CN108155211B - Touch display panel and touch display device - Google Patents
Touch display panel and touch display device Download PDFInfo
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- CN108155211B CN108155211B CN201711244662.3A CN201711244662A CN108155211B CN 108155211 B CN108155211 B CN 108155211B CN 201711244662 A CN201711244662 A CN 201711244662A CN 108155211 B CN108155211 B CN 108155211B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The application discloses touch-control display panel and touch-control display device, this touch-control display panel includes: the display panel comprises a display panel and a touch layer, wherein the touch layer covers the display panel, the display panel comprises a display area and a non-display area, and the non-display area comprises a lead binding area; the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area, and the touch lead extends to the lead binding area along one side of the insulating layer, which is far away from the display panel. Because the insulating layer in the touch layer is extended to the lead bonding area, and the touch lead can be extended to the lead bonding area along the insulating layer, compared with the prior art, the touch display panel provided by the embodiment of the application can effectively reduce the stress acting on the touch lead, thereby avoiding the breakage of the touch lead and effectively ensuring the touch function of the touch display panel.
Description
Technical Field
The application relates to the technical field of display, in particular to a touch display panel and a touch display device.
Background
The touch display panel integrates the touch screen and the flat display panel together, so that the flat display panel has a touch function. In general, a touch display panel can provide a man-machine interaction interface and allow input to be performed by a finger, a stylus, or the like, which is more direct and humanized in use. With the development of display technology, touch display panels are increasingly applied to various display devices.
The touch display panel generally includes a display driving lead and a touch lead, wherein the display driving lead is used for providing a display driving signal, and the touch lead is used for providing a touch driving signal. Generally, in order to facilitate control over the display driving leads and the touch leads, the touch leads may be extended to a lead bonding area of the display panel and bonded together with the display driving leads.
In the conventional touch display panel, when the touch lead is extended to the lead bonding area of the display panel, the touch lead needs to cross over the non-display area of the display panel, however, in practical applications, the touch lead is easily broken when crossing over the non-display area, which causes poor contact of the touch lead and further affects the touch function of the touch display panel.
Disclosure of Invention
The embodiment of the application provides a touch display panel and a touch display device, which are used for solving the problem that when a touch lead is bound to a lead area in the existing touch display panel, the touch lead is easy to break when crossing a non-display area, so that the touch lead is poor in contact and the touch function of the touch display panel is influenced.
An embodiment of the present application provides a touch display panel, including: display panel and touch-control layer, the touch-control layer cover in on the display panel, wherein:
the display panel comprises a display area and a non-display area, wherein the non-display area comprises a lead binding area;
the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area, and the touch lead extends to the lead binding area along one side, far away from the display panel, of the insulating layer.
Preferably, the display panel further includes a display region, and the non-display region further includes a bank region, wherein:
the dam region is located between the lead bonding region and the display region, and the insulating layer extends outwards and covers the dam region.
Preferably, the part of the insulating layer extending to cover the dyke region and the lead bonding region has a flattened bent structure.
Preferably, a portion of the insulating layer extending to the wire bonding region is gently lowered in an extension direction with respect to a height of the display panel.
Preferably, the touch display panel further includes: an encapsulation layer, wherein:
the packaging layer is located between the display panel and the touch layer, and the insulating layer extends out and covers the packaging layer.
Preferably, the material of the insulating layer is an organic material.
Preferably, the lead bonding area includes a touch lead bonding area, and the touch lead is bonded to the touch lead bonding area after extending to the lead bonding area.
Preferably, the lead bonding area further comprises a display drive lead bonding area, and the display drive lead bonding area is used for bonding a display drive lead;
the touch control lead and the display driving lead are connected with the same driving chip.
Preferably, if the touch lead is not in contact with one side of the insulating layer away from the display panel, the touch lead is led to the side of the insulating layer away from the display panel by means of an opening.
An embodiment of the present application further provides a touch display device, including the touch display panel described above.
The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:
the touch display panel provided by the embodiment of the application comprises: the display panel comprises a display panel and a touch layer, wherein the touch layer covers the display panel, the display panel comprises a display area and a non-display area, and the non-display area comprises a lead binding area; the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area, and the touch lead extends to the lead binding area along one side, far away from the display panel, of the insulating layer. Because the insulating layer in the touch layer is extended to the lead bonding area, and the touch lead can be extended to the lead bonding area along the insulating layer, compared with the prior art, the touch display panel provided by the embodiment of the application can effectively reduce the stress acting on the touch lead, thereby avoiding the breakage of the touch lead and effectively ensuring the touch function of the touch display panel.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a side view of a touch display panel according to an embodiment of the present disclosure;
fig. 2 is a side view of a wire bonding region provided by an embodiment of the present application;
fig. 3 is a side view of another touch display panel provided in the embodiment of the present application;
fig. 4 is a top view of an encapsulation layer provided in an embodiment of the present application;
fig. 5 is a front view of a lead bonding area according to an embodiment of the present application.
Detailed Description
In the conventional touch display panel, when the touch lead is bonded to the lead bonding area of the display panel, the touch lead is usually directly crossed over the non-display area, however, a portion of the non-display area crossed by the touch lead usually has an uneven structure (e.g., a bank area), so that when the touch lead crosses over the non-display area, stress acting on the touch lead is relatively large, and the touch lead is easily broken, thereby affecting the touch function of the touch display panel.
In the prior art, to avoid the breakage of the touch lead caused by repeated climbing of the touch lead, the following two methods can be generally adopted:
the first method comprises the following steps: organic materials are filled among the dike dam areas to realize the flattening of the surface topography of the dike dam areas, so that the stress accumulation of the dike dam areas can be reduced, and the stress acting on the touch lead can be relieved when the touch lead crosses the dike dam areas, thereby achieving the purpose of protecting the touch lead;
the second method comprises the following steps: extend the touch-control lead wire to the basement along the tip of sealed thin film layer, and then bind the touch-control lead wire to flexible printed circuit board on, wherein, the tip of sealed thin film layer is the slope form, like this, because the sealed thin film layer of slope form can cushion stress, consequently, the touch-control lead wire can reduce the stress of being used in on the touch-control lead wire when extending to the basement through the top of sealed thin film layer, reaches the purpose of protection touch-control lead wire.
However, in practical applications, it is found that although the two methods can reduce the stress acting on the touch lead to some extent, so as to achieve the purpose of protecting the touch lead, both methods have certain disadvantages, specifically:
for a first method: when the touch display panel is prepared, an independent process is needed to be added to manufacture the organic layer so as to flatten the surface appearance of the dam area, so that the situation that the touch lead is bent at a large angle still exists due to the increased process complexity and the insufficient flattening degree after the organic layer is added, and the breakage of the touch lead cannot be effectively avoided;
for the second method: when the touch lead passes through the end part of the sealing film layer with a slope, the stress applied to the touch lead by the end part of the sealing film layer is relatively large, so that the touch lead is easy to break, that is, after the end part of the sealing film layer is designed with a slope, the breakage of the touch lead cannot be effectively avoided.
In order to solve the above technical problem, an embodiment of the present application provides a touch display panel, including: the display panel comprises a display panel and a touch layer, wherein the touch layer covers the display panel, the display panel comprises a display area and a non-display area, and the non-display area comprises a lead binding area; the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area, and the touch lead extends to the lead binding area along one side, far away from the display panel, of the insulating layer.
In the touch display panel provided in the embodiment of the present application, the insulating layer in the touch layer extends to the lead bonding area, and the touch lead may extend to the lead bonding area along the insulating layer, which at least includes the following advantages compared to the two methods described above:
(1) the insulating layer in the touch layer is extended, and a new process cannot be added, so that the process is simple;
(2) the extension of the insulating layer in the touch layer can cover the end part of the thin film packaging layer on the display panel, so that the touch lead is prevented from bearing stress brought by the end part of the thin film packaging layer;
(3) the flattening degree of insulating layer is better, and the touch-control lead wire is followed the insulating layer is extended to the lead wire and is bound the district, can need not to climb repeatedly on the one hand, and on the other hand can effectively reduce the stress of effect on the touch-control lead wire, and then effectively avoids the touch-control lead wire fracture, guarantees touch-control display panel's touch-control function.
The technical solutions of the present application will be described clearly and completely below with reference to the specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the touch display panel provided in the embodiment of the present application may be an on-cell or out-cell touch display panel, and the touch display panel may be suitable for display panels of various modes, which is not specifically limited herein.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example 1
Fig. 1 is a side view of a touch display panel according to an embodiment of the present disclosure. The touch display panel is as follows.
The touch display panel shown in fig. 1 includes: display panel 11 and touch-control layer 12, touch-control layer 12 covers on display panel 11, wherein:
the display panel 11 includes a display region 111 and a non-display region 112, the non-display region 112 includes a wire bonding region 1121, and the touch layer 12 includes a touch wire 121 and an insulating layer 122.
In the embodiment of the application, the insulating layer 122 may extend along the X direction shown in fig. 1 and extend along the X direction to the lead bonding region 1121, and the touch lead 121 may extend along one side of the insulating layer 122 away from the display panel 11 to the lead bonding region 1121.
Since the touch lead 121 may extend to the lead bonding region 1121 along the insulating layer 122, compared to the prior art, the stress applied to the touch lead 121 may be effectively reduced, thereby preventing the touch lead 121 from being broken and ensuring the touch function of the touch display panel.
The non-display region 112 shown in fig. 1 may further include a bank region 1122, where the bank region 1122 is located between the lead bonding region 1121 and the display region 112, and the insulating layer 122 may further cover the bank region 1122 when extending to the lead bonding region 1121. Thus, the repeated climbing of the dam region 1122 when the touch lead 121 is led to the lead bonding region 1121 can be effectively avoided, so as to reduce the stress acting on the touch lead 121 and avoid the breakage of the touch lead 121.
In the embodiment of the present application, the portion of the insulating layer 122 extending to the wire bonding region 1121 may have a flattened curved structure. As shown in fig. 1, the insulating layer 122 is bent along the X direction and extends to the wire bonding region 1121, and the insulating layer 122 has a flattened bent structure.
Specifically, the height of the portion of the insulating layer 122 that extends to the wire bonding region 1121 with respect to the display panel 11 is gently lowered in the extension direction of the insulating layer 122. As shown in fig. 1, the height of the insulating layer 122 in the Y direction can be regarded as the height of the insulating layer 122 relative to the display panel 11, and the height of the insulating layer 122 in the Y direction gradually and gently decreases in the X direction.
In this way, the touch lead 121 may extend to the lead bonding region 1121 along the insulating layer 122 having the flattened curved structure, and the height of the portion of the touch lead 121 extending to the lead bonding region 1121 relative to the display panel 11 is also gradually lowered until the touch lead 121 extends to the lead bonding region 1121 and is bonded with the lead bonding region 1121.
The lead bonding region 1121 may include a touch lead bonding region (not shown in fig. 1), and when the touch lead 121 is bonded to the lead bonding region 1121, the touch lead bonding region may be bonded to the touch lead bonding region, where the touch lead bonding region may include a touch driver chip, and the touch lead 121 may be connected to the touch driver chip.
Fig. 2 is a side view of a wire bonding region according to an embodiment of the present application, as shown in fig. 2.
In fig. 2, 21 is a touch lead bonding area of the lead bonding area, 22 is a portion of the insulating layer that extends to cover the bank area and extends to the lead bonding area (specifically, a portion of the insulating layer that extends to the touch lead bonding area 11), 23 is a touch lead, 24 is a display panel, and the display panel 24 may specifically include a thin film transistor TFT and a light emitting diode OLED. As can be seen from fig. 2, the touch lead 23 can be bonded to the touch lead bonding area 21 after extending along the insulating layer 22 to the lead bonding area.
In fig. 2, when the touch lead 23 is bonded, a conductive adhesive film 25 (specifically, an ACF film) may be further covered on the touch lead 23, and the conductive adhesive film 25 may buffer the touch lead 23. A flexible printed wiring board 26 may also be covered on the conductive adhesive film 25 to achieve binding of the touch lead 23.
In this embodiment, the lead bonding region may further include a display drive lead bonding region, and the display drive lead bonding region may be used to bond the display drive lead. In this way, the common binding of the touch lead and the display driving lead in the lead binding region can be realized. The touch control lead and the display driving lead can be bound on different driving chips and can also be bound on the same driving chip.
In the touch display panel provided in the embodiment of the application, the touch lead 121 can extend to the lead bonding region 1121 along the insulating layer 122 having the flattened and bent structure, and is bonded to the touch lead bonding region in the lead bonding region 1121, so that compared with the prior art, repeated climbing of the touch lead 121 can be avoided, and thus the touch lead 121 is prevented from being broken.
The touch display panel shown in fig. 1 may further include a packaging layer 13, where the packaging layer 13 may cover the display area 111 of the display panel 11, in this embodiment, the packaging layer 13 may be a thin film packaging layer for packaging the display panel 11, or the thin film packaging layer and a substrate layer between the touch layer and the thin film packaging layer, or both the thin film packaging layer and the substrate layer may be included, which is not specifically limited herein.
In fig. 1, the end a of the encapsulation layer 13 is located at the boundary between the display region 111 and the non-display region 112, and when the insulating layer 122 extends to cover the bank region 1122, the end a of the encapsulation layer 13 can be covered, so that the problem of breakage of the touch lead 122 when crossing over the end a of the encapsulation layer 13 in the prior art can be effectively solved.
In the embodiment of this application, the touch-control lead is followed one side that display panel kept away from to the insulating layer extends to the district is bound to the lead wire, in order to further guarantee the touch-control lead is followed the insulating layer can not split when extending, the material of insulating layer can adopt the less organic material of stress, the organic material can be tetrafluoroethylene, polytetrafluoroethylene etc. this application embodiment does not do specifically and restricts.
In the touch display panel shown in fig. 1, the touch layer may further include a first conductive layer and a second conductive layer, where the first conductive layer may be located on a side of the insulating layer away from the display panel, and the second conductive layer may be located between the insulating layer and the first conductive layer, that is, the insulating layer may cover the second conductive layer and is used to insulate the driving electrode from the sensing electrode.
As shown in fig. 1, the first conductive layer may include a sensing electrode 123, the second conductive layer may include a driving electrode 124, the first conductive layer is located on a side of the insulating layer 122 away from the display panel 11, and the second conductive layer is located between the insulating layer 122 and the first conductive layer.
The sensing electrode 123 and the driving electrode 124 may be transparent conductive materials, including but not limited to: ITO (Indium Tin Oxide, english name), AgNW (nano silver wire), graphene, and the like, and may be a metal material.
The touch layer 12 shown in fig. 1 may further include a protection layer 125, wherein the protection layer 125 may cover the first conductive layer and may be used to encapsulate and protect the sensing electrode 123.
In other embodiments, the first conductive layer may include a driving electrode, the second conductive layer includes the sensing electrode, the first conductive layer includes the sensing electrode and the driving electrode, the second conductive layer includes a bridge for connecting the sensing electrode or the driving electrode, the second conductive layer includes the sensing electrode and the driving electrode, and the first conductive layer includes a bridge for connecting the sensing electrode or the driving electrode, which is not limited herein.
In an embodiment of the present application, the touch lead may include a sensing lead and a driving lead, where the sensing lead may be located in the same conductive layer as the sensing electrode, and the driving lead may be located in the same conductive layer as the driving electrode, for example, if the sensing electrode is located in the first conductive layer and the driving electrode is located in the second conductive layer, the sensing lead is located in the first conductive layer, and the driving lead is located in the second conductive layer.
It should be noted that, in the embodiment of the present application, the touch lead needs to extend along the insulating layer to the lead bonding area, so that in order to facilitate the touch lead to extend along the insulating layer, if the touch lead does not contact with one side of the insulating layer, which is away from the display panel, the touch lead can be led to the side of the insulating layer, which is away from the display panel, in a punching manner.
As shown in fig. 1, the sensing lead may be located in the first conductive layer, the driving lead may be located in the second conductive layer, the first conductive layer directly covers the insulating layer 122, and the insulating layer 122 directly covers the second conductive layer. The sensing lead may be regarded as being in contact with a side of the insulating layer 122 away from the display panel 11, and the driving lead may be regarded as being out of contact with a side of the insulating layer 122 away from the display panel 11. Therefore, in order to facilitate the driving lead to extend to the lead bonding region 1121 along the side of the insulating layer 122 away from the display panel 11, the insulating layer 122 may be perforated, so that the driving lead may be led to the side of the insulating layer 122 away from the display panel 11 by means of perforation and extend to the lead bonding region along the side of the insulating layer 122 away from the display panel 11.
In other embodiments, the touch lead may be led to the side of the insulating layer away from the display panel by other methods, for example, when the touch lead is prepared, the touch lead may be leaked (i.e., the touch lead is not covered by the insulating layer or other film layers), so that the touch lead may be led to the side of the insulating layer away from the display panel directly in the leakage area of the touch lead.
The touch display panel provided by the embodiment of the application comprises: the display panel comprises a display panel and a touch layer, wherein the touch layer covers the display panel, the display panel comprises a display area and a non-display area, and the non-display area comprises a lead binding area; the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area, and the touch lead extends to the lead binding area along one side, far away from the display panel, of the insulating layer. Because the insulating layer in the touch layer is extended to the lead bonding area, and the touch lead can be extended to the lead bonding area along the insulating layer, compared with the prior art, the touch display panel provided by the embodiment of the application can effectively reduce the stress acting on the touch lead, thereby avoiding the breakage of the touch lead and effectively ensuring the touch function of the touch display panel.
In the touch-control display panel that this application embodiment provided, can be with the insulating layer extension in the touch-control layer extremely the district is bound to the lead wire, the touch-control lead wire is followed the insulating layer is kept away from one side of display panel extends to the district is bound to the lead wire to the reduction is in stress on the touch-control lead wire avoids the fracture of touch-control lead wire, in other embodiments, can also with the packaging layer is extended to the district is bound to the lead wire, the touch-control lead wire is followed the packaging layer is kept away from one side of display panel extends to the district is bound to the lead wire, in order to reduce to be in stress on the touch-control lead wire avoids the fracture of touch-.
Fig. 3 is a side view of a touch display panel according to an embodiment of the present disclosure. The touch display panel is as follows.
The touch display panel shown in fig. 3 includes: display panel 31, packaging layer 32 and touch lead 33, wherein:
the display panel 31 may include a display region 311 and a non-display region 312, the non-display region 312 may include a wire-bonding region 3121, and the encapsulation layer 32 covers the display region 311 and may be used to encapsulate the display region 311.
It should be noted that the encapsulation layer 33 may be a film encapsulation layer for encapsulating the display panel 31, may also be the film encapsulation layer and a substrate layer between the touch layer and the film encapsulation layer, and may also include both the film encapsulation layer and the substrate layer, which is not limited specifically here. In the embodiment of the present application, the encapsulation layer 33 is taken as the thin film encapsulation layer for example.
In the embodiment of the application, the encapsulation layer 32 may extend along the X direction shown in fig. 3 and extend along the X direction to the lead bonding area 3121, and the touch lead 33 may extend along a side of the encapsulation layer 32 away from the display panel 31 to the lead bonding area 3121. Since the touch lead 33 can extend to the lead bonding area 3121 along the encapsulation layer 32, compared with the prior art, the stress acting on the touch lead 33 can be effectively reduced, thereby preventing the touch lead 33 from being broken and ensuring the touch function of the touch display panel.
The non-display region 312 shown in fig. 3 may further include a bank region 3122, the bank region 3122 is located between the lead bonding region 3121 and the display region 311, and the encapsulation layer 32 may further cover the bank region 3122 when extending to the lead bonding region 3121. Therefore, repeated climbing of the touch lead 33 in the dam region 3122 when the touch lead 33 is led to the lead bonding region 3121 can be effectively avoided, and further stress acting on the touch lead 33 is reduced, and breakage of the touch lead 33 is avoided.
In the embodiment of the present application, the portion of the encapsulation layer 32 extending to the lead bonding region 3121 may have a planarized horizontal structure, as shown in fig. 3, and the encapsulation layer 32 may extend horizontally to the lead bonding region 3121 along the X direction.
Specifically, the height of the portion of the encapsulation layer 32 that is extended to the wire-bonding region 3121 with respect to the display panel 31 remains constant along the extension direction of the encapsulation layer 32. As shown in fig. 3, the height of the encapsulation layer 32 in the Y direction may be regarded as the height of the encapsulation layer 32 relative to the display panel 31, and the height of the encapsulation layer 32 in the Y direction is kept constant in the X direction (i.e., the epitaxial direction of the encapsulation layer 32).
In this way, the touch leads 33 may extend horizontally along the encapsulation layer 32 to the lead bonding area 3121, and the height h of the portions of the touch leads 33 extending to the lead bonding area 3121 relative to the display panel 31 also remains unchanged.
The touch lead 33, after extending to the lead bonding area 3121, can be bonded to the lead bonding area 3121 over a height h. Specifically, the lead bonding area 3121 may include a touch lead bonding area (not shown in fig. 3), and the touch lead 33 is bonded to the lead bonding area 3121 at a height h, and may be the touch lead 33 is bonded to the touch lead bonding area, where the touch lead bonding area may include a touch driver chip, and the touch lead 33 may be connected to the touch driver chip.
In the touch display panel provided in the embodiment of the application, since the touch lead 33 can horizontally extend to the lead bonding area 3121 along the encapsulation layer 32 and is bonded to the touch lead bonding area in the lead bonding area 3121 at the height h, compared with the prior art, repeated climbing of the touch lead 33 can be avoided, and thus the touch lead 33 is prevented from being broken.
In this embodiment, the display panel shown in fig. 3 may further include a display driving lead (not shown in fig. 3), and the display driving signal may be a power supply lead, a signal scanning line, a data voltage signal line, and the like in the display panel, which is not limited herein. The display driving lead can be bound in the lead binding region 3121 according to the embodiment of the present application.
Specifically, the lead bonding area 3121 may further include a display driving lead bonding area (not shown in fig. 3) that may be used to bond the display driving leads, where the display driving lead bonding area may include a display driving chip, and after the display driving leads are bonded, the display driving leads may be connected to the display driving chip.
It should be noted that, in the embodiment of the present application, in order to facilitate the bonding of the display driving lead in the lead bonding region 3121, after the encapsulation layer 32 is epitaxially covered on the dam region 3122 and extends to the lead bonding region 3121, the touch lead bonding region may be covered, and the display driving lead bonding region is exposed, so as to facilitate the bonding of the display driving lead in the display driving lead region.
Fig. 4 is a top view of an encapsulation layer according to an embodiment of the present disclosure, as shown in fig. 4.
In fig. 4, the encapsulation layer 32 may include two regions 321 and 322, where part 321 of the encapsulation layer may be used to encapsulate the display area in the display panel, and part 322 of the encapsulation layer may be an encapsulation layer that extends to cover the dam region 3122 and extends to the wire bonding region 3121 shown in fig. 3.
41 shown in fig. 4 can be a touch lead bonding area in a lead bonding area, and 42 can be a display drive lead bonding area in a lead bonding area. As can be seen in fig. 4, the touch lead bonding areas 41 are covered by the epitaxial portion 322 of the encapsulation layer 32, showing that the drive lead bonding areas 42 are not covered by the encapsulation layer 32.
By designing the encapsulation layer 32 as shown in fig. 4, binding of the display drive leads to the display drive lead bonding regions of the lead bonding region 3121 can be achieved.
It should be noted that, since the touch lead 33 extends to the lead bonding area 3121 along the side of the encapsulation layer 32 away from the display panel 31 and has a certain height with respect to the display panel, and the display driving lead does not extend to the lead bonding area 3121 through the encapsulation layer 32, that is, the height of the display driving lead with respect to the display panel may be zero, in the embodiment of the present application, when the touch lead 33 and the display driving lead are jointly bonded in the lead bonding area 3121, the bonding height of the touch lead 33 is different from the bonding height of the display driving lead, where the bonding height of the touch lead 33 is greater than the bonding height of the display driving lead.
Fig. 5 is a front view of a lead bonding area according to an embodiment of the present application, as shown in fig. 5.
In fig. 5, 51 is a touch lead bonding area of the lead bonding area, 52 is a display driving lead bonding area of the lead bonding area, 53 is a portion of the encapsulation layer that extends to the lead bonding area (specifically, a portion of the encapsulation layer that extends to the touch lead bonding area 51), 54 is a touch lead, 55 is a display driving lead, and 56 is a display panel, which may specifically include a thin film transistor TFT and a light emitting diode OLED.
As can be seen from fig. 5, the touch lead 54 is bonded to the touch lead bonding area 51, the display driving lead 55 is bonded to the display driving lead bonding area 52, and the bonding height of the touch lead 54 is higher than that of the display driving lead 55.
In fig. 5, when the touch lead 54 and the display drive lead 55 are bonded, a conductive film 57 (specifically, an ACF film layer) may be further covered on the touch lead 54 and the display drive lead 55, the conductive film 57 may buffer the touch lead 54 and the display drive lead 55, and the conductive film 57 may cover the flexible printed circuit board 58, so as to bond the touch lead 54 and the display drive lead 55 at different heights.
Thus, on one hand, the touch lead 54 and the display drive lead 55 are jointly bound in the lead binding area, so that integration of the touch lead 54 and the display drive lead 55 can be realized, and on the other hand, the touch lead 54 and the display drive lead 55 are bound at different heights, repeated climbing of the touch lead 54 can be avoided, and short lines are avoided.
It should be noted that, in order to facilitate the bonding of the touch lead 54 and the display drive lead 55 at different heights, the flexible printed circuit board 58 may be partitioned in the lead bonding area according to the touch lead bonding area 51 and the display drive lead bonding area 52. Specifically, as shown in fig. 5, the flexible printed wiring board 58 may be divided into two pieces, one piece for bonding the touch lead 54 at the touch lead bonding area 51, and the other piece for bonding the display drive lead 55 at the display drive lead bonding area 52.
In practical applications, since the thickness of the encapsulation layer (about 10 μm) is much smaller than the thickness of the flexible printed circuit board, the flexible printed circuit board may not be subjected to the above-mentioned blocking process, and the embodiment of the present application is not particularly limited.
In addition, in order to facilitate the binding of the touch lead 54 and the display drive lead 55 with the lead binding region at different heights, the touch lead 54 and the display drive lead 55 may also extend to the lead binding region in the same direction. As shown in fig. 5, the touch lead 54 and the display drive lead 55 may extend in a direction perpendicular to the plane of fig. 5 outward to the lead bonding area.
In this embodiment, the touch lead extends to the lead bonding region along a side of the encapsulation layer away from the display panel, and in order to further ensure that the touch lead does not break when extending along the encapsulation layer, the material of the encapsulation layer may include an organic material with a small stress, for example, the material of the encapsulation layer may be a combination of an organic material and an inorganic material. The organic material may be tetrafluoroethylene, polytetrafluoroethylene, or the like, and the examples of the present application are not particularly limited.
In the touch display panel shown in fig. 3, the touch display panel may further include a first conductive layer and a second conductive layer, where the first conductive layer may be located on a side of the encapsulation layer away from the display panel, and the second conductive layer may be located between the encapsulation layer and the first conductive layer.
As shown in fig. 3, the first conductive layer may include a sensing electrode 35, the second conductive layer may include a driving electrode 34, the first conductive layer is located on a side of the encapsulation layer 32 away from the display panel 31, and the second conductive layer is located between the encapsulation layer 32 and the first conductive layer.
The sensing electrode 35 and the driving electrode 34 may be made of transparent conductive materials, including but not limited to: ITO (Indium Tin Oxide, english name), AgNW (nano silver wire), graphene, and the like, and may be a metal material.
The touch display panel shown in fig. 3 may further include an insulating layer 36 and a protective layer 37, wherein the insulating layer 36 may cover the second conductive layer and is used to insulate the driving electrode 34 and the sensing electrode 35 from each other, and the protective layer 37 may cover the first conductive layer and is used to encapsulate and protect the sensing electrode 35.
In other embodiments, the first conductive layer may include a driving electrode, the second conductive layer includes the sensing electrode, the first conductive layer includes the sensing electrode and the driving electrode, the second conductive layer includes a bridge for connecting the sensing electrode or the driving electrode, the second conductive layer includes the sensing electrode and the driving electrode, and the first conductive layer includes a bridge for connecting the sensing electrode or the driving electrode, which is not limited herein.
In an embodiment of the present application, the touch lead may include a sensing lead and a driving lead, where the sensing lead may be located in the same conductive layer as the sensing electrode, and the driving lead may be located in the same conductive layer as the driving electrode, for example, if the sensing electrode is located in the first conductive layer and the driving electrode is located in the second conductive layer, the sensing lead is located in the first conductive layer, and the driving lead is located in the second conductive layer.
It should be noted that, in this embodiment of the application, the touch lead needs to extend along the encapsulation layer to the lead bonding area, so that in order to facilitate extending the touch lead along the encapsulation layer, if the touch lead does not contact with one side of the encapsulation layer away from the display panel, the touch lead can be led to the side of the encapsulation layer away from the display panel in a punching manner.
As shown in fig. 3, the sensing leads may be located in the first conductive layer, and the driving leads may be located in the second conductive layer, which directly covers the encapsulation layer 32. The driving leads may be regarded as being in contact with a side of the encapsulation layer 32 away from the display panel 31, and the sensing leads may be regarded as being out of contact with a side of the encapsulation layer 32 away from the display panel 31. In this way, in order to facilitate the sensing leads to extend to the lead bonding regions 3121 along the side of the encapsulation layer 32 away from the display panel 31, the insulating layer 36 may be perforated such that the sensing leads may be introduced to the side of the encapsulation layer 32 away from the display panel 31 by means of perforation and extend to the lead bonding regions 3121 along the side of the encapsulation layer 32 away from the display panel 31.
In other embodiments, the touch lead may be led to the side of the encapsulation layer away from the display panel by other methods, for example, when the touch lead is prepared, the touch lead may be leaked (i.e., the touch lead is not covered by other film layers), so that the touch lead may be led to the side of the encapsulation layer away from the display panel directly in the leakage area of the touch lead.
In the touch-control display panel that this application embodiment provided, the packaging layer cover in the display area, the packaging layer is extensive extremely the lead wire binding area, the touch-control lead wire is followed the packaging layer is kept away from one side in display area extends to the lead wire binding area. Because the touch display panel extends the packaging layer to the lead wire binding area, and the touch lead wire can extend to the lead wire binding area along the packaging layer, compared with the prior art, the touch display panel can effectively reduce stress acting on the touch lead wire, thereby avoiding the touch lead wire from being broken and effectively ensuring the touch function of the touch display panel.
Example 2
An embodiment of the present application further provides a touch display device, where the touch display device may include the touch display panel described in embodiment 1.
It should be apparent to those skilled in the art that while the preferred embodiments of the present invention have been described, additional variations and modifications in these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A touch display panel, comprising: display panel, encapsulation layer and touch-control layer, the touch-control layer cover in on the display panel, the encapsulation layer is located display panel with between the touch-control layer, wherein:
the display panel comprises a non-display area, and the non-display area comprises a lead bonding area;
the touch layer comprises a touch lead and an insulating layer, the insulating layer extends to the lead binding area and covers the packaging layer, and the touch lead extends to the lead binding area along one side of the insulating layer, which is far away from the display panel; the display panel further includes a display area, the non-display area further includes a bank area, wherein:
the dam region is positioned between the lead binding region and the display region, and the insulating layer extends outwards and covers the dam region;
the part of the insulating layer extending to cover the dyke region and the lead binding region is provided with a flattened bent structure;
the lead binding area comprises a touch lead binding area and a display drive lead binding area, and the touch lead is bound with the touch lead binding area after extending to the lead binding area; the display drive lead binding region is used for binding the display drive lead.
2. The touch display panel of claim 1,
the part of the insulating layer extending to the lead bonding area is gently reduced along the extension direction relative to the height of the display panel.
3. The touch display panel of claim 1,
the insulating layer is made of an organic material.
4. The touch display panel of claim 1,
the touch control lead and the display driving lead are connected with the same driving chip.
5. The touch display panel of claim 1,
if the touch lead is not in mutual contact with one side, far away from the display panel, of the insulating layer, the touch lead is led to one side, far away from the display panel, of the insulating layer in a hole opening mode.
6. A touch display device, comprising: the touch display panel according to any one of claims 1 to 5.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711244662.3A CN108155211B (en) | 2017-11-30 | 2017-11-30 | Touch display panel and touch display device |
| PCT/CN2018/096163 WO2019105045A1 (en) | 2017-11-30 | 2018-07-18 | Touch display panel and touch display device |
| US16/464,533 US11106298B2 (en) | 2017-11-30 | 2018-07-18 | Touch display panels and touch display devices |
| TW107126241A TWI666579B (en) | 2017-11-30 | 2018-07-27 | Touch display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711244662.3A CN108155211B (en) | 2017-11-30 | 2017-11-30 | Touch display panel and touch display device |
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| CN108155211A CN108155211A (en) | 2018-06-12 |
| CN108155211B true CN108155211B (en) | 2021-07-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019105045A1 (en) * | 2017-11-30 | 2019-06-06 | 云谷（固安）科技有限公司 | Touch display panel and touch display device |
| CN109904197A (en) * | 2019-01-31 | 2019-06-18 | 昆山国显光电有限公司 | A kind of display panel and display equipment |
| CN111090357B (en) * | 2019-11-25 | 2022-04-22 | 业成科技（成都）有限公司 | Touch module, preparation method thereof and electronic equipment |
| CN111403620A (en) * | 2020-03-25 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| CN114115601B (en) * | 2021-11-24 | 2023-08-01 | 昆山国显光电有限公司 | Display device |
| CN114253420B (en) | 2021-12-13 | 2023-08-22 | 合肥维信诺科技有限公司 | Touch display panel and touch display device |
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| CN107180852B (en) * | 2017-05-18 | 2019-11-15 | 上海天马有机发光显示技术有限公司 | A kind of touch-control display panel and display device |
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Application publication date: 20180612 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Assignor: The valley (Guan) Technology Co. Ltd. Contract record no.: X2019990000155 Denomination of invention: Touch display panel and touch display device License type: Common License Record date: 20191030 |
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Effective date of registration: 20191204 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Applicant after: Guangzhou Guoxian Technology Co., Ltd Address before: 065500 Hebei Langfang County Guan emerging industry demonstration area Applicant before: The valley (Guan) Technology Co. Ltd. |
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