CN207993683U - SMD plastic-packaged electronic components - Google Patents
SMD plastic-packaged electronic components Download PDFInfo
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- CN207993683U CN207993683U CN201721746515.1U CN201721746515U CN207993683U CN 207993683 U CN207993683 U CN 207993683U CN 201721746515 U CN201721746515 U CN 201721746515U CN 207993683 U CN207993683 U CN 207993683U
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- silver
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Abstract
The utility model provides a kind of SMD plastic-packaged electronic components, including by silver-colored tile, upper end and lower end are being separately connected by the upper and lower ends of silver-colored tile；Upper end and lower end are separately connected exit and lower exit, insulating material housing body is equipped with outside by silver-colored tile, the outer end of upper exit and lower exit be in insulating material housing in vitro and is folded upward at the upper surface for conforming to insulating material housing body twice.The utility model positioning parts in production are easy, the production that can be automated, are avoided that the quality problems such as dislocation, turnover deformation in circular flow, do not need positioning tool and revolving bracket, and end properties are stablized, and production cost is reduced.The utility model is simple in structure, of low cost, and using effect is good.
Description
Technical field
The utility model is related to technical field of electronic components, especially a kind of SMD plastic-packaged electronic components.
Background technology
It is traditional plug-in type that the big portion of extraordinary electronic component produced at present, which takes,：It is welded simultaneously by silver core piece two sides
Upper elongated garden lead encapsulates one layer of insulating materials in silver-colored face chip surface, which is epoxy resin, silicones, phenol
One kind in urea formaldehyde, product use artificial plug-in method using installation, partly take braid plug-in unit, also made because pin pitch is easily deformed
At a large amount of defective products, plug-in method overwhelming majority postwelding is vertical on pcb board, occupied space.
Product miniaturization, thin type, patch type are irreversible development trends, and plug-in type product is changed to surface mount
Irresistible trend, at present low pressure low value capacitor, the piezoresistor of low pressure low current amount, temperature control PTC/
NTC uses chip production technology, and the piezoresistor of the big flux of high-voltage large-capacity capacitor, high pressure, big through-flow PTC,
Inhibit the NTC of surge using still plug-in type production.
ZL201620681451.0 mentions a kind of element pasted on surface, and this structure has disadvantage mentioned above：1) volume is big, accounts for
Area is big；2) because that, because of reasons such as molding, sintering curres, chip thickness thickness can be caused to differ, it is difficult to make in tile production process
3 points all in a level, seriously affect welding performance.
ZL2015207476269.4 mentions a kind of element pasted on surface, is that existing plug-in unit product is packed into an insulation crust
In, this volume becomes much larger, and cost is also very high, therefore is difficult to promote.
Utility model content
The purpose of this utility model is：A kind of SMD plastic-packaged electronic components are provided, its compact, performance stabilization can
It leans on, it is of low cost.
The utility model is realized in this way：SMD plastic-packaged electronic components, including by silver-colored tile, by the upper of silver-colored tile
Lower both ends are separately connected upper end and lower end；Upper end and lower end are separately connected exit and lower exit, silver-colored
Be equipped with insulating material housing body outside tile, the outer end of upper exit and lower exit be in insulating material housing in vitro and to
It is upper to bend the upper surface for conforming to insulating material housing body twice.
The upper end and lower end is twist.
Described is disk or square piece by silver-colored tile.
As a result of above technical scheme, the utility model production when positioning parts be easy, the production that can be automated,
It is avoided that the quality problems such as dislocation, turnover deformation in circular flow, does not need positioning tool and revolving bracket, and end properties
Stablize, reduces production cost.The utility model is simple in structure, of low cost, and using effect is good.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the dismantling schematic diagram of the utility model；
Fig. 3 is the structural schematic diagram when exit of the utility model is not bent.
Specific implementation mode
The embodiments of the present invention：SMD plastic-packaged electronic components, including by silver-colored tile 10, by the upper of silver-colored tile 10
Lower both ends are separately connected upper end 21 and lower end 23；Upper end 21 and lower end 23 are separately connected exit 22 and draw under
Outlet 24, is equipped with insulating material housing body outside by silver-colored tile 10, and the outer end of upper exit 22 and lower exit 24 is in exhausted
Edge material envelope is external and is folded upward at the upper surface for conforming to insulating material housing body twice；The upper end 21 is under
End 23 is twist；Described is disk by silver-colored tile 10.
The embodiment described in the utility model being not limited to described in specific implementation mode, those skilled in the art are according to this
The technical solution of utility model obtains other embodiments, also belongs to the technological innovation scope of the utility model.Obviously originally
The technical staff in field can carry out the utility model spirit and model of the various modification and variations without departing from the utility model
It encloses.In this way, if these modifications and variations of the present invention belong to the claims of the present invention and its equivalent technology range
Interior, then the utility model is also intended to include these modifications and variations.
Claims (3)
1. a kind of SMD plastic-packaged electronic components, including by silver-colored tile（10）, it is characterised in that：By silver-colored tile（10）Up and down
Both ends are separately connected upper end（21）And lower end（23）；Upper end（21）And lower end（23）It is separately connected exit（22）
With lower exit（24）, by silver-colored tile（10）Outside is equipped with insulating material housing body, upper exit（22）With lower exit
（24）To be in insulating material housing external and be folded upward at the upper surface for conforming to insulating material housing body twice for outer end.
2. SMD plastic-packaged electronic components according to claim 1, it is characterised in that：The upper end（21）The lower end and
Head（23）Twist.
3. SMD plastic-packaged electronic components according to claim 1 or 2, it is characterised in that：It is described by silver-colored tile（10）For
Disk or square piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721746515.1U CN207993683U (en) | 2017-12-14 | 2017-12-14 | SMD plastic-packaged electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721746515.1U CN207993683U (en) | 2017-12-14 | 2017-12-14 | SMD plastic-packaged electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207993683U true CN207993683U (en) | 2018-10-19 |
Family
ID=63816619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721746515.1U Active CN207993683U (en) | 2017-12-14 | 2017-12-14 | SMD plastic-packaged electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207993683U (en) |
-
2017
- 2017-12-14 CN CN201721746515.1U patent/CN207993683U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: SMD plastic packaging electronic components Effective date of registration: 20210616 Granted publication date: 20181019 Pledgee: Qiandongnan branch of Bank of Guizhou Co.,Ltd. Pledgor: GUIZHOU KAILI ECONOMIC DEVELOPMENT ZONE ZHONGHAO ELECTRONICS Co.,Ltd. Registration number: Y2021520000007 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230801 Granted publication date: 20181019 Pledgee: Qiandongnan branch of Bank of Guizhou Co.,Ltd. Pledgor: GUIZHOU KAILI ECONOMIC DEVELOPMENT ZONE ZHONGHAO ELECTRONICS CO.,LTD. Registration number: Y2021520000007 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: SMD plastic encapsulated electronic components Effective date of registration: 20230821 Granted publication date: 20181019 Pledgee: Qiandongnan branch of Bank of Guizhou Co.,Ltd. Pledgor: GUIZHOU KAILI ECONOMIC DEVELOPMENT ZONE ZHONGHAO ELECTRONICS CO.,LTD. Registration number: Y2023520000044 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |