CN208207435U - A kind of liquid crystal display FOG bindings bit protection structure - Google Patents
A kind of liquid crystal display FOG bindings bit protection structure Download PDFInfo
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- CN208207435U CN208207435U CN201820888052.0U CN201820888052U CN208207435U CN 208207435 U CN208207435 U CN 208207435U CN 201820888052 U CN201820888052 U CN 201820888052U CN 208207435 U CN208207435 U CN 208207435U
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- film layer
- protective film
- bindings bit
- circuit board
- flexible circuit
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Abstract
The utility model discloses a kind of liquid crystal display FOG bindings bits to protect structure.The structure includes chip bonding position protective film layer (1), flexible circuit board bindings bit protective film layer (2) and bindings bit connection protective film layer (3)；Chip bonding position protective film layer (1) is covered on chip (4) surface；The flexible circuit board bindings bit protective film layer (2) is covered on the bindings bit surface of flexible circuit board (5)；Chip bonding position protective film layer (1) is connect by bindings bit connection protective film layer (3) with flexible circuit board bindings bit protective film layer (2), and the bindings bit of the bindings bit and flexible circuit board (5) to chip (4) is surrounded；Chip bonding position protective film layer (1), flexible circuit board bindings bit protective film layer (2) and bindings bit connection protective film layer (3) are fine and close fluorination liquid film layer.The utility model is conducive to preferably protect IC, FPC and surrounding metal cabling, save the cost.
Description
Technical field
The utility model relates to liquid crystal display preparation technical fields, and in particular to a kind of liquid crystal display FOG bindings bit
Protect structure.
Background technique
For the production technology of current liquid crystal display leading portion, polaroid, COG(chip on glass are pasted in cleaning,
Chip is by direct bonding on glass), FOG(FPC on Glass, flexible circuit board is bundled on glass) after binding, complete
Require the protective glue that coating includes silica gel, UV glue or TUFFY glue before fitting and protect IC(semiconductor original part product), FPC(it is soft
Property circuit board) and surrounding metal cabling, in order to avoid moisture foreign matter etc. causes to get rusty to bindings bit and metal routing, short circuit, corrosion etc.
It is bad.But for the increasingly thinning of liquid-crystalline glasses requirement, it can not meet thinning glazier in part by the way of point protection glue
Skill, that is, have that dispensing thickness can not thinning, dispensing speed be slow, curing time is slow, need the problems such as UV irradiation solidification, and thickness can not
Control be easy to cause glue-line is blocked up to cause to be bonded glass pressure break entirely.
And be fluorinated liquid with strong wearability, strong flexibility, spontaneous curing time is fast, moisture-proof antirust, thickness are very thin and at
This low advantage, separately replaces common gluing process with injection valve coating processes again, make protective coating thinning, quickening coating speed,
It improves production efficiency and reduces cost.Therefore, protective glue is replaced to walk IC, FPC and surrounding metal using the thin layer of fluorination liquid
Line is protected, and is of great significance.
Utility model content
The purpose of this utility model is that in view of the deficiencies of the prior art, providing a kind of liquid crystal display FOG bindings bit
Protect structure.The protection structure replaces protective glue to protect IC, FPC and surrounding metal cabling using the thin layer of fluorination liquid
Shield.
The purpose of this utility model is achieved through the following technical solutions.
A kind of liquid crystal display FOG bindings bit protection structure, including the binding of chip bonding position protective film layer, flexible circuit board
Position protective film layer and bindings bit connect protective film layer；
Chip bonding position protective film layer is covered on chip surface；The flexible circuit board bindings bit protective film layer covering
On the bindings bit surface of flexible circuit board；The bindings bit connects protective film layer for chip bonding position protective film layer and flexible circuitry
The connection of plate bindings bit protective film layer, and the bindings bit of the bindings bit and flexible circuit board to chip is surrounded；
Chip bonding position protective film layer, flexible circuit board bindings bit protective film layer and bindings bit connect protective film layer
It is fine and close fluorination liquid film layer.
