CN208239570U - A kind of semiconductor switch pipe test device - Google Patents
A kind of semiconductor switch pipe test device Download PDFInfo
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- CN208239570U CN208239570U CN201820464187.4U CN201820464187U CN208239570U CN 208239570 U CN208239570 U CN 208239570U CN 201820464187 U CN201820464187 U CN 201820464187U CN 208239570 U CN208239570 U CN 208239570U
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Abstract
The utility model discloses a kind of semiconductor switch pipe test devices.The semiconductor switch pipe test device of the utility model, comprising: test box, test box have accommodating chamber, and the side wall of accommodating chamber is equipped with air inlet and air outlet, and air outlet is equipped with diversion fan；Test board, test board are set in accommodating chamber, and test board includes the test circuit that dipulse test is carried out for treating testing element, and test circuit includes: detection module, drive module and control module；Wherein, drive module and detection module are successively arranged from air inlet to direction of air outlet.The semiconductor switch pipe test device of the utility model is improved service life and reliability due to can radiate to the element of its inside with radiator structure.
Description
Technical field
The utility model relates to electronic equipment detection technique field more particularly to a kind of semiconductor switch pipe test devices.
Background technique
With the rapid development of China's new energy technology, alternating current-direct current energy is converted into the most pass for photovoltaic and new energy vehicle
The sport technique segment of key, and receive the great attention of new energy industry, country.
IGBT power device is the core devices of alternating current-direct current energy conversion, and energy conversion is directly determined using parameter
Stability and efficiency, it is general that dipulse test is carried out to IGBT power device using semiconductor switch pipe test device, to obtain
The use parameter of IGBT power device.
But semiconductor switch pipe test device in the prior art does not have radiator structure, when working long hours, by
The temperature of element inside semiconductor switch pipe test device is excessively high, will lead to the damage of semiconductor switch pipe test device, shadow
Ring the progress of test.
Therefore, do not have radiator structure for existing semiconductor switch pipe test device, cause what it was easily damaged to ask
Topic, it is desirable to provide one kind has radiator structure and the higher semiconductor switch pipe test device of reliability.
Utility model content
To solve the above problems, the utility model provides a kind of semiconductor switch pipe test device, due to having heat dissipation knot
Structure can radiate to the element of its inside, improve service life and reliability.
To achieve the above object, the utility model provides a kind of semiconductor switch pipe test device, comprising:
Test box, test box have accommodating chamber, and the side wall of accommodating chamber is equipped with air inlet and air outlet, and air outlet is equipped with
Diversion fan；
Test board, test board are set in accommodating chamber, and test board includes carrying out dipulse test for treating testing element
Test circuit, test circuit include:
Detection module, detection module include element test circuit and pulse test circuit, and element test circuit and pulse are surveyed
Examination circuit is connect with element to be tested respectively, and element test circuit carries out failure testing, pulse test for treating testing element
Circuit carries out dipulse test for treating testing element；
Drive module, drive module are connect with element to be tested, provide pulse test signal for element to be tested；With
Control module, the signal output end of control module respectively with element test circuit, pulse test circuit and driving mould
Block communication connection；The signal input part of control module is connect with element to be tested, to obtain the test result of element to be tested；
Wherein, drive module and detection module are successively arranged from air inlet to direction of air outlet.
Further, test board further include:
Test interface for connecting with element to be tested, detection module, drive module and control module pass through survey respectively
Mouth of trying is connect with element to be tested.
Further, the top plate of test box offers test window, and test board is removable installed in accommodating chamber, and
Test interface is set to stretch out the accommodating chamber by test window.
Further, test window is equipped with the sealing plate for protecting accommodating chamber.
Further, further includes:
Low-tension supply, low-tension supply are set in accommodating chamber, low-tension supply be respectively element test circuit, drive module and
Control module power supply.
Further, the first side plate of test box is equipped with high voltage power supply socket, and high voltage power supply socket is used for and high-voltage electricity
Source connection, and power for pulse test circuit.
Further, test board further includes that the first mounting plate, the second mounting plate and connecting plate, connecting plate are vertically arranged, the
One mounting plate is horizontally placed on connecting plate top, and the second mounting plate is horizontally placed on mounting plate bottom end, and detection module is integrated in
On one mounting plate, drive module and control module are integrated on the second mounting plate.
Further, the second side plate of test box is equipped with air inlet, and the third side plate of test box is equipped with air outlet, the
The connection adjacent with the first side plate of two side plates, third side plate is adjacent with the second side plate to be connected and is oppositely arranged with the first side plate.
Further, the bottom of the first mounting plate side plate parallel with the second side plate is equipped with water conservancy diversion tooth vertically.
Further, further include display screen, display screen be set on top plate and with test circuit connection.
The semiconductor switch pipe test device of the utility model, the side wall of the accommodating chamber of test box be equipped with air inlet and
Air outlet, air outlet are equipped with diversion fan, the radiating airflow in accommodating chamber are allow to form a heat dissipation ventilation channel, thus
Can by radiating airflow by the heat for being located at the element in heat dissipation ventilation channel until hull outside, make to be located at heat dissipation ventilation channel
Interior element can available ventilation heat dissipation.Meanwhile drive module, control mould and detection module according to its heat resistance by as low as
Height is successively arranged from air inlet to direction of air outlet, can be improved radiating efficiency and reliability.
Detailed description of the invention
Fig. 1 is the external structure schematic diagram of the semiconductor switch pipe test device of the utility model；
Fig. 2 is the radiator structure schematic diagram of the semiconductor switch pipe test device of the utility model；
Fig. 3 is the schematic diagram of internal structure of the semiconductor switch pipe test device of the utility model；
Fig. 4 is the module diagram of the test circuit of the utility model；
Fig. 5 is the circuit diagram of the test circuit of the utility model；
Fig. 6 is the structural schematic diagram of the test board of the utility model；
Fig. 7 is the partial enlarged view in the portion A in Fig. 6.
Specific embodiment
In the following, structure and working principle to the utility model etc. are further described in conjunction with attached drawing.
As shown in Figure 1-3, a kind of semiconductor switch pipe test device of the utility model, including test board 20 and test
Case.Test box has accommodating chamber, and the side wall of accommodating chamber is equipped with air inlet 61 and air outlet 62, and air outlet 62 is equipped with water conservancy diversion wind
Fan 63.Test board 20 is set in accommodating chamber, and test board 20 includes the survey that dipulse test is carried out for treating testing element 30
Circuit is tried, test circuit includes detection module, drive module 27 and control module 28.Wherein, drive module 27 and detection module
Successively arranged from air inlet to direction of air outlet.
In the utility model embodiment, test board 20 further includes the test interface for connecting with element 30 to be tested
21, detection module, drive module 27 and control module 28 are connect by test interface 21 with element 30 to be tested respectively.
In the utility model embodiment, the shell of test box is by top plate 11, bottom plate 16, the first side plate 12, the second side plate
13, third side plate 14, the 4th side plate 15 and bottom plate 16 are constituted, the first side plate 12, the second side plate 13, third side plate 14 and the 4th side
Plate 15 constitutes the side wall of shell after connecting, after side wall is connect with top plate 11, bottom plate 16, the internal accommodating chamber for forming test box.
As shown in Figure 1, the top plate 11 of test box offers test window, test board 20 is removable installed in accommodating chamber
It is interior, and test interface 21 is made to stretch out accommodating chamber by test window.Since test board 20 is detachably connected with test box, for
When different new energy products is treated testing element 30 and is tested, can with test board 20 corresponding with the new energy product into
Row test.Therefore, the test under the progress different application scene of testing element 30 only can be treated by replacement test board 20, met
To the simulation test demand of common new energy product, so that semiconductor switch pipe test device has versatility, therefore, Neng Gouti
High testing efficiency reduces testing cost.Simultaneously as test board 20 can simulate different new energy products, therefore, Neng Gou
It is tested under the actual condition of specific products, keeps test more targeted.
In the utility model embodiment, test window is equipped with the sealing plate 17 for protecting accommodating chamber.Sealing plate 17 can be only
It is exposed to test interface 21 outside shell, and the gap between 21 edge of test interface and test window is covered in, prevent ash
The object that dirt, impurity, water etc. are easily damaged semiconductor switch pipe test device enters accommodating chamber.Meanwhile in the utility model reality
It applies in example, test interface 21 is straight cutting interface, and it is convenient that this external straight cutting design can be such that element 30 to be tested plugs, and improves and surveys
Try efficiency.
As shown in Fig. 2, the second side plate 13 of test box is equipped with air inlet 61, test in the utility model embodiment
The third side plate 14 of case is equipped with air outlet 62, and air outlet 62 is equipped with diversion fan 63, can pass through radiating airflow for accommodating chamber
The heat of interior element makes the element in accommodating chamber can available ventilation heat dissipation until hull outside.
In the utility model embodiment, as shown in figure 4, test circuit includes detection module, drive module 27 and control
Module 28.Wherein, detection module includes element test circuit 25 and pulse test circuit 26, and element test circuit 25 and pulse are surveyed
Examination circuit 26 is connect with test interface 21 respectively, and element test circuit 25 carries out failure testing, arteries and veins for treating testing element 30
Punching test circuit 26 carries out dipulse test for treating testing element 30.Drive module 27 is connect with test interface 21, for
Testing element 30 provides pulse test signal.The signal output end of control module 28 is surveyed with element test circuit 25, pulse respectively
It tries circuit 26 and drive module 27 communicates to connect, for control element test circuit 25, pulse test circuit 26 and drive module
27 work.The signal input part of control module 28 is connect with test interface 21, to obtain the test result of element 30 to be tested.
In the utility model embodiment, semiconductor switch pipe test device further includes low-tension supply 52, low-tension supply 52
It is set in accommodating chamber, low-tension supply 52 is respectively that element test circuit 25, drive module 27 and control module 28 are powered.Test
First side plate 12 of case is equipped with high voltage power supply socket 51, and high voltage power supply socket 51 is pulse for connecting with high voltage power supply
Circuit 26 is tested to power.
In the utility model embodiment, semiconductor switch pipe test device further includes display screen 40, and display screen 40 is arranged
In on top plate 11 and with test circuit connection, display screen 40 can show the current state of semiconductor switch pipe test device, need
The parameter of the parameter and detection to be arranged.Display screen 40 can also be touch display screen 40, for testing semiconductor switching tube
Device carries out parameter setting.
As shown in figure 5, test circuit is used to detect the ginseng of element QD1 to be tested in the utility model one embodiment
Number, including detection module, drive module 27, control module 28 and power module.
Wherein, low-tension supply DC2 provides light current power supply to dipulse test platform.High voltage power supply DC1 is pulse test electricity
Road 26 provides the high tension voltage needed.High voltage power supply DC1 can be controlled by control module 28, according to the to be checked of different voltages grade
The standard test voltage condition of device is surveyed, the corresponding output voltage values of high voltage power supply are adjusted.
In the utility model embodiment, detection module includes element test circuit 25 and pulse test circuit 26.Wherein,
Element test circuit 25 includes relay K4 and resistance R2, after relay K4, resistance R2 and low-tension supply DC2 are sequentially connected in series, is led to
Cross the end C1 and the end E1 that test interface 21 is connected to element QD1 to be tested, make relay K4, resistance R2, low-tension supply DC2 and to
Testing element QD1 constitutes circuit.
At this point, control module 28 can by control relay K4 on-off, control element test circuit 25 with it is to be tested
Whether element QD1 is connected to.After control module 28 controls relay K4 closure, control module 28 controls drive module 27 and sends arteries and veins
Signal is rushed, and detects first test result of the element QD1 to be tested at conductive and nonconductive two kinds, is surveyed according to first
Test result determines whether element QD1 to be tested is active component.
Pulse test circuit 26 includes relay K3 and power device QD2, power device QD2, relay K3 and high-voltage electricity
After source DC1 series connection, it is connected to the end C1 and the end E1 of element QD1 to be tested, makes power device QD2, relay K3, high voltage power supply
DC1 and element QD1 to be tested constitutes circuit.Specifically, the end E2 of power device QD2 also passes through test interface 21 and member to be tested
The end C1 of part QD1 connects, and the end C2 of power device QD2 also passes through test interface 21 and connect with relay K3, relay K3 and height
After voltage source DC1 series connection, then passes through test interface 21 and connect with the end E1 of element QD1 to be tested.Control module 28 can pass through
The on-off of relay K3 is controlled, whether control pulse test circuit 26 is connected to element QD1 to be tested.When control module 28 controls
After relay K3 closure, control module 28 controls drive module 27 and sends pulse signal, and detects the of element QD1 to be tested
Two test results determine the parameter of element QD1 to be tested according to the second test result.
In the utility model embodiment, test circuit can also include unhurried current circuit 53, and unhurried current circuit 53 includes reactance
Device L1, the both ends of reactor L1 pass through test interface 21 respectively and connect with the end C2 of power device QD2, the end E2, to survey to pulse
Examination circuit 26 plays the role of unhurried current.
In the utility model embodiment, test circuit further includes voltage regulator circuit, and voltage regulator circuit is in parallel with high voltage power supply to be connected
It connects.Wherein, voltage regulator circuit includes accumulation of energy branch and releases energy branch, and accumulation of energy branch is connected with energy branch circuit parallel connection is released.Specifically, accumulation of energy
Branch includes capacitor C1, and releasing energy branch includes resistance R1 and power device QD3 identical with element QD1 to be tested.Capacitor C1 is simultaneously
It is coupled to the both ends high voltage power supply DC1.One end of resistance R1 is connect with one end of capacitor C1, and the other end of resistance R1 passes through test interface
21 connect with the end C3 of power device QD3, and the end E3 of power device QD3 is connected by the other end of test interface 21 and capacitor C1
It connects.Wherein, setting resistance R1 is to make its discharge current value according to Ohm's law and by current limliting in capacitor C1 electric discharge.
In order to guarantee the safety of dipulse test platform, before carrying out dipulse test, without being carried out to capacitor C1
Charging, in the utility model embodiment, further respectively has relay between the both ends of capacitor C1 and the both ends of high voltage power supply DC1
K1 and relay K2, relay K2 are series between high voltage power supply DC1 and relay K3, and relay K2 is series at high voltage power supply
Between DC1 and the test interface 21 of element QD1 to be tested.Control module 28 can control the logical of relay K1 and relay K2
Disconnected, specifically, after carrying out failure detection, when testing element QD1 progress dipulse test is treated in preparation, control module 28 is controlled
Relay K1 and relay K2 closure processed, makes high voltage power supply DC1 charge capacitor C1, when control module 28 detects capacitor
When the voltage of C1 is identical as the output voltage of high voltage power supply DC1, control module 28 controls relay K3 closure, and to be measured
It tries element QD1 and carries out dipulse test.At the end of dipulse test, in order to guarantee the safety of dipulse test platform, lead to
It crosses and releases energy branch to capacitor C1 electric discharge.
In the utility model embodiment, drive module 27 includes drive control device and transformer, and drive control device passes through
Transformer is connect with control module 28.The Vcc pin of drive control device passes through the end C1 of test interface 21 and element QD1 to be tested
Connection, the GL pin and GH pin of drive control device pass through test interface 21 respectively and connect with the end G1 of element QD1 to be tested, drive
The Vc pin of movement controller is connect by test interface 21 with the end E1 of element QD1 to be tested, to mention for element QD1 to be tested
For pulse signal.
When control module 28 issues dipulse signal to drive control device, which arrives boost in voltage by transformer
The voltage range (0~15V) driven needed for element QD1 to be tested carries out switch control to treat testing element QD1, makes to control
Module 2830 obtains the second test result according to switch control result.Specifically, when pulse signal is high level, member to be tested
Part QD1 conducting, when pulse signal is low level, element QD1 cut-off to be tested.
In the utility model embodiment, control module 28 includes host computer, controller and sample circuit.Wherein, it controls
Device and host computer communicate to connect, the signal output end of controller respectively with element test circuit 25, pulse test circuit 26 and drive
Dynamic model block 27 communicates to connect, and the signal input part of controller is connect by sample circuit with element to be tested.Controller can be
DSP control panel, the GPIO pin of DSP control panel are used to issue each relay the signal for controlling its on-off, DSP control panel
The connection of the circuit output end of ADC pin and sample circuit, the RS485 pin of DSP control panel are used to communicate to connect with host computer,
The GPIO10 pin of DSP control panel is used to communicate to connect with drive control device.Wherein, DSP control panel receives opening for host computer
Begin dipulse signal can be issued from GPIO10 pin as drive control device, by drive control device to be measured after test instruction
It tries element QD1 and carries out switch control.
In addition to this, DSP control panel can also be communicated to connect with high voltage power supply DC1, and tester can be by host computer
The size of the output voltage of high voltage power supply DC1 and the pulse width of dipulse test signal is arranged, thus to height in the software set
Voltage source DC1 is manually adjusted.
In the utility model embodiment, sample circuit can use circuit for voltage, and controller passes through voltage sample electricity
Road acquires the voltage signal at element both ends to be tested.Specifically, voltage sampling circuit include resistance RD1, RD2, RD3, RD4,
RD5, RD6, RD7 and differential operational amplifier UC1.Wherein, resistance RD1, RD2 is Chip-R, passes through test interface 21 respectively
It is parallel to the end C1, the end E1 of element QD1 to be tested.Voltage can be amplified the high voltage of acquisition by calculus of differences using circuit
After device UC1 dwindles into the voltage signal of 0~3V, the ADC pin of DSP control panel is sent to, so that the C1 of element QD1 to be tested
It holds, the voltage value Uce1 at the end E1 is as test result.
As shown in fig. 6, test board 20 further includes the first mounting plate 22, the second mounting plate in the utility model embodiment
23 and connecting plate 24, connecting plate 24 be vertically arranged, the first mounting plate 22 is horizontally placed on 24 top of connecting plate, the second mounting plate 23
It is horizontally placed on mounting plate bottom end, element test circuit 25 and pulse test circuit 26, the test interface 21 of detection module are distinguished
It is integrated on the first mounting plate 22, drive module 27 and control module 28 are integrated on the second mounting plate 23.It should be noted that
As shown in Figure 1-3, except detection module, drive module 27 and the control module 28 of test circuit are set to the first mounting plate 22 and the
Other than two mounting plates 23, the gentle current circuit 53 of voltage regulator circuit for testing circuit is respectively arranged in the spare space of accommodating chamber.
As shown in fig. 6-7, in the utility model embodiment, the first mounting plate 22 side parallel with the second side plate 13
Bottom is equipped with water conservancy diversion tooth 29 vertically.Water conservancy diversion tooth 29 be it is multiple, multiple water conservancy diversion teeth 29 are distributed evenly in the first mounting plate 22 and the
The parallel side bottom of two side plates 13, the spacing between two neighboring water conservancy diversion tooth 29 are identical.Therefore, air inlet 61, water conservancy diversion tooth 29,
Air outlet 62, diversion fan 63 cooperate, and the radiating airflow in accommodating chamber is allow to form a heat dissipation ventilation channel (in such as Fig. 6
Shown in arrow), so as to which the heat of the element in heat dissipation ventilation channel will be located at until hull outside, makes position by radiating airflow
It can available ventilation heat dissipation in the element in heat dissipation ventilation channel.
It is resistance to due to the heat resistance of drive module 27, detection module and test interface 21 in the utility model embodiment
The heat resistance of hot gentle current circuit 53 successively increases, therefore, will be set to drive module 27 second mounting plate 23 close into
The position in air port 61, will test module and test interface 21 is set to the first position of the mounting plate 22 far from air inlet 61, will delay
Current circuit 53 is set to the position in accommodating chamber close to air outlet 62, and radiating airflow can successively be made to play maximum heat radiation energy
Power improves radiating efficiency and reliability, reduces installation cost.
The application method of the semiconductor switch pipe test device of the utility model embodiment are as follows:
After element 30 to be tested is injected test interface 21, high voltage power supply socket 51 is connect with high voltage power supply.In starting
Position machine is arranged the output voltage of high voltage power supply, the output voltage and pulse width of low voltage by display screen 40, then starts
Dipulse test.After test, host computer sends electric discharge instruction, and the electricity of all capacitors, breaks in test circuit of releasing
High voltage power supply is opened, test is terminated.
More than, the only schematic description of the utility model, it will be recognized by those skilled in the art that practical without departing from this
On the basis of novel working principle, a variety of improvement can be made to the utility model, this belongs to the protection of the utility model
Range.
Claims (10)
1. a kind of semiconductor switch pipe test device characterized by comprising
Test box, the test box have accommodating chamber, and the side wall of the accommodating chamber is equipped with air inlet and air outlet, the outlet air
Mouth is equipped with diversion fan；
Test board, the test board are set in the accommodating chamber, and the test board includes double for treating testing element progress
The test circuit of pulse test, the test circuit include:
Detection module, the detection module include element test circuit and pulse test circuit, the element test circuit and institute
Pulse test circuit is stated to connect with the element to be tested respectively, the element test circuit be used for the element to be tested into
Row failure testing, the pulse test circuit are used to carry out dipulse test to the element to be tested；
Drive module, the drive module are connect with the element to be tested, provide pulse test letter for the element to be tested
Number；With
Control module, the signal output end of the control module respectively with the element test circuit, the pulse test circuit
It is communicated to connect with the drive module；The signal input part of the control module is connect with the element to be tested, to obtain
State the test result of element to be tested；
Wherein, the drive module and detection module are successively arranged from air inlet to direction of air outlet.
2. semiconductor switch pipe test device as described in claim 1, which is characterized in that the test board further include:
Test interface for connecting with the element to be tested, the detection module, drive module and control module are led to respectively
The test interface is crossed to connect with the element to be tested.
3. semiconductor switch pipe test device as claimed in claim 2, which is characterized in that the top plate of the test box offers
Test window, the test board are removable installed in the accommodating chamber, and the test interface is made to pass through the test
Window stretches out the accommodating chamber.
4. semiconductor switch pipe test device as claimed in claim 3, which is characterized in that the test window is equipped with for protecting
Protect the sealing plate of the accommodating chamber.
5. semiconductor switch pipe test device as described in claim 1, which is characterized in that further include:
Low-tension supply, the low-tension supply are set in the accommodating chamber, and the low-tension supply is respectively the element test electricity
Road, the drive module and control module power supply.
6. semiconductor switch pipe test device as described in claim 1, which is characterized in that on the first side plate of the test box
Equipped with high voltage power supply socket, the high voltage power supply socket is powered for connecting with high voltage power supply, and for the pulse test circuit.
7. semiconductor switch pipe test device as claimed in claim 6, which is characterized in that the test board further includes the first peace
Loading board, the second mounting plate and connecting plate, the connecting plate are vertically arranged, and first mounting plate is horizontally placed on the connecting plate
Top, second mounting plate are horizontally placed on the mounting plate bottom end, and the detection module is integrated in first mounting plate
On, the drive module and the control module are integrated on second mounting plate.
8. semiconductor switch pipe test device as claimed in claim 7, which is characterized in that on the second side plate of the test box
Equipped with air inlet, the third side plate of the test box is equipped with air outlet, second side plate company adjacent with first side plate
It connects, the third side plate is adjacent with second side plate to be connected and be oppositely arranged with first side plate.
9. semiconductor switch pipe test device as claimed in claim 8, which is characterized in that first mounting plate and described the
The bottom of the parallel side plate of two side plates is equipped with water conservancy diversion tooth vertically.
10. semiconductor switch pipe test device as described in claim 1, which is characterized in that it further include display screen, the display
Screen be set on the top plate of the test box and with the test circuit connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820464187.4U CN208239570U (en) | 2018-03-30 | 2018-03-30 | A kind of semiconductor switch pipe test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820464187.4U CN208239570U (en) | 2018-03-30 | 2018-03-30 | A kind of semiconductor switch pipe test device |
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| Publication Number | Publication Date |
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| CN208239570U true CN208239570U (en) | 2018-12-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113391135A (en) * | 2021-05-13 | 2021-09-14 | 昆山丘钛光电科技有限公司 | NFC test equipment |
-
2018
- 2018-03-30 CN CN201820464187.4U patent/CN208239570U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113391135A (en) * | 2021-05-13 | 2021-09-14 | 昆山丘钛光电科技有限公司 | NFC test equipment |
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