CN206871681U - A kind of chip semiconductor package box - Google Patents
A kind of chip semiconductor package box Download PDFInfo
- Publication number
- CN206871681U CN206871681U CN201720354768.8U CN201720354768U CN206871681U CN 206871681 U CN206871681 U CN 206871681U CN 201720354768 U CN201720354768 U CN 201720354768U CN 206871681 U CN206871681 U CN 206871681U
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- fixedly connected
- spring
- sliding panel
- shaped piece
- away
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Abstract
The utility model discloses a kind of chip semiconductor package box, including the casing of base first, the bottom of first cabinet wall is fixedly connected with U-shaped piece of symmetrical first, the bottom of first U-shaped piece of inwall is fixedly connected with the first spring, the other end of first spring is fixedly connected with the first sliding panel, the both ends and the both sides of first U-shaped piece of inwall of first sliding panel are slidably connected, the described one end of first sliding panel away from the first spring is fixedly connected with head rod, the one end of the head rod away from the first sliding panel runs through first U-shaped piece of top and extends to first U-shaped piece of outside, the one end of the head rod away from the first sliding panel is fixedly connected by the second casing.The chip semiconductor package box, when packing box is subjected to jolting, comprehensive damping reduces semiconductor chip impaired probability in transportation, and whole device is easy to use, can be produced in enormous quantities.
Description
Technical field
Field of chip manufacture technology is the utility model is related to, specially a kind of chip semiconductor package box.
Background technology
Semiconductor chip is that etch is carried out on semiconductor sheet material, wiring, the manufactured semiconductor that can realize certain function
Device.More than silicon, common also includes GaAs,（GaAs is poisonous, so some circuit boards inferior should not be curious point
Solve it）The semi-conducting materials such as germanium.Semiconductor has trend also like automobile.The US enterprises such as nineteen seventies, Intel exist
Get the upper hand in DRAM (D-RAM) market.But due to mainframe computer appearance, it is necessary to high-performance D-RAM two
Tenth century the eighties, Japanese enterprises come out at the top.
Many transportations are needed during semiconductor chip manufactures, but the semiconductor chip of finished product is because of it
Special accuracy, so transport case usual in transportation can cause because not possessing shock-absorbing function to semiconductor chip
Damage, this unnecessary damage can influence the accuracy of semiconductor chip, therefore, a kind of it is proposed that chip semiconductor package
Box.
Utility model content
The purpose of this utility model is to provide a kind of chip semiconductor package box, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the utility model provides following technical scheme：A kind of chip semiconductor package box, including the
One casing, the bottom of first cabinet wall are fixedly connected with U-shaped piece of symmetrical first, first U-shaped piece of inwall
Bottom be fixedly connected with the first spring, the other end of first spring is fixedly connected with the first sliding panel, and described first slides
The both ends and the both sides of first U-shaped piece of inwall of dynamic plate are slidably connected, and the described one end of first sliding panel away from the first spring is fixed
It is connected with head rod, top and extension of the one end of the head rod away from the first sliding panel through first U-shaped piece
To first U-shaped piece of outside, the one end of the head rod away from the first sliding panel is fixedly connected by the second casing, described
The surface of head rod is fixedly connected with the first fixed block, and the surface of the head rod is socketed with second spring, described
The top and bottom distribution of second spring is fixedly connected on the bottom and first U-shaped piece of top of the first fixed block, and described first
The both sides of cabinet wall have been fixedly connected with second U-shaped piece, and the bottom of second U-shaped piece of inwall is fixedly connected with the 3rd bullet
Spring, the other end of the 3rd spring be fixedly connected with the second sliding panel, the both ends of second sliding panel with second U-shaped piece
Inwall is slidably connected, and the side of second sliding panel away from the 3rd spring is fixedly connected with the second connecting rod, and described second connects
The one end of extension bar away from the second sliding panel is fixedly connected with the first fixed plate, first fixed plate away from the second connecting rod one
Side is provided with the 4th spring, and the side of first casing top is connected with cover plate by fixed ball, and the cover plate is remote
Bottom from one end of fixed ball is fixedly connected with the second fixed plate, and the one end of second fixed plate away from cover plate, which is fixed, to be connected
It is connected to fixture block, the position of the opposite side of first casing top and corresponding fixture block offers neck.
Preferably, the fixture block includes shell, and the 3rd fixed plate is fixedly connected with the axis of the outer casing inner wall, described
The both sides of 3rd fixed plate are fixedly connected with the 5th symmetrical spring, the described one end of 5th spring away from the 3rd fixed plate
The 3rd sliding panel is fixedly connected with, the both ends of the 3rd sliding panel and the inwall of shell are slidably connected, the 3rd sliding panel
Side away from the 5th spring is fixedly connected with arc caking block.
Preferably, it is provided with symmetrical limited block at the top of second U-shaped piece of inwall.
Preferably, the bottom of first casing is fixedly connected with anti-skid rubber cushion, and the anti-skid rubber cushion is away from first
The side of casing is provided with anti-skidding salient point.
Compared with prior art, the beneficial effects of the utility model are：The chip semiconductor package box, is subjected in packing box
When jolting, by extruding of second casing to head rod, then the second casing is produced by the first spring and second spring and delayed
Impulse force, the 4th spring is extruded so as to reach damping up and down, when double swerve occurs for the second casing so as to extrude the second connecting rod pair
3rd spring extrudes, and two spring collective effects cause packing box to reach left and right damping, and comprehensive damping reduces semiconductor
Chip impaired probability in transportation, and whole packing box is easy to use, can be produced in enormous quantities.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model A-A schematic enlarged-scale views.
In figure：1 first casing, 2 first U-shaped pieces, 3 first springs, 4 first sliding panels, 5 head rods, 6 first fix
Block, 7 second springs, 8 second casings, 9 second U-shaped pieces, 10 the 3rd springs, 11 second sliding panels, 12 second connecting rods, 13 first
Fixed plate, 14 the 4th springs, 15 fix balls, 16 cover plates, 17 second fixed plates, 18 fixture blocks, 19 shells, 20 the 3rd fixed plates,
21 the 5th springs, 22 the 3rd sliding panels, 23 arc caking blocks, 24 necks, 25 limited blocks, 26 anti-skid rubber cushions, 27 anti-skidding salient points.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：A kind of chip semiconductor package box, including first
Casing 1, the bottom of the first casing 1 are fixedly connected with anti-skid rubber cushion 26, and side of the anti-skid rubber cushion 26 away from the first casing 1 is set
It is equipped with anti-skidding salient point 27, the setting of anti-skid rubber cushion 26 and anti-skidding salient point 27 can ensure that packing box will not be by transportation
Move easily, the bottom of the inwall of the first casing 1 is fixedly connected with U-shaped piece 2 of symmetrical first, the bottom of first U-shaped piece of 2 inwall
Portion is fixedly connected with the first spring 3, and the other end of the first spring 3 is fixedly connected with the first sliding panel 4, and the two of the first sliding panel 4
The both sides with first U-shaped piece of 2 inwall are held to be slidably connected, the one end of the first sliding panel 4 away from the first spring 3 is fixedly connected with first
Connecting rod 5, the one end of head rod 5 away from the first sliding panel 4 through first U-shaped piece 2 top and extend to first U-shaped piece
2 outside, the one end of head rod 5 away from the first sliding panel 4 are fixedly connected by the second casing 8, the table of head rod 5
Face is fixedly connected with the first fixed block 6, and the surface of head rod 5 is socketed with second spring 7, the top and bottom of second spring 7
Part cloth is fixedly connected on the bottom and first U-shaped piece 2 of top of the first fixed block 6, by first U-shaped piece of 2, first spring 3,
Mutual cooperation between first sliding panel 4, head rod 5, the first fixed block 6 and second spring 7, when the second casing 8 because
Head rod 5 is squeezed when outside cause rocks produces cushion effect so as to extrude the first spring 3 and second spring 7, so as to
Reach damping up and down, the both sides of the inwall of the first casing 1 have been fixedly connected with second U-shaped piece 9, and the bottom of second U-shaped piece of 9 inwall is consolidated
Surely the 3rd spring 10 is connected with, the other end of the 3rd spring 10 is fixedly connected with the second sliding panel 11, and the two of the second sliding panel 11
End is slidably connected with second U-shaped piece 9 of inwall, and the second sliding panel 11 and second U-shaped piece 9 are slidably connected so that damping is conducted more
What is added is smooth, and symmetrical limited block 25 is provided with the top of second U-shaped piece of 9 inwall, and the setting of limited block 25 prevents second
Sliding panel 11 departs from second U-shaped piece 9, and the second side of the sliding panel 11 away from the 3rd spring 10 is fixedly connected with the second connecting rod
12, the one end of the second connecting rod 12 away from the second sliding panel 11 is fixedly connected with the first fixed plate 13, and the first fixed plate 13 is remote
The side of second connecting rod 12 is provided with the 4th spring 14, and the side at the top of the first casing 1 is flexibly connected by fixed ball 15
There is cover plate 16, the setting of fixed ball 15 can be such that cover plate 16 is arbitrarily rotated along fixed ball 15, and cover plate 16 rolls away from fixed
The bottom of one end of pearl 15 is fixedly connected with the second fixed plate 17, and second one end of fixed plate 17 away from cover plate 16 is fixedly connected with
Fixture block 18, fixture block 18 include shell 19, the 3rd fixed plate 20, the 3rd fixed plate 20 are fixedly connected with the axis of the inwall of shell 19
Both sides be fixedly connected with the 5th symmetrical spring 21, the 5th one end of spring 21 away from the 3rd fixed plate 20 is fixedly connected
There is the 3rd sliding panel 22, the both ends of the 3rd sliding panel 22 and the inwall of shell 19 are slidably connected, and the 3rd sliding panel 22 is away from the 5th
The side of spring 21 is fixedly connected with arc caking block 23, and the position of the opposite side at the top of the first casing 1 and corresponding fixture block 18 is opened
Provided with neck 24, pass through second U-shaped piece of the 9, the 3rd spring 10, the second sliding panel 11, the second connecting rod 12, the and of the first fixed plate 13
Mutual cooperation between 4th spring 14, when the second 8 double swerve of casing, the second casing 8 can extrude the 4th spring 14, and the 4th
Spring 14 promotes the first fixed plate 13 and the second connecting rod 12 to extrude the second sliding panel 11 and the 3rd spring 10, the He of the 3rd spring 10
The collective effect of 4th spring 14 is so as to having reached left and right damping.
Operation principle：When chip semiconductor package box, pass through first U-shaped piece of 2, first spring 3, the first sliding panel 4, first
Mutual cooperation between connecting rod 5, the first fixed block 6 and second spring 7, when the second casing 8 because the when outside cause rocks
One connecting rod 5 is squeezed produces cushion effect so as to extrude the first spring 3 and second spring 7, so as to reach damping up and down, passes through
Between second U-shaped piece of the 9, the 3rd spring 10, the second sliding panel 11, the second connecting rod 12, the first fixed plate 13 and the 4th spring 14
Mutual cooperation, when the second 8 double swerve of casing, the second casing 8 can extrude the 4th spring 14, and the 4th spring 14 promotes first
The connecting rod 12 of fixed plate 13 and second extrudes the second sliding panel 11 and the 3rd spring 10, the 3rd spring 10 and the 4th spring 14 are common
Act on so as to reach left and right damping.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of chip semiconductor package box, including the first casing（1）, it is characterised in that：First casing（1）The bottom of inwall
Portion is fixedly connected with U-shaped piece of symmetrical first（2）, described first U-shaped piece（2）The bottom of inwall is fixedly connected with the first bullet
Spring（3）, first spring（3）The other end be fixedly connected with the first sliding panel（4）, first sliding panel（4）Both ends
With first U-shaped piece（2）The both sides of inwall are slidably connected, first sliding panel（4）Away from the first spring（3）One end fix connect
It is connected to head rod（5）, the head rod（5）Away from the first sliding panel（4）One end run through first U-shaped piece（2）'s
Top and extend to first U-shaped piece（2）Outside, the head rod（5）Away from the first sliding panel（4）One end pass through
Two casings（8）It is fixedly connected, the head rod（5）Surface be fixedly connected with the first fixed block（6）, first connection
Bar（5）Surface be socketed with second spring（7）, the second spring（7）Top and bottom distribution to be fixedly connected on first solid
Determine block（6）Bottom and first U-shaped piece（2）Top, first casing（1）The both sides of inwall have been fixedly connected with the 2nd U
Type block（9）, described second U-shaped piece（9）The bottom of inwall is fixedly connected with the 3rd spring（10）, the 3rd spring（10）It is another
One end and the second sliding panel（11）It is fixedly connected, second sliding panel（11）Both ends with second U-shaped piece（9）Inwall slide
Connection, second sliding panel（11）Away from the 3rd spring（10）Side be fixedly connected with the second connecting rod（12）, described
Two connecting rods（12）Away from the second sliding panel（11）One end be fixedly connected with the first fixed plate（13）, first fixed plate
（13）Away from the second connecting rod（12）Side be provided with the 4th spring（14）, first casing（1）The side at top passes through
Fixed ball（15）It is connected with cover plate（16）, the cover plate（16）Away from fixed ball（15）One end bottom fix connect
It is connected to the second fixed plate（17）, second fixed plate（17）Away from cover plate（16）One end be fixedly connected with fixture block（18）, institute
State the first casing（1）The opposite side at top and corresponding fixture block（18）Position offer neck（24）.
A kind of 2. chip semiconductor package box according to claim 1, it is characterised in that：The fixture block（18）Including shell
（19）, the shell（19）The 3rd fixed plate is fixedly connected with the axis of inwall（20）, the 3rd fixed plate（20）Two
Side is fixedly connected with the 5th symmetrical spring（21）, the 5th spring（21）Away from the 3rd fixed plate（20）One end consolidate
Surely it is connected with the 3rd sliding panel（22）, the 3rd sliding panel（22）Both ends and shell（19）Inwall be slidably connected, it is described
3rd sliding panel（22）Away from the 5th spring（21）Side be fixedly connected with arc caking block（23）.
A kind of 3. chip semiconductor package box according to claim 1, it is characterised in that：Described second U-shaped piece（9）Inwall
Top be provided with symmetrical limited block（25）.
A kind of 4. chip semiconductor package box according to claim 1, it is characterised in that：First casing（1）Bottom
Portion is fixedly connected with anti-skid rubber cushion（26）, the anti-skid rubber cushion（26）Away from the first casing（1）Side be provided with it is anti-skidding
Salient point（27）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720354768.8U CN206871681U (en) | 2017-04-06 | 2017-04-06 | A kind of chip semiconductor package box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720354768.8U CN206871681U (en) | 2017-04-06 | 2017-04-06 | A kind of chip semiconductor package box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206871681U true CN206871681U (en) | 2018-01-12 |
Family
ID=61342745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720354768.8U Expired - Fee Related CN206871681U (en) | 2017-04-06 | 2017-04-06 | A kind of chip semiconductor package box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206871681U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108298190A (en) * | 2018-03-30 | 2018-07-20 | 北京轩宇智能科技有限公司 | For the retaining mechanism of container cover, the container cover that quickly opens and closes and container |
| CN108626110A (en) * | 2018-06-19 | 2018-10-09 | 芜湖纯元光电设备技术有限公司 | A kind of set casing of filling industrial pump |
| CN108719413A (en) * | 2018-06-22 | 2018-11-02 | 郭文英 | A kind of meat grinder having decrease of noise functions |
| CN108792288A (en) * | 2018-07-28 | 2018-11-13 | 江西省东龙实业股份有限公司 | A kind of movement is packed for plastic sucking disc |
| CN108792190A (en) * | 2018-04-28 | 2018-11-13 | 佛山鼎容软件科技有限公司 | A kind of compact disc player packing box for transportation |
| CN109017915A (en) * | 2018-08-02 | 2018-12-18 | 杭州金浪机电有限公司 | A kind of spinneret machine of the switching with transport function |
| CN109229791A (en) * | 2018-08-16 | 2019-01-18 | 广西紫极科技有限公司 | A kind of device for Computer systems chip transportation |
| CN109896161A (en) * | 2019-03-27 | 2019-06-18 | 卢李娜 | A kind of medical instrument shipping container |
| CN109969551A (en) * | 2019-01-25 | 2019-07-05 | 上海微择科技有限公司 | A kind of box for photomask of high performance anti-pollution particle |
| CN110341773A (en) * | 2019-07-23 | 2019-10-18 | 安徽霍山龙鑫金属科技有限公司 | A kind of cast transfer car(buggy) that stability is high |
| CN112224679A (en) * | 2020-10-06 | 2021-01-15 | 许同 | Prevent falling fixing device based on semiconductor chip |
| CN113816013A (en) * | 2021-09-15 | 2021-12-21 | 陈欣 | Composite fiber packing box |
-
2017
- 2017-04-06 CN CN201720354768.8U patent/CN206871681U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108298190B (en) * | 2018-03-30 | 2024-01-02 | 北京轩宇智能科技有限公司 | Locking mechanism for container cover, container cover capable of being opened and closed rapidly and container |
| CN108298190A (en) * | 2018-03-30 | 2018-07-20 | 北京轩宇智能科技有限公司 | For the retaining mechanism of container cover, the container cover that quickly opens and closes and container |
| CN108792190A (en) * | 2018-04-28 | 2018-11-13 | 佛山鼎容软件科技有限公司 | A kind of compact disc player packing box for transportation |
| CN108626110A (en) * | 2018-06-19 | 2018-10-09 | 芜湖纯元光电设备技术有限公司 | A kind of set casing of filling industrial pump |
| CN108719413A (en) * | 2018-06-22 | 2018-11-02 | 郭文英 | A kind of meat grinder having decrease of noise functions |
| CN108792288A (en) * | 2018-07-28 | 2018-11-13 | 江西省东龙实业股份有限公司 | A kind of movement is packed for plastic sucking disc |
| CN109017915A (en) * | 2018-08-02 | 2018-12-18 | 杭州金浪机电有限公司 | A kind of spinneret machine of the switching with transport function |
| CN109229791A (en) * | 2018-08-16 | 2019-01-18 | 广西紫极科技有限公司 | A kind of device for Computer systems chip transportation |
| CN109969551A (en) * | 2019-01-25 | 2019-07-05 | 上海微择科技有限公司 | A kind of box for photomask of high performance anti-pollution particle |
| CN109896161A (en) * | 2019-03-27 | 2019-06-18 | 卢李娜 | A kind of medical instrument shipping container |
| CN110341773A (en) * | 2019-07-23 | 2019-10-18 | 安徽霍山龙鑫金属科技有限公司 | A kind of cast transfer car(buggy) that stability is high |
| CN112224679A (en) * | 2020-10-06 | 2021-01-15 | 许同 | Prevent falling fixing device based on semiconductor chip |
| CN113816013A (en) * | 2021-09-15 | 2021-12-21 | 陈欣 | Composite fiber packing box |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180112 Termination date: 20180406 |
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| CF01 | Termination of patent right due to non-payment of annual fee |