Preferably, the ingredient of the fluorination liquid includes fluoroplast 10wt% and non-combustible fluorine element solvent 90wt%.
Preferably, chip bonding position protective film layer, flexible circuit board bindings bit protective film layer and bindings bit connection
The film layer that protective film layer is integrated.
Preferably, the thickness of chip bonding position protective film layer and flexible circuit board bindings bit protective film layer be less than or
Equal to 3 μm.
It is furthermore preferred that chip bonding position protective film layer and flexible circuit board bindings bit protective film layer with a thickness of 2 ~
3μm。
Preferably, the bindings bit connection protective film layer is also connect with the glasses for LCD of liquid crystal display.
Compared with prior art, the utility model is had the following advantages and beneficial effects:
The utility model replaces protective glue using the thin layer of fluorination liquid, has strong wearability, strong flexible based on fluorination liquid
The advantage that property, spontaneous curing time is fast, moisture-proof antirust and thickness are very thin, is advantageously implemented to IC, FPC and surrounding metal cabling
Preferably protected；Meanwhile protective glue is replaced using the thin layer of fluorination liquid, it being capable of effectively save cost.
Detailed description of the invention
Fig. 1 is the cross-sectional view that the utility model liquid crystal display FOG bindings bit protects structure in specific embodiment；
Fig. 2 is the top view that the utility model liquid crystal display FOG bindings bit protects structure in specific embodiment；
Attached drawing mark: chip bonding position protective film layer 1, flexible circuit board bindings bit protective film layer 2, bindings bit connection protection
Glass 6 under film layer 3, chip 4, flexible circuit board 5, liquid crystal display, glass 7, polaroid 8 on liquid crystal display.
Specific embodiment
The technical solution of the utility model is described in further detail below in conjunction with specific embodiments and drawings, but this
The protection scope and embodiment of utility model are without being limited thereto.
In specific embodiment, the utility model liquid crystal display FOG bindings bit protects the cross-sectional view and top view point of structure
Not not as depicted in figs. 1 and 2；In liquid crystal display, glass 7 on liquid crystal display are respectively arranged under liquid crystal display on the surface of glass 6
With polaroid 8；And the side binding under liquid crystal display far from glass 7 on liquid crystal display on the surface of glass 6 has chip 4 and flexible wires
Road plate 5；There is the bindings bit of chip 4 and flexible circuit board 5 FOG bindings bit to protect structure, which includes chip bonding
Position protective film layer 1, flexible circuit board bindings bit protective film layer 2 and bindings bit connect protective film layer 3；
Chip bonding position protective film layer 1, flexible circuit board bindings bit protective film layer 2 and bindings bit connect protective film layer 3
It is fine and close fluorination liquid film layer, and chip bonding position protective film layer 1, flexible circuit board bindings bit protective film layer 2 and binding
The film layer that position connection protective film layer 3 is integrated；Chip bonding position protective film layer 1 is covered on 4 surface of chip；Flexible circuit board binding
Position protective film layer 2 is covered on the bindings bit surface of flexible circuit board 5；Bindings bit connection protective film layer 3 protects chip bonding position
Film layer 1 is connect with flexible circuit board bindings bit protective film layer 2, and the bindings bit of the bindings bit and flexible circuit board 5 to chip 4
It is surrounded；Bindings bit connection protective film layer 3 is also connect with glass 7 on the liquid crystal display of liquid crystal display；
Wherein, the thickness of chip bonding position protective film layer 1 and flexible circuit board bindings bit protective film layer 2 is less than or equal to
3μm。
Embodiment 1
In above-mentioned liquid crystal display FOG bindings bit protection structure, chip bonding position protective film layer 1 and flexible circuit board are tied up
Position protective film layer (2) with a thickness of 2 ~ 3 μm.
Above embodiments are only the preferred embodiment of the utility model, be only that the technical solution of the utility model make into
The detailed description of one step, but the protection scope of the utility model is not limited, it is any substantially to be done without departing from the spirit of the present invention
Change, modifications or substitutions etc. be included in the protection scope of the utility model.
Claims (5)
1. a kind of liquid crystal display FOG bindings bit protects structure, which is characterized in that including chip bonding position protective film layer (1), soft
Property wiring board bindings bit protective film layer (2) and bindings bit connection protective film layer (3)；
Chip bonding position protective film layer (1) is covered on chip (4) surface；The flexible circuit board bindings bit protective film layer
(2) it is covered on the bindings bit surface of flexible circuit board (5)；Bindings bit connection protective film layer (3) protects chip bonding position
Film layer (1) is connect with flexible circuit board bindings bit protective film layer (2), and bindings bit and flexible circuit board (5) to chip (4)
Bindings bit surrounded；
Chip bonding position protective film layer (1), flexible circuit board bindings bit protective film layer (2) and bindings bit connect protective film
Layer (3) is fine and close fluorination liquid film layer.
2. a kind of liquid crystal display FOG bindings bit according to claim 1 protects structure, which is characterized in that the chip
Bindings bit protective film layer (1), flexible circuit board bindings bit protective film layer (2) and bindings bit connection protective film layer (3) are integrated
Film layer.
3. a kind of liquid crystal display FOG bindings bit according to claim 1 protects structure, which is characterized in that the chip
The thickness of bindings bit protective film layer (1) and flexible circuit board bindings bit protective film layer (2) is less than or equal to 3 μm.
4. a kind of liquid crystal display FOG bindings bit according to claim 1 protects structure, which is characterized in that the chip
Bindings bit protective film layer (1) and flexible circuit board bindings bit protective film layer (2) with a thickness of 2 ~ 3 μm.
5. a kind of liquid crystal display FOG bindings bit according to claim 1 protects structure, which is characterized in that the binding
Position connection protective film layer (3) is also connect with the glasses for LCD of liquid crystal display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820888052.0U CN208207435U (en) | 2018-06-08 | 2018-06-08 | A kind of liquid crystal display FOG bindings bit protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820888052.0U CN208207435U (en) | 2018-06-08 | 2018-06-08 | A kind of liquid crystal display FOG bindings bit protection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208207435U true CN208207435U (en) | 2018-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820888052.0U Active CN208207435U (en) | 2018-06-08 | 2018-06-08 | A kind of liquid crystal display FOG bindings bit protection structure |
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| CN (1) | CN208207435U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002246A (en) * | 2020-09-28 | 2020-11-27 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN112996235A (en) * | 2021-02-10 | 2021-06-18 | 上海天马有机发光显示技术有限公司 | Flexible circuit board, display panel and insulating film |
| CN113534605A (en) * | 2021-06-30 | 2021-10-22 | 昆山华冠商标印刷有限公司 | Method for preparing grain embossing template |
| CN116699911A (en) * | 2023-08-03 | 2023-09-05 | 惠科股份有限公司 | Display panel, bonding method of display panel and display device |
-
2018
- 2018-06-08 CN CN201820888052.0U patent/CN208207435U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002246A (en) * | 2020-09-28 | 2020-11-27 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN112002246B (en) * | 2020-09-28 | 2022-04-29 | 武汉天马微电子有限公司 | Display panel and display device |
| CN112996235A (en) * | 2021-02-10 | 2021-06-18 | 上海天马有机发光显示技术有限公司 | Flexible circuit board, display panel and insulating film |
| US11564315B2 (en) | 2021-02-10 | 2023-01-24 | Wuhan Tianma Micro-Electronics Co., Ltd. | Flexible circuit board, display panel, and insulating film |
| CN113534605A (en) * | 2021-06-30 | 2021-10-22 | 昆山华冠商标印刷有限公司 | Method for preparing grain embossing template |
| CN116699911A (en) * | 2023-08-03 | 2023-09-05 | 惠科股份有限公司 | Display panel, bonding method of display panel and display device |
| CN116699911B (en) * | 2023-08-03 | 2023-11-14 | 惠科股份有限公司 | Display panel, bonding method of display panel and display device |
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