CN208270078U - A kind of board failure monitor based on non-contact infrared sensor array - Google Patents
A kind of board failure monitor based on non-contact infrared sensor array Download PDFInfo
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- CN208270078U CN208270078U CN201820412324.XU CN201820412324U CN208270078U CN 208270078 U CN208270078 U CN 208270078U CN 201820412324 U CN201820412324 U CN 201820412324U CN 208270078 U CN208270078 U CN 208270078U
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- array
- infrared sensor
- contact infrared
- sensor array
- board
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Abstract
A kind of board failure monitor based on non-contact infrared sensor array, it is formed by the mechanism for monitoring of the temperature for monitoring circuit-under-test plate and for adjusting circuit-under-test plate and the supporting mechanism of mechanism for monitoring relative position, the mechanism for monitoring includes signal acquiring board, array-type sensor, rangefinder and mainboard, wherein processor is provided on mainboard, the signal output end of the array-type sensor is electrically connected by I2C interface with the signal input part of signal acquiring board, the signal output end of signal acquiring board is electrically connected by I2C interface with the I/O interface of processor, the signal output end of rangefinder is electrically connected by I2C interface with the I/O interface of processor, processor has also been electrically connected data storage, rangefinder, display screen, keyboard and alarm.The utility model provides a kind of board failure monitor, real-time monitoring can be carried out to the local fault device during circuit board testing, in time discovery and positioning failure device position and Current Temperatures situation.
Description
Technical field
The utility model relates to a kind of board failure monitoring devices, specifically a kind of to be based on non-contact infrared battle array
The board failure monitor of sensor.
Background technique
In complete machine batch production, the integrated level of circuit board is higher and higher, and the failure rate of batch production circuit board seriously restricts life
Production progress, and troubleshooting is more difficult, the time is long.Failure component is often in the presentation temperature in test that is powered on circuit board
Degree ascendant trend finally burns out component since temperature is excessively high, makes as the extension heating temperature of testing time can steeply rise
It scraps and does over again at device, may cause circuit board when serious and scrap, bring serious quality and economic loss.By more to scene
The failure tracking of the circuit board testing process of kind model, temperature rising is slower in energization 1-10S mostly for discovery failure component,
The case where temperature is less high, excludes if powered off in time, can continue device failure caused by increasing to avoid temperature generation.Therefore
The temperature variations of real-time monitoring circuit board surface device are at effective means to solve this problem.
Utility model content
In order to solve deficiency in the prior art, the utility model provides a kind of based on non-contact infrared sensor array
Board failure monitor, can in certain area during circuit board testing device temperature carry out real-time monitoring, and
The device of Shi Faxian temperature anomaly variation simultaneously positions it, reminds operator to power off in time, avoids device from burning and cause
Loss.
To achieve the goals above, the utility model use the specific scheme is that
A kind of board failure monitor based on non-contact infrared sensor array, by for monitoring circuit-under-test plate
The mechanism for monitoring of temperature and the supporting mechanism for adjusting circuit-under-test plate and mechanism for monitoring relative position form, the monitoring
Mechanism includes signal acquiring board, array-type sensor, rangefinder and mainboard, and processor, the array are wherein provided on mainboard
The signal output end of formula sensor is electrically connected by I2C interface with the signal input part of signal acquiring board, the letter of signal acquiring board
Number output end be electrically connected by I2C interface with the I/O interface of processor, the signal output end of rangefinder by I2C interface with locate
The I/O interface electrical connection of device is managed, processor has also been electrically connected data storage, rangefinder, display screen, keyboard and alarm
Device.
Further, the supporting mechanism by horizontally disposed testboard, be slidably arranged on testboard and set part plate, solid
The monitor bracket that testboard side is set calmly and the monitor supporting plate being slidably arranged on monitor bracket composition, the master
Plate is arranged on monitor supporting plate, and array-type sensor and rangefinder are fixed at the surface of monitor supporting plate and incude direction
Downwards, described set is provided with circuit-under-test plate on part plate.
Further, the upper surface of the testboard offers two sliding slots arranged side by side, and the lower surface for setting part plate is solid
There are two sliding block, sliding block is matched with sliding slot to be completed testboard and sets being slidably connected for part plate for fixed setting.
Further, the part plate of setting is driven by the cylinder being arranged on testboard.
Further, the edge for setting part plate upper surface is provided with the inductive layer matched with rangefinder.
Further, the array-type sensor is the non-refrigeration type non-contact infrared array of model MLX90621
Sensor, array are 4 × 16 arrays.
Further, the display screen is 8 cun of serial ports configuration LCD liquid crystal display screens.
Further, the memory is SPI FLASH W25Q128 storage chip.
Further, the alarm is made of LED warning lamp and buzzer.
Further, the rangefinder is infrared range-measurement system.
The utility model has the advantages that
1, the utility model is to judge the component by the temperature conditions of all parts in observation circuit plate galvanization
It is no to break down, it if broken down, records trouble unit and staff is notified to power off in time, loss can be effectively reduced；
2, the monitoring of temperature is carried out by array-type sensor, to realize the precise positioning to trouble unit；
3, supporting mechanism is set, can be adjusted flexibly between mechanism for monitoring and circuit-under-test plate for different circuit boards
Distance, to guarantee that circuit-under-test plate is completely covered in the monitoring region of mechanism for monitoring, be not in monitoring dead angle lead to not and
Shi Faxian trouble unit.
Detailed description of the invention
Fig. 1 is mechanism for monitoring structural schematic diagram；
Fig. 2 is supporting mechanism structural schematic diagram.
Appended drawing reference: 1, mainboard, 2, signal acquiring board, 3, single-chip microcontroller, 4, memory, 5, rangefinder, 6, array sensing
Device, 7, display screen, 8, keyboard, 9, alarm, 10, circuit-under-test plate, 11, testboard, 12, set part plate, 13, monitor bracket,
14, monitor supporting plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1 and 2 is please referred to, Fig. 1 is mechanism for monitoring structural schematic diagram, and Fig. 2 is supporting mechanism structural schematic diagram.
Embodiment one.
A kind of board failure monitor based on non-contact infrared sensor array, by for monitoring circuit-under-test plate
The mechanism for monitoring of 10 temperature and supporting mechanism for adjusting circuit-under-test plate 10 and mechanism for monitoring relative position form, described
Mechanism for monitoring includes signal acquiring board 2, array-type sensor 6, rangefinder 5 and mainboard 1, is wherein provided with processor on mainboard 1
3, the signal output end of the array-type sensor 6 is electrically connected by I2C interface with the signal input part of signal acquiring board 2, is believed
The signal output end of number collection plate 2 is electrically connected by I2C interface with the I/O interface of processor 3, the signal output end of rangefinder 5
Be electrically connected by I2C interface with the I/O interface of processor 3, processor 3 be also electrically connected data storage 4, rangefinder 5,
Display screen 7, keyboard 8 and alarm 9.
The supporting mechanism by horizontally disposed testboard 11, be slidably arranged on testboard 11 and set part plate 12, fixed
The monitor bracket 13 that 11 side of testboard is set and the monitor supporting plate 14 being slidably arranged on monitor bracket 13 composition,
The mainboard 1 is arranged on monitor supporting plate 14, and array-type sensor 6 and rangefinder 5 are fixed at monitor supporting plate 14
Surface and induction direction it is downward, described set is provided with circuit-under-test plate 10 on part plate 12.The upper surface of the testboard 11 opens up
There are two sliding slots arranged side by side, there are two sliding block, sliding block matches completion with sliding slot for the lower surface fixed setting for setting part plate 12
Testboard 11 with set being slidably connected for part plate 12.
Preferably, the concrete model of all parts is as follows.
The array-type sensor 6 is the non-refrigeration type non-contact infrared array-type sensor of model MLX90621,
Array is 4 × 16 arrays.The display screen 7 is 8 cun of serial ports configuration LCD liquid crystal display screens.The memory 4 is SPI FLASH
W25Q128 storage chip.The alarm 9 is made of LED warning lamp and buzzer.The rangefinder 5 is infrared range-measurement system.Institute
Stating keyboard 8 is preferably matrix keyboard, and for the temperature threshold of input circuit plate component, temperature threshold is stored in data storage 4
In.
Specific monitoring method is as follows.
For the specific size of circuit-under-test plate 10, selection suitably sets part plate 12, circuit-under-test plate 10 is placed on and sets part
On plate 12, height of the monitor supporting plate 14 on monitor bracket 13 is then manually adjusted respectively and sets part plate 12 in testboard 11
On position, be completely in circuit-under-test plate 10 in the monitoring range of array-type sensor 6.Then it is powered to circuit board, by
The temperature conditions of all parts on 6 real-time monitoring circuit-under-test plate 10 of array-type sensor generates the temperature of 4 × 16 pixels
Image, and be converted into after digital signal by signal acquiring board 2 and to be transferred to processor 3 and handled, processor 3 generates hygrogram
It is shown as being transferred to display screen 7, simultaneous processor 3 is according to the temperature threshold being preset in data storage 4 to each portion
The temperature of part is judged, when the temperature of some component is more than its preset temperature threshold, controls alarm 9 by processor 3
It sends a warning message, while identifying the pixel where the component that is out of order on display screen 7.Staff is receiving warning message
Afterwards, circuit-under-test plate 10 can be powered off in time, is burnt to avoid circuit-under-test plate 10 and causes more huge economic loss.?
In monitoring process, collected temperature data is persistently written in data storage 4 by processor 3, is recorded, after facilitating
It is continuous to consult.
Embodiment two.
On the basis of example 1, the part plate 12 of setting is driven by the cylinder being arranged on testboard 11, makes to set part plate
12 can move back and forth on testboard 11, and complete the pick-and-place work to circuit-under-test plate 10 using manipulator crawl, to mention
The degree of automation and working efficiency of high monitor.When circuit-under-test plate 10 is located at the underface of array-type sensor, to prison
The height for surveying instrument supporting plate 14 is adjusted.Monitor supporting plate 14 is pushed by the cylinder being arranged on monitor bracket 13, described to set
The edge of 12 upper surface of part plate is provided with the inductive layer matched with rangefinder 5, acquires array-type sensor 6 by rangefinder 5
The distance between circuit-under-test plate 10, distance values are transferred to processor 3 and are handled, when distance values reach data storage
In device 4 when preset value, then stop the movement to monitor supporting plate 14.Above-mentioned preset value is to precalculate to obtain and pass through key
Disk 8 is input in data storage 4, for different size of circuit board, has different preset values, meanwhile, it replaces every time
Different size of circuit board is monitored, can be by the model of 8 input circuit plate of keyboard, and is driven and supported by processor 3
Mechanism is adjusted, and working efficiency is higher.
It should also be noted that, herein, the terms "include", "comprise" or its any other variant are intended to non-
It is exclusive to include, so that the process, method, article or equipment for including a series of elements not only includes those elements,
It but also including other elements that are not explicitly listed, or further include solid by this process, method, article or equipment
Some elements.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including
There is also other identical elements in the process, method, article or equipment of the element.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (10)
1. a kind of board failure monitor based on non-contact infrared sensor array, by for monitoring circuit-under-test plate
(10) mechanism for monitoring of temperature and supporting mechanism for adjusting circuit-under-test plate (10) and mechanism for monitoring relative position form,
It is characterized by: the mechanism for monitoring includes signal acquiring board (2), array-type sensor (6), rangefinder (5) and mainboard (1),
It is wherein provided with processor (3) on mainboard (1), the signal output end of the array-type sensor (6) passes through I2C interface and signal
The signal input part of collection plate (2) is electrically connected, and the signal output end of signal acquiring board (2) passes through I2C interface and processor (3)
The signal output end of the electrical connection of I/O interface, rangefinder (5) is electrically connected by I2C interface with the I/O interface of processor (3), is handled
Device (3) has also been electrically connected data storage (4), rangefinder (5), display screen (7), keyboard (8) and alarm (9).
2. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the supporting mechanism by horizontally disposed testboard (11), be slidably arranged on testboard (11) set part plate (12),
The monitor for being fixed at the monitor bracket (13) of testboard (11) side and being slidably arranged on monitor bracket (13)
Supporting plate (14) composition, the mainboard (1) are arranged on monitor supporting plate (14), and array-type sensor (6) and rangefinder (5) are fixed
Be arranged monitor supporting plate (14) surface and induction direction it is downward, described set is provided with circuit-under-test plate on part plate (12)
(10).
3. a kind of board failure monitor based on non-contact infrared sensor array as claimed in claim 2, special
Sign is: the upper surface of the testboard (11) offers two sliding slots arranged side by side, and the lower surface for setting part plate (12) is fixed
There are two sliding block, sliding block is matched with sliding slot to be completed testboard (11) and sets being slidably connected for part plate (12) for setting.
4. a kind of board failure monitor based on non-contact infrared sensor array as claimed in claim 2, special
Sign is: the part plate (12) of setting is driven by the cylinder being arranged on testboard (11).
5. a kind of board failure monitor based on non-contact infrared sensor array as claimed in claim 2, special
Sign is: the edge for setting part plate (12) upper surface is provided with the inductive layer matched with rangefinder (5).
6. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the array-type sensor (6) is the non-refrigeration type non-contact infrared sensor array of model MLX90621, battle array
It is classified as 4 × 16 arrays.
7. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the display screen (7) is 8 cun of serial ports configuration LCD liquid crystal display screens.
8. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the memory (4) is SPI FLASH W25Q128 storage chip.
9. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the alarm (9) is made of LED warning lamp and buzzer.
10. a kind of board failure monitor based on non-contact infrared sensor array as described in claim 1, special
Sign is: the rangefinder (5) is infrared range-measurement system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820412324.XU CN208270078U (en) | 2018-03-26 | 2018-03-26 | A kind of board failure monitor based on non-contact infrared sensor array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820412324.XU CN208270078U (en) | 2018-03-26 | 2018-03-26 | A kind of board failure monitor based on non-contact infrared sensor array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208270078U true CN208270078U (en) | 2018-12-21 |
Family
ID=64674755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820412324.XU Expired - Fee Related CN208270078U (en) | 2018-03-26 | 2018-03-26 | A kind of board failure monitor based on non-contact infrared sensor array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208270078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554302A (en) * | 2019-09-10 | 2019-12-10 | 北京理工大学 | device for rapidly and automatically detecting circuit board fault |
-
2018
- 2018-03-26 CN CN201820412324.XU patent/CN208270078U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554302A (en) * | 2019-09-10 | 2019-12-10 | 北京理工大学 | device for rapidly and automatically detecting circuit board fault |
| CN110554302B (en) * | 2019-09-10 | 2020-07-28 | 北京理工大学 | Device for rapidly and automatically detecting circuit board fault |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181221 Termination date: 20200326 |