CN208241974U - Integrated circuit board and electric terminal - Google Patents
Integrated circuit board and electric terminal Download PDFInfo
- Publication number
- CN208241974U CN208241974U CN201820585519.4U CN201820585519U CN208241974U CN 208241974 U CN208241974 U CN 208241974U CN 201820585519 U CN201820585519 U CN 201820585519U CN 208241974 U CN208241974 U CN 208241974U
- Authority
- CN
- China
- Prior art keywords
- electrical component
- integrated circuit
- circuit board
- hollowed out
- out area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model relates to a kind of integrated circuit board and electric terminals.The integrated circuit board includes printed wiring board and electrical component, electrical component is integrated into printed wiring board, electrical component is connect by the circuit layout of printed wiring board with other electronic equipments, printed wiring board includes ground metal layer, and ground metal layer forms hollowed out area in region corresponding with electrical component.A technical problem to be solved in the utility model is that the metal ground plane of existing integrated circuit board covers entire plate, causes the temperature drift phenomenon of electrical component.One purposes of utility model is for various electric terminals.
Description
Technical field
The utility model relates to field of circuit technology, more specifically, the utility model relates to a kind of integrated circuit board and
Electric terminal.
Background technique
IMU is a kind of device for measuring object triaxial attitude angle (or angular speed) and acceleration.IMU Aeronautics and Astronautics,
It is widely used in terms of household electrical appliance, portable device.For example, the mainboard of VR equipment be generally integrated master chip, power supply chip with
And IMU.The power consumption of master chip and power supply chip is very big, and the ground connection layers of copper in existing mainboard is usually integrally covered on circuit cloth
Around figure, heat is conducted with ground connection layers of copper, be easy to cause environment temperature excessively high.
However, the zero bias of IMU are highly prone to the influence of environment temperature.The heat of ground connection layers of copper conduction can be such that IMU rises rapidly
There is " temperature drift " phenomenon to cause the performance of VR equipment unstable in temperature.
Utility model content
One purpose of the utility model is to provide a kind of new solution of integrated circuit board.
One aspect according to the present utility model provides a kind of integrated circuit board.The integrated circuit board includes printed wire
Plate and electrical component, the electrical component are integrated into printed wiring board, the electricity that the electrical component passes through printed wiring board
Road Butut is connect with other electronic equipments, and the printed wiring board includes ground metal layer, the ground metal layer with it is described
The corresponding region of electrical component forms hollowed out area.
Optionally, the ground metal layer extends internally, and to form ground line, the ground line is located at the hollowed out area
Interior, the ground line is connect with the grounding point of the electrical component.
Optionally, the ground line is straight line, and the plated-through hole for ground connection nearest with distance is connect.
Optionally, fill insulant or the hollowed out area are exposed in external environment in the hollowed out area.
Optionally, the printed wiring board includes the multiple ground metal layers being stacked together, the multiple
Ground metal layer is respectively formed the hollowed out area in region corresponding with the electrical component.
Optionally, multiple ground metal layers are electrically connected by plated-through hole.
Optionally, the area of the hollowed out area is greater than orthographic projection of the electrical component in the printed wiring board
Area.
Optionally, the geometric center of the orthographic projection of the electrical component is overlapped with the geometric center of the hollowed out area, and
And the electrical component and the corresponding side of the hollowed out area are adjacent and parallel.
Optionally, corner of the ground metal layer in the hollowed out area makees chamfering.
Second aspect according to the present utility model provides a kind of electric terminal.The electric terminal includes the utility model
The integrated circuit board provided.
One of the utility model has technical effect that the ground metal layer of integrated circuit board is corresponding with electrical component
Region formed hollowed out area.Even heat is prevented to conduct via ground metal layer to electrical component in such manner, it is possible to effectively slow down,
Such as on IMU, to efficiently reduce the temperature drift phenomenon for even being eliminated electrical component, the durability of integrated circuit board is improved
And stability
In addition, the integrated circuit board can save raw material.
By the detailed description referring to the drawings to the exemplary embodiment of the utility model, the utility model it is other
Feature and its advantage will become apparent.
