CN207924323U - a kind of backlight module - Google Patents

a kind of backlight module Download PDF

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Publication number
CN207924323U
CN207924323U CN201820463189.1U CN201820463189U CN207924323U CN 207924323 U CN207924323 U CN 207924323U CN 201820463189 U CN201820463189 U CN 201820463189U CN 207924323 U CN207924323 U CN 207924323U
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China
Prior art keywords
glue frame
baffle
glue
frame
backlight module
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Application number
CN201820463189.1U
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Chinese (zh)
Inventor
戴佳民
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Truly Semiconductors Ltd
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Truly Semiconductors Ltd
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Priority to CN201820463189.1U priority Critical patent/CN207924323U/en
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Abstract

The utility model discloses a kind of backlight modules comprising lower frame, FPC and glue frame, the lower frame include bottom plate and multiple side walls for being upwardly extended by bottom edge;The FPC is set on the bottom plate, and the FPC is equipped with LED light, and the top side wall close to the LED light extends internally and is formed with baffle;The glue frame is sheathed in the lower frame, is connected on the side wall on the outside of the glue frame, the glue frame disconnects at the baffle to avoid the baffle.I.e. the glue frame is directly disconnected with the interference portion of baffle, door type glue frame is formed, to avoid baffle.Backlight module provided by the utility model is easily assembled, and automated production easy to implement reduces production cost to promote efficiency of assembling.

Description

A kind of backlight module
Technical field
The utility model is related to a kind of display technology fields, more specifically to a kind of backlight module.
Background technology
It is higher due to having to thickness and brightness such as tablet computer class product for the backlight that Ultrathin high-brightness degree requires It is required that so c-type lower frame would generally be arranged in one end equipped with LED light, to allow LED light and light guide plate light inlet to wrap up In the c-type lower frame, be conducive to the utilization rate for improving light.But glue frame can not be then set well after setting c-type lower frame, by Interference is will produce in glue frame and c-type lower frame, c-type lower frame can be caused to be assembled with glue frame difficult, be difficult to realize automated production, Efficiency of assembling is caused to reduce, production cost is high.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of backlight modules, and the glue frame is in the interference with baffle Part directly disconnects, and door type glue frame is formed, to avoid baffle.Backlight module provided by the utility model is easily assembled, and is held Easily realize that automated production reduces production cost to promote efficiency of assembling.
Technical problem to be solved in the utility model is achieved by the following technical programs:
In order to solve the above technical problems, the utility model provides a kind of backlight module comprising lower frame, FPC and glue frame, The lower frame includes bottom plate and multiple side walls for being upwardly extended by bottom edge;The FPC is set on the bottom plate, the FPC It is equipped with LED light, the top side wall close to the LED light extends internally and is formed with baffle;The glue frame is sheathed on institute It states in lower frame, is connected on the side wall on the outside of the glue frame, the glue frame disconnects at the baffle to avoid the baffle.
Further, double-sided adhesive is equipped on the outside of the glue frame with the side wall contact area or is coated with glue.
Further, the glue frame bottom is equipped with double-sided adhesive with the bottom plate contact area or is coated with glue.
Further, multiple buckles are equipped on the outside of the glue frame, the lower frame is equipped with button bit corresponding with the buckle.
Further, open up fluted on the bottom plate, the groove is located at below the baffle;The FPC is set to institute It states in groove.
Further, further include reflector plate and the double faced adhesive tape on the FPC, the reflector plate is on the bottom plate And outside the groove, the depth of the groove is d, and the thickness of the FPC is T1, the thickness of the double faced adhesive tape is T2, described The thickness of reflector plate is T3, wherein d >=T1+T2-T3
The utility model has the advantages that:The glue frame is directly disconnected with the interference portion of baffle, forms door word Type glue frame, to avoid baffle.Backlight module provided by the utility model is easily assembled, automated production easy to implement, to Efficiency of assembling is promoted, production cost is reduced.
Double-sided adhesive is equipped with side wall contact area on the outside of glue frame or is coated with glue, glue frame can be made to be securely attached to side On wall, prevent glue frame from deforming.
Description of the drawings
Fig. 1 is a kind of backlight module sectional view provided by the utility model.
Fig. 2 is the stereogram of the lower frame and glue frame in Fig. 1.
Fig. 3 is enlarged drawing at the A in Fig. 2.
Fig. 4 is the sectional view of Fig. 1 left views.
Fig. 5 is FPC structural schematic diagrams.
Specific implementation mode
The utility model is described in detail with reference to embodiment, embodiment is only the preferred reality of the utility model Mode is applied, is not the restriction to the utility model.
It is a kind of backlight module provided by the utility model comprising lower frame 1, FPC2 and glue frame incorporated by reference to Fig. 1 to Fig. 3 3, the lower frame 1 includes bottom plate 11 and the multiple side walls 12 upwardly extended by 11 edge of bottom plate, the bottom plate 11 and the side wall 12 are mutually perpendicular to;The FPC2 is set on the edge of the bottom plate 11, and the FPC2 is equipped with LED light 4, close to the LED light 4 The top of the side wall 12 extend internally and be formed with baffle 13, the baffle 13 is parallel with the bottom plate 11, to form c-type Structure;The glue frame 3 is sheathed in the lower frame 1, and 3 outside of the glue frame is connected on the side wall 12, and the glue frame 3 is in institute It states and is disconnected at baffle 13 to avoid the baffle 13.I.e. the glue frame 3 is directly disconnected with the interference portion of baffle 13, forms door word Type glue frame 3, to avoid baffle 13.Backlight module provided by the utility model is easily assembled, automated production easy to implement, from And efficiency of assembling is promoted, reduce production cost.
Further, 3 outside of the glue frame is equipped with multiple buckles 31, and the lower frame 1 is equipped with corresponding with the buckle 31 Button bit 32.So that glue frame 3 is fixed on lower frame 1, glue frame 3 is further prevented to deform.
Incorporated by reference to Fig. 3 and Fig. 4, since the present embodiment is the tablet computer class product applied to Ultrathin high-brightness degree requirement, glue Frame 3 is narrow frame and ultra-thin, and the solid thickness of glue frame 3 is very tiny, fastens although buckle 31 can be designed, is still easy It is deformed, further, 3 outside of the glue frame is equipped with double-sided adhesive 5 with 12 contact area of the side wall or is coated with glue.This Embodiment is preferably double-sided adhesive 5, and glue frame 3 can be made to be securely attached on side wall 12, prevents glue frame 3 from deforming.
Further, 3 bottom of the glue frame is equipped with double-sided adhesive 5 with 11 contact area of the bottom plate or is coated with glue.This Embodiment is preferably double-sided adhesive 5, and glue frame 3 can be made to be securely attached on side wall 12, and glue frame 3 is further prevented to deform.
Referring to Fig. 1, further, the backlight module further includes the reflector plate 6 being set on the bottom plate 11, the bottom Fluted 7 are opened up on plate 11, the groove 7 is located at 13 lower section of the baffle;The FPC2 is set in the groove 7, FPC2 mono- As the lower section of light guide plate 9 is pasted and fixed on by double faced adhesive tape 8.Since the thickness of FPC2 is often more than plus the thickness of double faced adhesive tape 8 The thickness of reflector plate 6, i.e., there are difference in height between them, reflector plate 6 is by taking the ESR series of 3M companies as an example, since product has thickness Degree limitation, can generally select the ESR of 0.065mm, and the thickness of FPC2 is usually 0.15mm, and double-sided adhesive 5 is usually 0.05mm, The sum of FPC2 and the thickness of double faced adhesive tape 8 are 0.2mm, have 0.135 difference in height with reflector plate 6, this difference in height can make reflection Piece 6 cannot be tightly attached between light guide plate 9 and lower frame 1, and light losing is thereby resulted in, and also result in brightness and the effect of backlight module It is unstable.The present embodiment is since FPC2 is set in groove 7, and the thickness of double faced adhesive tape 8 is usually less than the thickness of reflector plate 6, with this It can make reflector plate 6 that can be tightly attached between light guide plate 9 and lower frame 1, prevent light losing, avoid brightness and the effect of backlight module It is unstable.
Further, the depth of the groove 7 is d, and the thickness of the FPC2 is T1, the thickness of the double faced adhesive tape 8 is T2, The thickness of the reflector plate 6 is T3, wherein d >=T1+T2-T3, so that groove 7 has enough space FPC2, avoid reflector plate 6 occur the case where can not being tightly attached to light guide plate 9 and lower frame 1, it is preferable that d=T1+T2-T3, all parts can be made to be adjacent to, and The service life of backlight module will not also can be improved due to sending out sound when vibrations.
Referring to Fig. 5, further, which includes substrate layer 21, the upper surface of substrate layer 21 is provided with circuit layer 22, The lower surface of substrate layer 21 is provided with metallic radiating layer 23, and set-up mode can be circuit layer 22, the difference of metallic radiating layer 23 It is pasted on substrate layer 21.Due to the thinner thickness of substrate layer 21, the heat on FPC2 can be diffused into gold by substrate layer 21 Belong to heat dissipating layer 23, which can effectively increase the heat dissipation area of FPC2, play the role of Homogeneouslly-radiating, to carry The high radiating efficiency of FPC2.Wherein substrate layer 21 can be any one in polyimides, polyester, polysulfones or polytetrafluoroethylene (PTFE) Kind, which can be copper foil layer.
Further, FPC2 further includes at least one through the logical of substrate layer 21, circuit layer 22 and metallic radiating layer 23 Hole 24, the inner wall of the through-hole 24 are provided with the heat-conducting layer contacted with circuit layer 22, metallic radiating layer 23, using good at through-hole 24 Heat conductivility, the circuit layer 22 and metallic radiating layer 23 of 21 both sides of substrate layer can be electrically connected, play good heat conduction work( Can, and heat-conducting layer can provide heat conduction function, to reach good heat dissipation effect.Wherein, which can be copper glue conductive oil Layer of ink.
Further, it is provided with the heat carrier being connect with external conductive structure in through-hole 24, the heat carrier is from circuit layer 22 side is connected with external conductive structure, is also in contact with the heat-conducting layer in through-hole 24, so that circuit layer 22, metal dissipate Thermosphere 23 can be connected by through-hole 24 with external conductive structure, so that the heat in FPC2 passes through in the through-hole 24 Heat carrier diffuses to external conductive structure, to further increase the radiating efficiency of FPC2.Preferably, in order to allow through-hole 24 with External conductive structure is connected, which is set to the marginal position of FPC2.
Further, the metallic radiating layer 23 be uniform radiating structure, structure can be reticular structure, strip structure, Any one in wavelike structure or honeycomb structure can preferably improve heat dissipation effect by the uniform radiating structure.
Above example only expresses the embodiment of the utility model, the description thereof is more specific and detailed, but can not Therefore it is interpreted as the limitation to the utility model patent range, as long as the form using equivalent substitution or equivalent transformation is obtained Technical solution, shall fall within the scope of the present invention.

Claims (6)

1. a kind of backlight module, which is characterized in that it includes:
Lower frame comprising bottom plate and the multiple side walls upwardly extended by bottom edge;
FPC is set on the bottom plate, and the FPC is equipped with LED light, and the top side wall close to the LED light is inwardly prolonged It stretches and is formed with baffle;
Glue frame is sheathed in the lower frame, is connected on the side wall on the outside of the glue frame, the glue frame is at the baffle It disconnects to avoid the baffle.
2. backlight module according to claim 1, which is characterized in that set with the side wall contact area on the outside of the glue frame There is double-sided adhesive or is coated with glue.
3. backlight module according to claim 2, which is characterized in that the glue frame bottom is set with the bottom plate contact area There is double-sided adhesive or is coated with glue.
4. backlight module according to claim 1, which is characterized in that multiple buckles are equipped on the outside of the glue frame, under described Frame is equipped with button bit corresponding with the buckle.
5. backlight module according to claim 1, which is characterized in that open up fluted, the groove position on the bottom plate Below the baffle;The FPC is set in the groove.
6. backlight module according to claim 5, which is characterized in that further include reflector plate and pair on the FPC Face glue, the reflector plate are set on the bottom plate and outside the groove, and the depth of the groove is d, the thickness of the FPC For T1, the thickness of the double faced adhesive tape is T2, the thickness of the reflector plate is T3, wherein d >=T1+T2-T3
CN201820463189.1U 2018-04-03 2018-04-03 a kind of backlight module Active CN207924323U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820463189.1U CN207924323U (en) 2018-04-03 2018-04-03 a kind of backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820463189.1U CN207924323U (en) 2018-04-03 2018-04-03 a kind of backlight module

Publications (1)

Publication Number Publication Date
CN207924323U true CN207924323U (en) 2018-09-28

Family

ID=63596996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820463189.1U Active CN207924323U (en) 2018-04-03 2018-04-03 a kind of backlight module

Country Status (1)

Country Link
CN (1) CN207924323U (en)

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