CN207818613U - A kind of wafer package protective device - Google Patents
A kind of wafer package protective device Download PDFInfo
- Publication number
- CN207818613U CN207818613U CN201820120722.4U CN201820120722U CN207818613U CN 207818613 U CN207818613 U CN 207818613U CN 201820120722 U CN201820120722 U CN 201820120722U CN 207818613 U CN207818613 U CN 207818613U
- Authority
- CN
- China
- Prior art keywords
- pressure guard
- paster
- pad pasting
- crystal grain
- wafer package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of wafer package protective devices; belong to chip protection device field; including film-sticking paper and pressure guard; wherein film-sticking paper is made of pad pasting and paster bonding; pressure guard is square slab construction; the center of pressure guard is additionally provided with through-hole, and the width of pressure guard is less than the width of pad pasting and paster；When work, pressure guard is lain between pad pasting and paster.The utility model is a kind of self-contained wafer package protective device, and the present apparatus can be packaged chip is whole, change the outbound mode of previous grain dress；The present apparatus has the characteristics that device is simple, practical, protecting effect is good, and crystal grain can be integrally transferred to downstream packing producing line, and downstream producer is not required to sculling encapsulation, can be directly by assembly line on crystal grain.
Description
Technical field
The utility model is related to chip protection device more particularly to a kind of wafer package protective devices.
Background technology
Chip is one of most important raw materials of LED, is the luminous component of LED, part most crucial LED, chip it is good
The bad performance that will directly determine LED, chip is by being made of III and V race's composite semiconductor substance.Chip is usually by monocrystalline
The thin slice that silicon is cut into, diameter have 6 inches, 8 inches, 12 inches of equal-specifications, are mainly used to produce integrated circuit, chip is original
Material, it is necessary to can be used by electronic component by a series of processing precision processing below.At present from the chip after cutting
It is upper stripping crystal grain conventional steps be：Through diffusion --- trench digging --- wafer surface metallization --- cut crystal, at this moment, every
It has been cut into thousands of a little crystal grains on chip, then little crystal grain is separated by hand by the sliver to chip.Such little crystal grain
By e-sort machine testing, so that it may with bag crystal grain warehousing finished products in bulk.But this processing method is used, after cleaved
Little crystal grain on chip, it is necessary to manually remove, fully enter e-sort machine testing at dispersed regardless of quality, could sort
Go out non-defective unit crystal grain storage, this mode increases the pressure of subsequent detection.The utility model is changed for the above technical problem
Into crystal grain in bulk being changed to pad pasting chip, the process of the utility model is as follows：
Detection：Electrical and appearance full inspection first is carried out to crystal grain in chip with electronics dotting machine, by crystal grain face defective
Coloured pencil gets marking ready.Again by the crystal edge of the non-formation rule of Waffer edge, gone out with same color stroke.
Cutting：After finishing mark, full wafer cutting is carried out to chip.Note：Only 2/3 thickness of cutting, it is also not broken to cut rear chip, protects
Hold certain rigidity.
Pad pasting：The chip cutting finished will have been cut to face upward, be placed on paster center, heartcut line is in positive paster
The heart, then thereon by the covering of pad pasting toughness one side.
Sliver：Hand rolls around 1 time by idler wheel with chip open channels at 90 degree forwards.Turn 90 degree of chip, idler wheel
Again to 90 degree of chip open channels, roll again back and forth 1 time forwards.Crystal grain groove on film has cracked, but also entirety is sticked to film
On.
Upper pressure guard：There is flaw crystal grain to be rejected from film marking, pressure guard is then lain in into pad pasting and paster
Between, remainder non-defective unit crystal grain is put into pressure guard central through hole.
It arranges：Chip face pressure guard center, quadrangle low force stretch uniform, pressure guard upper cover film-sticking paper, to non-defective unit crystal grain
Statistics is made, is put in storage.
It is whole pad pasting crystal grain shipment that this process, which changes crystal grain in bulk, and downstream producer is not required to sculling encapsulation, can be direct
By assembly line on crystal grain.Unstripped crystal grain is first just identified quality by this operating process in advance, makes label.Chip is integrally cut again
Cut --- sliver.Defective products on chip after sliver (only occupying the minority) is chosen into rejecting by hand.Chip (no defective products after handling
Crystal grain) integrally it is posted on diaphragm, statistics is made to non-defective unit crystal grain, is put in storage shipment.
The utility model is directed to improved processing flow, have developed it is a kind of can be to dress that wafer package plays a protective role
It sets, the present apparatus can be packaged chip is whole, change the outbound mode of previous grain dress；The present apparatus has device letter
Single, practical, protecting effect is good feature, and crystal grain can be integrally transferred to downstream packing producing line, downstream producer is not required to shake
Ship encapsulates, can be directly by assembly line on crystal grain.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of wafer package protective device, with
Solving existing crystal grain in bulk must manually remove, and e-sort machine testing is fully entered at dispersed regardless of quality；And
Downstream producer needs to carry out selecting technical problem caused by sequence to crystal grain in bulk again.
The utility model is achieved through the following technical solutions in order to solve the above technical problems：The utility model discloses
A kind of wafer package protective device, including film-sticking paper and pressure guard, wherein film-sticking paper are made of pad pasting and paster bonding, against pressure
Plate is square slab construction, and the center of pressure guard is additionally provided with through-hole, and the width of pressure guard is less than the width of pad pasting and paster；
When work, pressure guard is lain between pad pasting and paster, and the crystal grain after sliver is all covered in through-hole, prevents from transporting
Crystal grain falling and colliding in journey.
Further, in order to preferably facilitate artificial sliver, pad pasting to be made of transparent PVC membrane material, paster is grease proofing
Paper.
Further, in order to ensure the hardness of pressure guard, the physical life of pressure guard is improved, pressure guard uses makrolon
Material is made.
Further, the size of paster is 230*230mm, and the size of pad pasting is 210*210mm, through-hole it is straight
Diameter is 160~180mm, and the thickness of pressure guard is 10~15mm, and such crystal grain can cover on through-hole inner cavity, improve crystalline substance completely
The safety of grain.
The utility model discloses a kind of wafer package protective devices, are split by the way that chip to be integrally put into film-sticking paper
Piece, and by that placement pressure guard among film-sticking paper, can be protected to the chip after sliver.The utility model has dress
Set that simple, operation is practical, conveniently, avoiding conventional bulk crystal grain must manually remove, regardless of quality at dispersed all into
Enter e-sort machine testing；And downstream producer needs to carry out selecting technical problem caused by sequence to crystal grain in bulk again.
Description of the drawings
Fig. 1 is that the utility model installs vertical view；
Fig. 2 is film-sticking paper structural schematic diagram；
Fig. 3 is plate structure schematic diagram against pressure.
Specific implementation mode
It elaborates below to the embodiments of the present invention, the present embodiment before being with technical solutions of the utility model
It puts and is implemented, give detailed embodiment and specific operating process, but the scope of protection of the utility model is unlimited
In following embodiments.
Embodiment 1
Embodiment 1 discloses a kind of wafer package protective device, as shown in Figs. 1-2, including film-sticking paper 1 and pressure guard 2,
Middle film-sticking paper 1 is made of pad pasting 11 and the bonding of paster 12, and the back side of pad pasting 11 is coated with mucus, as shown in figure 3, pressure guard 2 is
Square plate structure, the center of pressure guard 2 are additionally provided with through-hole 21, and the width of pressure guard 2 is less than pad pasting 11 and paster 12
Width；When work, pressure guard 2 is lain between pad pasting 11 and paster 12, and the crystal grain 3 after sliver is all covered on through-hole 21
It is interior, prevent falling and colliding for crystal grain 3 in transportational process.Pad pasting 11 is made of transparent PVC membrane material in the present embodiment, paster
12 be greaseproof.Pressure guard 2 is made of makrolon material.The size of paster 12 is 230*230mm, the ruler of pad pasting 11
Very little size is 210*210mm, and the thickness of a diameter of 160mm of through-hole 21, pressure guard 2 are 10mm, and such crystal grain 3 can be complete
The inner cavity for covering on through-hole 21 improves the safety of crystal grain 3.Crystal grain 3 is all adhered to the back side of pad pasting 11, will not transport again
It is 3 inch wafers that sharp wear, damage, the wafer size in the present embodiment are caused in journey.
Embodiment 2
Embodiment 2 discloses a kind of wafer package protective device, including film-sticking paper 1 and pressure guard 2, and wherein film-sticking paper 1 is
It is made of pad pasting 11 and the bonding of paster 12, the back side of pad pasting 11 is coated with mucus, and pressure guard 2 is square slab construction, pressure guard 2
Center be additionally provided with through-hole 21, the width of pressure guard 2 is less than the width of pad pasting 11 and paster 12；When work, pressure guard 2 is kept flat
It is all covered in through-hole 21 between pad pasting 11 and paster 12, and by the crystal grain 3 after sliver, prevents crystal grain 3 in transportational process
Fall and collide.Pad pasting 11 is made of transparent PVC membrane material in the present embodiment, and paster 12 is greaseproof.Pressure guard 2 uses
Makrolon material is made.The size of paster 12 is 230*230mm, and the size of pad pasting 11 is 210*210mm, through-hole
The thickness of 21 a diameter of 180mm, pressure guard 2 are 15mm, and such crystal grain 3 can cover on the inner cavity of through-hole 21 completely, are improved
The safety of crystal grain 3.Crystal grain 3 is all adhered to the back sides of pad pasting 11, will not cause sharp wear, damage in transportational process again
It is bad.
Claims (4)
1. a kind of wafer package protective device, which is characterized in that including film-sticking paper and pressure guard, wherein the film-sticking paper is by pasting
Film and paster bond composition, and the pressure guard is square slab construction, and the center of the pressure guard is additionally provided with through-hole, described
The width of pressure guard is less than the width of the pad pasting and paster；When work, the pressure guard lie in the pad pasting and paster it
Between.
2. wafer package protective device as described in claim 1, which is characterized in that the pad pasting uses transparent PVC membrane material
It is made, the paster is greaseproof.
3. wafer package protective device as described in claim 1, which is characterized in that the pressure guard uses makrolon material
It is made.
4. wafer package protective device as described in claim 1, which is characterized in that the size of the paster is 230*
The size of 230mm, the pad pasting are 210*210mm, a diameter of 160~180mm of the through-hole, the thickness of the pressure guard
Degree is 10~15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820120722.4U CN207818613U (en) | 2018-01-24 | 2018-01-24 | A kind of wafer package protective device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820120722.4U CN207818613U (en) | 2018-01-24 | 2018-01-24 | A kind of wafer package protective device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207818613U true CN207818613U (en) | 2018-09-04 |
Family
ID=63324883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820120722.4U Expired - Fee Related CN207818613U (en) | 2018-01-24 | 2018-01-24 | A kind of wafer package protective device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207818613U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
-
2018
- 2018-01-24 CN CN201820120722.4U patent/CN207818613U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180904 Termination date: 20190124 |