Detailed description of the invention
The attached drawing for constituting part of specification describes the embodiments of the present invention, and uses together with the description
In explanation the principles of the present invention.
Fig. 1 is the structural schematic diagram of the integrated circuit board of one embodiment according to the present utility model.
Description of symbols:
11: hollowed out area；12: layers of copper；13: ground metallization through-hole；13a: apart from nearest ground metallization through-hole；
14: ground line；15: function pads；16: chamfering.
Specific embodiment
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should also be noted that unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Fig. 1 is the structural schematic diagram of the integrated circuit board of one embodiment according to the present utility model.
Integrated circuit board can be, but not limited to, the mainboard of electric terminal, wiring board of local electronic device etc..Such as Fig. 1
Shown, which includes printed wiring board and electrical component.For example, electrical component is IMU, temperature-sensitive sticker, Mike
Wind, bluetooth module, GPS module, pressure sensor, humidity sensor etc..
The electrical component is integrated into printed wiring board.Electrical component passes through the circuit layout of printed wiring board and other
Electronic equipment connection.For example, circuit layout exposes function pads 15 on the surface insulation layer of printed wiring board.It is welded by soldering
The mode connect welds together the pad of electrical component with corresponding function pads 15.Those skilled in the art can be according to reality
Border needs that circuit layout is arranged.
Printed wiring board includes ground metal layer.Ground metal layer can effectively shield external signal for being grounded
Interference reduces noise signal.
Specifically, ground metal layer is made by metallic conductor, for example, layers of copper 12, aluminium layer, tin layers, silver layer etc..
Ground metal layer outsourcing insulating layer coating.Ground metal layer can be one layer, or the multilayer being stacked.The ground connection of multilayer
It is mutually isolated by insulating layer between metal layer.In the utility model embodiment, ground metal layer is opposite with electrical component
The region answered forms hollowed out area 11.For example, ground metal layer is hollowed out for installing the region of electrical component scheduled
Processing, to form hollowed out area 11.The shape in the surface that printed wiring board contacts of the shape of hollowed out area 11 and electrical component
Shape matches.For example, circle, rectangle, square, triangle, diamond shape, ellipse etc..
In the utility model embodiment, the ground metal layer of integrated circuit board is in region corresponding with electrical component shape
At hollowed out area 11.Even heat is prevented to conduct via ground metal layer to electrical component in such manner, it is possible to effectively slow down, such as
On IMU, to efficiently reduce the temperature drift phenomenon for even being eliminated electrical component, the durability of integrated circuit board and steady is improved
It is qualitative
In addition, the integrated circuit board can save raw material.
Preferably, in the step of insulating layer is set, the fill insulant in the hollowed out area 11, for example, asphalt mixtures modified by epoxy resin
The materials such as rouge.Insulating materials has good thermal resistance effect, can effectively slow down the heat for even high-power components being prevented to distribute
In amount conduction to electrical component.
In other examples, which is exposed in external environment.For example, forming heat dissipation on a printed-wiring board
Hole.Heat release hole is opposite with electrical component.In this way, the heat of ground metal layer conduction can promptly be dispersed into outside
In environment, to accelerate the cooling rate of integrated circuit board, avoid impacting electrical component.
In one example, ground metal layer extends internally, to form ground line 14.Ground line is located in hollowed out area.
In the region for inwardly referring to ground metal layer encirclement.Ground line 14 is connect with the grounding point of electrical component.For example, ground metal layer
For layers of copper 12.As shown in Figure 1, extending to form ground line 14 into hollowed out area 11 from layers of copper 12.Ground line 14 and electrical component
Corresponding pad solder together.Electrical component is grounded by ground line 14, rather than is directly connect with layers of copper 12.This
Kind set-up mode equally realizes good earthing effect.
Preferably, ground line 14 is straight line, and the plated-through hole for ground connection nearest with distance is connect.For example,
As shown in Figure 1, ground line 14 is two.Plated-through hole passes through the through-hole through upper and lower surfaces in printed wiring board
Inner surface does metalized and the hole that is formed, such as plates metal material, to form metal layer.Plated-through hole can be led
Electricity.Two ground metallization through-hole 13a connections nearest at a distance from outside hollowed out area 11 respectively of ground line 14, and pass through the gold
14 conducting of categoryization through-hole 13a and main ground line.It is arranged to curve, broken line, meander line or irregular shape line with 14 will be grounded
It compares, the area of the ground line 14 of linear is minimum, can reduce heat-conducting area, further prevent the generation of temperature drift.
In addition, ground line 14 is connect with apart from nearest ground metallization through-hole 13a, so that the shield effectiveness of noise signal
More preferably.
In one example, multiple ground metal layers are respectively formed hollowed out area 11 in region corresponding with electrical component.
Multilayer layers of copper 12 hollows out processing in the position of setting electrical component, to form the hollowed out area 11 of same shape.Pass through this
Kind mode, heat can be obstructed via the conduction of multiple layers of copper 12 by hollowed out area 11, without being rapidly transferred to electrical component
On.
Preferably, multiple ground metal layers are electrically connected by plated-through hole.Plated-through hole is connected with each metal layer,
To make each layer of earth-continuity.
Preferably, the area of hollowed out area 11 is greater than the area of the orthographic projection of electrical component on a printed-wiring board.Electrically
Element is installed in hollowed out area 11.Upright projection of the orthographic projection, that is, electrical component on the surface of printed wiring board.For example,
The orthographic projection of electrical component is rectangle or square.Correspondingly, the entirety of hollowed out area 11 be rectangle or square.
The area of hollowed out area 11 is greater than the area of orthographic projection.In this way, ground metal layer and electrical component do not have overlapped region.
The heat of ground metal layer conduction will not be directly conducted on electrical component, so as to effectively completely cut off heat.
Preferably, the geometric center of the orthographic projection of electrical component is overlapped with the geometric center of hollowed out area 11, and electrical
Element and the corresponding side in hollowed out area 11 are adjacent and parallel.For example, the long side of orthographic projection is corresponding with the long side of hollowed out area 11；
The short side of orthographic projection is corresponding with the short side of hollowed out area 11.In this way, by ground metal layer conduction heat not
It can take a shortcut and conduct to electrical component, the heat insulation around electrical component is uniform, to significantly reduce temperature drift.
In one example, circuit layout includes the function pads 15 connecting with electrical component.Function pads 15, which are located at, engraves
In empty region 11.As shown in Figure 1, multiple function pads 15 include pad, the pad of input/output signal etc. of power supply.These
Function pads 15 extend in hollowed out area 11, become easy the welding of electrical component；It saves on the other hand
The space at other positions.
In one example, corner of the ground metal layer in hollowed out area 11 makees chamfering 16.For example, square or
The four corners rounded corner or oblique angle of rectangular hollowed out area 11.Chamfering 16 can prevent from occurring in printed wiring board straight
Angle.Those skilled in the art can be set according to actual needs the size of chamfering 16.Chamfering 16 enables to signal transmission effect
More preferably, noise signal is reduced.
In addition, chamfering can prevent point discharge phenomenon.
Another embodiment according to the present utility model, provides a kind of electric terminal.Electric terminal can be but not office
Be limited to VR equipment, AR equipment, smart phone, television set, computer, smartwatch, game machine, intercom, printer, camera,
Video camera etc..
The electric terminal includes integrated circuit board provided by the utility model.The electric terminal has good heat dissipation effect, property
The stable feature of energy.
Although being described in detail by some specific embodiments of the example to the utility model, this field
It is to be understood by the skilled artisans that above example merely to be illustrated, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case where, to above embodiments
It modifies.The scope of the utility model is defined by the following claims.
Claims (10)
1. a kind of integrated circuit board, which is characterized in that including printed wiring board and electrical component, the electrical component is integrated into
In printed wiring board, the electrical component is connect by the circuit layout of printed wiring board with other electronic equipments, the printing
Wiring board includes ground metal layer, and the ground metal layer forms hollowed out area in region corresponding with the electrical component.
2. integrated circuit board according to claim 1, which is characterized in that the ground metal layer extends internally, to be formed
Ground line, the ground line are located in the hollowed out area, and the ground line is connect with the grounding point of the electrical component.
3. integrated circuit board according to claim 2, which is characterized in that the ground line is straight line, and most with distance
The close plated-through hole connection for ground connection.
4. integrated circuit board according to claim 1, which is characterized in that in the hollowed out area fill insulant or
Hollowed out area described in person is exposed in external environment.
5. integrated circuit board according to claim 1, which is characterized in that the printed wiring board includes being stacked one
The multiple ground metal layers risen, the multiple ground metal layer is in the equal shape in region corresponding with the electrical component
At the hollowed out area.
6. integrated circuit board according to claim 5, which is characterized in that multiple ground metal layers are logical by metallization
Hole electrical connection.
7. integrated circuit board according to claim 1, which is characterized in that the area of the hollowed out area is greater than described electrical
The area of orthographic projection of the element in the printed wiring board.
8. integrated circuit board according to claim 7, which is characterized in that the geometric center of the orthographic projection of the electrical component
It is overlapped with the geometric center of the hollowed out area, and the corresponding side of the electrical component and the hollowed out area is adjacent and flat
Row.
9. integrated circuit board according to claim 1, which is characterized in that the ground metal layer is in the hollowed out area
Corner makees chamfering.
10. a kind of electric terminal, which is characterized in that including the integrated circuit board as described in any one in claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820585519.4U CN208241974U (en) | 2018-04-23 | 2018-04-23 | Integrated circuit board and electric terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820585519.4U CN208241974U (en) | 2018-04-23 | 2018-04-23 | Integrated circuit board and electric terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208241974U true CN208241974U (en) | 2018-12-14 |
Family
ID=64584716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820585519.4U Active CN208241974U (en) | 2018-04-23 | 2018-04-23 | Integrated circuit board and electric terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208241974U (en) |
-
2018
- 2018-04-23 CN CN201820585519.4U patent/CN208241974U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20160095203A1 (en) | Circuit board | |
| US10117322B2 (en) | Circuit assembly and electric junction box | |
| US9554453B2 (en) | Printed circuit board structure with heat dissipation function | |
| JP2004071670A (en) | Ic package, connecting structure and electronic apparatus | |
| CN110337178B (en) | Circuit board assembly and electronic equipment | |
| CN108074898A (en) | Semiconductor packages | |
| US20240008167A1 (en) | Heat dissipation apparatus and electronic device | |
| CN213694596U (en) | Circuit board structure and electronic equipment | |
| US7254032B1 (en) | Techniques for providing EMI shielding within a circuit board component | |
| US20170133314A1 (en) | Package structure and fabricating method thereof | |
| CN107197595B (en) | Printed circuit board and welding design thereof | |
| CN102164453A (en) | Circuit module | |
| AU2017403198B2 (en) | Mainboard for consumer electronic product, and terminal | |
| CN208241974U (en) | Integrated circuit board and electric terminal | |
| JP2003283144A (en) | Heat radiating structure of circuit board | |
| JP6007566B2 (en) | Component built-in wiring board and heat dissipation method of component built-in wiring board | |
| CN211062704U (en) | Chip module and electronic equipment | |
| US20210134702A1 (en) | Electronic device having a chip package module | |
| CN210093654U (en) | Double-sided PCB with stable bonding pad structure | |
| CN207783410U (en) | Chip, circuit board assemblies and mobile terminal | |
| CN207573221U (en) | A kind of modular power source | |
| CN111341740A (en) | Novel power management chip packaging system | |
| CN104640350B (en) | Circuit board module | |
| JP2001223452A (en) | Circuit board | |
| CN206963178U (en) | A kind of power supply thickness copper coin with excellent conductive performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Integrated circuit board and electron terminal Effective date of registration: 20200522 Granted publication date: 20181214 Pledgee: Bank of China Limited Qingdao hi tech Industrial Park sub branch Pledgor: QINGDAO XIAONIAO KANKAN TECHNOLOGY Co.,Ltd. Registration number: Y2020370010017 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210630 Granted publication date: 20181214 Pledgee: Bank of China Limited Qingdao hi tech Industrial Park sub branch Pledgor: QINGDAO XIAONIAO KANKAN TECHNOLOGY Co.,Ltd. Registration number: Y2020370010017 |