CN207947269U - A kind of ultra-thin heat dissipation type paster diode - Google Patents
A kind of ultra-thin heat dissipation type paster diode Download PDFInfo
- Publication number
- CN207947269U CN207947269U CN201721928545.4U CN201721928545U CN207947269U CN 207947269 U CN207947269 U CN 207947269U CN 201721928545 U CN201721928545 U CN 201721928545U CN 207947269 U CN207947269 U CN 207947269U
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- China
- Prior art keywords
- pin
- chip
- packaging body
- welding ends
- pins
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of ultra-thin heat dissipation type paster diode, including packaging body, chip and two pins, the welding ends of two pins is respectively welded at chip upper surface and lower surface, packaging body is by chip, the welding ends sealed envelope of two pins, the patch end of two pins is stretched out outside packaging body, the chip is obliquely installed, the face of welding chip is inclined surface on the welding ends of two pins, inclined surface angle of inclination is consistent with chip angle of inclination, it is welded in patch end upward bending in packaging body of the pin of chip lower surface, packaging body is stretched out in outside bending at not higher than the first pin, the patch end downward bending of two pins outside packaging body, extend to outside bending again after package bottom.
Description
Technical field
The utility model is related to stamp-mounting-paper diode, more particularly to a kind of ultra-thin heat dissipation type paster diode.
Background technology
With being constantly progressive for science and technology, electronic component increasingly develops to micromation, ultrathin type direction, in addition,
Electronic component also needs to have preferable heat dissipation effect, and generated heat expands in time when all electronic component can work
It sheds, heat is avoided to be gathered in around electronic component, otherwise can influence the use power of electronic component and use the longevity
Life.
In the prior art, the processing of stamp-mounting-paper diode is to clamp chip with two pins to be welded, then to chip into
Row encapsulates, and the pin and chip in stamp-mounting-paper diode are that levels stacked designs, and increase stamp-mounting-paper diode to a certain extent
Thickness, it is difficult to adapt to the trend developed to micromation, ultrathin type direction.In addition, the pin of the lower surface in addition to being welded on chip
Outside, stamp-mounting-paper diode is that also bending is to the bottom of packaging body for the pin of the upper surface that will be welded on chip mostly, so, patch
Piece diode at work caused by heat through pin to when external diffusion can pass through stamp-mounting-paper diode bottom so that patch two
The heat that pole pipe generates when working is gathered in the bottom of stamp-mounting-paper diode, causes to heat the bottom of stamp-mounting-paper diode,
Affect stamp-mounting-paper diode uses power and service life.
Utility model content
The technical problems to be solved in the utility model is how to reduce the size of stamp-mounting-paper diode, and it is enabled to have well
Heat sinking function.
In order to solve the above-mentioned technical problem, the utility model provides a kind of ultra-thin heat dissipation type paster diode comprising envelope
Filling body, chip, the first pin and second pin, first pin and second pin are equipped with welding ends and patch end, and first
The welding ends of pin is welded on the upper surface of chip, and the welding ends of second pin is welded on the lower surface of chip, and packaging body is by core
The welding ends sealed envelope of piece, the welding ends of the first pin and second pin, the patch end of the first pin and the patch of second pin
Bit end is stretched out outside packaging body, and the chip is obliquely installed, and the face of welding chip is inclined surface on the welding ends of two pins, is inclined
The angle of inclination on inclined-plane is consistent with the angle of inclination of chip, and packaging body is directly horizontally outward stretched out at the patch end of the first pin, the
The upward bending in packaging body of the patch end of two pins horizontally outward bending and stretches out packaging body at not higher than the first pin,
The patch end downward bending being located on two pins outside packaging body, horizontal direction is rolled over again not less than the position of package bottom
It is curved.
Preferably, the angle of inclination of the chip is not more than 30 °.
Preferably, one layer of tin, the second pin are welded between the welding ends and the upper surface of chip of first pin
Welding ends and the lower surface of chip between be welded with one layer of tin.
Preferably, the patch end level of the patch end of first pin and second pin is contour.
In the utility model, the chip of stamp-mounting-paper diode is obliquely installed, the face of welding chip on the welding ends of two pins
Also it is set as the inclined surface to match with chip, such welding manner sponges the thickness of chip itself on thickness so that patch
The thickness of piece diode be only two pins thickness and, rather than two traditional pins plus chip thickness and, therefore energy
The size of stamp-mounting-paper diode is effectively reduced, while two pins are protruding in the upper position of stamp-mounting-paper diode, effectively will
Generated heat takes away the bottom of stamp-mounting-paper diode when stamp-mounting-paper diode work, then heat is spread out to outside packaging body,
It fundamentally avoids heat and is gathered in the problem of it is heated in stamp-mounting-paper diode bottom, the heat dissipation performance of stamp-mounting-paper diode
It is improved, ensure that stamp-mounting-paper diode uses power and service life.
Description of the drawings
Fig. 1 is the structural schematic diagram of the ultra-thin heat dissipation type paster diode of the utility model；
Reference sign：1- packaging bodies；2- chips；The first pins of 3-；4- second pins.
Specific implementation mode
The utility model is further described with the following Examples.
As shown in Figure 1, the ultra-thin heat dissipation type paster diode of the utility model includes packaging body 1, chip 2, the first pin 3
With second pin 4, in order to reduce the thickness of stamp-mounting-paper diode, chip 2 is obliquely installed, if the angle of inclination of chip 2 is excessive, chip
2 occupied space in the vertical direction is more, causes the thickness of stamp-mounting-paper diode larger, therefore the angle of inclination of chip 2 is not more than
30 °, the first pin 3 is respectively welded at the upper surface of chip 2 by way of soldering, second pin 4 also by soldering mode
It is welded on the lower surface of chip 2, the one end welded with chip 2 on two pins is welding ends, and the other end is patch end, then first
There is one layer of tin to connect the two between the welding ends of pin 3 and the upper surface of chip, similarly, the welding of second pin 4
Also there is one layer of tin to connect the two between end and the lower surface of chip, the face of welding chip 2 on the welding ends of two pins
It is inclined surface, the angle of inclination of inclined surface is consistent with the angle of inclination of chip 2, and the thickness of such chip 2 will be drawn by two
The thickness of foot sponges, and can reduce the integral thickness of stamp-mounting-paper diode.
Packaging body 1 is by the welding ends sealed envelope of chip 2, the welding ends of the first pin 3 and second pin 4, the first pin 3
Patch end horizontally outward extend, directly stretch out packaging body 1, the patch end of the first pin 3 is rolled over still further below after stretching out packaging body 1
It is curved, it extends to not less than outside bending again after package bottom, patch end upward bending in packaging body 1 of second pin 4,
Packaging body 1 is stretched out not higher than outside bending at the first pin 3, bending still further below after packaging body 1 is stretched out, extends to and the first pin
Outside bending again after 3 post-chip end same level height, the level height that the patch end of two pins maintains like can facilitate patch
Piece works, and avoids two pins not contour and causes the stamp-mounting-paper diode after patch unstable, and stamp-mounting-paper diode is produced when working
Heat through the top pin in two positions to external diffusion, avoid heat from being gathered in stamp-mounting-paper diode bottom and it heated,
Stamp-mounting-paper diode is set to have good heat sinking function, ensure that stamp-mounting-paper diode uses power and service life.
Claims (4)
1. a kind of ultra-thin heat dissipation type paster diode, including packaging body, chip, the first pin and second pin, described first draws
Foot and second pin are equipped with welding ends and patch end, and the welding ends of the first pin is welded on the upper surface of chip, second pin
Welding ends be welded on the lower surface of chip, packaging body is close by the welding ends of chip, the welding ends of the first pin and second pin
Package is wrapped up in, and the patch end of the first pin and the patch end of second pin are stretched out outside packaging body, it is characterized in that：
The chip is obliquely installed, and the face of welding chip is inclined surface, the inclination angle of inclined surface on the welding ends of two pins
Degree is consistent with the angle of inclination of chip；
Packaging body is directly horizontally outward stretched out at the patch end of first pin, and the patch end of second pin is rolled over upwards in packaging body
It is curved, horizontally outward bending and packaging body is stretched out at not higher than the first pin, the patch end outside packaging body is located on two pins
Downward bending, in the horizontally outward bending again of the position not less than package bottom.
2. ultra-thin heat dissipation type paster diode according to claim 1, characterized in that the angle of inclination of the chip is little
In 30 °.
3. ultra-thin heat dissipation type paster diode according to claim 1, characterized in that the welding ends of first pin with
It is welded with one layer of tin between the upper surface of chip, one layer of tin is welded between the welding ends of the second pin and the lower surface of chip.
4. ultra-thin heat dissipation type paster diode according to claim 1, characterized in that the patch end of first pin and
The patch end of second pin is contour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721928545.4U CN207947269U (en) | 2017-12-29 | 2017-12-29 | A kind of ultra-thin heat dissipation type paster diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721928545.4U CN207947269U (en) | 2017-12-29 | 2017-12-29 | A kind of ultra-thin heat dissipation type paster diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207947269U true CN207947269U (en) | 2018-10-09 |
Family
ID=63701119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721928545.4U Expired - Fee Related CN207947269U (en) | 2017-12-29 | 2017-12-29 | A kind of ultra-thin heat dissipation type paster diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207947269U (en) |
-
2017
- 2017-12-29 CN CN201721928545.4U patent/CN207947269U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181009 Termination date: 20201229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |