CN208077958U - A kind of air-tightness ltcc substrate and microstrip structure through walls - Google Patents
A kind of air-tightness ltcc substrate and microstrip structure through walls Download PDFInfo
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- CN208077958U CN208077958U CN201721904501.8U CN201721904501U CN208077958U CN 208077958 U CN208077958 U CN 208077958U CN 201721904501 U CN201721904501 U CN 201721904501U CN 208077958 U CN208077958 U CN 208077958U
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- green band
- ltcc substrate
- connecting portion
- lower layer
- upper layer
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Abstract
The utility model is related to a kind of air-tightness ltcc substrate and microstrip structures through walls, including upper layer green band and lower layer's green band, the upper layer green band is along its lower surface first connecting portion with outward extension, lower layer's green band is equipped with second connecting portion corresponding with the first connecting portion along its upper surface, the first connecting portion is connect with second connecting portion, metal ground plane is equipped between upper layer green band and lower layer's green band, the metal ground plane is equipped with trepanning, the upper layer green band and lower layer's green band and is connected by trepanning compression sintered compact.Air-tightness ltcc substrate described in the utility model and microstrip structure through walls, by the contact area for reducing grounded metal and ceramic whiteware, to be connected in sintering process so that forming densification between levels green, the continuity of grounded metal semiotic function is neither influenced in this way, it can make upper layer and lower layer densified sintering product by design of material again, to reduce the leakage path of gas, the leak rate of substrate is reduced.
Description
Technical field
The present invention relates to a kind of substrates, and in particular to a kind of air-tightness ltcc substrate and microstrip structure through walls.
Background technology
Ltcc substrate provides reliable solution for the miniaturization of T/R assembly modules, passes through multilayer wiring, embedded components
The volume of component can be greatly reduced, and the lower dielectric losses of LTCC ensure that the efficiency of T/R component high frequency signal transmissions.This
Outside, it is directly welded by LTCC multilager base plates with peripheral frame and pedestal can be cut down so that multilager base plate was both used as multilayer circuit to interconnect
Substrate, and as the pedestal of package casing, to realize ltcc substrate and outer shell integrated air-tight packaging, as shown in Figure 1.Gas
The purpose of sealing dress is that environment is isolated, and the erosion of the pollutant of liquid, solid or gas is prevented, especially in outer space pole
Not only want the circulation change of bearing temperature under limit environment, to be more subjected to various different frequencies, wavelength incoming particle collision, envelope
The quality of dress body air-tightness is directly related to the stability and reliability of component or even system.
The integrative packaging of ltcc substrate is encapsulated different from Can, and substrate is directly exposed as a part of encapsulation
Outside, therefore the air-tightness of ltcc substrate directly affects the air-tightness of integrative packaging component.With the lead port of Can
Difference, the ports I/O are metallization conduction band on ltcc substrate, are formed with ltcc substrate cofiring, by buried metal conduction band through walls,
The lead-out wire of component can be extracted from the inside cavity of sealing.Therefore, the design of this ports I/O with structure through walls
Not only influence the signal transmission of T/R components with technique, the consistency of the calmodulin binding domain CaM of metal and ceramic substrate also influences LTCC bases
The air-tightness of plate.
Integrated metalized envelope covers usually by the way of parallel seam welding, and the leak rate of product is by covering later often
An order of magnitude can be reduced, therefore in order to enable the air-tightness of product reaches requirement after the final capping of integrated metalized envelope（< 1 ×
10-2 Pa·cm3/ s), need leak rate of the control assembly after welding peripheral frame to be less than 1 × 10-3 Pa·cm3/s.With structure through walls
Ltcc substrate often cause product rejection since leak rate is unqualified in integrative packaging, how to solve it is this have spy
Can the air-tight packaging of the ltcc substrate of different structure is the key that it be applied to have high reliability Aerospace Products.
Using vacuum grease coating peripheral frame and ltcc substrate weld, the leak rate of weldment is basically unchanged, and is coated on
Ltcc substrate micro-strip through walls and substrate seam crossing, leak rate is greatly reduced, by 10-1-10-2 Pa·cm3/ s drops below 1
×10-3 Pa·cm3/ s, this surface air leakage point are the contact position of conduction band through walls and ceramic whiteware, ltcc substrate micro-strip through walls and ceramic whiteware
Lap-joint's gas leakage be due to ltcc substrate it is not fine and close caused by.
Invention content
The purpose of the present invention is to provide a kind of air-tightness ltcc substrate and microstrip structures through walls, can greatly promote LTCC
The air-tightness of ceramic substrate, to promote the reliability of ltcc substrate integrative packaging.
To achieve the above object, present invention employs following technical schemes：
A kind of air-tightness ltcc substrate, including upper layer green band and lower layer's green band, the upper layer green band is along its following table
Face first connecting portion with outward extension, lower layer's green band are equipped with corresponding with the first connecting portion along its upper surface
Second connecting portion, the first connecting portion connect with second connecting portion, and gold is equipped between upper layer green band and lower layer's green band
Belong to ground plane, the metal ground plane is equipped with trepanning, the upper layer green band and lower layer's green band and compresses sintering by trepanning
Close connection.
Further, the upper layer green band and lower layer's green band are all made of glass material manufacture.
A kind of microstrip structure through walls, including metal base plate, ltcc substrate, peripheral frame and cover board composition, the ltcc substrate are set
Between metal base plate and peripheral frame, the cover board is located at the upside of peripheral frame and is fixedly connected with peripheral frame.
As shown from the above technical solution, air-tightness ltcc substrate of the present invention and microstrip structure through walls, pass through reduction
The contact area of grounded metal and ceramic whiteware, to be connected in sintering process so that forming densification between levels green, so both
The continuity of grounded metal semiotic function is not influenced, and can make upper layer and lower layer densified sintering product by design of material, to subtract
The leakage path for having lacked gas reduces the leak rate of substrate.
Description of the drawings
Fig. 1 is the cross-sectional view of ceramic substrate of the present invention；
Fig. 2 is the schematic diagram of present invention microstrip structure through walls；
Fig. 3 is the partial enlarged view of Fig. 2；
Fig. 4 is the explosive view of ltcc substrate of the present invention.
Specific implementation mode
The present invention will be further described below in conjunction with the accompanying drawings：
As shown in Figure 1, the air-tightness ltcc substrate of the present embodiment, including be made of multilayer ceramic substrate superposition sintering, it makes pottery
Porcelain substrate includes upper layer green band 11 and lower layer's green band 12, and upper layer green band 11 is along its lower surface with outward extension first
Interconnecting piece 13, lower layer's green band 12 are equipped with second connecting portion corresponding with first connecting portion 13 14 along its upper surface, and first connects
Socket part 13 is connect with second connecting portion 14, and metal ground plane 15, metal are equipped between upper layer green band 11 and lower layer's green band 12
Ground plane 15 is equipped with trepanning 16.The upper layer green band 11 and lower layer's green band 12 of the present embodiment are all made of glass material manufacture.
As shown in Fig. 2, the microstrip structure through walls of the present embodiment, including metal base plate 5, ltcc substrate 1, peripheral frame 3 and cover board 4
Composition, ltcc substrate 1 are set between metal base plate 5 and peripheral frame 3, and cover board 4 is located at the upside of peripheral frame 3 and is fixedly connected with peripheral frame 3,
Ltcc substrate 1 uses the air-tightness ltcc substrate of this implementation.Fig. 3 is the partial enlarged view of the present invention, as shown in Figure 3.
As shown in figure 4, LTCC multi-layer ceramics co-fired ceramic substrates are to be laminated, sintered by multi-layer green ceramic band and matching metal layer
, in ltcc substrate microwave integrative packaging structure, it is by conduction band 6 through walls and gold that the signal outside wall, which is led in/out, within the walls
Belong to what layer was realized, upper layer and lower layer green band sinters a ceramic of compact by laminating, and air leakage point is between metal and ceramics
Seam crossing.The substrate that the present invention uses is set between peripheral frame 3 and metal base plate 5, which is by green band, metal layer, life
Porcelain band, metal layer etc. are sequentially overlapped sintering and are made, and the metal layer being located at micro-strip 6 through walls is metal ground plane 15, is connect in metal
Stratum 15 is equipped with and is left white trepanning 16 i.e. of the present invention so that upper layer and lower layer green band is in close contact, and is reduced in sintering
The channel of ltcc substrate gas leakage can promote ltcc substrate air-tightness, reduce ltcc substrate leak rate.
The ltcc substrate of the present embodiment is is altogether 13 layer stacked structures, wherein micro-strip metal layer 15 through walls is the 8th layer, base
The micro-strip of plate top and low side is the conduction band of signal input and output.Part is left white without conductor when micro-strip through walls metallizes and prints
The printing mode of slurry so that the 8th layer of ceramic whiteware is in close contact with the 7th layer of ceramic whiteware in sintering process, reduces leakage path.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
It encloses and is defined, under the premise of not departing from design spirit of the present invention, technical side of the those of ordinary skill in the art to the present invention
The various modifications and improvement that case is made should all be fallen into the protection domain of claims of the present invention determination.
Claims (3)
1. a kind of air-tightness ltcc substrate, it is characterised in that：Including upper layer green band（11）With lower layer's green band（12）, it is described on
Layer green band（11）Along its lower surface first connecting portion with outward extension（13）, lower layer's green band（12）Along its upper table
Face is equipped with and the first connecting portion（13）Corresponding second connecting portion（14）, the first connecting portion（13）It is connect with second
Portion（14）Connection, upper layer green band（11）With lower layer's green band（12）Between be equipped with metal ground plane（15）, the metallic ground
Layer（15）It is equipped with trepanning（16）, the upper layer green band（11）With lower layer's green band（12）Pass through trepanning（16）It is tight to compress sintering
Close connection.
2. air-tightness ltcc substrate according to claim 1, it is characterised in that：The upper layer green band（11）It is given birth to lower layer
Porcelain band（12）It is all made of glass material manufacture.
3. a kind of microstrip structure through walls, it is characterised in that：Including metal base plate（5）, ltcc substrate（1）, peripheral frame（3）And cover board
（4）Composition, the ltcc substrate（1）Set on metal base plate（5）With peripheral frame（3）Between, the cover board（4）Positioned at peripheral frame（3）'s
Upside and and peripheral frame（3）It is fixedly connected, the ltcc substrate（1）For the ltcc substrate described in claims 1 or 2（1）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721904501.8U CN208077958U (en) | 2017-12-29 | 2017-12-29 | A kind of air-tightness ltcc substrate and microstrip structure through walls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721904501.8U CN208077958U (en) | 2017-12-29 | 2017-12-29 | A kind of air-tightness ltcc substrate and microstrip structure through walls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208077958U true CN208077958U (en) | 2018-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721904501.8U Active CN208077958U (en) | 2017-12-29 | 2017-12-29 | A kind of air-tightness ltcc substrate and microstrip structure through walls |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993986A (en) * | 2017-12-29 | 2018-05-04 | 中国电子科技集团公司第四十三研究所 | A kind of air-tightness ltcc substrate and microstrip structure through walls |
-
2017
- 2017-12-29 CN CN201721904501.8U patent/CN208077958U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993986A (en) * | 2017-12-29 | 2018-05-04 | 中国电子科技集团公司第四十三研究所 | A kind of air-tightness ltcc substrate and microstrip structure through walls |
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