CN208093550U - Ultrathin high density lamination impedance pcb board micropore packaging system - Google Patents
Ultrathin high density lamination impedance pcb board micropore packaging system Download PDFInfo
- Publication number
- CN208093550U CN208093550U CN201820511989.6U CN201820511989U CN208093550U CN 208093550 U CN208093550 U CN 208093550U CN 201820511989 U CN201820511989 U CN 201820511989U CN 208093550 U CN208093550 U CN 208093550U
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrode
- chip
- packaging system
- conductive plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of Ultrathin high density lamination impedance pcb board micropore packaging system, including substrate, electrode of substrate, IC chip, IC electrodes, insulating resin and conductive plated resin balls.Because electrode of substrate is welded on thereon, conductive plated resin balls are welded and fixed mounted on electrode of substrate one end, IC electrode weldings are fixed above conductive plated resin balls, IC chip is fixedly mounted on IC electrodes, positioned at IC chip and substrate intersection, IC electrodes, conductive plated resin balls, electrode of substrate one end, which is formed by gap, is separately filled with insulating resin composition packaging system, the packaging system can add the conductive plated resin balls that diameter only has several microns between IC chip and substrate, IC chip is fixed on substrate by insulating resin, directly it is extruded in the electrode area of substrate, be conducive to insulating resin compression and the convex recuperability of gold solder, it ensure that reliability electrically and mechanically, reach thinner with line, substrate is than relatively thin, small welding hole, it is easy to process.
Description
【Technical field】
The utility model is related to a kind of Ultrathin high density lamination impedance pcb board micropores in circuit board technology field to encapsulate
Device.
【Background technology】
Enhance with the integrated level of electronics industry core plate, attachment density is high, and circuit lead is thin, to the printing precision of printing machine
It is proposed new challenge so that structure and processing to current pcb board propose new requirement.Existing pcb board includes substrate, is welded in
A plurality of components of thereon, and it is welded in the operplate printing conducting wire of thereon.It is set on substrate due to described
Some components in face are connected by operplate printing conducting wire, and the operplate printing conducting wire ratio in thereon is resulted in
More, the welding hole for being set to thereon compares, and the speed of signal transmission is slow.Due to being welded on first device of thereon
Part is more and more so that within the scope of limited substrate area, can not weld, cause extremely processing inconvenient.
【Utility model content】
The technical purpose of the utility model is provided a kind of with line to solve the above-mentioned problems of the prior art
Thinner, substrate is than relatively thin, small welding hole, Ultrathin high density lamination impedance pcb board micropore packaging system easy to process.
In order to realize that above-mentioned technical problem, the utility model provide a kind of Ultrathin high density lamination impedance pcb board micropore
Packaging system, including substrate, electrode of substrate, IC chip, IC electrodes, insulating resin and conductive plated resin balls；The substrate
In thereon, the conductive plated resin balls are welded and fixed mounted on electrode of substrate one end, the IC electricity electrode welding
Pole is welded and fixed above conductive plated resin balls, and the IC chip is fixedly mounted on IC electrodes.
According to the technical characteristics, it is located at IC chip and substrate intersection, the IC electrodes, conductive plated resin
Ball, electrode of substrate one end are formed by gap and are separately filled with insulating resin.
The beneficial effects of the utility model：It is described because the technical program is welded on thereon using the electrode of substrate
Conductive plated resin balls be welded and fixed mounted on electrode of substrate one end, the IC electrode weldings fix conductive plated resin balls
Above, the IC chip is fixedly mounted on IC electrodes, is located at IC chip and substrate intersection, the IC electrodes, conduction
Plated resin ball, electrode of substrate one end are formed by gap and are separately filled with insulating resin, constitute packaging system, encapsulation dress
The conductive plated resin balls that diameter only has several microns can be added between IC chip and substrate by setting, and insulating resin is by IC chip
It is fixed on substrate, formation gold solder is convex, is directly extruded in the electrode area of substrate, is conducive to insulating resin compression and gold solder is convex
Recuperability, ensure that reliability electrically and mechanically, avoid on substrate using operplate printing conducting wire connect component, make
It must reach thinner with line, substrate is than relatively thin, and small welding hole is easy to process.
With reference to the accompanying drawings and examples, the technical solution of the utility model is described in further detail.
【Description of the drawings】
Fig. 1 is the schematic diagram of Ultrathin high density lamination impedance pcb board micropore packaging system in the utility model.
【Specific implementation mode】
In order to keep technical problem to be solved in the utility model, technical solution and advantageous effect clearer, clear, with
Under in conjunction with the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
Shown in please referring to Fig.1, illustrate a kind of Ultrathin high density lamination impedance pcb board micropore encapsulation dress with reference to embodiment
It sets, including substrate 1, electrode of substrate 2, IC chip 3, IC electrodes 4, insulating resin 5 and conductive plated resin balls 6.
The electrode of substrate 2 is welded on above substrate 1, and the conductive plated resin balls 6 are welded and fixed mounted on substrate
2 one end of electrode, the IC electrodes 4 are welded and fixed above conductive plated resin balls 6, and the IC chip 3 is fixedly mounted on IC
On electrode 4.Positioned at IC chip 3 and 1 intersection of substrate, the IC electrodes 4, conductive plated resin balls 6,2 one end of electrode of substrate
Be formed by gap and be separately filled with insulating resin 5, form the packaging system, the packaging system can IC chip 3 with
The conductive plated resin balls 6 that diameter only has several microns are added between substrate 1, IC chip 3 is fixed on substrate 1 by insulating resin 5
On, it is convex to form gold solder, is directly extruded in the electrode area of substrate 1, is conducive to insulating resin compression and the convex recuperability of gold solder,
It ensure that reliability electrically and mechanically, avoid asking for the appearance of the coefficient of thermal expansion different situations between IC chip 3 and substrate 1
Topic, be conducive to it is aspectant between IC chip 3 and IC chip 3 be directly connected to, this connection without line, connection have it is most short,
Bump diameter generally only 10 microns.It avoids and connects component using operplate printing conducting wire on substrate so that reach
Thinner with line, substrate 1 is than relatively thin, and small welding hole is easy to process.
In conclusion because the technical program is welded on above substrate 1 using the electrode of substrate 2, the conductive plated
Resin balls 6 are welded and fixed mounted on 2 one end of electrode of substrate, and the work C electrodes 4 are welded and fixed above conductive plated resin balls 6,
The IC chip 3 is fixedly mounted on IC electrodes 4, is located at IC chip 3 and substrate intersection, the IC electrodes 4, conductive electricity
Plated resin ball 6,2 one end of electrode of substrate, which are formed by gap, is separately filled with insulating resin 5, constitutes packaging system, the encapsulation
Device can add the conductive plated resin balls 6 that diameter only has several microns between IC chip 3 and substrate 1, and insulating resin 5 will
IC chip 3 is fixed on substrate 1, and formation gold solder is convex, is directly extruded in the electrode area of substrate 1, is conducive to the pressure of insulating resin 5 and is answered
Power and the convex recuperability of gold solder, ensure that reliability electrically and mechanically, avoid and connected on substrate 1 using operplate printing conducting wire
Connect component so that reach thinner with line, substrate is than relatively thin, and small welding hole is easy to process.
To those skilled in the art, it can be modified or changed according to the above description, and all these
Modifications and variations should belong to the utility model and apply within the scope of protecting.
Claims (2)
1. a kind of Ultrathin high density lamination impedance pcb board micropore packaging system, including substrate, electrode of substrate, IC chip, IC electricity
Pole, insulating resin and conductive plated resin balls；It is characterized in that：The electrode of substrate is welded on thereon, and described leads
Electric plated resin ball bonding is fixedly mounted on electrode of substrate one end, and the IC electrode weldings are fixed in conductive plated resin balls
Face, the IC chip are fixedly mounted on IC electrodes.
2. Ultrathin high density lamination impedance pcb board micropore packaging system according to claim 1, it is characterised in that：It is located at
IC chip and substrate intersection, the IC electrodes, conductive plated resin balls, electrode of substrate one end are formed by gap respectively
Filled with insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820511989.6U CN208093550U (en) | 2018-04-10 | 2018-04-10 | Ultrathin high density lamination impedance pcb board micropore packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820511989.6U CN208093550U (en) | 2018-04-10 | 2018-04-10 | Ultrathin high density lamination impedance pcb board micropore packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208093550U true CN208093550U (en) | 2018-11-13 |
Family
ID=64055847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820511989.6U Expired - Fee Related CN208093550U (en) | 2018-04-10 | 2018-04-10 | Ultrathin high density lamination impedance pcb board micropore packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208093550U (en) |
-
2018
- 2018-04-10 CN CN201820511989.6U patent/CN208093550U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181113 Termination date: 20210410 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |