CN208016126U - Substrate and the electronic equipment for having the substrate - Google Patents
Substrate and the electronic equipment for having the substrate Download PDFInfo
- Publication number
- CN208016126U CN208016126U CN201690000987.XU CN201690000987U CN208016126U CN 208016126 U CN208016126 U CN 208016126U CN 201690000987 U CN201690000987 U CN 201690000987U CN 208016126 U CN208016126 U CN 208016126U
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- substrate
- hole
- planar conductor
- thickness direction
- conductor
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a kind of substrate and has the electronic equipment of the substrate.Substrate (101) includes the individual layers of insulating substrate (2) or the laminated body (1) of two layers or more of the insulating substrate,And include the first planar conductor (31) and the second planar conductor (32) of mutually different position configuration on the thickness direction of surface or inside,The substrate has through-hole (5),The through-hole penetrates through the substrate in a thickness direction,And make at least part of covering inner surface configured with electrically conductive film (6) in the through-hole,First planar conductor is connected via the electrically conductive film of the through-hole with second planar conductor,First planar conductor is protruded towards the inside of the through-hole,When with being observed in the sectional view of the face cutting of the center line across the through-hole,It is clipped in the curve-like that at least part continued from the first planar conductor in the inner surface of the through-hole between first planar conductor and the second planar conductor is directed towards the outside protrusion of through-hole.
Description
Technical field
The utility model is related to substrate and has the electronic equipment of the substrate.More particularly, it relates to have so-called through-hole
The substrate of construction and the electronic equipment for having the substrate.
Background technology
It is described in laminated substrate in thickness direction in Japanese Unexamined Patent Publication 2003-218533 bulletins (patent document 1)
The technology that upper copper foil and wiring pattern in different positions are electrically connected.
It is described in Japanese Unexamined Patent Publication 2007-59803 bulletins (patent document 2) and has and will in a thickness direction configure not
The multilayer printed board for the via that the wiring pattern of same position is connected to each other.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2003-218533 bulletins
Patent document 2：Japanese Unexamined Patent Publication 2007-59803 bulletins
Utility model content
The utility model project to be solved
Being arranged as described in Patent Document 2 in the case where the through-hole of multilayer printed board is linear, logical
The inner surface card in hole is hung less, therefore there are the feelings that the plated film for being formed as covering inner surface falls off from the stripping of the inner surface of through-hole
Condition.For example, the residual stress after multilayer printed board has been applied in heating, or when being applied in impact from outside etc.,
It is possible that the phenomenon that causing plated film to remove and fall off from the inner surface of through-hole.
Therefore, in the present invention, it is intended that providing a kind of film being not likely to produce the inner surface for being formed in through-hole
The substrate to fall off and the electronic equipment for having the substrate.
A technical solution to solve project
In order to achieve the above objectives, the substrate based on the utility model be include insulating substrate individual layers or two layers or more
Insulating substrate laminated body, and include the first plane of the mutually different position configuration on the thickness direction of surface or inside
There is through-hole, above-mentioned through-hole to penetrate through aforesaid substrate in a thickness direction for the substrate of conductor and the second planar conductor, aforesaid substrate,
And it is configured with electrically conductive film in the through-hole so that cover at least part of inner surface, above-mentioned first planar conductor is via above-mentioned logical
The above-mentioned electrically conductive film in hole is connected with above-mentioned second planar conductor, and above-mentioned first planar conductor is protruded towards the inside of above-mentioned through-hole,
When with being observed in the sectional view of the face cutting of the center line across above-mentioned through-hole, it is clipped in above-mentioned first planar conductor and above-mentioned the
At least part continued from above-mentioned first planar conductor in the inner surface of above-mentioned through-hole between two planar conductors is directed towards
State the curve-like of the outside protrusion of through-hole.
In addition, the electronic equipment of the utility model has when aforesaid substrate is set as first substrate：First base
Plate；And second substrate, it is attached with grafting material on surface, the first substrate becomes at least part of the grafting material
It is imported into the state of the inner space of the through-hole, the first substrate is mutual via the grafting material with the second substrate
Engagement.
In addition, the substrate of the another mode of the utility model, include the insulation of the individual layers of insulating substrate or two layers or more
The laminated body of base material, and include the first planar conductor of the mutually different position configuration on the thickness direction of surface or inside with
And second planar conductor, the substrate have through-hole, the through-hole penetrates through the substrate in a thickness direction, and matches in the through-hole
Be equipped with electrically conductive film so that cover at least part of inner surface, first planar conductor via the through-hole the conductor
Film is connected with second planar conductor, and first planar conductor is protruded towards the inside of the through-hole, flat described first
Between face conductor and second planar conductor, the inner surface of the through-hole becomes barrel-shaped shape.
Utility model effect
According to the utility model, substrate has adequately bumps in the shape of the inner surface of through-hole, therefore can become
It is not likely to produce the construction of the film for the inner surface for being formed in through-hole to fall off.
Description of the drawings
Fig. 1 is the phantom of the substrate in the embodiment 1 based on the utility model.
Fig. 2 is the regarding sectional view about the II-II lines in Fig. 1.
Fig. 3 is the definition graph of the first step of the manufacturing method of the substrate in the embodiment 2 based on the utility model.
Fig. 4 is the definition graph of the second step of the manufacturing method of the substrate in the embodiment 2 based on the utility model.
Fig. 5 is the definition graph of the third step of the manufacturing method of the substrate in the embodiment 2 based on the utility model.
Fig. 6 is the definition graph of the fourth step of the manufacturing method of the substrate in the embodiment 2 based on the utility model.
Fig. 7 is the phantom of the substrate in the embodiment 3 based on the utility model.
Fig. 8 is the enlarged drawing of the parts Z1 in Fig. 7.
Fig. 9 is the phantom of the substrate in the embodiment 4 based on the utility model.
Figure 10 is the first figure of the variation for showing the construction near the through-hole of the substrate based on the utility model.
Figure 11 is the second figure of the variation for showing the construction near the through-hole of the substrate based on the utility model.
Figure 12 is the third figure for the variation for showing the construction near the through-hole of the substrate based on the utility model.
Figure 13 is the phantom of the substrate in the embodiment 5 based on the utility model.
Figure 14 is the explanation for the appearance that first substrate and second substrate are connected in the embodiment 6 based on the utility model
Figure.
Figure 15 is the schematical sectional view of the electronic equipment in the embodiment 6 based on the utility model.
Figure 16 is the explanation of an example of the occupation mode of the electronic equipment in the embodiment 6 based on the utility model
Figure.
Figure 17 is first example for showing barrel-shaped shape in association with the substrate in the embodiment 1 based on the utility model
The definition graph of son.
Figure 18 is the second case for showing barrel-shaped shape in association with the substrate in the embodiment 1 based on the utility model
Definition graph.
Specific implementation mode
(embodiment 1)
Referring to Fig.1~Fig. 2 illustrates the substrate in the embodiment 1 based on the utility model.This reality is shown in Fig. 1
Apply the sectional view of the substrate in mode.Fig. 2 shows the regarding sectional views about the II-II lines in Fig. 1.
Substrate 101 in present embodiment is such as lower substrate：The insulation of individual layers including insulating substrate 2 or two layers or more
The laminated body 1 of base material 2, and include the first planar conductor of mutually different position configuration on the thickness direction of surface or inside
31 and second planar conductor 32.Substrate 101 has a through-hole 5, through substrate 101 in a thickness direction of through-hole 5, and in the through-hole
5 are configured with electrically conductive film 6 so that cover at least part of inner surface.First planar conductor 31 via through-hole 5 electrically conductive film 6 with
Second planar conductor 32 is connected.First planar conductor 31 is protruded towards the inside of through-hole 5.With the center line across through-hole 5
When being observed in face of the sectional view of the progress cutting of substrate 101, it is clipped between the first planar conductor 31 and the second planar conductor 32
Through-hole 5 inner surface in from the first planar conductor 31 continue at least part be directed towards through-hole 5 outside protrude curve
Shape.
Electrically conductive film 6 is for example made of copper.Electrically conductive film 6 is, for example, plated film.As long as electrically conductive film 6 covers the inner surface of through-hole 5
At least part, and in the example depicted in figure 1, electrically conductive film 6 covers the entire inner surface of through-hole 5.The thickness of electrically conductive film 6
Such as can be 5 μm or more and 20 μm thickness appropriate below.
