then require chip area big, thick
Spend that thin, welding wire is thick, quantity is more, frame carrier is thick.
Based on above-mentioned requirements, the semi-finished product encapsulated out are seperated by rib cutting, during rib cutting, since frame thickness is big,
The chip area of the inside is big and thin, and the disengaging or partly accepting and partly rejecting of chip and frame is easily caused during rib cutting；Welding wire and core
Piece and frame it is partly accepting and partly rejecting；Frame and encapsulating material are layered, and certainly will influence the reliability of finished product in this way.
Utility model content
The purpose of the utility model is to provide a kind of encapsulating structures of highly reliable RF power device, so that device is in rib cutting
When it is relatively reliable, improve the yields of device.
Purpose of the utility model is realized as follows: a kind of encapsulating structure of highly reliable RF power device, including modeling
It is enclosed in the intracorporal lead frame of plastic packaging, chip and bonding wire, the lead frame includes the pin for being arranged in the periphery Ji Dao, institute
It states the Ji Dao and pin passes through middle muscle and is connected on frame, position is sheared on the middle muscle and is machined with groove.
As further limiting for the utility model, the Ji Dao be rectangular Ji Dao, rectangular Ji Dao the left and right sides warp in
Muscle is connected on frame, and the side of being symmetrically arranged with of the two sides up and down strip pin of rectangular Ji Dao, square strip pin passes through muscle in two
It is connected on frame.
As further limiting for the utility model, the rectangular Ji Dao and equal silver-plated process on square strip pin.
Compared with prior art, the beneficial effects of the utility model are, the utility model is recessed by opening up on middle muscle
Slot, so that device is sheared when carrying out rib cutting from the groove, so that plastic-sealed body is more easier to be detached from frame, the groove
Place easily disconnects, and does not influence the combination of chip and frame, scolding tin and chip and frame, frame and plastic packaging material time, ensure that
The reliability of device substantially increases the yields of device.The utility model can be used in high power device production.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model.
Fig. 2 is lead frame structure schematic diagram in the utility model.
Wherein, 1 plastic-sealed body, 2 Ji Dao, 3 chips, 4 bonding wires, 5 pins, muscle in 6,6a groove.
Specific embodiment
The encapsulating structure of a kind of highly reliable RF power device as shown in Figs. 1-2, including plastic packaging drawing in plastic-sealed body 1
Wire frame, chip 3 and bonding wire 4, lead frame include the pin 5 for being arranged in 2 periphery of base island, and base island 2 passes through with pin 5
Middle muscle 6 is connected on frame, and position is sheared on middle muscle 6 and is machined with groove 6a, base island 2 is rectangular base island 2, the left side on rectangular base island 2
Muscle 6 is connected on frame in right two sides warp, the side of being symmetrically arranged with of the two sides up and down strip pin 5 on rectangular base island 2, square strip pin
5, which pass through muscle 6 in two, is connected on frame, equal silver-plated process on rectangular base island 2 and square strip pin 5.
The utility model is by opening up groove 6a on middle muscle 6 so that device is when carrying out rib cutting, from groove 6a into
Row shearing easily disconnects at groove 6a so that plastic-sealed body 1 is more easier to be detached from frame, does not influence chip 3 and frame, scolding tin
With the combination of chip 3 and frame, frame and plastic packaging material time, the reliability of device ensure that, substantially increase the good of device
Product rate.
The utility model is not limited to above-described embodiment, on the basis of technical solution disclosed by the utility model, this
For the technical staff in field according to disclosed technology contents, not needing creative labor can be special to some of which technology
Sign makes some replacements and deformation, these replacements and deformation are within the protection scope of the present utility model.
Claims (3)
1. a kind of encapsulating structure of highly reliable RF power device, including plastic packaging the intracorporal lead frame of plastic packaging, chip and
Bonding wire, which is characterized in that the lead frame includes the pin for being arranged in the periphery Ji Dao, during the Ji Dao and pin pass through
Muscle is connected on frame, and position is sheared on the middle muscle and is machined with groove.
2. a kind of encapsulating structure of highly reliable RF power device according to claim 1, which is characterized in that the Ji Dao
For rectangular Ji Dao, muscle is connected on frame in the left and right sides warp of rectangular Ji Dao, and the two sides up and down of rectangular Ji Dao are symmetrically arranged with
Square strip pin, square strip pin pass through muscle in two and are connected on frame.
3. a kind of encapsulating structure of highly reliable RF power device according to claim 2, which is characterized in that described rectangular
Ji Dao and equal silver-plated process on square strip pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820306211.1U CN208271879U (en) | 2018-03-06 | 2018-03-06 | A kind of encapsulating structure of highly reliable RF power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820306211.1U CN208271879U (en) | 2018-03-06 | 2018-03-06 | A kind of encapsulating structure of highly reliable RF power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271879U true CN208271879U (en) | 2018-12-21 |
Family
ID=64674396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820306211.1U Active CN208271879U (en) | 2018-03-06 | 2018-03-06 | A kind of encapsulating structure of highly reliable RF power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271879U (en) |
-
2018
- 2018-03-06 CN CN201820306211.1U patent/CN208271879U/en active Active
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| GR01 | Patent grant |