CN208023883U - Ground hybrid system - Google Patents

Ground hybrid system Download PDF

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Publication number
CN208023883U
CN208023883U CN201820397292.0U CN201820397292U CN208023883U CN 208023883 U CN208023883 U CN 208023883U CN 201820397292 U CN201820397292 U CN 201820397292U CN 208023883 U CN208023883 U CN 208023883U
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China
Prior art keywords
ground
floor
layer
combined
hybrid system
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Active
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CN201820397292.0U
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Chinese (zh)
Inventor
闫俊杰
梅能敏
赵静
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Huaneng Renju Technology Group Co ltd
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TIANJIN DAYIN BUILDING MATERIAL Co Ltd
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Priority to CN201820397292.0U priority Critical patent/CN208023883U/en
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Abstract

The utility model discloses a kind of ground hybrid systems, including:Carrier is used to be set up on foundation ground and forms Stilt layer between the foundation ground;The carrier has horizontal loading end;Composite floor board is layed on the loading end;Wherein:The composite floor board is docked by polylith combined floor;Every piece of combined floor includes the ceramic tile layer being mutually bonded and calcium silicate board layer, and the calcium silicate board layer is located at the lower section of the ceramic tile layer.Combined floor is made of the ceramic tile layer and calcium silicate board layer being mutually bonded, on the one hand, ceramic tile layer has played the beautiful effect of ceramic tile decorative ground;On the other hand, calcium silicate board layer has played its effect easy to process, so as to facilitate the thickness of adjusting combined floor and conveniently make to be attached and position between combined floor.

Description

Ground hybrid system
Technical field
The utility model is related to assembled decoration technology field, more particularly to a kind of ground hybrid system.
Background technology
Ceramic tile is glittering and translucent with its, robust product characteristic is usually used in ground surface finishing.Existing ground surface finishing is usual It is fitted up using wet method, the technological process specifically fitted up is:Processing foundation ground → doing screed-coat → does waterproof layer → smear binder course Mortar → edge tiling → wiping seam → cleaning → maintenance.
As described above, needing to carry out complicated process to ground before inlaying tiling to meet edge tiling institute The requirement of flatness is needed, and because there is mortar larger mobility so that flatness is poor, cause the effect for inlaying tiling bad, And expend time and manpower.
In addition, in some cases, it is desirable to changing the thickness of the ceramic tile of existing thickness, however, the material because of ceramic tile is hard So that the thickness of ceramic tile is difficult to change.
Utility model content
For the above-mentioned technical problems in the prior art, the embodiments of the present invention provide one kind and can realize To foundation ground complete quick decoration and have the ground hybrid system easy to process for also not losing aesthetic advantage.
In order to solve the above technical problems, the embodiments of the present invention the technical solution adopted is that:
A kind of ground hybrid system, including:
Carrier is used to be set up on foundation ground and forms Stilt layer between the foundation ground;The carrying Frame has horizontal loading end;
Composite floor board is layed on the loading end;Wherein:
The composite floor board is docked by polylith combined floor;Every piece of combined floor includes the ceramic tile layer being mutually bonded With calcium silicate board layer, the calcium silicate board layer is located at the lower section of the ceramic tile layer.
Preferably, connector is provided between adjacent two pieces of combined floors, the connector is for limiting adjacent two Combined floor described in block misplaces in the thickness direction thereof.
Preferably, there are two plates for the connector tool;It is described multiple that two plates are plugged in adjacent two pieces respectively It closes in the side that floor tile is connected to each other.
Preferably, two plates are inserted into respectively in the calcium silicate board layer of two pieces of adjacent combined floors.
Preferably, the connector includes the upper plate and lower plate and between the upper plate and lower plate of parallel setting Riser, wherein:
The part positioned at the both sides of the riser of the upper plate forms two plates;
The part that the lower plate is located at the both sides of the riser is attached at the bottom of two pieces of combined floors to hold respectively Hold in the palm the combined floor.
Preferably, the bottom surface of the combined floor offers deep gouge close to the region of the side of docking;The lower plate is set to In the deep gouge.
Preferably, the carrier is spliced by polylith floor heating module;The floor heating module is arranged in arrays.
Preferably, multiple foundation bolts are provided between the carrier and the foundation ground;Each foundation bolt Upper end is provided with supporting plate;Multiple foundation bolts are arranged along the abutment joint of adjacent floor heating module so that multiple lower margins The supporting plate while the adjacent floor heating module of support of bolt.
Compared with prior art, the advantageous effect of the ground hybrid system of the utility model is:Combined floor is by being mutually bonded Ceramic tile layer and calcium silicate board layer composition, on the one hand, ceramic tile layer has played the beautiful effect of ceramic tile decorative ground;Another party Face, calcium silicate board layer have played its effect easy to process, so as to facilitate the thickness of adjusting combined floor and conveniently make multiple It is attached and positions between conjunction floor tile.
Description of the drawings
Fig. 1 is the vertical view for the ground hybrid system that the embodiments of the present invention provide.
Fig. 2 is the view profile for the ground hybrid system that the embodiments of the present invention provide.
Fig. 3 is the enlarged view of the local A of Fig. 2.
Fig. 4 is the structural schematic diagram of combined floor in the ground hybrid system that the embodiments of the present invention provide.
In figure:
10- carriers;11- floor heating modules;20- composite floor boards;21- combined floors;211- ceramic tile layers;212- calcium silicate boards Layer;22- connectors;221- upper plates;222- lower plates;223- risers;30- foundation bolts.
Specific implementation mode
It is below in conjunction with the accompanying drawings and specific real to make those skilled in the art be better understood from the technical solution of the utility model Mode is applied to elaborate to the utility model.
As shown in Figures 1 to 4, the embodiments of the present invention disclose a kind of ground hybrid system, the compound system in the ground For system for fitting up flooring, which includes carrier 10 and composite floor board 20.Carrier 10 is for being set up in Stilt layer is formed on foundation ground and between foundation ground, there is carrier 10 horizontal loading end, carrier 10 can be Integral structure, either by multiple concatenation units with the carrier 10 of the molding structure integral structure of connecting method or its splicing Unit is prefabricated in the factory molding;Composite floor board 20 is layed on the loading end of carrier 10, wherein composite floor board 20 is by polylith Combined floor 21 docks;As shown in figure 4, every piece of combined floor 21 be mutually bonded with calcium silicate board layer 212 by ceramic tile layer 211 at Type, and calcium silicate board layer 212 is located at the lower section of ceramic tile layer 211.
The ground hybrid system of above-described embodiment has the following advantages:
1, it is formed by supporter in such a way that carrier 10 replaces conventional wet plaster leveling, improves the construction at scene Environment improves construction efficiency.
2, combined floor 21 is made of the ceramic tile layer 211 and calcium silicate board layer 212 being mutually bonded, on the one hand, ceramic tile layer 211 is sent out The beautiful effect of ceramic tile decorative ground is waved;On the other hand, calcium silicate board layer 212 has played its effect easy to process, from And the thickness for adjusting combined floor 21 can be facilitated and conveniently make to be attached and position between combined floor 21.
3, combined floor 21 saves the materials of ceramic tile under the premise of not influencing ceramic tile aesthetic effect, and then saves Cost.
4, Stilt layer is formed between carrier 10 and foundation ground, facilitates and passes through water, electric line from Stilt layer, to It is provided a convenient for arrangement water, electric line.
In a preferred embodiment of the utility model, as shown in figure 4, being provided between adjacent two pieces of combined floors 21 Connector 22, connector 22 misplaces in the thickness direction thereof for limiting adjacent two pieces of combined floors 21, after making to be laid with Composite floor board 20 have higher flatness.Specifically, there are two plates for the connector 22 tool;Two plates are plugged in respectively In the side that two pieces of adjacent combined floors 21 are connected to each other.In this way, under the limitation of plate, adjacent two pieces of combined floors 21 will not Dislocation is generated on vertical direction (i.e. the thickness direction of combined floor 21).Preferably, two plates are inserted into adjacent respectively In the calcium silicate board layer 212 of two pieces of combined floors 21.Plate, which is inserted into calcium silicate board layer 212, to be advantageous in that:Calcium silicate board Layer 212 is easily worked out the interpolation slit for plate grafting compared to ceramic tile layer 211, to reduce difficulty of processing.
In another preferred embodiment of the utility model, connector 22 be arranged to can either to prevent adjacent two pieces it is compound The dislocation of floor tile 21 again can carry out adjacent two pieces of combined floors 21 structure of support.Specifically, as shown in figure 4, connector 22 Upper plate 221 and lower plate 222 including parallel setting and the riser between upper plate 221 and lower plate 222 223, the riser 223 is vertical with upper plate 221 and lower plate 222, wherein:The part positioned at the both sides of riser 223 of upper plate 221 forms above-mentioned two A plate;The part that lower plate 222 is located at the both sides of riser 223 is attached at the bottoms of two pieces of combined floors 21 respectively.In this implementation In example, while upper plate 221 is formed by two plates and is inserted into two relative sides of adjacent two pieces of combined floors 21, lower plate 222 pairs of two pieces of combined floors 21 carry out support, to improve the intensity of the connection between adjacent combined floor 21.Preferably, The bottom surface of combined floor 21 offers deep gouge close to the region of the side of docking;Lower plate 222 is set in deep gouge, so that lower plate 222 Lower face it is non-bulging in the lower surface of calcium silicate board layer 212, in this way, the composite floor board 20 being spliced into when combined floor 21 is spread When on carrier 10, gap not will produce between composite floor board 20 and the loading end of carrier 10.
In another preferred embodiment of the utility model, as shown in Figure 1 to Figure 3, carrier 10 is by polylith floor heating mould Block 11 (floor heating module 11 be dry construction in common component, concrete structure can there are many, majority in length and width it is bigger Lath-shaped) it is spliced, floor heating module 11 is arranged in arrays, for example, can be arranged in a manner of a line multiple row.In carrier 10 Multiple foundation bolts 30 are provided between foundation ground for support carrying frame 10, specifically, each foundation bolt 30 Upper end is provided with supporting plate;Uniformly distributed multiple foundation bolts 30 at the abutment joint of every two pieces adjacent floor heating modules 11, it is every to make The supporting plate while two pieces of floor heating modules 11 of support of a foundation bolt 30.The above structure of foundation bolt 30 and arrangement It is advantageous in that:The support to floor heating module 11 is not only realized, while adjacent two pieces of floor heating modules 11 being prevented to generate vertical side Upward dislocation.
Above example is only the exemplary embodiment of the utility model, is not used in limitation the utility model, this practicality is new The protection domain of type is defined by the claims.Those skilled in the art can be in the essence and protection domain of the utility model It is interior, various modifications or equivalent replacements are made to the utility model, this modification or equivalent replacement also should be regarded as falling new in this practicality In the protection domain of type.

Claims (8)

1. a kind of ground hybrid system, which is characterized in that including:
Carrier is used to be set up on foundation ground and forms Stilt layer between the foundation ground;The carrier tool There is horizontal loading end;
Composite floor board is layed on the loading end;Wherein:
The composite floor board is docked by polylith combined floor;Every piece of combined floor includes the ceramic tile layer being mutually bonded and silicon Sour calcium plate layer, the calcium silicate board layer are located at the lower section of the ceramic tile layer.
2. ground hybrid system according to claim 1, which is characterized in that be arranged between adjacent two pieces of combined floors There are connector, the connector to misplace in the thickness direction thereof for limiting adjacent two pieces of combined floors.
3. ground hybrid system according to claim 2, which is characterized in that there are two plates for the connector tool;Two The plate is plugged in respectively in the side that two pieces of adjacent combined floors are connected to each other.
4. ground hybrid system according to claim 3, which is characterized in that two plates are inserted into adjacent two respectively In the calcium silicate board layer of combined floor described in block.
5. ground hybrid system according to claim 3, which is characterized in that the connector includes the upper of parallel setting Plate and lower plate and the riser between the upper plate and lower plate, wherein:
The part positioned at the both sides of the riser of the upper plate forms two plates;
The part that the lower plate is located at the both sides of the riser is attached at the bottom of two pieces of combined floors with support institute respectively State combined floor.
6. ground hybrid system according to claim 5, which is characterized in that the bottom surface of the combined floor is close to docking The region of side offers deep gouge;The lower plate is set in the deep gouge.
7. ground hybrid system according to claim 1, which is characterized in that the carrier is spliced by polylith floor heating module It forms;The floor heating module is arranged in arrays.
8. ground hybrid system according to claim 7, which is characterized in that between the carrier and the foundation ground It is provided with multiple foundation bolts;The upper end of each foundation bolt is provided with supporting plate;Multiple foundation bolts are along adjacent ground The abutment joint of heating module arrange so that multiple foundation bolts the supporting plate adjacent floor heating module of support simultaneously.
CN201820397292.0U 2018-03-22 2018-03-22 Ground hybrid system Active CN208023883U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820397292.0U CN208023883U (en) 2018-03-22 2018-03-22 Ground hybrid system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820397292.0U CN208023883U (en) 2018-03-22 2018-03-22 Ground hybrid system

Publications (1)

Publication Number Publication Date
CN208023883U true CN208023883U (en) 2018-10-30

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CN201820397292.0U Active CN208023883U (en) 2018-03-22 2018-03-22 Ground hybrid system

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CN (1) CN208023883U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109779199A (en) * 2019-03-06 2019-05-21 孙夏星 A kind of ready-package computer room antistatic floor
CN110067361A (en) * 2019-05-23 2019-07-30 金螳螂精装科技(苏州)有限公司 A kind of assembled facing horizontal splicing mounting structure and installation method
CN110080491A (en) * 2019-05-23 2019-08-02 金螳螂精装科技(苏州)有限公司 The lateral assembled paving structure and method for paving of a kind of ground finishing material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109779199A (en) * 2019-03-06 2019-05-21 孙夏星 A kind of ready-package computer room antistatic floor
CN110067361A (en) * 2019-05-23 2019-07-30 金螳螂精装科技(苏州)有限公司 A kind of assembled facing horizontal splicing mounting structure and installation method
CN110080491A (en) * 2019-05-23 2019-08-02 金螳螂精装科技(苏州)有限公司 The lateral assembled paving structure and method for paving of a kind of ground finishing material

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GR01 Patent grant
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CP03 Change of name, title or address

Address after: 300456 Building 1, zone 1, Ronghui business park, Binhai Zhongguancun Science and Technology Park, Binhai New Area Economic and Technological Development Zone, Tianjin

Patentee after: Heneng renju Technology (Tianjin) Group Co.,Ltd.

Address before: 300270 Tianjin Economic and Technological Development Zone (Nangang Industrial Zone) No. 7 Workshop at the Junction of Textile 4th Road and Light 2nd Street, Central District

Patentee before: TIANJIN DAYIN BUILDING MATERIAL Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 300456 Building 1, zone 1, Ronghui business park, Binhai Zhongguancun Science and Technology Park, Binhai New Area Economic and Technological Development Zone, Tianjin

Patentee after: Huaneng Renju Technology Group Co.,Ltd.

Address before: 300456 Building 1, zone 1, Ronghui business park, Binhai Zhongguancun Science and Technology Park, Binhai New Area Economic and Technological Development Zone, Tianjin

Patentee before: Heneng renju Technology (Tianjin) Group Co.,Ltd.