CN207818566U - Pre-plastic package lead frame item - Google Patents
Pre-plastic package lead frame item Download PDFInfo
- Publication number
- CN207818566U CN207818566U CN201820059901.1U CN201820059901U CN207818566U CN 207818566 U CN207818566 U CN 207818566U CN 201820059901 U CN201820059901 U CN 201820059901U CN 207818566 U CN207818566 U CN 207818566U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- plastic package
- frame item
- package lead
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model is related to pre-plastic package lead frame items.According to the pre-plastic package lead frame item of one embodiment of the utility model, with opposite first surface and second surface.The pre-plastic package lead frame item includes the lead frame unit of multiple array arrangements, each lead frame unit includes being configured to carry the carrier of circuit to be packaged, several pins being arranged around the carrier and preformed adhesive body, wherein the carrier exposes to the first surface of pre-plastic package lead frame item, and several pin exposeds are in the first surface and second surface of pre-plastic package lead frame item.The utility model embodiment can carry out performance adjustment to chip by lead frame unit, improve the quality, reliability and qualification rate of product under the premise of each lead frame cellular construction in not destroying lead frame item.
Description
Technical field
The utility model is related to technical field of semiconductors, more particularly to the pre-plastic package lead frame in technical field of semiconductors
Item.
Background technology
In technical field of semiconductors, carrier of the lead frame item as chip can be by the wafer electric in semiconductor packages
Gas is connected to external circuit.Therefore, lead frame item has vital influence for the quality of semiconductor package body.
Pin in traditional lead frame item keeps connecting before plastic packaging only by company's muscle on lead frame item
State.If cutting off company's muscle on lead frame item, all pins will lose fixation, and the structure of lead frame item will also meet with
To destruction, however, if the not company's of excision muscle, although the structure of lead frame item can be kept, all pins are all short circuits
, it is difficult to performance adjustment is carried out to chip by lead frame item.Though at present can be by the technology of some pre-plastic packages to lead frame
Frame item does pre-plastic package processing to solve the above problems, but using galvanoplastics, cost and manufacture difficulty are relatively very high, production
Product yields is relatively low.
Therefore, existing pre-plastic package lead frame item and its manufacturing method are still further improved.
Utility model content
One of the purpose of this utility model is to provide a pre-plastic package lead frame item, can solve of the existing technology
The technical issues of being difficult to carry out performance adjustment to chip by lead frame item before plastic packaging.
One embodiment of the utility model provides a pre-plastic package lead frame item, with opposite first surface and the
Two surfaces.The pre-plastic package lead frame item includes the lead frame unit of multiple array arrangements, and each lead frame unit includes
It is configured to carry carrier, several pins being arranged around the carrier and the preformed adhesive body of circuit to be packaged,
In the carrier expose to the first surface of pre-plastic package lead frame item, several pin exposeds in pre-plastic package lead frame article
One surface and second surface.
Another embodiment according to the present utility model, which further includes connect with the carrier
Connecting rod and connect company's muscle of several pins, the surface for exposing to the second surface of several pins has tin layers.
The pre-plastic package lead frame item that the utility model embodiment provides, each in not destroying lead frame item can lead
Under the premise of wire frame cellular construction, performance adjustment is carried out to chip by lead frame unit；And improve the product of product
Matter, reliability and qualification rate.
Description of the drawings
It is the schematic diagram according to the first surface of the pre-plastic package lead frame item of one embodiment of the utility model shown in Fig. 1
It is the schematic diagram according to the second surface of the pre-plastic package lead frame item of one embodiment of the utility model shown in Fig. 2
It is to be shown according to the processing procedure of the manufacturing method of the pre-plastic package lead frame item of one embodiment of the utility model shown in Fig. 3-6
It is intended to
Specific implementation mode
To be better understood from the spirit of the utility model, it is made below in conjunction with the part preferred embodiment of the utility model
It further illustrates.
Fig. 1 and Fig. 2 is the first table of the pre-plastic package lead frame item 10 of one embodiment according to the present utility model respectively
The schematic diagram in face 100 and second surface 101, wherein first surface 100 and second surface 101 are pre-plastic package lead frame items 10
Two opposite surfaces.
Include combined with Figure 1 and Figure 2, multiple arrays according to the pre-plastic package lead frame item 10 of the utility model one embodiment
The lead frame unit 12 of arrangement, because the space of a whole page limits to, Fig. 1 and 2 only shows the lead frame unit 12 of 9 array arrangements, Fig. 3-6
It is similar.Wherein, each lead frame unit 12 includes carrier 102, connecting rod 103, several pins 104, even muscle 106 and pre-
Plastic packaging colloid 105.Specifically, carrier 102 is configured to carry circuit (not shown) to be packaged；Connecting rod 103 will be adjacent
Carrier 102 connect to form array；Several pins 104 are arranged around the surrounding of carrier 102, and are configured to hold
Circuit to be packaged on load plate 102 is electrically connected with external pin (not shown)；Even muscle 106 connects several pins 104 to keep drawing
The arrangement position of foot 104, preformed adhesive body 105 fill carrier 102, connecting rod 103, several pins 104 and even muscle 106 it
Between gap, and the above-mentioned component of part overlaid.
Specifically, on the first surface 100 of pre-plastic package lead frame item 10 as shown in Figure 1, carrier 102, connection
Bar 103, several pins 104 and company's muscle 106 expose to the first surface 100 of pre-plastic package lead frame item 10, i.e. pre-plastic package
Colloid 105 is filled between above-mentioned each component without covering them.
However, on the second surface 101 of pre-plastic package lead frame item 10 shown in Fig. 2, only several pins 104 and hold
Load plate 102 is exposed, that is to say, that on the second surface 101 of pre-plastic package lead frame item 10, connecting rod 103 and muscle 106 are all
Covered by preformed adhesive body 105.
Further, since several pins 104 are generally made of metallic copper, it is easy oxidation by air.In the present embodiment, Ruo Ganyin
Foot 104, which exposes to, to be gone back uniform fold on the surface of second surface 101 and has tin layers, to protect exposed several pins 104.
By not only there is even muscle 106 between several pins 104 of pre-plastic package lead frame item 10 in this present embodiment, also
Preformed adhesive body 105, therefore, when carrying out performance adjustment to chip by pre-plastic package lead frame item 10, by the even excision of muscle 106
After excluding the short-circuit state between each pin 104, can still it be protected by the fixation of preformed adhesive body 105 between several pins 104
Hold that location and shape are constant, the structure of each lead frame unit 12 can also keep complete.
Fig. 3-Fig. 6 is shown according to the processing procedure of the manufacturing method of the pre-plastic package lead frame item 10 of one embodiment of the utility model
It is intended to, the manufacturing method of the pre-plastic package lead frame item 10 can manufacture the pre-plastic package lead frame according to the utility model embodiment
Item 10, for example, embodiment as depicted in figs. 1 and 2 pre-plastic package lead frame item 10.
First, a lead frame item 20 (referring to Fig. 3) is provided, the lead frame item 20 is with first surface 200 and therewith
Opposite second surface 201 (referring to Fig. 4-6), and include the lead frame unit 22 of multiple array arrangements, wherein each conducting wire
Frame unit 22 includes carrier 202, connecting rod 203, several pins 204 and connects muscle 206.Specifically, carrier 202 is through matching
It sets to carry circuit (not shown) to be packaged；Connecting rod 203 connects adjacent carrier 202 to form array；It is several
Pin 204 is arranged around the surrounding of carrier 202, is configured to circuit to be packaged and the external pin on carrier 202 (not
Diagram) electrical connection；Even muscle 206 connects several pins 204 to keep the arrangement position of pin 204.When the lead frame item of offer
When there is pad pasting (not shown) on 20 second surface 201, the pad pasting on second surface 201 is removed.
As shown in figure 4, the pad pasting 21 on the first surface 200 of lead frame item 20, which can be high temperature resistant glued membrane, can
The plastic packaging glue used when preventing plastic packaging is spilt on the first surface 200 of lead frame item 20.
Then, the lead frame item of film 21 will have been pasted towards the direction of the inside of cavity (not shown) with first surface 200
20 are put into cavity, and pre-plastic package is carried out to the first surface 200 of lead frame item 20.
Later, as shown in figure 5, being ground to the second surface 201 of the lead frame item 20 after pre-plastic package, grinding is as
Dry pin 204 exposes to second surface 201, and then plating exposes to several pins 204 of second surface 201 to prevent it
It is aoxidized, which can be used tin as plating metal.
As shown in fig. 6, removing the film 21 on first surface 200, you can obtain pre-plastic package lead frame as illustrated in fig. 1 and 2
Frame item 10.
Designed compared to traditional lead frame item, pre-plastic package lead frame item that the utility model embodiment provides and its
Manufacturing method has the following advantages：
First, the pre-plastic package lead frame item used in the utility model embodiment still can after excision even muscle
The original location and shape of pin are kept, can not carry out the conventional wires frame of performance adjustment before plastic packaging to chip can pass through the party
Case carries out performance adjustment before realizing plastic packaging to chip, in addition, the pre-plastic package lead frame item that the utility model embodiment provides
Manufacturing method can be used for surface and be used without the lead frame item of plastic packaging.
Secondly, in the case where not changing the plastic package die of original volume production, the manufacturer of the utility model embodiment offer
Plastic packaging and grinding technics in method is relatively simple, at low cost and with short production cycle.
The technology contents and technical characterstic of the utility model have revealed that as above, however those skilled in the art still may be used
Teaching and announcement that can be based on the utility model and make various replacements and modification without departing substantially from the spirit of the present invention.Therefore, originally
The protection domain of utility model should be not limited to the revealed content of embodiment, and should include various replacing without departing substantially from the utility model
It changes and modifies, and covered by present patent application claims.
Claims (4)
1. a kind of pre-plastic package lead frame item, with opposite first surface and second surface；The pre-plastic package lead frame
Frame item includes the lead frame unit of multiple array arrangements, and each lead frame unit includes：
Carrier is configured to carry circuit to be packaged；
Several pins are arranged around the carrier；And
Preformed adhesive body,
It is characterized in that the carrier exposes to the first surface of the pre-plastic package lead frame item, several pins
Expose to the first surface of the pre-plastic package lead frame item and the second surface.
2. pre-plastic package lead frame item according to claim 1 is, characterized in that it further comprises with the carrier
The connecting rod of connection.
3. pre-plastic package lead frame item according to claim 1 is, characterized in that it further comprises connection is described several
Company's muscle of pin.
4. pre-plastic package lead frame item according to claim 1, it is characterised in that exposing to for several pins is described
The surface of second surface has tin layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820059901.1U CN207818566U (en) | 2018-01-15 | 2018-01-15 | Pre-plastic package lead frame item |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820059901.1U CN207818566U (en) | 2018-01-15 | 2018-01-15 | Pre-plastic package lead frame item |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207818566U true CN207818566U (en) | 2018-09-04 |
Family
ID=63327167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820059901.1U Active CN207818566U (en) | 2018-01-15 | 2018-01-15 | Pre-plastic package lead frame item |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207818566U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108269779A (en) * | 2018-01-15 | 2018-07-10 | 苏州日月新半导体有限公司 | Pre-plastic package lead frame strip and manufacturing method thereof |
-
2018
- 2018-01-15 CN CN201820059901.1U patent/CN207818566U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108269779A (en) * | 2018-01-15 | 2018-07-10 | 苏州日月新半导体有限公司 | Pre-plastic package lead frame strip and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: 215026 No.188 Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |