CN208157393U - A kind of electronic equipment and its chip heat radiator - Google Patents
A kind of electronic equipment and its chip heat radiator Download PDFInfo
- Publication number
- CN208157393U CN208157393U CN201820841219.8U CN201820841219U CN208157393U CN 208157393 U CN208157393 U CN 208157393U CN 201820841219 U CN201820841219 U CN 201820841219U CN 208157393 U CN208157393 U CN 208157393U
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- Prior art keywords
- radiator
- resilient legs
- chip
- clamping
- hole
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- 230000005489 elastic deformation Effects 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses the chip heat radiator of a kind of electronic equipment, including the mainboard for chip and the radiator for being close on the chip surface radiate to it, circumferential direction on mainboard around chip is provided with several clamping through-holes, its circumferential direction is provided with several resilient legs on radiator, and each resilient legs are inserted in respectively in corresponding clamping through-hole, are abutted with the elastic force generated by elastic deformation with the inner wall of clamping through-hole.In this way, user is when installing or removing radiator, each resilient legs only need to be pinched with hand, make its to contract to a certain degree after, then each resilient legs are clamped into corresponding each clamping through-hole or the extraction out of each clamping through-hole.The installation and removal process of radiator is simple and easy, easily laborsaving, while also can effectively avoid damaging the component on radiator or mainboard.A kind of electronic equipment is also disclosed in the utility model, and its advantages are as described above.
Description
Technical field
The utility model relates to technical field of electronic equipment, the in particular to chip heat radiator of a kind of electronic equipment.This
Utility model further relates to a kind of electronic equipment including said chip radiator.
Background technique
With the development of China Electronics's technology, more and more electronic equipments have been used widely.
In the electronic device, it generally requires and uses a large amount of mainboard, CPU, chip, memory, PCIE, HDD, SSD, power supply mould
The components such as block and resistance, capacitor, these components can generate heat when circuit is run, and some components generate
Heat ratio it is more significant, such as segment chip.Come for this purpose, being generally required on mainboard and radiator being separately provided for the segment chip
It radiates.
Currently, heat-pipe air-cooling radiator of the radiator to radiate to chip usually using close contact, especially by will
Heat pipe (such as copper pipe) abutting on the surface of the chip, is absorbed by the good heat conductivity of heat pipe (and heat-absorbing action of silicone grease)
Chip generates heat, and conducts heat in the cooling fin of top, then carries out forced convertion heat dissipation to cooling fin by fan.For
The radiating efficiency of raising, it is more that quantity is generally arranged in the cooling fin on radiator, and arranges close, and volume is larger.In view of core
The heat dissipation area very little of piece, and the volume of radiator is larger, for the mounting stability for guaranteeing radiator, prevents from surprisingly toppling over,
It generally requires and radiator is fixed using additional solid lock attachment on mainboard.
In the prior art, there are mainly three types of the solid lock forms of radiator, i.e. screw solid lock, hook solid lock and rubber rivet
Solid lock (push pin).Wherein, rubber rivet solid lock form is the main solid lock mode of radiator.But rubber rivet solid lock
Although form is easily installed, be but unfavorable for dismantling.When passing through rubber rivet fixed heat sink, user needs firmly respectively will
The pressing of each rubber rivet enters in the soft nail of expansion set, expand it is soft withstand on forced expansion after, be connected to the bottom of mainboard
On face, radiator is fixed, and can not be disengaged.However, user then can not when needing to dismantle radiator and being replaced or repaired
Rubber rivet or the soft top of expansion are taken out from mainboard easily, generally requires and is disassembled by violence, it so will certainly be to radiator
Or mainboard and its component damage, radiator can not continue to use after disassembly.
Therefore, how to allow users to simply, easily complete the disassembling operations to the radiator of chip, avoid operating
Radiator or component are damaged in journey, are this fields.
Utility model content
The purpose of the utility model is to provide the chip heat radiators of a kind of electronic equipment, are able to use family simply, conveniently
It completes that the disassembling operations of the radiator of chip are avoided damaging radiator or component in operating process in ground.This is practical
Novel another object is to provide a kind of electronic equipment including said chip radiator.
In order to solve the above technical problems, the utility model provides the chip heat radiator of a kind of electronic equipment, including it is used for
The mainboard of chip and for being tightly attached to the radiator to radiate on the chip surface to it, around institute on the mainboard
The circumferential direction for stating chip is provided with several clamping through-holes, its circumferential direction is provided with several resilient legs on the radiator, and
Resilient legs described in each item are inserted in respectively in corresponding clamping through-hole, with the elastic force generated by elastic deformation
It is abutted with the inner wall of the clamping through-hole.
Preferably, the bottom of resilient legs described in each item is provided with for abutting with the bottom surface of the mainboard to prevent it
The hook popped up from the clamping through-hole.
Preferably, each clamping through-hole connects into annular in the circumferential direction of the chip.
Preferably, 4~8 resilient legs have been uniformly arranged in the circumferential direction on the radiator.
Preferably, each resilient legs are symmetrical in the circumferential direction of the radiator.
Preferably, one end of each resilient legs is both connected on the top outer surface of the radiator, and each described
Resilient legs are in aduncate arc strip.
Preferably, further include on the outer surface for be connected to the radiator between the inner wall of resilient legs described in each item
Tensioning spring, and the tensioning state of the tensioning spring is synchronous with the tensioning state of resilient legs described in each item.
The utility model also provides a kind of electronic equipment, including shell is filled with the intracorporal chip cooling of the shell is set to
It sets, wherein the chip heat radiator is specially chip heat radiator described in any of the above embodiments.
The chip heat radiator of electronic equipment provided by the utility model mainly includes mainboard and radiator.Wherein, main
Chip is installed, radiator is arranged on mainboard, is mainly used for radiating to chip on plate.The specific setting structure of radiator
For：Circumferential direction on mainboard around chip is provided with several clamping through-holes, while being provided in the circumferential direction of radiator several
Resilient legs, and each resilient legs are plugged in respectively in corresponding clamping through-hole, and each resilient legs are each
It abutted, squeeze by its inner wall in a clamping through-hole, produce elastic deformation, every resilient legs are squeezed to generate diameter
To elastic force outwardly, closely abutted with the inner wall of each clamping through-hole.And each clamping through-hole is respectively in the circumferential direction of chip, and each
Resilient legs are also distributed about in the circumferential direction of radiator, thus each resilient legs integrally by from clamping through-hole radially
Pressure inwardly, so that each resilient legs are integrally clamped to contract, and then by each resilient legs into each clamping
After through-hole, stable clamping is formed with each clamping through-hole using elasticity tension and is connect.Meanwhile the increase of elastic force improves each item
Stiction between resilient legs and each clamping through-hole wall, guarantees the mounting stability of radiator.In this way, user is pacifying
When filling radiator, each resilient legs only need to be pinched with hand, make its to contract to a certain degree after, then by each resilient legs card
It taps into corresponding each clamping through-hole, guarantees mounting stability using elastic force.Conversely, user when dismantling radiator, only needs
Each resilient legs are pinched with hand, continue it inwardly after shrinking to a certain degree, then each resilient legs are logical from each clamping
It is extracted in hole.Wherein, the installation and removal process of radiator is simple and easy, easily laborsaving, while also can effectively avoid
Component on radiator or mainboard is damaged.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is a kind of overall structure diagram of specific embodiment provided by the utility model.
Fig. 2 is the status diagram after the disassembly of radiator shown in Fig. 1.
Wherein, in Fig. 1-Fig. 2：
Chip -1, mainboard -2 are clamped through-hole -201, radiator -3, resilient legs -301, hook -302, tensioning
Spring -4.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to FIG. 1, Fig. 1 is a kind of overall structure diagram of specific embodiment provided by the utility model.
In a kind of specific embodiment provided by the utility model, 1 radiator of chip of electronic equipment is mainly wrapped
Include mainboard 2 and radiator 3.
Wherein, chip 1 is installed, radiator 3 is arranged on mainboard 2, is mainly used for radiating to chip 1 on mainboard 2.
The specific setting structure of radiator 3 is：Circumferential direction on mainboard 2 around chip 1 is provided with several clamping through-holes 201, simultaneously
Several resilient legs 301 are provided in the circumferential direction of radiator 3, and each resilient legs 301 are plugged in respective correspondence respectively
Clamping through-hole 201 in, and each resilient legs 301 in each clamping through-hole 201 by its inner wall abut, squeeze, generate
Elastic deformation, every resilient legs 301 are squeezed to generate elastic force radially, with each clamping through-hole 201
Inner wall closely abut.
Each clamping through-hole 201 is respectively in the circumferential direction of chip 1, and each resilient legs 301 are also distributed about the week of radiator 3
Upwards, therefore each resilient legs 301 are whole by the pressure radially inwards from clamping through-hole 201, so that respectively
Resilient legs 301 are whole to be clamped to contract, and then by each resilient legs 301 into after each clamping through-hole 201, and bullet is utilized
Property tension forms stable clamping with each clamping through-hole 201 and connect.Meanwhile the increase of elastic force improves each resilient legs
Stiction between 301 and each clamping 201 inner wall of through-hole, guarantees the mounting stability of radiator 3.
In this way, user when installing radiator 3, only need to pinch each resilient legs 301 with hand, keep it certain to contract
After degree, then each resilient legs 301 are clamped into corresponding each clamping through-hole 201, elastic force is utilized to guarantee that installation is stablized
Property.Conversely, user when dismantling radiator 3, only need to pinch each resilient legs 301 with hand, it is made inwardly to continue to shrink centainly
After degree, then each resilient legs 301 are extracted out of each clamping through-hole 201.Wherein, the peace installation and dismantling of radiator 3
It is simple and easy to unload process, it is easily laborsaving, while also can effectively avoid damaging the component on radiator 3 or mainboard 2.
Further, in view of when the elastic deformation of each resilient legs 301 is larger, in each resilient legs 301
Have accumulated biggish elastic reaction, to prevent when elastic reaction is larger, due to the factors such as vibration influence and make each item elasticity
Supporting leg 301 is unexpected to be deviate from from each clamping through-hole 201, and the present embodiment is provided on the bottom of each resilient legs 301
Hook 302.The hook 302 can tightly hook mainboard 2 and the bottom surface for being clamped 201 joint of through-hole, to complete to pacify in radiator 3
After dress, by the withstanding effect of hook 302 and 2 bottom surface of mainboard, it effectively prevent each resilient legs 301 from each clamping through-hole
It is popped up in 201.
For convenience of the setting and distribution of clamping through-hole 201, the present embodiment, each clamping through-hole 201 can be located on mainboard 2
The circumferential direction head and the tail connection arrangement of chip 1, in this way, each clamping through-hole 201 will form one completely around chip 1
Annular (connects 1 part of chip at center and the mainboard 2 of periphery by connecting rod).So that each elasticity on radiator 3
Supporting leg 301 can be installed on any direction around chip 1.Certainly, if considering on mainboard 2 at 1 position of chip
Structural strength, it is each clamping through-hole 201 can also discontinuously be distributed on mainboard 2 be located at chip 1 around annular region in.
Further, for the convenience of the user to the operation of clutching of each resilient legs 301, while to improve mounting stability,
In the present embodiment, 4~8 resilient legs 301 are evenly arranged in the circumferential direction of radiator 3.Certainly, more or less
Resilient legs 301 can similarly use.So set, can be to a certain degree by the quantity increase for increasing resilient legs 301
Increase the abutting stability between clamping through-hole 201, meanwhile, when the quantity of resilient legs 301 is more, the entirety of radiator 3
Stress condition is intended to balance, and is conducive to improve mounting stability.
It further, can be by each resilient legs when the quantity for the resilient legs 301 being arranged on radiator 3 is more
301 be upwardly formed in the week of radiator 3 it is symmetrical.So set, radiator 3 it is same radially, due to two sides by
Radial component size it is identical and contrary, therefore radiator 3 whole stress condition balance, be effectively ensured installation stablize
Property, while also making the elastic deformation degree of each resilient legs 301 identical.
In a kind of preferred embodiment about resilient legs 301, whole each resilient legs 301 can be in curve inwardly
Arc strip structure, while one end of each resilient legs 301 can be both connected on the top outer surface of radiator 3.So
Setting, for each resilient legs 301 when plugging in each corresponding clamping through-hole 201, each resilient legs 301 can be inside
It shrinks and generates elastic deformation, so that the convenient inner surface with each clamping through-hole 201 forms nature and abuts.
Furthermore, it is contemplated that radiator 3 is at work, need to be close to the heat that the surface of chip 1 could rapidly generate chip 1
Amount absorbs, in view of this, being additionally arranged several tensioning springs 4 in the present embodiment.Specifically, one end of each tensioning spring 4 connects
On the outer surface of radiator 3, and the other end of each tensioning spring 4 is connected in corresponding each resilient legs 301.
So set, being able to drive tensioning spring 4 when each resilient legs 301 are when carrying out to contract or expanding outwardly and being stretched
Contracting.Also, each tensioning spring 4 each resilient legs 301 in the raw under (expansion state not being pressurized) when,
(do not generate elastic deformation) in the raw, and each elasticity is in the case where each resilient legs 301 are in compression contraction state
It is to be also at compression contraction state.In this way, the elastic telescopic by tensioning spring 4 acts on, each resilient legs can be reinforced
301 elastic telescopic degree.
Further, one end of each tensioning spring 4 is attached to the bottom position of radiator 3, and each tensioning spring 4
The other end be attached to the top position of resilient legs 301, so set, when each resilient legs 301 are to contract
When, i.e., tensioning spring 4 is compressed diagonally downward.For tensioning spring 4, the conjunction from each resilient legs 301 that is subject to
Power is only left downward component due to radially offseting each other, so that downward pressure is formed to radiator 3, so that dissipating
Hot device 3 is pressed on the surface of chip 1, improves heat pipe and the compression degree on 1 surface of chip and the heat absorption of heat pipe of radiator 3
Efficiency.
The present embodiment also provides a kind of electronic equipment, mainly include shell and setting intracorporal 1 radiator of chip of shell,
In, 1 radiator of chip is identical as above-mentioned related content, and details are not described herein again.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (8)
1. the chip heat radiator of a kind of electronic equipment, which is characterized in that including the mainboard (2) for chip (1) and use
In being tightly attached to the radiator (3) to radiate on the chip (1) surface to it, the chip (1) is surround on the mainboard (2)
Circumferential direction be provided with several clampings through-hole (201), its circumferential direction is provided with several resilient legs on the radiator (3)
(301), and resilient legs described in each item (301) are inserted in respectively in corresponding clamping through-hole (201), to pass through
The elastic force that elastic deformation generates is abutted with the inner wall of clamping through-hole (201).
2. chip heat radiator according to claim 1, which is characterized in that the bottom of resilient legs described in each item (301)
It is provided with the hook for abutting with the bottom surface of the mainboard (2) to prevent it from popping up from clamping through-hole (201)
(302)。
3. chip heat radiator according to claim 2, which is characterized in that each clamping through-hole (201) is in the core
Annular is connected into the circumferential direction of piece (1).
4. chip heat radiator according to claim 3, which is characterized in that circumferentially uniformly set on the radiator (3)
It is equipped with 4~8 resilient legs (301).
5. chip heat radiator according to claim 4, which is characterized in that each resilient legs (301) dissipate described
It is symmetrical in the circumferential direction of hot device (3).
6. chip heat radiator according to claim 5, which is characterized in that one end of each resilient legs (301) is equal
It is connected on the top outer surface of the radiator (3), and each resilient legs (301) are in aduncate arc strip
Shape.
7. chip heat radiator according to claim 1-6, which is characterized in that further include being connected to the heat dissipation
Tensioning spring (4) on the outer surface of device (3) between the inner wall of resilient legs described in each item (301), and the tensioning spring
(4) tensioning state is synchronous with the tensioning state of resilient legs described in each item (301).
8. a kind of electronic equipment, including shell and it is set to the intracorporal chip heat radiator of the shell, which is characterized in that the core
Piece radiator is specially the described in any item chip heat radiators of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820841219.8U CN208157393U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic equipment and its chip heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820841219.8U CN208157393U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic equipment and its chip heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157393U true CN208157393U (en) | 2018-11-27 |
Family
ID=64388761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820841219.8U Active CN208157393U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic equipment and its chip heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208157393U (en) |
-
2018
- 2018-05-31 CN CN201820841219.8U patent/CN208157393U/en active Active
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