CN207966697U - Glass cover-plate and electronic equipment - Google Patents
Glass cover-plate and electronic equipment Download PDFInfo
- Publication number
- CN207966697U CN207966697U CN201820172672.4U CN201820172672U CN207966697U CN 207966697 U CN207966697 U CN 207966697U CN 201820172672 U CN201820172672 U CN 201820172672U CN 207966697 U CN207966697 U CN 207966697U
- Authority
- CN
- China
- Prior art keywords
- copper
- glass cover
- layers
- plate
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Details Of Aerials (AREA)
Abstract
The utility model provides a kind of glass cover-plate and electronic equipment, is related to technical field of electronic equipment, which includes glass matrix, and the layers of copper as charge coil and/or antenna is coated on the glass matrix surface.The glass cover-plate for alleviating the prior art using the glass cover-plate is thicker and there is technical issues that edge in use, and having reached makes glass cover-plate thinnedization purpose, and improves the stability of glass cover-plate.
Description
Technical field
The utility model is related to technical field of electronic equipment, more particularly, to a kind of glass cover-plate and electronic equipment.
Background technology
The universal of consumer electrical product, such as smart mobile phone etc. greatly facilitates people’s lives and work.Due to
The function of these electronic products is increasingly powerful, and energy consumption is also increasing.How to be quickly and easily electronic device electric energy supplement is
It is badly in need of the problem solved.Constraint of the wireless charging technology due to breaking away from wire cable so that consumer is more convenientlyly pair
Electronic device charges, therefore more and more production firms are concerned with how to improve wireless charging technology, by wireless charging
Device is applied in these electronic devices.
In the electronic equipments such as conventional mobile phone and tablet computer, often by charge coil and antenna be made in glass cover-plate with
Realize the wireless charging and antenna function of product.
And current glass cover-plate is by fixing ready-made charge coil and antenna with double faced adhesive tape or binding resin
In glass cover-plate.For the ease of installation, often size is larger for the charge coil and antenna of this kind of structure, in order to anti-after installation
Charge coil and antenna are usually embedded in resin insulating barrier by situations such as only leaking electricity, to increase charge coil and
The thickness at antenna entirety position influences the lightening development of product；Meanwhile there is side in the glass cover-plate of the structure in use
The problem of edge tilts, and then influence the normal use of charge coil and antenna.
Utility model content
The first of the utility model is designed to provide a kind of glass cover-plate, and the second of the utility model is designed to provide
A kind of electronic equipment of the above-mentioned glass cover-plate of protection, the glass cover-plate to alleviate the prior art is thicker and exists in use
The technical issues of edge tilts.
In order to realize that the above-mentioned purpose of the utility model, spy use following technical scheme：
A kind of glass cover-plate, including glass matrix are coated on the glass matrix surface as charge coil and/or antenna
Layers of copper.
Further, it is equipped between the glass matrix and the layers of copper for increasing glass matrix and layers of copper conjugation
Transition zone.
Further, the transition zone includes the nitride or copper alloy of niobium, the oxide of niobium, copper.
Further, the transition zone is corronil.
Further, the thickness of the transition zone is 1-50nm.
Further, the thickness of the layers of copper is 1-5000nm.
Further, the layers of copper is multilayer, and the first insulating layer is equipped between the layers of copper.
Further, the layers of copper surface is equipped with second insulating layer.
Further, the thickness of the second insulating layer is 1-2 microns.
A kind of electronic equipment, including above-mentioned glass cover-plate.
Compared with the prior art, the utility model has the advantages that：
The utility model provides a kind of glass cover-plate, is coated with as charge coil and/or antenna on glass matrix surface
Layers of copper.Relative to the glass cover-plate with sticking double faced adhesive tape coil, thinner, the saving sky of the glass cover-plate of the utility model
Between；Simultaneously as obtain one layer of layers of copper on glass matrix surface in the way of sputter or plating, therefore, glass and layers of copper
Binding force higher, structure is more stable, is not in the problem of edge tilts in use, increases the reliable of glass cover-plate
Property.In addition, due to eliminating double faced adhesive tape, the heat during the layers of copper as charge coil uses can be directly outside by glass
Heat dissipation, heat loss is fast, safe.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is the planar structure schematic diagram for the glass cover-plate that the utility model embodiment 1 provides；
Fig. 2 is the cross-sectional view at A-A in structure shown in the utility model Fig. 1；
Fig. 3 is the cross-sectional view for the glass cover-plate that the utility model embodiment 2 provides；
Fig. 4 is the cross-sectional view for the glass cover-plate that the utility model embodiment 3 provides.
Icon：10- glass matrix；20- transition zones；30- layers of copper；The first insulating layers of 40-；50- second insulating layers.
Specific implementation mode
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
The every other embodiment that field those of ordinary skill is obtained without making creative work, belongs to this practicality
Novel protected range.
It is in the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be electrical connection；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, on can understanding as the case may be
State the concrete meaning of term in the present invention.
The one side of the utility model provides a kind of glass cover-plate, including glass matrix, in the glass matrix table
Face is coated with the layers of copper as charge coil and/or antenna.
The utility model provides a kind of glass cover-plate, is coated with as charge coil and/or antenna on glass matrix surface
Layers of copper.Relative to the glass cover-plate with sticking double faced adhesive tape coil, thinner, the saving sky of the glass cover-plate of the utility model
Between；Simultaneously as obtain one layer of layers of copper on glass matrix surface in the way of sputter or plating, therefore, glass and layers of copper
Binding force higher, structure is more stable, is not in the problem of edge tilts in use, increases the reliable of glass cover-plate
Property.In addition, due to eliminating double faced adhesive tape, the heat during the layers of copper as charge coil uses can be directly outside by glass
Heat dissipation, heat loss is fast, safe.
Glass cover-plate provided by the utility model is prepared using following methods：It will by the way of sputter or plating
Then copper direct plating obtains preset pattern, and then obtain glass cover-plate on glass cover-plate by yellow light etching technics.Compared to biography
The production method with sticking double faced adhesive tape of system can be increased without the adhesive layer between glass cover-plate, energy using the above method
The lightening development of product is realized well.Due to the purity higher for the layers of copper that sputter or plating obtain, conductivity is also higher,
With high electric conductivity and energy conversion rate, while there are the distinguishing features such as rapid heat dissipation and safety in utilization height.Current many hands
Glass cover-plate in the products such as machine, tablet, intelligent wearable device all has wireless charging and antenna function, and utilizes sputter or electricity
The stability that the obtained glass cover-plate with wireless charging and antenna function can guarantee signal transmission is plated, is had huge
Big market prospects.
In some embodiments of the utility model, it is equipped between the glass matrix and the layers of copper for increasing glass
The transition zone of glass matrix and layers of copper conjugation.
In order to further strengthen the binding force of glass matrix and layers of copper, one layer of transition is set between glass matrix and layers of copper
Layer.The binding force higher of the transition zone and glass matrix, meanwhile, also can preferably it be combined with layers of copper.After increasing the transition zone,
The reliability during glass cover-plate use can be further increased, its service life is extended.
It is understood that the utility model does not make restriction to the specific material of transition zone, as long as increase can be played
Binding force between glass matrix and layers of copper.For example, transition zone can be the nitride or copper of niobium, the oxide of niobium, copper
Alloy.
During preparing transition zone, first glass matrix is cleaned up, then one layer of transition zone of sputter or plating, connects
One layer of copper of sputter or plating on transition zone again, the layers of copper plated is subjected to yellow light etching later, forms required wireless charging
And antenna pattern, and then obtain glass cover-plate.
In some embodiments of the utility model, the transition zone is corronil.Experiment proves that corronil
The binding force of glass matrix and layers of copper can be significantly improved.
In some embodiments of the utility model, the thickness of the transition zone is 1-50nm.Wherein, transition zone
Thickness for example can be without limitation：1nm, 5nm, 10nm, 15nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm or
50nm。
In some embodiments of the utility model, the thickness of the layers of copper is 1-5000nm.Wherein, the thickness of layers of copper
Spend for example can be without limitation：1nm、50nm、100nm、500nm、1000nm、1500nm、2000nm、3000nm、
4000nm or 5000nm.
In some embodiments of the utility model, the layers of copper is multilayer, and first is equipped between the layers of copper absolutely
Edge layer.
In order to meet the requirement of certain power, need by charge coil and antenna do it is thicker when, can also will fill
Electric coil and antenna are set as multilayered structure, and middle layer is separated with the first insulating layer.
In the charge coil and antenna for preparing multilayered structure, plated film and etching are carried out by several times.When charge coil and
The thickness and figure of antenna, only need to be between every layer of layers of copper not it is also possible to obtain required figure by gradation plated film and etching
One layer of first insulating layer is set.Wherein, the thickness of the first insulating layer is 1-2 microns.
In some embodiments of the utility model, the layers of copper surface is equipped with second insulating layer.The second insulation of setting
Layer prevents from contacting generation short circuit with other component.
In some embodiments of the utility model, the thickness of the second insulating layer is 1-2 microns.Wherein, second
The thickness of insulating layer it is unrestricted for example can be：1 micron, 1.5 microns and 2 microns.
It is a kind of electric from sub- equipment, including above-mentioned glass cover-plate.
Below in conjunction with embodiment, the utility model is described in more detail.
Embodiment 1
As depicted in figs. 1 and 2, the present embodiment is a kind of glass cover-plate, including glass matrix 10 and is set in turn in glass
Transition zone 20 on glass matrix 10 and layers of copper 30.Wherein, transition zone 20 and layers of copper 30 are one layer.
Glass cover-plate in the present embodiment is prepared by the following method to obtain：First glass matrix is cleaned up, is then existed
One layer of corronil of sputter on glass matrix, thickness 20nm, then one layer of copper of sputter again, thickness 500nm, the copper that will have been plated
Yellow light etching is carried out again, is formed the charge coil and antenna of required pattern, is obtained glass cover-plate.
Embodiment 2
As shown in figure 3, the present embodiment is a kind of glass cover-plate, including glass matrix 10, glass matrix 10 are equipped with transition
Layer 20, layers of copper 30, the first insulating layer 40, layers of copper 30 and second insulating layer 50.
Wherein, the first insulating layer is located between layers of copper and layers of copper, and is filled in simultaneously in the inter-pattern space of layers of copper and glass
Substrate contact, to prevent layers of copper from leaking electricity in this layer of structure.Second insulating layer covers the layers of copper of most surface, equally
It is filled in the inter-pattern space of the layers of copper on most surface layer, is contacted with the first insulating layer.
Glass cover-plate in the present embodiment is prepared by the following method to obtain：
Step a)：First glass matrix is cleaned up, then one layer of corronil of sputter, thickness are on glass matrix
20nm, then the copper plated is carried out yellow light etching by one layer of copper of sputter, thickness 500nm again again, forms the charging of required pattern
Coil and antenna；
Step b)：Photoresist is coated in step a) resulting copper layer and obtains the first insulating layer, and thick bottom is 1 micron, passes through exposure
Photodevelopment obtains the preformed hole for electrical connection, is electrically connected to the layers of copper of different layers by the preformed hole；
Step c)：One layer of copper of sputter sputter on the first insulating layer obtained by step b), thickness 500nm, the copper that will have been plated
Yellow light etching is carried out again, forms the charge coil and antenna of required pattern；
Step d)：Photoresist is coated in step c) resulting copper layer and obtains second insulating layer, and thickness plays protection in 2um
The effect of product.
Embodiment 3
As shown in figure 4, the present embodiment is a kind of glass cover-plate, including glass matrix 10, glass matrix 10 are equipped with transition
Layer 20 is equipped with layers of copper 30, the first insulating layer 40, transition zone 20, layers of copper 30 and second insulating layer 50 on transition zone 20 successively again.
Wherein, the first insulating layer is in addition to being located between layers of copper and transition zone, while also filling up in the inter-pattern space of layers of copper
It is contacted with glass matrix, to prevent layers of copper from leaking electricity in this layer of structure.Second insulating layer covers the layers of copper of most surface,
It is equally also filled in the inter-pattern space of layers of copper on most surface layer, is contacted with the first insulating layer.
Glass cover-plate in the present embodiment is prepared by the following method to obtain：
Step a)：First glass matrix is cleaned up, then one layer of corronil of sputter, thickness are on glass matrix
20nm, then the copper plated is carried out yellow light etching by one layer of copper of sputter, thickness 500nm again again, forms the charging of required pattern
Coil and antenna；
Step b)：Photoresist is coated in step a) resulting copper layer and obtains the first insulating layer, and thick bottom is 1 micron, passes through exposure
Photodevelopment obtains the preformed hole for electrical connection, is electrically connected to the layers of copper of different layers by the preformed hole；
Step c)：One layer of corronil of sputter on the first insulating layer obtained by step b), thickness 20nm, then sputter again
The copper plated is carried out yellow light etching by one layer of copper, thickness 500nm again, forms the charge coil and antenna of required pattern；
Step d)：Photoresist is coated in step c) resulting copper layer and obtains second insulating layer, and thickness plays protection in 2um
The effect of product.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it
System；Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should
Understand：It still can be with technical scheme described in the above embodiments is modified, either to which part or whole
Technical characteristic carries out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution are new
The range of each embodiment technical solution of type.
Claims (10)
1. a kind of glass cover-plate, which is characterized in that including glass matrix, be coated with as charge coil on the glass matrix surface
And/or the layers of copper of antenna.
2. glass cover-plate according to claim 1, which is characterized in that be equipped with and use between the glass matrix and the layers of copper
In the transition zone for increasing glass matrix and layers of copper conjugation.
3. glass cover-plate according to claim 2, which is characterized in that the transition zone includes niobium, the oxide of niobium, copper
Nitride or copper alloy.
4. glass cover-plate according to claim 2, which is characterized in that the transition zone is corronil.
5. according to claim 2-4 any one of them glass cover-plates, which is characterized in that the thickness of the transition zone is 1-
50nm。
6. according to claim 1-4 any one of them glass cover-plates, which is characterized in that the thickness of the layers of copper is 1-
5000nm。
7. according to claim 1-4 any one of them glass cover-plates, which is characterized in that the layers of copper is multilayer, and the copper
The first insulating layer is equipped between layer.
8. according to claim 1-4 any one of them glass cover-plates, which is characterized in that the layers of copper surface is equipped with second absolutely
Edge layer.
9. glass cover-plate according to claim 8, which is characterized in that the thickness of the second insulating layer is 1-2 microns.
10. a kind of electronic equipment, which is characterized in that including claim 1-9 any one of them glass cover-plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820172672.4U CN207966697U (en) | 2018-01-31 | 2018-01-31 | Glass cover-plate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820172672.4U CN207966697U (en) | 2018-01-31 | 2018-01-31 | Glass cover-plate and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207966697U true CN207966697U (en) | 2018-10-12 |
Family
ID=63736393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820172672.4U Active CN207966697U (en) | 2018-01-31 | 2018-01-31 | Glass cover-plate and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207966697U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111446072A (en) * | 2019-01-17 | 2020-07-24 | 深圳市百柔新材料技术有限公司 | Wireless charging coil and preparation method thereof |
-
2018
- 2018-01-31 CN CN201820172672.4U patent/CN207966697U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111446072A (en) * | 2019-01-17 | 2020-07-24 | 深圳市百柔新材料技术有限公司 | Wireless charging coil and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3191884U (en) | touch screen | |
| CN106207285B (en) | Battery component and smart machine | |
| CN107041065B (en) | A kind of digital signal processor | |
| CN111491441B (en) | Circuit board structure and display device | |
| US20210273036A1 (en) | In-plane inductors in ic packages | |
| TW200803677A (en) | Stack structure of circuit board with semiconductor component embedded therein | |
| CN103906371B (en) | Circuit board with embedded element and preparation method thereof | |
| CN107134443A (en) | The method for packing of chip on film, display device and integrated circuit | |
| CN207966697U (en) | Glass cover-plate and electronic equipment | |
| CN104979226A (en) | Copper mixed bonding method | |
| CN207458013U (en) | Touch-control film, touch control component, touch-screen and electronic equipment | |
| CN207053873U (en) | A kind of inexpensive flexible PCB | |
| CN106954343A (en) | A kind of preparation method of the busbar circuit board of thick conductor layer | |
| CN208570755U (en) | A kind of core strueture and electronic product | |
| CN105552043A (en) | Packaging structure for fingerprint identification sensor | |
| CN206322130U (en) | Electronic equipment, touching display screen, touch control component and its touch control conductive film | |
| KR101194864B1 (en) | Back contact solar cell module and manufacturing method thereof | |
| CN101262739B (en) | Substrate for carrying element, method for manufacturing the same, and semiconductor module | |
| CN205883335U (en) | Mobile equipment | |
| US8242594B2 (en) | Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure | |
| CN104320925B (en) | A kind of preparation method of new embedded circuit board | |
| CN209488907U (en) | A kind of bend-resistance flexible circuitry soft board | |
| CN211047392U (en) | Circuit board | |
| CN207118156U (en) | Terminal device and its pcb board ground structure | |
| TWM423927U (en) | Improved structure of flexible membrane antenna of wireless charger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |