CN207969073U - A kind of multilayer circuit board of Anti-seismic - Google Patents
A kind of multilayer circuit board of Anti-seismic Download PDFInfo
- Publication number
- CN207969073U CN207969073U CN201820178011.2U CN201820178011U CN207969073U CN 207969073 U CN207969073 U CN 207969073U CN 201820178011 U CN201820178011 U CN 201820178011U CN 207969073 U CN207969073 U CN 207969073U
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- CN
- China
- Prior art keywords
- circuit board
- clathrum
- several
- multilayer circuit
- seismic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A kind of multilayer circuit board of Anti-seismic provided by the utility model, including circuit board, the circuit board includes the top plate stacked gradually from top to bottom, first clathrum, double-sided substrate, second clathrum, lower plywood, several vias perforative from top to bottom are equipped in the circuit board, first clathrum is made of several strip epoxy resin to intersect vertically, several first through hole are formed in first clathrum, second clathrum is made of several strip silica gel plates to intersect vertically, several second through-holes are formed in second clathrum, the via both passes through the first through hole and second through-hole.Latticed plate layer forms multiple through-holes, enhances the gas permeability of circuit board；On the other hand, the second clathrum is made of several strip silica gel plates to intersect vertically, and silica gel plate has high resiliency, can enhance the anti-seismic performance of circuit board.
Description
Technical field
The utility model is related to circuit board technology fields, and in particular to a kind of multilayer circuit board of Anti-seismic.
Background technology
Circuit board has already taken up consequence in the electronics industry.Nearly ten years, circuit board fabrication industry in China's is sent out
Exhibition is rapid, and lamina cannot be satisfied with present diversified electronic equipment, and multilayer circuit board is close due to integrated antenna package
The increase of degree results in the high concentration of interconnection line, this makes the use of more substrates become required.In the space of a whole page cloth of printed circuit
In office, there is unpredictalbe design problem, such as noise, stray capacitance, crosstalk.So Printed Circuit Board Design is necessary
It efforts be made so that signal line length is minimum and avoids parallel line etc..Obviously, in single sided board, even in dual platen, due to
The number of crossovers that may be implemented is limited, these demands cannot all obtain satisfied answer.In the feelings of a large amount of interconnection and intersection demand
Under condition, as soon as circuit board will reach a satisfied performance, plate layer must be expanded to two layers or more, thus multilayer circuit occur
Plate.
Existing multilayer circuit board is made of stacked multi-layer board, and anti-seismic performance is poor, when multilayer circuit board application
In mobile devices such as unmanned plane, automobiles, multilayer circuit board is easy to damage because of the high-speed motion of mobile device.
Utility model content
In view of the above problems, the utility model provides a kind of multilayer circuit board of good seismic performance.
To achieve the above object, the utility model solves by the following technical programs：
A kind of multilayer circuit board of Anti-seismic, including circuit board, the circuit board include stack gradually from top to bottom it is upper
Laminate, the first clathrum, double-sided substrate, the second clathrum, lower plywood, the circuit board are interior equipped with several perforative from top to bottom
Via, first clathrum are made of several strip epoxy resin to intersect vertically, are formed in first clathrum several
First through hole, second clathrum are made of several strip silica gel plates to intersect vertically, if being formed in second clathrum
Dry second through-hole, the via both pass through the first through hole and second through-hole.
Specifically, the thickness of first clathrum is 0.3mm.
Specifically, the thickness of second clathrum is 0.5mm.
Specifically, the top plate upper surface is equipped with several electronic components.
Specifically, the double-sided substrate upper and lower surface is equipped with several conducting wires, the conducting wire passes through the mistake
The double-sided substrate is electrically connected by hole with the top plate, the lower plywood.
Specifically, the lower plywood lower surface is equipped with several pads.
The utility model has the beneficial effects that：
Multilayer circuit board uses latticed respectively between top plate and double-sided substrate, between double-sided substrate and lower plywood
Plate layer and the prepreg instead of device of shifting block type, latticed plate layer form multiple through-holes, enhance the gas permeability of circuit board；
On the other hand, the second clathrum is made of several strip silica gel plates to intersect vertically, and silica gel plate has high resiliency, can enhance circuit
The anti-seismic performance of plate.
Description of the drawings
Fig. 1 is a kind of internal structure schematic diagram of the multilayer circuit board of Anti-seismic of the utility model.
Fig. 2 is a kind of dimensional structure diagram of the multilayer circuit board of Anti-seismic of the utility model.
Reference numeral is：Top plate 1, electronic component 11, the first clathrum 2, first through hole 21, double-sided substrate 3, conductor wire
Road 31, the second clathrum 4, the second through-hole 41, lower plywood 5, pad 51, via 6.
Specific implementation mode
The utility model is described in further detail with reference to embodiment and attached drawing, but the implementation of the utility model
Mode is without being limited thereto.
As shown in Figs. 1-2：
A kind of multilayer circuit board of Anti-seismic, including circuit board, circuit board include the top plate stacked gradually from top to bottom
1, the first clathrum 2, double-sided substrate 3, the second clathrum 4, lower plywood 5, circuit board is interior to be equipped with several mistakes perforative from top to bottom
Hole 6, the first clathrum 2 are made of several strip epoxy resin to intersect vertically, and several first through hole are formed in the first clathrum 2
21, the second clathrum 4 is made of several strip silica gel plates to intersect vertically, and several second through-holes 41 are formed in the second clathrum 4,
Via 6 both passes through first through hole 21 and the second through-hole 41, and multiple first through hole 21 and the second through-hole 41 can increase circuit board
Gas permeability.
Further, the first clathrum 2 is thermally conductive insulating layer, and the thickness of the first clathrum 2 is 0.3mm.
Further, in order to enhance the anti-seismic performance of circuit board, the thickness of the second clathrum 4 is 0.5mm.
Further, 1 upper surface of top plate is equipped with several electronic components 11.
Further, 3 upper and lower surface of double-sided substrate is equipped with several conducting wires 31, and conducting wire 31 will across via 6
Double-sided substrate 3 is electrically connected with top plate 1, lower plywood 5.
Further, 5 lower surface of lower plywood is equipped with several pads 51.
A kind of embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
1. a kind of multilayer circuit board of Anti-seismic, including circuit board, which is characterized in that the circuit board includes from top to bottom successively
Top plate (1), the first clathrum (2), double-sided substrate (3), the second clathrum (4), the lower plywood (5) of stacking, the circuit board
Interior to be equipped with several vias (6) perforative from top to bottom, first clathrum (2) is by several strip epoxy resin to intersect vertically
It constitutes, forms several first through hole (21) in first clathrum (2), second clathrum (4) is intersected vertically by several
Strip silica gel plate constitute, several second through-holes (41) are formed in second clathrum (4), the via (6) both passes through institute
State first through hole (21) and second through-hole (41).
2. a kind of multilayer circuit board of Anti-seismic according to claim 1, which is characterized in that first clathrum (2)
Thickness be 0.3mm.
3. a kind of multilayer circuit board of Anti-seismic according to claim 1, which is characterized in that second clathrum (4)
Thickness be 0.5mm.
4. a kind of multilayer circuit board of Anti-seismic according to claim 1, which is characterized in that top plate (1) upper table
Face is equipped with several electronic components (11).
5. a kind of multilayer circuit board of Anti-seismic according to claim 1, which is characterized in that on the double-sided substrate (3)
Lower surface is equipped with several conducting wires (31), and the conducting wire (31) passes through the via (6) by the double-sided substrate (3)
It is electrically connected with the top plate (1), the lower plywood (5).
6. a kind of multilayer circuit board of Anti-seismic according to claim 1, which is characterized in that lower plywood (5) following table
Face is equipped with several pads (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820178011.2U CN207969073U (en) | 2018-02-01 | 2018-02-01 | A kind of multilayer circuit board of Anti-seismic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820178011.2U CN207969073U (en) | 2018-02-01 | 2018-02-01 | A kind of multilayer circuit board of Anti-seismic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207969073U true CN207969073U (en) | 2018-10-12 |
Family
ID=63736465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820178011.2U Expired - Fee Related CN207969073U (en) | 2018-02-01 | 2018-02-01 | A kind of multilayer circuit board of Anti-seismic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207969073U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110212881A (en) * | 2019-04-26 | 2019-09-06 | 江苏华讯电子技术有限公司 | A kind of antivibration installation method of the crystal oscillator of SMD encapsulation |
-
2018
- 2018-02-01 CN CN201820178011.2U patent/CN207969073U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110212881A (en) * | 2019-04-26 | 2019-09-06 | 江苏华讯电子技术有限公司 | A kind of antivibration installation method of the crystal oscillator of SMD encapsulation |
| CN110212881B (en) * | 2019-04-26 | 2023-10-13 | 江苏华讯电子技术有限公司 | Vibration-resistant mounting method of SMD packaged crystal oscillator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 Termination date: 20210201 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |