CN208140987U - The low-power consumption circuit structure of high speed optoelectronic transceiver module - Google Patents
The low-power consumption circuit structure of high speed optoelectronic transceiver module Download PDFInfo
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- CN208140987U CN208140987U CN201820687118.XU CN201820687118U CN208140987U CN 208140987 U CN208140987 U CN 208140987U CN 201820687118 U CN201820687118 U CN 201820687118U CN 208140987 U CN208140987 U CN 208140987U
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Abstract
The utility model discloses the low-power consumption circuit structures of high speed optoelectronic transceiver module, it includes printed circuit board, printed circuit board one end has signal input output end mouth, the printed circuit board over-assemble has VCSEL laser array, CDR+Driver integrated chip, PD photodetector array and CDR+TIA integrated chip, the CDR+Driver integrated chip integrated clock restores chip functions and laser driving function, the CDR+TIA integrated chip integrated clock restores chip functions and trans-impedance amplifier function, the VCSEL laser array connect with CDR+Driver integrated chip and forms signal transmitting terminal, the PD photodetector array connect with CDR+TIA integrated chip and forms signal receiving end.The utility model uses the design of integrated chip, can reduce by two independent CDR chips in this way, assembly is simple, low in cost, 25% or more lower power consumption.
Description
Technical field
The utility model relates to technical field of optical fiber communication more particularly to the low consumption circuit knots of high speed optoelectronic transceiver module
Structure.
Background technique
Increasingly developed with communication field, traditional transmission technology has been difficult to meet wanting for transmission capacity and speed
It asks, in fields such as typical application fields such as data center, network connection, search engine, high-performance calculation, to prevent broadband from providing
To planning that high speed network agreement of new generation is disposed, this is just needed accordingly by the deficiency in source, common carrier and service suppliers
High speed transceiver module to meet the data transportation requirements of high density high-speed.Short distance multidiameter delay optical transport is vertical cavity surface
Emitting laser（VCSEL）And parallel light interconnection technique is not reducing system with piece transmission optical fiber of each laser alignment
Under the premise of transmit capacity, the transmission rate of every optical fiber is reduced, to realize a kind of simple, cheap and reliable optical transport
Mode.An individual CDR core is equipped in transmitting terminal and receiving end in the circuit structure of existing high speed optoelectronic transceiver module
Piece（Clock recovery chip）, energy consumption is high, and assembly is complicated, at high cost.
Summary of the invention
In order to solve deficiency in the prior art, the purpose of this utility model is to provide a kind of at low cost, assembly simply
High speed optoelectronic transceiver module low-power consumption circuit structure.
To achieve the above object, the utility model uses following technical scheme：
The low-power consumption circuit structure of high speed optoelectronic transceiver module, including printed circuit board, printed circuit board one end have letter
Number input/output port, the printed circuit board over-assemble have VCSEL laser array, CDR+Driver integrated chip, PD light
Electric explorer array and CDR+TIA integrated chip, the CDR+Driver integrated chip integrated clock restore chip functions and
Laser driving function, the CDR+TIA integrated chip integrated clock restores chip functions and trans-impedance amplifier function, described
VCSEL laser array connect with CDR+Driver integrated chip and forms signal transmitting terminal, the PD photodetector array
It is connect with CDR+TIA integrated chip and forms signal receiving end.
The VCSEL laser array, CDR+Driver integrated chip, PD photodetector array and CDR+TIA collection
It is four-way device at chip.
The VCSEL laser array, CDR+Driver integrated chip, PD photodetector array and CDR+TIA collection
At chip by conducting resinl direct-assembling on the electrode of printed circuit board.
The signal input output end mouth is golden finger.
The utility model uses the design of integrated chip, can reduce by two independent CDR chips in this way, and assembly is simple,
It is low in cost, 25% or more lower power consumption.
Detailed description of the invention
The utility model is described in further details below in conjunction with the drawings and specific embodiments：
Fig. 1 is the schematic diagram of the low-power consumption circuit structure of the utility model high speed optoelectronic transceiver module；
Fig. 2 is the enlarged drawing in Fig. 1 at D.
Specific embodiment
As shown in Figure 1 or 2, the low-power consumption circuit structure of the utility model high speed optoelectronic transceiver module, including printing electricity
Road plate 1,1 one end of printed circuit board have signal input output end mouth 2, and 1 over-assemble of printed circuit board has VCSEL laser
Array 3, CDR+Driver integrated chip 4, PD photodetector array 5 and CDR+TIA integrated chip 6, the CDR+
4 integrated clock of Driver integrated chip restores chip（CDR）Function and laser driving（Driver）Function, the CDR+TIA
6 integrated clock of integrated chip restores chip（CDR）Function and trans-impedance amplifier（TIA）Function, the VCSEL laser array 3
Signal transmitting terminal, the PD photodetector array 5 and CDR+TIA collection are connect and formed with CDR+Driver integrated chip 4
It is connected at chip 6 and forms signal receiving end.
The VCSEL laser array 3, CDR+Driver integrated chip 4, PD photodetector array 5 and CDR+TIA
Integrated chip 6 is four-way device.
The VCSEL laser array 3, CDR+Driver integrated chip 4, PD photodetector array 5 and CDR+TIA
Integrated chip 6 is by conducting resinl direct-assembling on the electrode of printed circuit board 1.
The signal input output end mouth 2 is golden finger.
The working principle of the utility model：After signal transmitting terminal, electric signal golden finger input, by CDR+Driver
Integrated chip 4, the CDR function part of CDR+Driver integrated chip 4 compensate be input to after the loss of its link and noise reduction CDR+
The Driver function part of Driver integrated chip 4, the Driver function part of CDR+Driver integrated chip 4 is welded by spun gold will
Signal is input to VCSEL laser array 3 to drive its light emission；In signal receiving end, optical signal is coupled to PD photodetector
After array 5, CDR+TIA integrated chip 6 is input a signal by spun gold weldering, by the TIA function of CDR+TIA integrated chip 6
Signal is amplified in portion, and the CDR function part for being then input to CDR+TIA integrated chip 6 carries out link compensation and signal shaping, most
It is transferred to golden finger output electric signal eventually.
The utility model use above technical scheme, using the design of integrated chip, can reduce in this way two it is independent
CDR chip, assembly is simple, low in cost, 25% or more lower power consumption.
Claims (4)
1. the low-power consumption circuit structure of high speed optoelectronic transceiver module, including printed circuit board, printed circuit board one end has signal
Input/output port, it is characterised in that：The printed circuit board over-assemble has VCSEL laser array, CDR+Driver integrated
Chip, PD photodetector array and CDR+TIA integrated chip, the CDR+Driver integrated chip integrated clock restore core
Piece function and laser driving function, the CDR+TIA integrated chip integrated clock restore chip functions and trans-impedance amplifier function
Can, the VCSEL laser array connect with CDR+Driver integrated chip and forms signal transmitting terminal, and the PD photoelectricity is visited
Device array is surveyed to connect with CDR+TIA integrated chip and form signal receiving end.
2. the low-power consumption circuit structure of high speed optoelectronic transceiver module according to claim 1, it is characterised in that：It is described
VCSEL laser array, CDR+Driver integrated chip, PD photodetector array and CDR+TIA integrated chip are four
Passage device.
3. the low-power consumption circuit structure of high speed optoelectronic transceiver module according to claim 1, it is characterised in that：It is described
VCSEL laser array, CDR+Driver integrated chip, PD photodetector array and CDR+TIA integrated chip are by leading
Electric glue direct-assembling is on the electrode of printed circuit board.
4. the low-power consumption circuit structure of high speed optoelectronic transceiver module according to claim 1, it is characterised in that：The signal
Input/output port is golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820687118.XU CN208140987U (en) | 2018-05-09 | 2018-05-09 | The low-power consumption circuit structure of high speed optoelectronic transceiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820687118.XU CN208140987U (en) | 2018-05-09 | 2018-05-09 | The low-power consumption circuit structure of high speed optoelectronic transceiver module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208140987U true CN208140987U (en) | 2018-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820687118.XU Active CN208140987U (en) | 2018-05-09 | 2018-05-09 | The low-power consumption circuit structure of high speed optoelectronic transceiver module |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020220829A1 (en) * | 2019-04-29 | 2020-11-05 | 杭州芯耘光电科技有限公司 | Adjustable bidirectional transmission micro-optoelectronic system supporting online upgrade configuration |
-
2018
- 2018-05-09 CN CN201820687118.XU patent/CN208140987U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020220829A1 (en) * | 2019-04-29 | 2020-11-05 | 杭州芯耘光电科技有限公司 | Adjustable bidirectional transmission micro-optoelectronic system supporting online upgrade configuration |
| US11522613B2 (en) | 2019-04-29 | 2022-12-06 | Hangzhou Xin Yun Technology Co., Ltd | Adjustable bidirectional transmission micro-optoelectronic system supporting online upgrade configuration |
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