CN207818389U - High voltage-resistant passive element - Google Patents
High voltage-resistant passive element Download PDFInfo
- Publication number
- CN207818389U CN207818389U CN201820027348.3U CN201820027348U CN207818389U CN 207818389 U CN207818389 U CN 207818389U CN 201820027348 U CN201820027348 U CN 201820027348U CN 207818389 U CN207818389 U CN 207818389U
- Authority
- CN
- China
- Prior art keywords
- those
- passive device
- pressure
- layer board
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000000463 material Substances 0.000 claims abstract description 30
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000004642 Polyimide Substances 0.000 claims abstract description 13
- 229920001721 polyimide Polymers 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 39
- 125000002015 acyclic group Chemical group 0.000 claims description 15
- 238000004146 energy storage Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 2
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical group [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- -1 phenolic aldehyde Chemical class 0.000 claims description 2
- 230000005389 magnetism Effects 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 2
- 239000002023 wood Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/40—Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/04—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a high withstand voltage's passive component, it contains a multiply wood, is formed by a plurality of withstand voltage base plates and the mutual storehouse of laminating material, is provided with a plurality of conductive films on these some withstand voltage base plates, and a iron core group runs through a perforation of withstand voltage base plate, and the conductive film has non-cyclic annular part and cyclic annular part respectively, and wherein this withstand voltage base plate is polyimide with laminating material.
Description
Technical field
The utility model is about a kind of passive device, especially with respect to a kind of high voltage bearing passive device and its structure.
Background technology
Development in science and technology is rapid now, and many electronic products consider convenience and manufacturing cost, is with micro interiors of products electricity
Road is designed for the purpose of space, and largely uses printed circuit board, and only usually there are two types of important components in electronic product, make
At its volume upper limit system, one is capacitor, and capacitor between two conductors comprising its dielectric medium by being formed, conductor area and distance
Its capacitance is influenced, therefore micro capacitor acquires a certain degree of difficulty.Another size-limited component is inductance, please refers to Fig. 1, Fig. 2,
For known Inductive component schematic diagram, it includes iron core group and coil, iron core group is combined by two appearance E fonts iron cores 90, each
Iron core 90 includes a center pillar, and two iron cores 90 are interconnected, and first coil 80 is wound in wherein the one of two iron cores 90
Column, if in addition, Inductive component such as transformer have different coil turn demands when, as shown in Figure 2, it is necessary to wind one second line
Circle 81 overlaps in center pillar with first coil 80, the coil stacking of the number of turns different from the second 81 liang of coil of first coil 80 around
The center pillar of iron core.
In addition, above-mentioned coil is formed in a manner of printed circuit, however, known techniques are usually with the glass cloth such as FR4, phenolic aldehyde cotton
Paper or epoxy resin are as the substrate of printed circuit board, and such material has certain thickness, and impedance is low, to increase coil and
The impedance of circuit board must just increase the thickness of substrate, even if therefore known techniques Inductive component is formed in a manner of printed circuit,
It still has to occupy sizable space, and pressure resistance is limited.
In conclusion the capacitor and inductor of known techniques, have volume excessive, and the defect of resistance to pressure difference, having must
Further to improve makes it in the case where not occupying circuit layout space largely, and has high voltage characteristic.
Utility model content
The purpose of this utility model is to provide a kind of passive devices, take main material as pressure-resistant substrate of polyimides with
It is bonded material, there is high voltage and the substantially characteristic of thinning.
The purpose of this utility model is to provide a kind of passive device, electronic product can be made except electricity in embedded circuit substrate
Outside base board, energy-storage units and magnet unit are housed without exceptional space is provided.
To reach above-mentioned censured each purpose and effect, the utility model discloses a kind of passive device of high voltage,
Including a multi-layer board, forms for multiple pressure-resistant substrates with multiple mutual storehouses of material that are bonded, and have on those pressure-resistant substrates more
A conductive film.One iron core group runs through multiple-plate perforation.Those conductive films are respectively formed an acyclic moiety and annulus, should
The acyclic moiety of a little conductive films forms an energy-storage units such as conductor plate, with pressure-resistant substrate, and energy-storage units are adjusted such as capacitor
Capacitance can be changed in whole acyclic moiety.Annulus just as coil, then forms a magnetic around multiple-plate perforation with iron core group
Property unit, adjusted by the annulus number of turns, change its inductance value, or the transformer with different turn ratios, wherein pressure-resistant base
Plate is polyimides with the material for being bonded material, and due to polyimides and FR4, the impedance ratio under same thickness is 4:1, therefore, by
By polyimides plasticity, high and high impedance characteristic, forms a high voltage, and the passive device that thickness reduces.
Description of the drawings
Fig. 1：It is known techniquesThe schematic diagram of Inductive component；
Fig. 2：It is the schematic diagram of the multi-coil canoe of known techniques；
Fig. 3：It is the schematic diagram of the first embodiment of the passive device of the utility model high voltage；
Fig. 4：It is the explosive view of first embodiment；
Fig. 5：It is the schematic diagram of the second embodiment of the passive device of the utility model high voltage；
Fig. 6：It is the schematic diagram of the 3rd embodiment of the passive device of the high voltage of the utility model；And
Fig. 7：It is the part schematic diagram of the fourth embodiment of the passive member of the high voltage of the utility model.
【Figure number is to as directed】
10 multi-layer boards
11 perforation
100 pressure-resistant substrates
1001 trepannings
101 fitting materials
20 conductive films
201 annulus
202 acyclic moieties
203 circuit patterns
30 iron core groups
301 upper cores
302 lower cores
31 center pillars
40 energy-storage units
50 magnet units
60 circuit boards
61 conducting wires
62 grooves
80 first coils
81 second coils
90 iron cores
Specific implementation mode
In order to make the utility model structure feature and it is reached the effect of have a better understanding and awareness, it is special with compared with
Good embodiment and cooperation detailed description, is described as follows：
Please with reference to Fig. 3 and Fig. 4, Fig. 3 its be the utility model high voltage passive device first embodiment schematic diagram,
Fig. 4 is the explosive view of first embodiment.As shown, the passive device of the utility model high voltage includes a multi-layer board 10, more
A conductive film 20 and an iron core group 30.
The multi-layer board 10 of the utility model is formed by multiple pressure-resistant substrates 100 with multiple 101 storehouses of material that are bonded.In addition, leading
Electrolemma 20 is respectively arranged on those pressure-resistant substrates 100, in forming circuit loop, and conductive film on those pressure-resistant substrates 100
20 can more be subdivided into annulus 201 and acyclic moiety 202, and wherein annulus 201 is set to by surrounding to perforate in a manner of 11
On pressure-resistant substrate 100, acyclic moiety 202 is then set to depending on circuit requirements on each pressure-resistant substrate 100.
The fitting material 101 is attached on pressure-resistant substrate 100, to protect conductive film 20 and increase impedance.The utility model
A wherein embodiment avoids exposing to directly by fitting 101 sticking position of material in the outer surface (as shown in Figure 3) of multi-layer board 10
Conductive film 20 on multi-layer board 10 is impaired；Or fitting material 101 is attached between two pressure-resistant substrates 100, and the quantity attached is not
Limitation, to increase impedance.In addition, there is iron core group 30 an at least center pillar 31, the size of center pillar 31 to be adapted for through multi-layer board 10
One perforation 11.
Wherein, the pressure-resistant substrate 100 of the utility model with to be bonded the material of material 101 be polyimides, due to identical thickness
FR4 high used in the more conventional technology of impedance of the polyimides of degree, and polyimides plasticity is strong, can make soft glued membrane or
Rigid substrate.Therefore, pressure-resistant substrate 100 is made with polyimides with material 101 is bonded, the component facade that makes, thickness, impedance with
And pressure voltage, visual user's demand are adjusted.Such as multi-layer board can be with a pressure-resistant substrate, a fitting material and a pressure-resistant substrate
Sequentially storehouse forms, with can sequentially storehouse forms by a pressure-resistant substrate, multiple fitting materials and a pressure resistance substrate.By polyimides
High impedance and the strong characteristic of plasticity, the thickness of passive device substantially reduces, and promotes pressure voltage.
There is conductive film 20 annulus 201 and acyclic moiety 202, this acyclic moiety 202 to be located at such as conductor plate
Pressure-resistant substrate 100 between acyclic moiety 202 forms an energy-storage units 40 such as dielectric medium.In addition, annulus 201
Such as coil, and around 11 setting of perforation, a magnet unit 50 is formed with the center pillar 31 of iron core group 30.
The passive device of the utility model high voltage can be in a multi-layer board 10 by the technology of above-mentioned pressure-resistant substrate 100
On be formed simultaneously the energy-storage units 40 and magnet unit 50 of high voltage, energy-storage units 40 are such as capacitor, by changing non-annularity
The area or quantity of part 202, adjust its capacitance.Magnet unit 50 then such as inductor, can be adjusted by annulus 201
The number of turns, adjust its inductance value.
Fig. 5 is please referred to, is the schematic diagram of the second embodiment of the passive device of the utility model high voltage.Fig. 3's leads
Electrolemma 20 can more be formed between multi-layer board 10 as shown in Figure 5 other than such as Fig. 4 is acyclic moiety 202 or annulus 201
Multiple circuit patterns 203, and pressure-resistant substrate 100 has multiple trepannings 1001, the conductive film between different layers pressure resistance substrate 100
20, it can be connected with each other through trepanning 1001, even if so multi-layer board 10 has circuit trace simultaneously.
Fig. 6 is please referred to, is the schematic diagram of the 3rd embodiment of the passive device of the utility model high voltage.As schemed
Show, iron core group 30 may include a upper core 301 and a lower core 302 to assemble convenient and stability, iron core group 30, respectively
It is assigned into three perforation 11 by 10 upper and lower of multi-layer board in addition, the shape of the utility model iron core group 30 is not limiting as, can be Fig. 5
I fonts or Fig. 6 E fonts, 11 quantity of perforating on multi-layer board 10 correspond to the shape of iron core group 30, therefore user can be voluntarily
It selects 30 shape of iron core group and designs multi-layer board 10.
Fig. 7 is please referred to, is the schematic diagram of the fourth embodiment of the passive device of the utility model high voltage.As schemed
Show, the utility model high voltage passive device may include multiple circuit boards 60, those 60 mutual storehouses of circuit board, material
Matter can select known printed circuit board material, such as：FR4 or epoxy resin, and there is conducting wire 61 in circuit board 60,
Conducting wire 61 connects conductive film 20, and the installation position of circuit board 60 can be in the top of multi-layer board 10, or in multi-layer board
10 lower section, or can have a groove 62 after 60 storehouse of circuit board as shown in Figure 7, so that multi-layer board 10 is used embedded mode
It is placed between those circuit boards 60.In addition, the conducting wire of the conductive film 20 and circuit board 60 to avoid multi-layer board 10
61 influence each other and 30 appearance of iron core group gaps when embedded circuit substrate 60, influence component reliability, can be in multilayer
10 up or down of plate configuration, one fitting material 101 sandwiches multi-layer board 10, those circuits are sealed at completely when multi-layer board 10 being allow to be embedded in
Between substrate 60.
Because circuit board 60 can externally be extended other assemblies, in the circuit design for making product, the utility model
Passive device has larger elasticity for ornaments, it is only necessary in 10 embedded circuit substrate 60 of multi-layer board and will be electrically connected, convenience
It is splendid.
The utility model has the passive device of high voltage characteristic, is formed using multiple pressure-resistant substrates with the mutual storehouse of material is bonded
Multi-layer board, and on those pressure-resistant substrates there are multiple conductive films and iron core group to run through multiple-plate perforation.Those are conductive
Film forms annulus and acyclic moiety, and acyclic moiety forms energy-storage units, energy storage just as conductor plate, with pressure-resistant substrate
For unit as capacitor, capacitance can be changed in adjustment acyclic moiety；Annulus is perforated around multiple-plate just as coil,
And wire circle is adjustable, then forms magnet unit with iron core group, is adjusted by the annulus number of turns, then its inductance can be changed
Amount, or the transformer with different turn ratios.In addition, there are pressure-resistant substrate multiple trepannings, those conductive films to penetrate those trepannings
It is electrically connected with each other, makes multi-layer board while having the function of circuit board, and energy-storage units can be electrically connected with each other with magnet unit,
Wherein fitting material and pressure-resistant baseplate material are polyimides, through the characteristic of polyimides, complete a high voltage and volume substantially
The passive device of reduction.Furthermore the utility model may include circuit board, has conducting wire in circuit board, makes conductor wire
Road and conductive film are electrically connected, through circuit board can external other assemblies, and by the groove of multi-layer board embedded circuit substrate
In, saving takes up space.
Above is only the preferred embodiments of the utility model, not are used for limiting the range of the utility model implementation,
Equivalent changes and modifications carried out by all shape, construction, feature and spirit according to described in the utility model claims range, should all
It is included in the right of the utility model.
Claims (11)
1. a kind of passive device of high voltage, which is characterized in that it includes：
One multi-layer board is formed by multiple pressure-resistant substrates and the mutual storehouse of multiple fitting materials, and the multi-layer board is at least one perforation；And
Multiple conductive films are set on those pressure-resistant substrates, those conductive films have an annulus and an acyclic moiety, should
Annulus surrounds the perforation；And
There is one iron core group an at least center pillar, the center pillar to run through the perforation；
The material that wherein those pressure-resistant substrates are bonded material with those is polyimides.
2. passive device as described in claim 1, which is characterized in that wherein those fitting materials are located at multiple-plate appearance
Face.
3. passive device as described in claim 1, which is characterized in that wherein those fitting materials are located at at least two pressure-resistant substrate
Between.
4. passive device as described in claim 1, which is characterized in that wherein those pressure-resistant substrates have multiple trepannings, those
Conductive film is electrically connected with each other through those trepannings.
5. passive device as described in claim 1, which is characterized in that wherein the iron core group has a upper core and iron once
Core.
6. passive device as described in claim 1, which is characterized in that wherein the multi-layer board forms a magnetism with the annulus
Unit, the multi-layer board form an energy-storage units with acyclic moiety.
7. passive device as described in claim 1, which is characterized in that it further includes multiple circuit boards, those circuit boards
There are multiple conducting wires, those conducting wires to be electrically connected with those conductive films for mutual storehouse, those circuit boards.
8. passive device as claimed in claim 7, which is characterized in that wherein those circuit board materials are glass cloth, phenolic aldehyde
Cotton paper or epoxy resin.
9. passive device as claimed in claim 7, which is characterized in that wherein it is multiple-plate to be set to this for those circuit boards
On.
10. passive device as claimed in claim 7, which is characterized in that wherein those circuit boards be set to the multi-layer board it
Under.
11. passive device as claimed in claim 7, which is characterized in that wherein those circuit boards have a groove, the groove
House the multi-layer board.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106100465A TWI628768B (en) | 2017-01-06 | 2017-01-06 | Passive component with high withstand voltage |
| TW106200271 | 2017-01-06 | ||
| TW106100465 | 2017-01-06 | ||
| TW106200271U TWM546014U (en) | 2017-01-06 | 2017-01-06 | High withstand-voltage passive component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207818389U true CN207818389U (en) | 2018-09-04 |
Family
ID=62803414
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810015986.8A Active CN108281285B (en) | 2017-01-06 | 2018-01-08 | High voltage-resistant passive element |
| CN201820027348.3U Withdrawn - After Issue CN207818389U (en) | 2017-01-06 | 2018-01-08 | High voltage-resistant passive element |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810015986.8A Active CN108281285B (en) | 2017-01-06 | 2018-01-08 | High voltage-resistant passive element |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108281285B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281285A (en) * | 2017-01-06 | 2018-07-13 | 照敏企业股份有限公司 | High voltage-resistant passive element |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677342A (en) * | 1992-08-28 | 1994-03-18 | Kyocera Corp | Circuit board |
| US8188829B2 (en) * | 2008-12-26 | 2012-05-29 | Tdk Corporation | Coil substrate structure, substrate holding structure, and switching power supply |
| US20150116950A1 (en) * | 2013-10-29 | 2015-04-30 | Samsung Electro-Mechanics Co., Ltd. | Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the same |
| CN204560027U (en) * | 2015-04-27 | 2015-08-12 | 博敏电子股份有限公司 | There is the printed circuit board imbedding inductance |
| CN105472912B (en) * | 2015-11-23 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of compression method of high pressure resistant thick copper PCB |
| CN108281285B (en) * | 2017-01-06 | 2020-03-17 | 照敏企业股份有限公司 | High voltage-resistant passive element |
-
2018
- 2018-01-08 CN CN201810015986.8A patent/CN108281285B/en active Active
- 2018-01-08 CN CN201820027348.3U patent/CN207818389U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281285A (en) * | 2017-01-06 | 2018-07-13 | 照敏企业股份有限公司 | High voltage-resistant passive element |
| CN108281285B (en) * | 2017-01-06 | 2020-03-17 | 照敏企业股份有限公司 | High voltage-resistant passive element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108281285B (en) | 2020-03-17 |
| CN108281285A (en) | 2018-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180904 Effective date of abandoning: 20200317 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180904 Effective date of abandoning: 20200317 |