CN207993804U - A kind of DIP encapsulation chip pin reshaping clamp - Google Patents
A kind of DIP encapsulation chip pin reshaping clamp Download PDFInfo
- Publication number
- CN207993804U CN207993804U CN201820005499.9U CN201820005499U CN207993804U CN 207993804 U CN207993804 U CN 207993804U CN 201820005499 U CN201820005499 U CN 201820005499U CN 207993804 U CN207993804 U CN 207993804U
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- Prior art keywords
- fixed seat
- shaping
- chip pin
- reshaping clamp
- rack
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Abstract
The utility model discloses a kind of DIP to encapsulate chip pin reshaping clamp, including rack, compatible upper rail and lower railway are provided in the rack, the sliding slot for placing encapsulation chip is provided on the lower railway, shaping fixed seat is additionally provided in the rack, apparatus for shaping is provided in shaping fixed seat, the axis of the apparatus for shaping and the axis of lower railway are located in same perpendicular；The utility model will encapsulate and carry out shaping quickly through apparatus for shaping during chip slides in sliding slot, on the one hand its plastic precision is guaranteed, it can also realize different shaping requirements by replacing different dressing sticks simultaneously, on the other hand the sliding speed of chip is encapsulated by quickening to improve the efficiency of shaping, plastic precision and shaping efficiency are all higher.
Description
Technical field
The utility model is related to integrated antenna package equipment technical fields, and in particular to a kind of DIP encapsulation chip pin is whole
Clamp.
Background technology
DIP encapsulation chips refer to the IC chip using dual-inline package, and most middle and small scales are integrated
Circuit（IC）It is all made of such packing forms.Usually there are two rows of pins using the DIP cpu chips encapsulated, using straight cutting to having
On the chip carrier socket of DIP structures, or it is directly inserted on the circuit board with identical welding hole number and geometry arrangement and is welded.
In the process of DIP series of products, it is Trim Molding to have a procedure, and function is that will be encapsulated on frame
IC products are separated into finished product, and for product in separation process and after process, it is not up to standard that small part product will appear two rows of pin spans
Defect or customer requirement two rows of pin spans of the product for the type that has been processed into are enlarged as requested.
The processing mode for being directed to case above in the prior art is manually to turn round to arrive with feeling by pins of products with tweezers to require
Pin span, reuse detection jig and be detected pin away from whether qualified.But such mode is not suitable on a large scale
Production correction, while serious waste human resources.
The Chinese utility model patent of Publication No. CN204052717U discloses a kind of be applicable on December 31st, 2014
In the bending pins mechanism for expanding or shrinking width, including rack, compression bar, the deformation briquetting for being fixed on compression bar lower end and positioned at becoming
Material table below shape briquetting, compression bar can be further fixed on pin locking apparatus in its axial movement, compression bar；Pin locking apparatus
Including spring base, spring and positioning briquetting, spring base is fixed on compression bar, the both ends of spring respectively with spring base and positioning briquetting
It is fixedly connected, and the axis of spring is parallel with the axis of compression bar, the lower end position of positioning briquetting is less than the lower end position for deforming briquetting
It sets；It is both provided with accommodating hole on positioning briquetting and deformation briquetting；Be additionally provided with groove adjustment portion on material table, groove adjustment portion with
A groove is formed between material table.The utility model is simple in structure, and spacing is because bending process occurs between can preventing pin
Variation is finally resulted in be occurred with the not high situation of pin bores cooperation precision, suitable for expanding or shrinking the pin of width between pin
Bending.
Invention content
Low, the serious defect of waste of human resource, this practicality for pin existing in the prior art correction, expansion efficiency
Novel to disclose a kind of DIP encapsulation chip pin apparatus for shaping, the utility model can fast and accurately draw encapsulation chip
Foot carries out shaping, effectively increases the efficiency of chip pin shaping.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of DIP encapsulates chip pin reshaping clamp, including rack, is provided with lower railway in the rack, on lower railway
Side is provided with matched upper rail, and the sliding slot for placing encapsulation chip is provided on lower railway；It is also set up in the rack
There is shaping fixed seat, be provided with apparatus for shaping in the shaping fixed seat, in the central axes and lower railway of the apparatus for shaping
Axis is located in same perpendicular.
The apparatus for shaping includes fixed seat, and roller shaft is installed in fixed seat, rolling is provided on the roller shaft
Wheel.
At least two groups idler wheel is symmetrically arranged in the fixed seat, every group there are two idler wheels；And the idler wheel in same group it
Between spacing be more than encapsulation chip pin thickness, difference group idler wheels about fixed seat axisymmetrical be distributed.
The idler wheel is obliquely installed in fixed seat, and the inclination angle of fixed seat and is encapsulated the gradient of chip pin and mutually fitted
Match.
The arrival end of the lower railway, which is provided with, draws material rail, it is described draw material rail on be provided with the deflector chute being connected to sliding slot；
It is described to be additionally provided with material pressing device and material-pulling device to deflector chute surface.
The material pressing device includes the pivoted arm seat being fixedly installed in rack, and binder pivoted arm is hinged on the pivoted arm seat,
It is provided with binder item on the binder pivoted arm.
The binder pivoted arm and pivoted arm are sat, are additionally provided with tension spring between seat.
The material-pulling device includes the shaft fixed seat being fixedly installed in rack, and cunning is provided in the shaft fixed seat
Moving axis bar, on the sliding shaft rod sliding be provided with expeller.
The shaft fixed seat includes left axle bar fixed seat and right axle bar fixed seat.
The outlet end of the lower railway is provided with expects pipe fixed seat, and the expects pipe fixation, which is taken, is provided with blow tank, described
Blow tank is the inclined-plane that gradient is 20 ° -30 °.
Compared with prior art, the utility model has advantageous effect：
1, the utility model is provided with mutually matched lower railway and upper rail in rack, is provided with above lower railway whole
Shape dress is set, and encapsulation chip is positioned in sliding slot, and sliding slot is arranged above apparatus for shaping, and encapsulation chip slides in sliding slot
During quickly through apparatus for shaping carry out shaping, on the one hand its plastic precision is guaranteed, while can also be by more
It changes different dressing sticks and realizes different shaping requirements, the sliding speed of chip is on the other hand encapsulated by quickening to improve shaping
Efficiency, plastic precision and shaping efficiency are all higher.
2, the apparatus for shaping of the utility model includes fixed seat, and idler wheel is tiltedly installed in fixed seat, and the idler wheel includes
At least 2 groups 4, and it is more than the pin thickness for encapsulating chip with spacing between the idler wheel of group, the inclined angle sparetime encapsulates chip
Pin be adapted, and the idler wheel of different group is then symmetrically distributed in fixed seat, ensures that the pin of encapsulation chip can be smooth
Passed through between two idler wheels, avoid pair of rollers encapsulation chip pin damage, while pass through idler wheel reduce encapsulation core
Friction between piece and apparatus for shaping not only increases shaping effect, also protects chip pin.
3, it is provided with material pressing device and material-pulling device in the rack of the utility model, lower railway on the one hand is entered to preparation
On encapsulation chip arranged, ensure its it is orderly shaping is carried out by lower railway, be not on the other hand conveniently operated person to lower rail
Input package chip in road improves working efficiency.
4, the material-pulling device of the utility model includes pivoted arm seat, and binder pivoted arm is provided on pivoted arm seat, is set on binder pivoted arm
It is equipped with binder item, and is connected by tension spring between binder pivoted arm and pivoted arm seat, ensures the finishing effect to encapsulating chip, it is ensured that raw
Production flow is smoothed out, while ensureing the attitude stabilization of binder pivoted arm by tension spring, it is ensured that it imitates the limit for encapsulating chip
Fruit.
5, the material-pulling device of the utility model includes left axle bar fixed seat and right axle bar fixed seat, left and right shaft fixed seat
Between be provided with sliding shaft rod, be provided with expeller on sliding shaft rod, convenient for users to quickly stirring encapsulation chip, improve encapsulation
The shaping efficiency of chip.
6, the lower railway outlet end of the utility model is additionally provided with expects pipe fixed seat, is arranged in expects pipe fixed seat and gradient is
20 ° -30 ° of blow tank, the case chip for making shaping finish using the effect of gravity realize quickly discharging material, encapsulation, improve equipment
Working efficiency.
Description of the drawings
Fig. 1 is the utility model front view；
Fig. 2 is the utility model rearview；
Fig. 3 is the utility model left view；
Fig. 4 is the utility model vertical view；
Reference numeral：1, rack, 2, lower railway, 3, upper rail, 4, sliding slot, 5, shaping fixed seat, 6, fixed seat, 7, idler wheel
Axis, 8, idler wheel, 9, draw material rail, 10, deflector chute, 11, pivoted arm seat, 12, binder pivoted arm, 13, binder item, 14, tension spring, 15, sliding
Shaft, 16, expeller, 17, left axle bar fixed seat, 18, right axle bar fixed seat, 19, expects pipe fixed seat, 20, blow tank.
Specific implementation mode
It below will the utility model is described in further detail by specific embodiment：
Embodiment 1
Most preferred embodiment of the present embodiment as the utility model, it discloses a kind of DIP to encapsulate chip pin plastic splint
Tool, concrete structure are fixedly installed upper rail 3 and lower railway 2, the lower rail as shown in Figure 1, including rack 1 in the rack 1
The sliding slot 4 for placing encapsulation chip is provided on road 2, upper rail 3 is located at the top of lower railway 2；It is also set up in the rack 1
There is shaping fixed seat 5, fixed seat 6 is provided in the shaping fixed seat 5, the fixed seat 6 is located at the surface of sliding slot 4, Gu
It is additionally provided with roller shaft 7 in reservation 6, is rotated on the roller shaft 7 and is provided with idler wheel 8；At least 2 groups 4, the idler wheel 8, together
One group of two idler wheels 8 are inclined to be set in fixed seat 6, and angle of inclination and the pin angle of inclination of encapsulation chip are mutually fitted
It answers, and the spacing between idler wheel 8 is more than the thickness of encapsulation chip pin；Axisymmetrical of the idler wheel 8 of difference group about fixed seat 6
Distribution；The arrival end of lower railway 2, which is provided with, draws material rail 9, it is described draw be provided with deflector chute 10 on material rail 9, the deflector chute 10 with
Sliding slot 4 is connected；It is additionally provided with pivoted arm seat 11 in the rack 1, binder pivoted arm 12, and binder pivoted arm are hinged on pivoted arm seat 11
It is also connected by tension spring 14 between 12 and pivoted arm seat 11；Binder item 13, binder item 13 are installed on the binder pivoted arm 12
Positioned at the surface of deflector chute 10；The side of the rack 1 is provided with left axle bar fixed seat 17 and right axle bar fixed seat 18, left axle
It is provided with sliding shaft rod 15 between bar fixed seat 17 and right axle bar fixed seat 18, is slidably installed and is useful on the sliding shaft rod 15
The expeller 16 for pushing encapsulation chip to be moved to lower railway 2；The outlet end of the lower railway 2 is fixedly connected with expects pipe fixed seat
19, blow tank 20 is provided in the expects pipe fixed seat 19, blow tank 20 is an inclined-plane, and angle of inclination is 20 °.
Embodiment 2
The gradient of another embodiment of the present embodiment as the utility model, the blow tank 20 is 30 °.
The course of work of the utility model：Corresponding apparatus for shaping is selected to be installed on shaping fixed seat as needed first
On, then chip pin being positioned in deflector chute upward will be encapsulated, and binder pivoted arm is positioned over working condition, make binder item position
In the surface of encapsulation chip；Expeller is slided in the direction where track still further below, and encapsulation chip is made to be entered from deflector chute
In sliding slot, and shaping of the pin of chip between two idler wheels from same group by realization to pin is encapsulated, last shaping is complete
Complete encapsulation chip can sliding slot outlet end enter directly into the expects pipe being fixedly connected in expects pipe fixed seat by blow tank
In, realize quickly discharging material, the packaging of encapsulation chip；The utility model can preferably ensure the plastic precision of encapsulation chip, together
When greatly improve encapsulation chip shaping efficiency.
Claims (10)
1. a kind of DIP encapsulates chip pin reshaping clamp, including rack（1）, the rack（1）On be provided with lower railway（2）, under
Track（2）Top is provided with matched upper rail（3）, lower railway（2）On be provided with place encapsulation chip sliding slot
（4）；The rack（1）On be additionally provided with shaping fixed seat（5）, the shaping fixed seat（5）On be provided with apparatus for shaping, it is described
The central axes of apparatus for shaping and lower railway（2）Central axes be located in same perpendicular.
2. a kind of DIP according to claim 1 encapsulates chip pin reshaping clamp, it is characterised in that：The apparatus for shaping
Including fixed seat（6）, fixed seat（6）On be installed with roller shaft（7）, the roller shaft（7）On be provided with idler wheel（8）.
3. a kind of DIP according to claim 2 encapsulates chip pin reshaping clamp, it is characterised in that：The fixed seat（6）
On be symmetrically arranged at least two groups idler wheel（8）, every group there are two idler wheels（8）；And the idler wheel in same group（8）Between spacing it is big
In the thickness of encapsulation chip pin, the idler wheel of difference group（8）About fixed seat（6）Axisymmetrical distribution.
4. a kind of DIP according to any one of Claims 2 or 3 encapsulates chip pin reshaping clamp, it is characterised in that：
The idler wheel（8）It is obliquely installed in fixed seat（6）On, and its angle of inclination is adapted with the gradient of encapsulation chip pin.
5. a kind of DIP according to claim 1 encapsulates chip pin reshaping clamp, it is characterised in that：The lower railway（2）
Arrival end be provided with and draw material rail（9）, described to draw material rail（9）On be provided with and sliding slot（4）The deflector chute of connection（10）；It is described to lead
Hopper（10）Surface is additionally provided with material pressing device and material-pulling device.
6. a kind of DIP according to claim 5 encapsulates chip pin reshaping clamp, it is characterised in that：The material pressing device
Including being fixedly installed in rack（1）On pivoted arm seat（11）, the pivoted arm seat（11）On be hinged with binder pivoted arm（12）, the pressure
Expect pivoted arm（12）On be provided with binder item（13）.
7. a kind of DIP according to claim 6 encapsulates chip pin reshaping clamp, it is characterised in that：The binder pivoted arm
（12）With pivoted arm seat（11）Between be additionally provided with tension spring（14）.
8. a kind of DIP according to claim 5 encapsulates chip pin reshaping clamp, it is characterised in that：The material-pulling device
Including being fixedly installed in rack（1）On shaft fixed seat, be provided with sliding shaft rod in the shaft fixed seat（15）, the cunning
Moving axis bar（15）Upper sliding is provided with expeller（16）.
9. a kind of DIP according to claim 8 encapsulates chip pin reshaping clamp, it is characterised in that：The shaft is fixed
Seat includes left axle bar fixed seat（17）With right axle bar fixed seat（18）, the sliding shaft rod（15）Both ends be fixedly installed in respectively
Left axle bar fixed seat（17）With right axle bar fixed seat（18）On.
10. a kind of DIP according to claim 1 encapsulates chip pin reshaping clamp, it is characterised in that：The lower railway
（2）Outlet end be provided with expects pipe fixed seat（19）, the expects pipe fixed seat（19）On be provided with blow tank（20）, the discharging
Slot（20）It is the inclined-plane that gradient is 20 ° -30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005499.9U CN207993804U (en) | 2018-01-03 | 2018-01-03 | A kind of DIP encapsulation chip pin reshaping clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005499.9U CN207993804U (en) | 2018-01-03 | 2018-01-03 | A kind of DIP encapsulation chip pin reshaping clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207993804U true CN207993804U (en) | 2018-10-19 |
Family
ID=63818915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820005499.9U Active CN207993804U (en) | 2018-01-03 | 2018-01-03 | A kind of DIP encapsulation chip pin reshaping clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207993804U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
| CN113070541A (en) * | 2021-04-01 | 2021-07-06 | 安徽同佳电子科技有限公司 | Positioning mechanism for tin coating of motor coil end |
-
2018
- 2018-01-03 CN CN201820005499.9U patent/CN207993804U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113070541A (en) * | 2021-04-01 | 2021-07-06 | 安徽同佳电子科技有限公司 | Positioning mechanism for tin coating of motor coil end |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: DIP encapsulation chip pin plastic anchor clamps Effective date of registration: 20190507 Granted publication date: 20181019 Pledgee: China Postal Savings Bank Limited by Share Ltd Suining Sui branch Pledgor: Sichuan Ming Tai Electronic Science and Technology Co., Ltd. Registration number: 2019510000053 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 629000 Dequan road Microelectronics Industrial Park, Suining economic and Technological Development Zone, Sichuan Province Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd. Address before: 629000 Dequan road Microelectronics Industrial Park, Suining economic and Technological Development Zone, Sichuan Province Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220328 Granted publication date: 20181019 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2019510000053 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |