CN208126279U - Fan-free heat dissipation computer - Google Patents

Fan-free heat dissipation computer Download PDF

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Publication number
CN208126279U
CN208126279U CN201820426881.7U CN201820426881U CN208126279U CN 208126279 U CN208126279 U CN 208126279U CN 201820426881 U CN201820426881 U CN 201820426881U CN 208126279 U CN208126279 U CN 208126279U
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China
Prior art keywords
front housing
heat
several
conducting piece
fan
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Active
Application number
CN201820426881.7U
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Chinese (zh)
Inventor
史洪波
王玉章
张秋香
陈志列
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Shenzhen Yanxiang Smart Technology Co ltd
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EVOC Intelligent Technology Co Ltd
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Priority to CN201820426881.7U priority Critical patent/CN208126279U/en
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Abstract

The utility model relates to a kind of fan-free heat dissipation computers, including front housing, circuit board module and heat-conducting piece;Front housing includes front housing substrate and front housing side plate;Several recess being set in distance are respectively equipped on the side of the length direction of front housing side plate;Circuit board module includes wiring board and primary processor;Heat-conducting piece includes heat-conducting piece main body, boss and the installation wing;The corresponding primary processor that is sticked of boss, the installation wing connect front housing side plate;Front housing is that Heat Conduction Material is made with heat-conducting piece.Above-mentioned fan-free heat dissipation computer, by the heat-conducting piece that is sticked on assist side component, heat-conducting piece connects front housing, heat-conducting piece is that Heat Conduction Material is made with front housing, with Thermal conductivity, the heat that circuit board module generates effectively is dispersed into the external world, prevents over-heat inside;Meanwhile the front housing side plate of front housing is equipped with recess, increasing heat radiation area, to improve radiating efficiency.

Description

Fan-free heat dissipation computer
Technical field
The utility model relates to electronic equipment dissipating heat technical fields, more particularly to a kind of fan-free heat dissipation computer.
Background technique
Handheld computer has become the necessity of people's life and work study, with universal, people's application of computer The chance of handheld computer is also more and more, needs in different occasions using handheld computer.Pacify the inside of handheld computer Equipped with a large amount of electronic component, a large amount of thermal energy, therefore the inside setting of computer can be generated when computer operation Radiator fan radiates.
However, the installation of fan needs to occupy certain space, and fan operation needs to consume a large amount of energy, in this way Radiator structure be not suitable for the handheld computer of compact.
Utility model content
Based on this, the utility model is directed to the demand of handheld computer, provides a kind of fan-free heat dissipation computer, structure letter Single, perfect heat-dissipating effectively improves radiating efficiency, prevents over-heat inside.
In order to realize the purpose of this utility model, the utility model adopts the following technical solution:
A kind of fan-free heat dissipation computer including front housing, the circuit board module being installed in the front housing and is sticked described The heat-conducting piece of circuit board module;The front housing includes the front housing side plate of front housing substrate and the connection front housing substrate periphery;It is described Several recess being set in distance are respectively equipped on the side of the length direction of front housing side plate;The circuit board module includes route Plate and the primary processor being installed on the wiring board;The heat-conducting piece includes heat-conducting piece main body, from heat-conducting piece main body court The boss and the outwardly extending installation wing of the heat-conducting piece main body opposite end extended to the circuit board module direction;It is described The corresponding primary processor that is sticked of boss, the installation wing connect the front housing side plate;The front housing is with the heat-conducting piece Heat Conduction Material is made.
Above-mentioned fan-free heat dissipation computer, by the heat-conducting piece that is sticked on assist side component, heat-conducting piece connects front housing, thermally conductive Part is that Heat Conduction Material is made with front housing, has Thermal conductivity, is effectively dispersed into the heat that circuit board module generates The external world prevents over-heat inside;Meanwhile the front housing side plate of front housing is equipped with recess, increasing heat radiation area, to improve radiating efficiency.
The front housing substrate is equipped with centre bore and positioned at the several of the centre bore side in one of the embodiments, Key hole;Several connectors and several battery ports are respectively equipped on the side of the wide direction of the front housing side plate.
The front housing substrate is towards having several limits in the one side of the circuit board module in one of the embodiments, Item and enclosing sets several first connecting columns and several second connecting columns of the positive stop strip;The positive stop strip is enclosed set on the center The periphery in hole, the positive stop strip and the front housing substrate form positioning chamber;Second connecting column connects the wiring board.
The height of first connecting column is less than second connecting column in one of the embodiments,.
The fan-free heat dissipation computer further includes operation circle being installed in the front housing in one of the embodiments, Face component and lid set the rear shell component of the front housing;The operation interface component includes display screen module, is connected to the display The support plate of the connecting plate for shielding mould group side, several keys being installed on the connecting plate and connection first connecting column;Institute Display screen module correspondence is stated to be installed in the positioning chamber;The key correspondence wears the key hole.
If in one of the embodiments, the circuit board module further include the dry cell being installed on the wiring board, The other electronic components for being installed on several connectors of the wiring board opposite end and being installed on the wiring board;Institute It states battery and corresponds to the battery port, the connector corresponds to the connector.
The rear shell component includes the rear shell for matching the front housing, is installed on the rear shell in one of the embodiments, Interior hard disk and lid sets the sealing plate of the rear shell;The hard disk is packaged between the rear shell and the sealing plate.
The one side of the rear shell towards the circuit board module is equipped with several accommodating chambers in one of the embodiments, The accommodating chamber is corresponding to accommodate the battery.
Several positioning columns are connected on the wiring board in one of the embodiments, the positioning column is set to described At the opposite sides of primary processor;The side of the wiring board also opens up several first assembly holes.
The heat-conducting piece main body is equipped with several location holes in one of the embodiments, and the location hole is set to institute State the opposite end of boss;The location hole corresponds to the positioning column;The side of the heat-conducting piece main body opens up several second groups Hole is filled, second assembly hole corresponds to first assembly hole.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the fan-free heat dissipation computer of one better embodiment of the utility model;
Fig. 2 is the stereoscopic schematic diagram at another visual angle of fan-free heat dissipation computer shown in FIG. 1;
Fig. 3 is the decomposition diagram of fan-free heat dissipation computer shown in FIG. 1;
Fig. 4 is the stereoscopic schematic diagram at another visual angle of the front housing in fan-free heat dissipation computer shown in Fig. 3;
Fig. 5 is circuit board module and the corresponding schematic diagram of heat-conducting piece in fan-free heat dissipation computer shown in Fig. 3;
Fig. 6 is the stereoscopic schematic diagram at another visual angle of heat-conducting piece shown in fig. 5.
Attached drawing marks explanation:
10- front housing, 11- front housing substrate, 111- centre bore, 112- key hole, 12- front housing side plate, 13- recess, 14- connect Interface, 15- battery port, 16- positive stop strip, the first connecting column of 17-, the second connecting column of 18-;
20- operation interface component, 21- display screen module, 22- connecting plate, 23- key, 24- support plate;
30- circuit board module, 31- wiring board, 32- primary processor, 33- battery, 34- positioning column, the first assembly hole of 35-;
40- heat-conducting piece, 41- heat-conducting piece main body, 42- boss, 43- install the wing, 44- location hole, the second assembly hole of 45-;
Shell component after 50-, 51- rear shell, 52- hard disk, 53- sealing plate, 54- accommodating chamber.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model, It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model The understanding for opening content is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Fig. 1 to Fig. 6 is please referred to, is the fan-free heat dissipation computer of one better embodiment of the utility model, including front housing 10, the heat-conducting piece 40 of the circuit board module 30 and the circuit board module 30 that is sticked that are installed in front housing 10.The front housing 10 includes Front housing substrate 11 and the front housing side plate 12 for connecting 11 periphery of front housing substrate;It is set respectively on the side of the length direction of front housing side plate 12 There are several recess 13 being set in distance, with increasing heat radiation area, improves radiating efficiency.The circuit board module 30 includes route Plate 31 and the primary processor 32 being installed on wiring board 31.The heat-conducting piece 40 includes heat-conducting piece main body 41, from heat-conducting piece main body 41 boss 42 and the outwardly extending installation wing of 41 opposite end of heat-conducting piece main body extended towards 30 direction of circuit board module 43;The corresponding primary processor 32 that is sticked of boss 42, the installation wing 43 connect front housing side plate 12.Front housing 10 and heat-conducting piece 40 are heat conduction material Material is made.Above-mentioned fan-free heat dissipation computer, by the heat-conducting piece 40 that is sticked on assist side component 30, before heat-conducting piece 40 connects Shell 10, heat-conducting piece 40 are that Heat Conduction Material is made with front housing 10, have Thermal conductivity, effectively produce circuit board module 30 Raw heat is dispersed into the external world, prevents over-heat inside;Meanwhile the front housing side plate 12 of front housing 10 is equipped with recess 13, increases radiating surface Product, to improve radiating efficiency.
The front housing 10 is made with heat-conducting piece 40 of Heat Conduction Material, has good heating conduction.In the present embodiment, preceding Shell 10 is made with heat-conducting piece 40 of metal material, such as aluminium, copper material or steel.In other embodiments, the front housing 10 can also be other Heat Conduction Materials with heat-conducting piece 40, such as heat-conducting plastic etc. can play the role of identical with the present embodiment , it is not limited to metal.
Front housing substrate 11 is equipped with centre bore 111 and several key holes 112 positioned at 111 side of centre bore.Front housing side plate 12 Wide direction side be equipped with several connectors 14 and several battery ports 15, worn respectively for the component of circuit board module 30 If.In the present embodiment, connector 14 is set on a side of the wide direction of front housing side plate 12, before battery port 15 is set to On two sides of the wide direction of shell-side plate 12.Further, in other embodiments, connector 14 also can be set in preceding On two sides of the wide direction of shell-side plate 12;Similarly, in other embodiments, battery port 15 also can be set in preceding shell-side On one side of the wide direction of plate 12.The setting position of connector 14 and battery port 15, it is not limited in the present embodiment Position.
If front housing substrate 11 sets positive stop strip 16 towards having several positive stop strips 16 in the one side of circuit board module 30 and enclose Dry first connecting column 17 and several second connecting columns 18.Positive stop strip 16 encloses the periphery set on centre bore 111, and positive stop strip 16 is with before Shell substrate 11 forms positioning chamber.In the present embodiment, the height of the first connecting column 17 less than the second connecting column 18 height, One connecting column 17 is used for attended operation interface assembly 20, and the second connecting column 18 is used for connection line board group part 30, in order to grasp Make interface assembly 20 to be located between front housing substrate 11 and circuit board module 30.
As shown in figure 3, the fan-free heat dissipation computer further include the operation interface component 20 being installed in front housing 10 and Lid sets the rear shell component 50 of front housing 10.
The operation interface component 20 include display screen module 21, be connected to 21 side of display screen module connecting plate 22, The support plate 24 for the first connecting column 17 of several keys 23 and connection being installed on connecting plate 22.The corresponding installation of display screen module 21 In in positioning chamber, the correspondence of key 23 wears key hole 112, and support plate 24 is attached at display screen module 21 close to circuit board module 30 Display screen module 21 and connecting plate 22 are packaged in positioning chamber by side, support plate 24.
If the circuit board module 30 further includes the dry cell 33 being installed on wiring board 31, is installed on wiring board 31 relatively Several connectors at both ends and the other electronic components being installed on wiring board 31.Wiring board 31 connects the second connecting column 18, Realize the connection of circuit board module 30 and front housing 10.Battery 33 corresponds to battery port 15, and connector is correspondingly connected with mouth.On wiring board 31 Several positioning columns 34 are connected with, positioning column 34 is set at the opposite sides of primary processor 32.Further, in the present embodiment In, the side of wiring board 31 also opens up several first assembly holes 35.
Several location holes 44 are additionally provided in heat-conducting piece main body 41, location hole 44 is set to the opposite end of boss 42.Further Ground, in the present embodiment, the side of heat-conducting piece main body 41 also open up several second assembly holes 45.When assembling, heat-conducting piece main body 41 It is attached on wiring board 31, the corresponding primary processor 32 that is sticked of boss 42, the corresponding positioning column 34 of location hole 44, the second assembly hole 45 is right Answer the first assembly hole 35.The heat that the work of primary processor 32 generates is transmitted by boss 42, heat-conducting piece main body 41 and the installation wing 43 Onto front housing 10, then it is dispersed into air and radiates.
Shell component 50 includes after the rear shell 51 of matching front housing 10, the hard disk 52 being installed in rear shell 51 and lid are set after described The sealing plate 53 of shell 51;Hard disk 52 is packaged between rear shell 51 and sealing plate 53,52 electrical interconnection plate 31 of hard disk.Rear shell 51 is towards line The one side of road board group part 30 is equipped with several accommodating chambers 54, and accommodating chamber 54 is corresponding to accommodate battery 33.
Further, in other embodiments, it can also be sticked on the heater elements such as battery 33, hard disk 52 described Heat-conducting piece 40, to further enhance heat dissipation effect.
The fan-free heat dissipation computer of the utility model, passes through the heat-conducting piece 40 that is sticked on assist side component 30, heat-conducting piece 40 connection front housings 10, heat-conducting piece 40 is that Heat Conduction Material is made with front housing 10, has Thermal conductivity, effectively by wiring board The heat that component 30 generates is dispersed into the external world, prevents over-heat inside;Meanwhile the front housing side plate 12 of front housing 10 is equipped with recess 13, increases Big heat dissipation area, to improve radiating efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.

Claims (10)

1. a kind of fan-free heat dissipation computer, which is characterized in that including front housing, the circuit board module being installed in the front housing, And the heat-conducting piece for the circuit board module that is sticked;Before the front housing includes front housing substrate and connects the front housing substrate periphery Shell-side plate;Several recess being set in distance are respectively equipped on the side of the length direction of the front housing side plate;The route board group Part includes wiring board and the primary processor that is installed on the wiring board;The heat-conducting piece include heat-conducting piece main body, from described in lead The boss and the outwardly extending peace of heat-conducting piece main body opposite end that warmware main body extends towards the circuit board module direction Fill the wing;The corresponding primary processor that is sticked of the boss, the installation wing connect the front housing side plate;The front housing is led with described Warmware is that Heat Conduction Material is made.
2. fan-free heat dissipation computer according to claim 1, which is characterized in that the front housing substrate be equipped with centre bore, And several key holes positioned at the centre bore side;Several connections are respectively equipped on the side of the wide direction of the front housing side plate Mouth and several battery ports.
3. fan-free heat dissipation computer according to claim 2, which is characterized in that the front housing substrate is towards the route Several first connecting columns for setting the positive stop strip with several positive stop strips and enclosing in the one side of board group part are connect with several second Column;The positive stop strip encloses the periphery set on the centre bore, and the positive stop strip and the front housing substrate form positioning chamber;Described Two connecting columns connect the wiring board.
4. fan-free heat dissipation computer according to claim 3, which is characterized in that the height of first connecting column is less than Second connecting column.
5. fan-free heat dissipation computer according to claim 3, which is characterized in that further include being installed in the front housing Operation interface component and lid set the rear shell component of the front housing;The operation interface component includes display screen module, is connected to institute State the connecting plate of display screen module side, several keys for being installed on the connecting plate and connection first connecting column Support plate;The display screen module correspondence is installed in the positioning chamber;The key correspondence wears the key hole.
6. fan-free heat dissipation computer according to claim 5, which is characterized in that the circuit board module further includes installation If on the wiring board dry cell, be installed on several connectors of the wiring board opposite end and be installed on the line Other electronic components on the plate of road;The battery corresponds to the battery port, and the connector corresponds to the connector.
7. fan-free heat dissipation computer according to claim 6, which is characterized in that shell component includes described in matching after described The rear shell of front housing, the hard disk being installed in the rear shell and lid set the sealing plate of the rear shell;The hard disk is packaged in the rear shell Between the sealing plate.
8. fan-free heat dissipation computer according to claim 7, which is characterized in that the rear shell is towards the route board group The one side of part is equipped with several accommodating chambers, and the accommodating chamber is corresponding to accommodate the battery.
9. fan-free heat dissipation computer according to claim 1, which is characterized in that it is several fixed to be connected on the wiring board Position column, the positioning column are set at the opposite sides of the primary processor;The side of the wiring board also opens up several first Assembly hole.
10. fan-free heat dissipation computer according to claim 9, which is characterized in that if the heat-conducting piece main body is equipped with Dry location hole, the location hole are set to the opposite end of the boss;The location hole corresponds to the positioning column;It is described thermally conductive The side of part main body opens up several second assembly holes, and second assembly hole corresponds to first assembly hole.
CN201820426881.7U 2018-03-27 2018-03-27 Fan-free heat dissipation computer Active CN208126279U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820426881.7U CN208126279U (en) 2018-03-27 2018-03-27 Fan-free heat dissipation computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820426881.7U CN208126279U (en) 2018-03-27 2018-03-27 Fan-free heat dissipation computer

Publications (1)

Publication Number Publication Date
CN208126279U true CN208126279U (en) 2018-11-20

Family

ID=64193221

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820426881.7U Active CN208126279U (en) 2018-03-27 2018-03-27 Fan-free heat dissipation computer

Country Status (1)

Country Link
CN (1) CN208126279U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20230713

Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd.

Address before: 518100 5th floor, No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen City, Guangdong Province

Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right