First planar conductor 31 and the second planar conductor 32 are, for example, conductor foil.Conductor foil is, for example, metal foil.First
Planar conductor 31 and the second planar conductor 32 are copper foils.The thickness of copper foil said here, such as can be 5 μm or more and 35
μm thickness appropriate below.Insulating substrate 2 is, for example, the base material being made of resin.Insulating substrate 2 can be by thermoplastic resin
The insulating substrate that fat is constituted.The material of insulating substrate 2 for example can be liquid crystal polymer (LCP) resin.Insulating substrate 2 it is each
The average thickness of layer for example can be 10 μm or more and 100 μm thickness appropriate below.
First planar conductor 31 becomes is provided with shape as opening portion in the center of plectane.First planar conductor 31 has
There are inner circumferential 31a and periphery 31b.Inner circumferential 31a and periphery 31b is expressed as same heart shaped herein, but this is an example, and unlimited
In same heart shaped.It is arranged that the diameter in the opening portion of planar conductor for example can be 0.3mm or more and 3mm is below appropriate big
It is small.The inner surface length E (referring to Fig.1) outstanding of planar conductor from through-hole 5 for example can be 10 μm or more and 30 μm below
Size appropriate.But length E is more than the thickness of planar conductor.
Laminated body 1 has the main surface 1v of downside in the main surface 1u and figure of upside in figure.Shown in present embodiment
In example, in through-hole 5 in the place that main surface 1u, 1v is open, it is also each configured with planar conductor.Shown in present embodiment
In example, the planar conductor configured in main surface 1u becomes the second planar conductor 32.
In the present embodiment, it is clipped in the inner surface of the through-hole 5 between the first planar conductor 31 and the second planar conductor 32
In from the first planar conductor 31 continue at least part be directed towards through-hole 5 outside protrude curve-like, therefore at least with
A part of section of first planar conductor 31 adjoining, space in through-hole 5 is with from the first planar conductor 31 towards the second plane
Conductor 32 and expand.Because the interior shape of through-hole 5 is not linear, expand, is formed in so being not likely to produce like this
The electrically conductive film 6 of the inner surface of through-hole falls off.In the case of the film of the type other than the inner surface of through-hole is formed with electrically conductive film 6
Similarly, it is not likely to produce falling off for film.
There are following situations：Form through-hole in substrate, and the through-hole fill grafting material and by substrate and other devices
Or substrate is connected to each other.In the case where through-hole is linear, exist makes to connect to external force to a certain degree greatly due to being applied in
Condensation material falls off this problem from through-hole.But in the present embodiment, because the inner surface of through-hole is in interior expansion, because
This is difficult to generate falling off for the grafting material in the case where through-hole fills grafting material and is used to connect.In addition, because through-hole 5
Interior shape become curved surface, so in the case where grafting material is solder etc., grafting material is easily wetted expansion, thus excellent
Choosing.
As shown in the embodiment, at least one party of the first planar conductor 31 and the second planar conductor 32 is preferably in substrate
Midway on 101 thickness direction is from through-hole 5 towards protruding inwardly.Like this, any one so-called planar conductor is in substrate 101
Midway on thickness direction protrudes, in other words, it is meant that and any one planar conductor is not configured as surface conductor patterns, but
It is configured to inner conductor pattern.Like this, so-called inner conductor pattern is protruded inwardly in the midway of through-hole court, it is meant that logical
The card extension of the inner surface in hole increases, therefore the film that can be more reliably prevented from the inner surface that is formed in through-hole falls off.About
Through-hole fills grafting material and is used for falling off for the grafting material in the case of connection, can also be more reliably prevented from.
In the present embodiment as shown in Fig. 2, when looking down, inside region of preferably the first planar conductor 31 to through-hole 5
It is continuously covered between lateral area.In fig. 2, the electrically conductive film 6 with the inner circumferential 31a of the first planar conductor 31 of covering divides
Ground is opened, the electrically conductive film 6 that through-hole 5 bloats the best part (part for becoming diameter D) is shown in broken lines.In referred to as through-hole 5
In the case of side region, lateral area, refer respectively to with the electrically conductive film 6 shown in the dotted line for boundary, respectively more in the inner part than it
Region, more outward region.In the example shown in Fig. 2, inside region and outside of first planar conductor 31 to through-hole 5
It is continuously covered between region.Like this, the first planar conductor 31, which extends, exists so that from inside across to outside, to
It can fully ensure the part that the first planar conductor 31 is kept by insulating substrate 2, therefore the first planar conductor 31 can be prevented
It falls off and bends inside through-hole 5.In addition, due to also ensuring that the inside of the first planar conductor 31 towards through-hole 5 is outstanding
Part, therefore be easy to prevent from being formed in falling off for the film of the inner surface of through-hole.Grafting material and the company of being used for are filled about in through-hole
Falling off for grafting material in the case of connecing, is similarly easy to prevent.
Although here, for convenience of description, using in the planar conductor for having three pieces from upper the second plate plane conductor as
It one planar conductor 31 and is illustrated using the planar conductor in the top as the second planar conductor 32, but as will
Which planar conductor is considered as the first planar conductor, which planar conductor is considered as the second planar conductor, however it is not limited to be shown here
Example, can suitably determine every time.It is also not necessarily limited to the second planar conductor 32 and is in more upper than the first planar conductor 31,
Can also be in more on the lower.
In addition, if changing an angle, the substrate 101 in present embodiment can be also grasped as following.Substrate
101 be to include the individual layers of insulating substrate 2 or the laminated body 1 of two layers or more of insulating substrate 2 and be included in surface or inside
The substrate of the first planar conductor 31 and the second planar conductor 32 of the configuration of mutually different position, substrate tool on thickness direction
There are through-hole 5, through-hole 5 to penetrate through the substrate in a thickness direction and be configured with electrically conductive film 6 in the through-hole 5 so that covering inner surface
At least part, the first planar conductor 31 is connected via the electrically conductive film 6 of through-hole 5 and the second planar conductor 32, and the first plane is led
Body 31 is protruded towards the inside of through-hole 5, between the first planar conductor 31 and the second planar conductor 32, the inner surface of through-hole 5 at
For barrel-shaped shape.
In addition, substrate 101 preferably include it is exhausted using same kind of thermoplastic resin as two layers or more of main material
The substrate of the laminated body 1 of edge base material 2.It is preferred that all one species of main material for multiple insulating substrates 2 that laminated body 1 includes.
If can the insulating substrate of multiple sheets carried out layer using same kind of thermoplastic resin as main material like this
It is thermally compressed together after folded.If insulating substrate is one species, it is not likely to produce at the mutual interface of insulating substrate
Step, therefore preferably.In the following embodiments and similarly.
(embodiment 2)
The manufacturing method of substrate is illustrated as the embodiment 2 based on the utility model with reference to Fig. 3~Fig. 6.
The manufacturing method is the manufacturing method of the substrate 101 for being illustrated in the embodiment 1.
First, prepare the laminated body 1 of construction as shown in Figure 3.Such laminated body 1 can be by being laminated certain the piece number
Have the insulating substrate 2 of conductor foil 30 on surface and obtains.Here, as an example, if 3 insulating substrates 2 have been laminated.Only
Have makes have the face-down of conductor foil 30 in undermost insulating substrate 2, makes in other insulating substrates 2 with conductor foil 30
It is face-up.Among multiple insulating substrates 2 that laminated body 1 includes, it can also be mixed with and not have the exhausted of conductor foil 30 on surface
Edge base material 2.
By for example being laser machined from any one in upper and lower surface, to as illustrated in fig. 4 to through hole 15 into
Row trepanning.As long as the processing method that can carry out trepanning to through hole 15 like this can also use other than laser processing
Processing method.By carrying out trepanning to through hole 15, opening portion is also respectively formed in conductor foil 30.Here, by there are multiple
A part in conductor foil 30 forms the first planar conductor 31 and the second planar conductor 32.At the time point, through hole 15
Inner surface can become substantially linear in insulating substrate 2.The inner surface of through hole 15 may be taper.
By being etched, to obtain shape shown in fig. 5.Etching at this time is for hardly removing conductor foil
In the case of remove insulating substrate 2 etching.From such a viewpoint, as long as etching at this time is according to the material of insulating substrate 2
The type of matter is carried out using fluid appropriate.The liquid of strong basicity can be for example used in the etching.The etching example
It can such as be carried out using the mixed liquor of monoethanolamine and KOH.
By carrying out plating, to as shown in fig. 6, forming electrically conductive film 6.Plating at this time for example can be electroless plating
With the combination of electrolytic coating.In this case, for example, electroless plating is carried out as the first stage, to form thin substrate
Hereafter plated film is used as second stage to carry out electrolytic coating, to form thick plated film.Like this, two stages can also be passed through
Plating process form electrically conductive film 6.In this case, precisely, electrically conductive film 6 becomes the stacking being made of two kinds of plated films
Body, but treated herein collectively as electrically conductive film 6.Electrically conductive film 6 is formed as covering the inner surface of through-hole 5.In the midway of through-hole 5
And the surface of the conductor foil 30 of the both ends exposing of through-hole 5 can also be covered by electrically conductive film 6.In such manner, it is possible to obtain substrate
101。
(embodiment 3)
With reference to Fig. 7~Fig. 8, the substrate in the embodiment 3 based on the utility model is illustrated.This is shown in Fig. 7
The sectional view of substrate 102 in embodiment is shown in Fig. 8 by the figure of the parts the Z1 amplification in Fig. 7.Base in present embodiment
Plate 102 is identical as the substrate 101 illustrated in the embodiment 1 as basic structure, but different in the following areas.Here, closing
Note is in nethermost conductor foil, is set to the first planar conductor 35.
First planar conductor 35 configure substrate 102 upper and lower any main surface, the first planar conductor 35 with insulation base
The surface roughness of the face 35a for the side that material 2 connects is more than the surface roughness of the face 35b of opposite side.
There are multiple planar conductors, as long as concern configuration is in the plane of any one upper and lower main surface of substrate
Conductor is simultaneously considered as the first planar conductor.In the planar conductor for properly selecting and being regarded as the first planar conductor like this
In, as long as meeting the magnitude relationship of above-mentioned surface roughness.
In the present embodiment, the effect that can be also illustrated in the embodiment 1.In turn, in the present embodiment,
As mentioned above, the surface roughness of the face 35a for the side of the first planar conductor 35 to connect with insulating substrate 2 is relatively large,
So the first planar conductor 35 becomes to be not easy to remove from insulating substrate 2.In addition, in the face 35b of its opposite side, that is, with it is other certain
In face used in electrical connection between object, surface roughness is relatively small, therefore can inhibit conductor resistance small.
It also can reach centainly in addition, though only meeting the condition in the planar conductor for being configured at any one upper and lower main surface
Effect, it is preferred that meeting the condition in the planar conductor for being configured at upper and lower two main surfaces.Although in present embodiment
In, as shown in Fig. 7~Fig. 8, pays close attention to and be in nethermost conductor foil, but further preferably, it is led in uppermost
In body foil (planar conductor), the surface roughness in the face of the side to connect with insulating substrate 2 is also made to be more than the table in the face of opposite side
Surface roughness.Meet above-mentioned condition by the conductor foil to the top and this bottom both sides, so as to obtain more
Advantageous effect.
(embodiment 4)
The substrate in the embodiment 4 based on the utility model is illustrated with reference to Fig. 9.Substrate in present embodiment
103 is identical as the substrate 101 illustrated in the embodiment 1 as basic structure, but different in the following areas.
It, will be in the thickness side of substrate 103 in the sectional view (with reference to Fig. 9) of substrate 103 when the first planar conductor 31 of concern
Look up away from the first planar conductor 31 most nearby and the diameter of through-hole 5 become greatly point be set as point A, by the first planar conductor
31 are set as point B towards the inside of through-hole 5 front end most outstanding, by the straight line drawn in a thickness direction from point A with from point B
The intersection point for the straight line vertically drawn with the thickness direction is set as point C, at this point, the length between BC is less than two of the length between AC
Times.If that is, as shown in figure 9, the length between BC is set as P, and the length between AC is set as H, then the relationship of P < 2H is set up.
In the present embodiment, the effect that can be also illustrated in the embodiment 1.In turn, in the present embodiment,
As described above, when observing in the cross-section, the relationship of P < 2H is set up, therefore the first planar conductor 31 will not be towards in through-hole 5
Heart protrusion is long, and the protrusion of the first planar conductor 31 is kept for configuring the grafting material in through-hole 5 as card
The intensity of catch member can steadily work.
So far, in as Fig. 1, Fig. 6, Fig. 7, it is shown in Fig. 9 constituted substrate laminated body 1 be have accumulated total 3
It is illustrated premised on the example of the laminated body of the insulating substrate 2 of layer, but the number of plies of the insulating substrate 2 that includes of laminated body 1
3 are not limited to, can be more, it can also be less.Fig. 1, Fig. 6, Fig. 7, example shown in Fig. 9 structure be, if concern through-hole 5 in,
Planar conductor is then being configured between first layer and the second layer from upper, plane, which is not configured, between the second layer and third layer leads
Body, but this is an example, the shape of planar conductor, the piece number, configuration are not limited to illustrated plane so far and lead
The shape of body, the piece number, configuration.For example, it is also possible to be that the whole interfaces to adjoin one another in insulating substrate 2 are matched as shown in Figure 10
The structure of planar conductor is set.
For example, it is also possible to be such as lower structure as shown in figure 11：Even if being laminated with multiple insulating substrates 2, in through-hole 5
Portion is only provided with planar conductor also without planar conductor in the upper and lower main surface for the laminated body 1 for being equivalent to the both ends of through-hole 5.
For example, it is also possible to be structure of the single layer provided with through-hole 5 in insulating substrate 2 as shown in figure 12.
Although in the example shown so far, it is open in upper and lower main surface 1u, 1v of laminated body 1 in through-hole 5
Place be provided with planar conductor, but not necessarily upper and lower main surface 1u, 1v of laminated body 1 to be provided with plane and lead
Body.Can also be the structure that a side only in upper and lower main surface 1u, 1v of laminated body 1 is provided with planar conductor, it can be with
It is that the structure of planar conductor is not set in upper and lower main surface 1u, 1v of laminated body 1.First planar conductor 31 and second is flat
Face conductor 32 can also be provided in internal inner conductor pattern, main surface 1u, 1v without being provided in laminated body 1.
(embodiment 5)
The substrate in 3 pairs of embodiments 5 based on the utility model illustrates referring to Fig.1.Base in present embodiment
Plate 104 has through-hole 5.
In substrate 104, grafting material 7 is configured in the inner space of through-hole 5.Substrate 104 is in addition to being configured with engagement material
Expect other than 7 this structure, the structure of other parts is identical as the substrate illustrated in embodiment 1, embodiment 2.
Grafting material 7 is, for example, conductive bonding material.Grafting material 7 is, for example, solder.Solder is electric conductivity engagement material
One kind of material.In the example shown in Figure 13, grafting material 7 is filled in the inner space of through-hole 5.
In the present embodiment, because the inner space of through-hole 5 be configured with grafting material 7, with other components
When electrically engaging, can use through-hole 5 inside grafting material 7, electrical connection becomes easy.
Although in the example shown in present embodiment, showing and being filled with grafting material 7 in the inner space of through-hole 5
Example, that is, the example of entire inner space of the grafting material 7 full of through-hole 5, but the configuration method of grafting material 7 is not limited to
This.Grafting material 7 can also be configured to only fill up a part for the inner space of through-hole 5.Although in the example shown in Figure 13,
Grafting material 7 is the state of degree slightly overflowed from through-hole 5 of upper and lower surface in laminated body 1, but can also be overflowed more.
The planar conductor configured in the upper and lower surface of laminated body 1 can also be covered by grafting material 7.
In addition, the substrate illustrated in above-mentioned each embodiment is preferably flexible base board.It is flexible base board in substrate
In the case of, when being contained in limited space, or when carrying out the connection with other devices etc., its change can be made as needed
Shape, therefore easily.
(embodiment 6)
4~Figure 16 illustrates the electronic equipment in the embodiment 6 based on the utility model referring to Fig.1.
In fig. 14, the appearance being attached to the substrate 101 with through-hole 5 and the substrate 201 with electrode 8 is shown.
Substrate 101 can be the substrate 101 illustrated in the embodiment 1.That is, substrate 101 has the thickness direction on surface or inside
The first planar conductor 31 and the second planar conductor 32 of upper mutually different position configuration.The inner surface of the through-hole 5 of substrate 101
At least part is covered by electrically conductive film 6.In the example being shown here, the entire inner surface of through-hole 5 is covered by electrically conductive film 6.
There is substrate 201 surface 201u, electrode 8 to configure in surface 201u.It is configured with grafting material 7 in the upper surface of electrode 8.Engage material
Material 7 is, for example, solder.
State after Figure 15 shows to connect substrate 101 and substrate 201.
When the substrate illustrated in the embodiment 1 101 is set as first substrate, the electronic equipment in present embodiment
501 have as the substrate 101 of first substrate and are attached with the substrate 201 as second substrate of grafting material on surface.The
One substrate becomes the state for the inner space that at least part of grafting material 7 is imported into through-hole 5.First substrate and the second base
Plate is interconnected via grafting material 7.One example of the occupation mode of electronic equipment 501 is shown in Figure 16.
In electronic equipment in the present embodiment, have adequately in the shape of first substrate and inner surface for being arranged
Concave-convex through-hole 5 makes the grafting material 7 for being attached to second substrate enter, to be engaged, therefore is not susceptible to grafting material
7 fall off such situation from through-hole 5.According to the present embodiment, the electronics to fall off realized and be not likely to produce grafting material can be done
Equipment.In the electronic equipment, because through-hole 5 has adequately bumps in the shape of inner surface, it is not easy to cause electrically conductive film 6
It falls off such situation from through-hole 5.
In electronic equipment in the present embodiment, the inner surface of the through-hole of first substrate becomes curved surface, so engaging
In the case that material is solder, it is easy in terms of the entire inner surface of through-hole soaks expansion to be also preferred in solder.
In addition, as shown in the embodiment, first substrate is preferably flexible base board.In the feelings that first substrate is flexible base board
Under condition, such as in Figure 16 illustrated by arrow 93, first substrate can change posture.If as shown in figure 16 first
Connector 12 is arranged in substrate, then connector 12 can be used as carrying out the connection for shell 51 illustrated by arrow 92.
Substrate 201 as second substrate uses through-hole 5 and grafting material with the substrate 101 as first substrate in joint portion 10
7 securely engage, therefore even if the case where so that substrate 101 is substantially deformed due to being connected to shell 51 using connector 12
Under, substrate 101 will not be easily separated with substrate 201, can steadily maintain connection status.
In addition, be in the embodiment 1 " barrel-shaped shape " by the inner surface of through-hole 5 explanation, about concept as barrel-shaped shape,
Further it is described in detail.Barrel-shaped shape said here is certainly included in and carries out cuing open for cutting with the plane across center line
The shape only indicated as shown in figure 17 by curve when being observed in view, but not limited to this, further includes in identical sectional view
The shape indicated as shown in figure 18 comprising straight line portion in midway when observation.Here, being example shown in Figure 17 and Figure 18
Show, also includes widely similar shape in addition to this.In addition, in Figure 17, Tu18Zhong, about planar conductor, electrically conductive film 6 etc.,
The illustration is omitted.
In addition, though in the respective embodiments described above, show that insulating substrate 2 is the example of resin, but insulating substrate 2
Can also be the material other than resin, such as ceramics.
Alternatively, it is also possible to which multiple be suitably combined in the above embodiment is used.
In addition, this time disclosed the above embodiment is to illustrate in all aspects, it is not restrictive.This practicality
Novel range is shown in the claims, and includes all changes in the meaning and range being equal with claims.
Reference sign
1：Laminated body, 1u, 1v：Main surface, 2：Insulating substrate, 5：Through-hole, 6：Electrically conductive film, 7：Grafting material, 8：Electrode,
10：Joint portion, 12：Connector, 15：Through hole, 30：Conductor foil, 31,35：First planar conductor, 31a：Inner circumferential, 31b：Periphery,
32：Second planar conductor, 35a, 35b：Face, 51：Shell, 91,92,93：Arrow, 101：Substrate (first substrate), 102,103,
104：Substrate, 201：Substrate (second substrate), 201u：Surface, 501：Electronic equipment.
Claims (11)
1. a kind of substrate, include the laminated body of the insulating substrate of the individual layers of insulating substrate or two layers or more, and is included in surface
Or the first planar conductor and the second planar conductor that mutually different position configures on internal thickness direction, wherein
The substrate has：Through-hole penetrates through the substrate, and is configured with electrically conductive film in the through-hole in a thickness direction so that covers
At least part of interior surface,
First planar conductor is connected via the electrically conductive film of the through-hole with second planar conductor,
First planar conductor is protruded towards the inside of the through-hole, in the face cutting with the center line across the through-hole
When being observed in sectional view, it is clipped in the inner surface of the through-hole between first planar conductor and second planar conductor
At least part continued from first planar conductor is directed towards the curve-like that the outside of the through-hole is protruded.
2. substrate according to claim 1, wherein
At least one party in first planar conductor and second planar conductor is on the thickness direction of the substrate
Midway is protruded inwardly from through-hole court.
3. substrate according to claim 1, wherein
When looking down, first planar conductor continuously covers between the inside region and lateral area of the through-hole
Lid.
4. substrate according to claim 1, wherein
It is configured with grafting material in the inner space of the through-hole.
5. substrate according to claim 1, wherein
First planar conductor configuration the substrate upper and lower any main surface, first planar conductor with it is described absolutely
The surface roughness in the face for the side that edge base material connects is more than the surface roughness in the face of opposite side.
6. substrate according to claim 1, wherein
When paying close attention to first planar conductor in the sectional view of the substrate, it will be observed away from institute in the thickness direction of the substrate
State the first planar conductor most nearby and the diameter of the through-hole become greatly point be set as point A, by first planar conductor court
It is set as point B to the inside of through-hole front end most outstanding, by the straight line drawn in a thickness direction from point A and from point B
When the intersection point for the straight line vertically drawn with the thickness direction is set as point C, the length between BC is less than twice of the length between AC.
7. substrate according to claim 1, wherein
The substrate includes using same kind of thermoplastic resin as the laminated body of two layers or more of insulating substrate of main material.
8. substrate according to claim 1, wherein
The substrate is flexible base board.
9. a kind of electronic equipment, wherein
When the substrate described in claim 7 is set as first substrate, have：
The first substrate；With
Second substrate is attached with grafting material on surface,
The first substrate becomes the state for the inner space that at least part of the grafting material is imported into the through-hole,
The first substrate is interconnected with the second substrate via the grafting material.
10. electronic equipment according to claim 9, wherein
The first substrate is flexible base board.
11. a kind of substrate, include the laminated body of the insulating substrate of the individual layers of insulating substrate or two layers or more, and is included in surface
Or the first planar conductor and the second planar conductor that mutually different position configures on internal thickness direction, wherein
The substrate has：Through-hole penetrates through the substrate, and is configured with electrically conductive film in the through-hole in a thickness direction so that covers
At least part of interior surface,
First planar conductor is connected via the electrically conductive film of the through-hole with second planar conductor,
First planar conductor is protruded towards the inside of the through-hole, is led in first planar conductor and second plane
Between body, the inner surface of the through-hole becomes barrel-shaped shape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015135404 | 2015-07-06 | ||
| JP2015-135404 | 2015-07-06 | ||
| PCT/JP2016/066439 WO2017006665A1 (en) | 2015-07-06 | 2016-06-02 | Substrate and electronic component provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208016126U true CN208016126U (en) | 2018-10-26 |
Family
ID=57685343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690000987.XU Active CN208016126U (en) | 2015-07-06 | 2016-06-02 | Substrate and the electronic equipment for having the substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208016126U (en) |
| WO (1) | WO2017006665A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024035176A1 (en) * | 2022-08-10 | 2024-02-15 | 엘지이노텍 주식회사 | Semiconductor package substrate and semiconductor package including same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3348990A (en) * | 1963-12-23 | 1967-10-24 | Sperry Rand Corp | Process for electrically interconnecting elements on different layers of a multilayer printed circuit assembly |
| US4628598A (en) * | 1984-10-02 | 1986-12-16 | The United States Of America As Represented By The Secretary Of The Air Force | Mechanical locking between multi-layer printed wiring board conductors and through-hole plating |
| JPS61263198A (en) * | 1985-05-16 | 1986-11-21 | 熊谷 彰治郎 | Interlamelar conductive section for multilayer printed wiring board |
| JPH0766548A (en) * | 1993-08-23 | 1995-03-10 | Nagano Japan Radio Co | Connection of printed board |
-
2016
- 2016-06-02 CN CN201690000987.XU patent/CN208016126U/en active Active
- 2016-06-02 WO PCT/JP2016/066439 patent/WO2017006665A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024035176A1 (en) * | 2022-08-10 | 2024-02-15 | 엘지이노텍 주식회사 | Semiconductor package substrate and semiconductor package including same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017006665A1 (en) | 2017-01-12 |
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